bp10x硬件設(shè)計(jì)參考系列datasheet bp1064a2數(shù)據(jù)手冊(cè)

6.1.使用條 圖圖1.結(jié)構(gòu)示意 圖2.音頻DSP信號(hào)處理框 圖3.引腳定 圖4.封裝形式和尺 表表1引腳說 表2GPIO上電狀態(tài)及電 表3推薦使用條 表6AudioDAC性能@ 表7AudioADC（LINEIN1/3通道）性能@ 表8AudioADC（LINEIN4/5通道）性能@ 表9AudioADC（MIC通道）性能@ 支持DSP指令，集成FPU支持浮點(diǎn)運(yùn)算ADC8KHz11.025KHz12KHz16KHz22.05KHz24KHz32KHz44.1KHz/ADC0通道帶AGC功能324bitDAC8KHz11.025KHz12KHz16KHz22.05KHz24KHz32KHz44.1KHz/位寬32bits 音頻和ARC

檢測(cè)）Watchdog 點(diǎn)，內(nèi)置PHY1SDIO@UART0支持流控max.450K15IO通道，2個(gè)內(nèi)部電壓采樣通道：MP2,MP3,WMA,APE,FLAC,AAC,MP4,M4A,WAV（IMA-ADPCM&PCM）,AIF,AIFCProfessionalVoice

能的Example和眾多中間件。LQFP64（7mmx圖1.結(jié)構(gòu)示意圖3.引腳定表1引腳說12 3456I789SPIS_MOSI/UART0_RXD/UART0_TXD/MCLK0_OUT/MCLK0_IN/TIM3_SPIS_CLK/UART0_TXD/UART0_RXD/I2S0_LRCLKI2S1_LRCLK/SPIS_MISO/UART0_CTS/I2S0_BCLK/SPIS_CS/UART0_RTS/I2S0_DO/I2S0_DI/IOLCD0/SPIM_MOSI/UART0_RXD/LCD1/SPIM_CLK/UART0_TXD/LCD2/SPIM_MISO/UART0_CTS/MCLK1_OUT/LCD3/UART0_RTS/I2S1_LRCLK/LCD4/UART1_RXD/I2S1_BCLK/LCD5/UART1_TXD/I2S1_DO/I2S1_DI/LCD6/UART1_CTS/I2S1_DI/I2S1_DO/LCD7/LCD10/LCD11/LCD12/USB_DM/USB_DP/AD0/SD_DAT/SPIM_MOSI/SPIS_MOSI/I2S0_LRCLK/AD1/SD_CLK/SPIM_CLK/SPIS_CLK/I2S0_BCLK/AD2/SD_CMD/SPIM_MISO/SPIS_MISO/UART1_RTS//I2S0_DI/LCD13/AD0/SPIS_CS/UART1_CTS/I2S0_DI/I2S0_DO/LCD14/AD1/UART1_RXD/I2C_SDA/MCLK0_OUT/MCLK0_IN/LCD15/AD2/UART1_TXD/I2C_SCL/AD4/MCLK1_OUT/MCLK1_IN/AD5/SPDIF_AI_0/I2S1_LRCLK/SPDIF_DI/SPDIF_DO/AD6/SPDIF_AI_1/I2S1_BCLK/SPDIF_DI/SPDIF_DO/CLKOUT/AD7/SPDIF_AI_2/I2S1_DO/I2S1_DI/I2C_SDA/SPDIF_DI/SPDIF_DO/DMIC1_DATAD8/SPDIF_AI_3/I2S1_DI/I2S1_DO/I2C_SCL/SPDIF_DI/SPDIF_DO/DMIC1_CLKEFUSEVDD/CLK_OUT/CLK_OUT/LINEIN4_R/AD9//LINEIN4_L/AD10/ /LINEIN5_R/LINEIN5_L/表2GPIO上電狀態(tài)及電平IO產(chǎn)生電流消耗。復(fù)用關(guān)系、輸入輸出和上下拉狀態(tài)等；也可以表現(xiàn)與a）一致。 表3推薦使用條℃ VVVVVVVVGPIO_A[17:5]/8GPIO_A[4:0]/GPIO_B[3:0]/48-GPIO_A[17:5]/2.6GPIO_A[4:0]/-6AudioDAC@88NoFilter@A-Weighted@NoFilter@A-Weighted@@8NoFilter@A-Weighted@NoFilter@A-Weighted@@8NoNoFilter@A-Weighted@不使用GainBoostPGAGainBoostPGAgain=0dB700mVrms BP1064A2isamoisturesensitivecomponent.ThemoisturesensitivityclassificationisClass3.It’simportantthatthepartsarehandledunderprecautionandapropermanner.Thehandling，bakingandout-of-packstorageconditionsofthemoisturesensitivecomponentsaredescribedinIPC/JEDCS-STD-033A.ThemendsutilizingthestandardprecautionslistedCalculatedshelflifeinSealedBag:12monthsat<40℃and<90%relativePeakPackageBodyTemperature:Afterbagisopened，devicesthatwillbesubjectedtoreflowsolderofotherhightemperatureprocessmustbe:Mountedwithin168hoursoffactorycondition≤30℃/60%Storedat<10%RHifnotDevicesrequirebaking，beforemountingHumidityindicatorcardis>10%whenreadat23±5℃immedia yaftermoisturebarrierbagisItems3aor3bisnotIfbakingisrequired，pleaserefertoJ-STD-033standardforlowtemperature（40℃）bakingrequirementinTape/Reelform.Allinformationanddatacontainedinthis arewithoutanycommitment，arenottobeconsideredasanofferforconclusionofacontract，norshalltheybeconstruedastocreateanyliability.Anynewissueofthis invalidatespreviousissues.Productavailabilityanddeliveryareexclusivelysubjecttoourrespectiveorderconfirmationform;thesameappliestoordersbasedondelivereddevelopmentsamplesdelivered.Bythispublication，ShanghaiMountainViewSiliconCo.，.（“MVSILICON”）doesnotassumeresponsibilityforpatentinfringementsorotherrightsofthirdpartiesthatmayresultfromitsuse.Nopartofthispublicationmaybereproduced，photocopied，storedinaretrievalsystem，ortranslatedinanyformorbyanymeans，electronic，mechanical，manual，optic