測(cè)溫板的制作Porfilerboard

1、Profiler board &ProfilingDate: 2002.05.12Rev. No.: 01Approved By : Prepared By : Xiaoping.chen1. Scope : 范圍:This program applies for Temperature Profiling for all product in Flextronics Industrial (zhu hai).適合偉創(chuàng)力實(shí)業(yè)有限公司所有產(chǎn)品溫度曲線的制作.Date: 2002.05.12Rev. No.: 012.Instrument: 儀器及工具h(yuǎn)igh temperature glue p

2、aperhigh temperature solderDATAPAQ9000thermocoupleDate: 2002.05.12Rev. No.: 013. Thermocouple preparation 準(zhǔn)備熱電偶線3.1 Only “K” type thermocouple wire be used for temperature profiling . 做溫度曲線只能使用型熱電偶線Date: 2002.05.12Rev. No.: 013. Thermocouple preparation 準(zhǔn)備熱電偶線 3.2 Ensure thermocouple wire is minimum

3、 15cm extension from board edge . 確定熱電偶線從板邊延長最少15cmDate: 2002.05.12Rev. No.: 0115cm4. preparation of profiling board 準(zhǔn)備溫度曲線測(cè)試板 4.1 Get ready the board for temperature profiling , select the actual product or approximate product as the sample board . 用生產(chǎn)產(chǎn)品的板或者近似生產(chǎn)產(chǎn)品的板做為溫度曲線的 測(cè)試樣板 4.2 Identify the loc

4、ations for soldering thermocouple wires. 確定焊接熱電偶線的位置Date: 2002.05.12Rev. No.: 01A) A minimum of three points must be measured on a PCB. The three points to be measured are the lead , end and center of the SMD component . 一塊板上最少有三個(gè)測(cè)試點(diǎn)，這三個(gè)點(diǎn)分別在板面上前， 后及中間的元件 4. preparation of profiling board 準(zhǔn)備溫度曲線測(cè)試板Da

5、te: 2002.05.12Rev. No.: 01B) The selection will be based on the coldest and the hottest location on the PCB . 在上選擇最冷的及最熱的位置 1) The coldest will be the most massive component and in the most densely loaded area 最冷的位置在最大的元件和元件最密集的區(qū)域 2) The hottest will be the highly exposed or isolated area 最熱的位置在非常曝露

6、或者單獨(dú)一個(gè)的區(qū)域4. preparation of profiling board 準(zhǔn)備溫度曲線測(cè)試板Date: 2002.05.12Rev. No.: 01 C) Select the heat sink location 選擇吸熱多的位置 D) Select the temperature sensitivity component . 選擇對(duì)溫度敏感的元件位置 E) Select the thermal shock location 選擇有熱沖擊的位置Note : Refer to the product process instruction for the thermocouple

7、 location of the respective products .注意：參考各自產(chǎn)品的工藝流程指示確定熱電偶線的位置4. preparation of profiling board 準(zhǔn)備溫度曲線測(cè)試板Date: 2002.05.12Rev. No.: 01 4.3 Add high temperature solder to the components termination which had been desoldered . 在需要焊接的元件端子加高溫錫 4.4 Thermocouple wire will be linked to the reserved locatio

8、n. 熱電偶線連在指定的位置4. preparation of profiling board 準(zhǔn)備溫度曲線測(cè)試板Date: 2002.05.12Rev. No.: 014.5 Upon soldering is completed .ensure the following is complied . 焊接后，確認(rèn)是否遵守下列內(nèi)容： A) No excessive solder cover up the thermocouple termination . 沒有過多的錫蓋在熱電偶線的端子上 B) The thermocouple termination (spot welded ) is f

9、ully submerge into the solder without any exposure . 熱電偶的端子全部焊在焊錫中，沒有曝露的4.6 Re-do soldering if it does not comply with the about requirements. 如果沒有達(dá)到要求，重新焊接4. preparation of profiling board 準(zhǔn)備溫度曲線測(cè)試板Date: 2002.05.12Rev. No.: 015. Board loading condition 板的傳送狀況5.1 Flow the profile board in the unload

10、ed condition during the initial and concurrent stages of profiling. this is to attain an acceptable profile. 在起初階段，爐內(nèi)沒有加載板的情況下，測(cè)試的曲線作 為一個(gè)初步的可接受的曲線Entry direction進(jìn)板方向Date: 2002.05.12Rev. No.: 015. Board loading condition 板的傳送狀況5.2 For the final profile , flow the profile board under a loaded conditio

