CCM產(chǎn)品工藝知識(shí)培知識(shí)PPT課件

1、Prepare by: civvy chen 授課：XXX Prepare by: civvy chen 授課：XXX2 o 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用 o 產(chǎn)品的類型產(chǎn)品的類型 o 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 o 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 o 問與答問與答 o 附錄附錄:專業(yè)名詞介紹專業(yè)名詞介紹 Prepare by: civvy chen 授課：XXX3 Part I 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用 Prepare by: civvy chen 授課：XXX4 Part I 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用 拆解拆解 Prepare by: civvy chen 授課：XXX5 Part II 產(chǎn)品的類型產(chǎn)品的類型 軟

2、板定焦模式(FF) 1. B-To-B 2.Gold Finger Prepare by: civvy chen 授課：XXX6 Part II 產(chǎn)品的類型產(chǎn)品的類型 軟板變焦模式 1.手動(dòng)變焦(MF) 2.自動(dòng)變焦(AF) Prepare by: civvy chen 授課：XXX7 Part II 產(chǎn)品的類型產(chǎn)品的類型 插槽模式(Socket) Prepare by: civvy chen 授課：XXX8 Part II 產(chǎn)品的類型產(chǎn)品的類型 像素分類 CIF (352*288) 10萬像素 (0.1M) VGA (640*480) 30萬像素 (0.3M) SXGA (1280*1024

3、) 130萬像素 (1.3M) UXGA (1600*1200) 200萬像素 (2.0M) Prepare by: civvy chen 授課：XXX9 Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 CSP (Chip Scale Package) Chip LensBarrel Holder IR Filter stiffener FPC Solder Ball Glass Prepare by: civvy chen 授課：XXX10 Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 COB (Chip On Board) Chip Lens Barrel Holder IR Filter Finger

4、 Gold Wire FPC PCB Prepare by: civvy chen 授課：XXX11 Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 鏡頭鏡頭(Lens) 鏡座鏡座(Holder) 芯片芯片(Chip) 電路板電路板(PCB) 連接器連接器(Con.) Prepare by: civvy chen 授課：XXX12 Part III 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 CMOS CHIP LENS HOLDER LENS BARREL These 3 items come as an assembly 1st LENS ELEMENT 2nd LENS ELEMENT IR GLASS SUBSTR

5、ATE FPC Prepare by: civvy chen 授課：XXX13 Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 材料 1. 晶圓(Wafer) 主要是由硅和鍺組成,是攝像頭模組的核心部分,稱 之為影像傳感器。 Prepare by: civvy chen 授課：XXX14 Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 2. 線路板 Printed Circuit Board印刷電路板,是電子元器 件的支撐體,是電子元器件電氣連接的提供者,簡(jiǎn)稱PCB. Prepare by: civvy chen 授課：XXX15 Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 3. 鏡座(Hold

6、er) Prepare by: civvy chen 授課：XXX16 Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 4. 鏡頭(Lens) Prepare by: civvy chen 授課：XXX17 Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 5. 軟板(FPC) Flexible Circuit Board軟性印制電路是以聚酰亞胺 或聚酯薄膜為基材制成的一種具有高度可靠性絕佳的可 撓性印刷電路。 Prepare by: civvy chen 授課：XXX18 Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 工藝流程 Wafer清洗Plasma清洗固晶固晶烘烤 邦線金線檢查DAM邦定DA

7、M烘烤 二流體清洗CCD檢查Glass貼附CCD檢查 固化半成品測(cè)試 Prepare by: civvy chen 授課：XXX19 Process Supply WaferTray OKOK OKOK N/AOK N/AOK IR Glass Attach Process CM800 Barrel Insert Process CM800 dispense CMOS Chip dispense IR Glass dispense + + + + Lens Barrel Die Attach Process CM800 Holder Attach Process CM800 Prepare b

8、y: civvy chen 授課：XXX20 Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 Die Bonding:使芯片 與PCB粘合。 注意點(diǎn)：1.芯片方向 2.膠量 3.頂針和吸嘴印 4.芯片角度 5.芯片位置 6.芯片傾斜 Prepare by: civvy chen 授課：XXX21 Part IV 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 Wire Bonding: 通過金線焊接 使芯片與PCB線路導(dǎo)通。 注意點(diǎn)：1.接線是否正確 2. 線弧 3.金球大小 4.金球厚度 5.金線拉力 6.金球推力 Prepare by: civvy chen 授課：XXX22 Solder Paste Scr

9、een PrintPassive Placement ForDie Attach Passive Solder PastePassive Substrate Prepare by: civvy chen 授課：XXX23 Die AttachWire BondingWet Clean Chip Sensor Area Au Wire Chip Sensor Area Au Wire Prepare by: civvy chen 授課：XXX24 IR Glass MountIR Glass SAW WaferRing IRGlass IRGlass Prepare by: civvy chen

10、 授課：XXX25 Glue Dispense IR Glass Attach Holder Holder Glue Glue IR cut Glass IRGlass Prepare by: civvy chen 授課：XXX26 Glue DispenseHolder Attach Glue Glue Barrel Insert Barrel Holder Prepare by: civvy chen 授課：XXX27 Singlation cut cut Prepare by: civvy chen 授課：XXX28 Focus adjust Barrel Barrel Fixation

11、 Motor Lighting （Percolation Method) chart Achromatic Lens ND4（Adjustment of Light Quantity） Laser Prepare by: civvy chen 授課：XXX29 Part V 問與答問與答 Prepare by: civvy chen 授課：XXX30 Part VI 專業(yè)名詞介紹專業(yè)名詞介紹 Prepare by: civvy chen 授課：XXX31 Prepare by: civvy chen 授課：XXX32 Bonding Process Prepare by: civvy chen

12、 授課：XXX33 Free air ball is captured in the chamfer Prepare by: civvy chen 授課：XXX34 Free air ball is captured in the chamfer SEARCH HEIGHT Prepare by: civvy chen 授課：XXX35 Free air ball is captured in the chamfer SEARCH SPEED1 SEARCH TOL 1 Prepare by: civvy chen 授課：XXX36 Free air ball is captured in t

13、he chamfer SEARCH SPEED1 SEARCH TOL 1 Prepare by: civvy chen 授課：XXX37 Free air ball is captured in the chamfer SEARCH TOL 1 SEARCH SPEED1 Prepare by: civvy chen 授課：XXX38 Free air ball is captured in the chamfer SEARCH TOL 1 SEARCH SPEED1 Prepare by: civvy chen 授課：XXX39 Free air ball is captured in t

14、he chamfer SEARCH TOL 1 SEARCH SPEED1 Prepare by: civvy chen 授課：XXX40 Formation of a first bond SEARCH SPEED1 SEARCH TOL 1 Prepare by: civvy chen 授課：XXX41 Formation of a first bond SEARCH SPEED1 SEARCH TOL 1 IMPACT FORCE Prepare by: civvy chen 授課：XXX42 Formation of a first bond Contact Prepare by: c

15、ivvy chen 授課：XXX43 Formation of a first bond Base Prepare by: civvy chen 授課：XXX44 Capillary rises to loop height position Prepare by: civvy chen 授課：XXX45 Capillary rises to loop height position Prepare by: civvy chen 授課：XXX46 Capillary rises to loop height position Prepare by: civvy chen 授課：XXX47 Ca

16、pillary rises to loop height position Prepare by: civvy chen 授課：XXX48 Capillary rises to loop height position Prepare by: civvy chen 授課：XXX49 Capillary rises to loop height position Prepare by: civvy chen 授課：XXX50 Formation of a loop RD (Reverse Distance) Prepare by: civvy chen 授課：XXX51 Formation of

17、 a loop Prepare by: civvy chen 授課：XXX52 Prepare by: civvy chen 授課：XXX53 Calculated Wire Length WIRE CLAMP CLOSE Prepare by: civvy chen 授課：XXX54 Calculated Wire Length Prepare by: civvy chen 授課：XXX55 SEARCH DELAY Prepare by: civvy chen 授課：XXX56 TRAJECTORY Prepare by: civvy chen 授課：XXX57 TRAJECTORY Pr

18、epare by: civvy chen 授課：XXX58 TRAJECTORY Prepare by: civvy chen 授課：XXX59 TRAJECTORY Prepare by: civvy chen 授課：XXX60 TRAJECTORY Prepare by: civvy chen 授課：XXX61 TRAJECTORY Prepare by: civvy chen 授課：XXX62 TRAJECTORY Prepare by: civvy chen 授課：XXX63 TRAJECTORY Prepare by: civvy chen 授課：XXX64 TRAJECTORY Prepare by: civvy chen 授課：XXX65 TRAJECTORY Prepare by: civvy chen 授課：XXX66 2nd Search Height Search Speed 2 Search Tol 2 Prepare by: civvy chen 授課：XXX67 Search Speed 2 Search Tol