11、n to simulate a fully production operating condition . Ensure that there are two “production boards” in front of the profile board and one behind . 曲線確定以后，再做曲線時(shí)以模擬爐內(nèi)充滿的狀態(tài) 在測(cè)試板的前面有兩個(gè)產(chǎn)品板，在它的后面有一塊產(chǎn)品板 Note : “production boards” can either be boards of same product type or of same dimension . 注意：產(chǎn)品板既可以是相

12、同的產(chǎn)品或相近似的產(chǎn)品板Date: 2002.05.12Rev. No.: 01Entry direction進(jìn)板方向Profile board測(cè)試樣板Production board產(chǎn)品板5. Board loading condition 板的傳送狀況Date: 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：6.1 Solder paste reflow for PCBA process . 錫膏焊接工藝Date: 2002.05.12Rev. No.: 016. Thermal profile req

13、uirement : 溫度曲線需要表達(dá)的內(nèi)容：6.1.1 The following parameter had to consider on the temperature profile . 在溫度曲線上必須考慮到下列參數(shù)： 6.1.1.1 Maximum Pre-heat Temp. Ramp from ambient to soak temperature 從室溫到軟化保溫區(qū)的溫度的最大的預(yù)熱溫度和斜率 6.1.1.2 Soak temperature and time 軟化保溫區(qū)的溫度及時(shí)間 6.1.1.3 Reflow temperature and time 回流的溫度及時(shí)間 6

14、.1.1.4 Peak temperature 最高溫度Date: 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：Peak temperatureReflow Soak Cool Preheat Date: 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：6.2 Wave solder for PCBA process . 波峰焊工藝Date: 2002.05.12Rev. No.: 016. Thermal profil

15、e requirement : 溫度曲線需要表達(dá)的內(nèi)容：6.2.1 The following parameter had to consider on the temperature profile . 在溫度曲線上必須考慮到下列參數(shù)： 6.2.1.1 Pre-heat Temp. and time 預(yù)熱溫度和時(shí)間 6.2.1.2 Solder temp. and time 焊錫溫度和時(shí)間Date: 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：Preheat Peak temperature Date:

16、 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：6.3 Adhesive curing for PCBA process .膠水固化工藝Date: 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：6.3.1 The following parameter had to consider on the temperature profile .在溫度曲線上必須考慮到下列參數(shù)： 6.3.1.1 Curing temp. and

17、 ramp 固化溫度及斜率； 6.3.1.2 Curing time 固化時(shí)間；Date: 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：Cool Preheat Curing Date: 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：6.4 Rework 返工Date: 2002.05.12Rev. No.: 016. Thermal profile requirement : 溫度曲線需要表達(dá)的內(nèi)容：6.4.1 Th

18、e following parameter had to consider on the temperature profile .在溫度曲線上必須考慮到下列參數(shù)： 6.4.1.1 the maximum temperature which components can bear . 元件本身能承受的最高溫度； 6.4.1.2 the maximum temperature and longest time on solder point. 錫點(diǎn)的最高溫度及時(shí)間Date: 2002.05.12Rev. No.: 017. Temperature profile frequency : 溫度曲線

19、測(cè)試頻率：7.1 Normal Process Temperature profile frequency : 正常工藝溫度曲線測(cè)試頻率： 7.1.1 When there is PP. 當(dāng)試產(chǎn)時(shí)； 7.1.2 When there is machine change 當(dāng)機(jī)器改變時(shí)； 7.1.3 When there is a model change 當(dāng)產(chǎn)品型號(hào)改變時(shí)； 7.1.4 When product quality is out of control 當(dāng)產(chǎn)品質(zhì)量超出控制限時(shí)； 7.1.5 After preventive maintenance 預(yù)期的維護(hù)之后； 7.1.6 Mini

20、mum once per week or according to the customers requirement 最少每周做一次或根據(jù)客戶需要Date: 2002.05.12Rev. No.: 017.2 Rework Process Temperature profile frequency : 返修工藝溫度曲線測(cè)試頻率： 7.2.1 When repair for first time ;當(dāng)?shù)谝淮畏敌迺r(shí)； 7.2.2 When there is apparatus change 當(dāng)儀器改變時(shí)； 7.2.3 When there is a model change當(dāng)產(chǎn)品型號(hào)改變時(shí)； 7.2.4 After preventive maintenance 預(yù)期的維護(hù)之后； 7.2.5 Minimum once per week or according to the customers requirement 最少每周做一次或根據(jù)客戶需要Date: 2002.05.12Rev. No.: 017. Temperature profile frequency : 溫度曲線測(cè)試頻率：8. How to Use “Reflow Tracker for windows” of