線路板術(shù)語手冊樣本

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Adhesive導(dǎo)電膠ConductiveAnodicFilament玻織紗式漏電ConductivePaste導(dǎo)電膏ConductiveSalt導(dǎo)電鹽Conductivity導(dǎo)電度ConductorSpacing導(dǎo)體間距ConformalCoating貼護(hù)層,護(hù)形ConformalMask銅窗Conformity吻合性,服貼性Connector連接器ContactAngle接觸角ContactArea接觸區(qū)ContactResistance接觸電阻Continuity連通性ContinuousLamination連續(xù)壓合,連續(xù)層壓ContractElectronicManufacturer(CEMorCM)電子品合同式制造商ContractService協(xié)力商,分包商,外包廠ControlledColaspse定高坍塌ControlledDepthDrilling定深鉆孔ConversionCoating轉(zhuǎn)化皮膜Coplanarity共面性Copolymer共聚物CopperFoil銅箔,銅皮Copper-invar-Copper(ClC)綜合夾心板CopperMirrorTest銅鏡試驗(yàn)CopperPaste銅膏Core(Board)核心板,核板CoreMaterial內(nèi)層板材,核材CornerCrack通孔斷角CornerMark板角標(biāo)記Counterboring垂直向下擴(kuò)孔,埋頭孔Counterflow(槽液)上下翻流,上下回流Countersinking錐型擴(kuò)孔,喇叭孔CouplingAgent耦合劑Coupon,TestCoupon板邊試樣Coverlayer,Coverlay表護(hù)層Crack裂痕Crater彈坑,凹坑Crazing白斑Crease皺褶Creep潛變CrossectionArea截面積Crosshatching十字交叉區(qū)CrosshatchTesting十字割痕試驗(yàn)Crosslinking,Crosslinkage交聯(lián),回橋Crossover越交,搭交Crosstalk噪聲,串訊Crushzone磨碎區(qū)CrystallineMeltingPoint晶體熔點(diǎn)Cure硬化,熟化Current-CarryingCapability載流能力CurrentDensity電流密度CurtainCoating濂涂法CycleMode逐次打擊式D-glassD玻璃DaisyChainedDesign,DaisyChaining菊瓣設(shè)計(jì),菊花瓣連墊DatumReference基準(zhǔn)參考點(diǎn)DaughterBoard子板Debris碎屑,殘材Deburring去毛頭Decibel(Db)分貝DeclinationAngle斜射角Definition邊緣齊直度,邊緣逼真度Degradation劣化Degrasing脫脂DeionizedWater去離子水Delamination分層DelayLine(SerpentineLine)延遲線路(蛇形線路)DendriticGrowth枝狀生長Denier丹尼爾Densitomer透光度計(jì)Dent凹陷Depanelization切開,分開Deposition沉積,附積,皮膜處理Desiccator干燥器Desmearing除膠渣Desoldering解焊Developer顯像液,顯像機(jī)Developing顯像Deviation偏差Device電子組件Demetting縮錫DiazoFilm偶氮棕片Dichromate重鉻酸鹽Dicing芯片分割Dicyandiamide(Dicy)雙氰胺Die沖模,鑄模DieAttach晶粒安裝DieBonding晶粒接著DieStamping沖壓Dielectric介質(zhì)DielectricBreakdown介質(zhì)崩潰DielectricBreakdownVoltage介質(zhì)崩潰電壓DielectricConstant介質(zhì)常數(shù)DielectricStrength介質(zhì)強(qiáng)度DifferentialScanningCalorimetry(DSC)微差掃瞄熟卡分析法DiffusionLayer擴(kuò)散層Digitizing數(shù)字化DihedralAngle雙反斜角DimensionalStability尺度安定性,尺寸安定性DimensionalStableAnode(DSA)尺度穩(wěn)定之陽極Dimple酒窩,微凹Diode二極管DlP(DuallnlinePackage)雙排腳封裝體DipCoating浸涂法DipSoldering浸焊法Dipole偶極,雙極DirectClipAttach(DCA)芯片直接安裝在電路板DirectEmulsion直接乳膠Direct/lndirectStencil直間版膜DirectPlating直接電鍍,直接鍍板DiscreteComponent散裝零件DiscreteWiringBoard散線電路板,復(fù)線板DishDown碟型下陷Dispensing逐點(diǎn)分配,定點(diǎn)分配,定量分配Dispersant分散劑DisspationFactor散失因素DisturbedJoint受擾焊點(diǎn)DoctorBlade修平刀,刮平刀DogBoneDesign啞鈴式(原文狗骨式)互連設(shè)計(jì)DogEar狗耳Doping摻雜DoubleAccess雙面露出DoubleDensity雙倍密度DoubleLayer電雙層DoubleTreatedFoil雙面處理銅箔Dragln/DragOut帶進(jìn)/帶出DragSoldering拖焊Drawbridging吊橋效應(yīng)Drift漂移DrillFacet鉆尖切削面DrillPointer鉆針重磨機(jī)DrilledBlank已鉆孔的裸板Dross浮渣DrumSide銅箔光面,光胴面DryFilm干膜DualWaveSoldering雙波焊接Ductility展性Dummy,Dummying假鍍片(板),假鍍DummyLand假墊Durometer橡膠硬度計(jì)DYCOstrate電漿蝕孔增層法DynamicFlex(FPC)動態(tài)軟板DynamicFlexiblePrintedBoard動態(tài)軟板DynamicMechanicalAnalysis(DMA)動態(tài)熱機(jī)分析法E-Beam(ElectronBeam)電子束E-glass電子級玻璃EddyCurrent渦電流Edge-BoardConnector板邊(金手指)承接器Edge-Boardcontact板邊金手指EdgeClip板邊插針Edge-DipSolderabilityTest板面焊錫性測試EdgeSpacing板邊空地,邊寬EDTA乙二胺四醋酸Eductor(液中)強(qiáng)流器,增流器Effluent排放物Elastomer彈性體ElectricStrength(耐)電性強(qiáng)度Electro-depositedPhotoresist電著光阻,電泳光阻Electrodeposition電鍍Electroforming電鑄ElectrolessDeposition無電鍍,化學(xué)鍍ElectrolessNickel/lmmersionGold(EN/LG)化鎳浸金ElectrolyticCleaning電解清洗ElectrolyticToughPitch電解銅Electro-migration電遷移ElectronicPackageHierarchy電子構(gòu)裝層極Electro-phoresis電泳動,電滲,電子構(gòu)裝Electro-staticDamage靜電傷害Electro-tinning鍍錫Electro-winning電解治煉Elongation延伸性,延伸率Embossing凸出性壓花EMF電動勢EMI電磁干擾Emulsion乳化EmulsionSide藥膜面Encapsulating囊封,膠囊Encapsulation封膠,封包Encroachment沾污,侵犯EndCap封頭Entek有機(jī)保焊處理Entrapment夾雜物EntryMaterial蓋板EpoxyResin環(huán)氧樹脂Etchant蝕刻劑,蝕刻液Etchback回蝕EtchFactor蝕刻因子,蝕刻函數(shù)EtchingIndicator蝕刻指標(biāo)EtchingResist抗蝕阻劑EuteticComposition共融組成ExcimerLaser準(zhǔn)分子雷射Exotherm放熱(曲線)ExpandedPTFE擴(kuò)張型”聚四氟乙烯”補(bǔ)強(qiáng)材簡寫為ePTFEExposure曝光Eyelet鉚眼Fabric網(wǎng)布FaceBonding晶面朝下之結(jié)合Failure故障,損壞FailureAnalysis故障分析FanOutWiring/FanInWiring扇出布線/扇入布線Farad法拉Faraday法拉第FatigueStrength抗疲勞強(qiáng)度Fault缺陷,瑕疵FaultPlane斷層面FeasibilityAnalysis可行性分析Features成員,諸元FeedThroughHole導(dǎo)通孔Feeder進(jìn)料器,送料器FiberExposure玻纖顯露FiducialMark基準(zhǔn)記號,光學(xué)靶標(biāo)Filament纖絲,單絲Fill緯向Filler填充料Fillet內(nèi)圓填角,填錫Film底片F(xiàn)ilmAdhesive接著膜,黏合膜Filter過濾器,濾光鏡片,濾波器FinalFinishing外表處理,終面處理FineLine細(xì)線Fineness純度,成色,粒度FinePitch密腳距,密線距,密墊距Finger手指(板邊連續(xù)排列接點(diǎn))Finishing終飾,終修FiniteElementMethod有限要素分析法FirstArticle首產(chǎn)品FirstPass-Yield初檢良品率FishBoneChant魚骨圖Fixture夾具Flair第一面外緣變形,刃角變形Flag芯片安置區(qū)FlamePoint自燃點(diǎn)Flammability燃性FlameResistant耐燃性FlammabilityRate燃性等級Flare扇形崩口FlashPlating閃鍍Flashover閃絡(luò)FlatCoat全平涂布,板面平鋪FlatPlug平塞,平填FlatCable扁平排線FlatPack扁平封裝(之零件)Flatness平坦度FlexiblePrintedCircuit,FPC軟板FlexuralFailure撓曲故障FlexuralModule彎曲模數(shù),抗撓性模數(shù)FlexuralStrength抗撓強(qiáng)度FlexuralStrengthatElevaltedTemperature高漸中抗撓強(qiáng)度FlipChip覆晶,扣晶FlipChipPackaging覆晶封裝法(或組裝法)FloatingShielding浮起式擋架Flocculation絮凝,凝聚FloodStrokePrint覆墨沖程印刷FlowSoldering流焊Fluorescence熒光FlurocarbonResin碳氟樹脂F(xiàn)lushBoard表面全平板FlushConductor嵌入式線路,貼平式導(dǎo)體FlushPoint閃火點(diǎn)Flute退屑槽Flux助焊劑FlyingLead飛腳FoilBurr銅箔毛邊FoilLamination銅箔壓板法Foot殘足FootPrint(LandPattern)腳墊ForeignMaterial外來物,異物Form-to-List布線說明清單FourPointTwisting四點(diǎn)扭曲法Freeboard干舷FreeRadical自由基,自由根Frequency頻率Frit玻璃熔料Fully-additiveProcess全加成法FungusResistance抗霉性FusedCoating熔錫層Fusing熔合FusingFluid助熔液Gage,Gauge量規(guī)GalliumArsenide(GaAs)砷化鎵GalvanicCorrosion賈凡尼式腐蝕GalvanicSeries賈凡尼次序Galvanizing鍍鋅GalvanometerMirror電流計(jì)式反射鏡GAP第一面分離,長刃斷開GasKnifeCooling氯刀冷卻法GateArray闡極數(shù)組,闡列GelTime膠性時(shí)間GelationParticle膠凝點(diǎn)GerberDate,GerberFile格博檔案GETEK奇異公司板材Ghostimage陰影Gilding鍍金GlassFiber玻纖GlassFiberProtrusion/Gouging,Groove玻纖突出/挖破GlassTransitionTemperature,Tg玻璃態(tài)轉(zhuǎn)化溫度Glaze釉面,釉料GlobTop圓頂封裝體GlobuleTest球狀測試法Glycol(EthyleneGlycol)乙二醇GoldenBoard測試用標(biāo)準(zhǔn)板GrainSize結(jié)晶粒度Graphite石墨Grid標(biāo)準(zhǔn)格GroundPlane(orEarthPlane)接地層GroundPlaneClearance接地空環(huán)GullWingLead鷗翼引腳GridSpacing(Distance)格距,孔距GrossLeak大漏GuidePin導(dǎo)針GP(GlobalWarmingPotentials)地球溫室潛因GalfAngle半角Halide鹵化物Haloing白圈,白邊Halon海龍Halation環(huán)暈HardAnodizing硬陽極化HardChromePlating鍍硬鉻HardSoldering硬焊Hardener硬化劑Hardness硬度Haring-BlumCell海因槽Harness電纜組合HayWire跳線HeatCleaning燒潔HeatDissipation散熱HeatDistortionPoint(Temp.)熱變形點(diǎn)(溫度)HeatSealing熱封HeatSink散熱器HeatSinkPlane散熱層HeatsinkTool散熱工具HeatTransferPaste導(dǎo)熱膏,傳熱膏Hertz(tz)赫HighEfficiencyParticulateAirFilter高效空氣塵粒過濾機(jī)Hi-Rel高可靠度HipotTest高壓電測Hit擊HoldingTime停置時(shí)間HoleBreakout孔位破出HoleCounter數(shù)孔機(jī)HoleDensity孔數(shù)密度HoleLocation孔位HolePreparation通孔準(zhǔn)備HolePullStrength孔壁抗拉強(qiáng)度HoleVoid破洞Hook切削刃緣外凸HotAirSolderLevelling(HASL)噴錫HotBar(Reflow)Soldering熱把焊接HotGasSoldering熱風(fēng)手焊HotRollLamination熱轉(zhuǎn)軸壓貼法THE(HighTemperatureElongation)高溫延伸性(率)HullCell哈氏槽HybridintegratedCircuit混成電路HydraulicBulgeTest液壓鼓起試驗(yàn)Hydrogen氫氣HydrogenEmbrittlement氣脆HydrogenOvervoltage氫超電壓,氫過電壓HydrolicPressure液壓,油壓Hydrolysis水解Hydrophilic親水性Hygroscopic吸濕性Hypersorption超吸附I.C.Socket集成電路器插座icicle錫尖Illuminance照度ImageTransfer影像轉(zhuǎn)移,圖像轉(zhuǎn)移Imaging成像處理ImmersionPlating浸鍍ImmersionSilver浸鍍銀ImmersionTin浸鍍錫Impedance阻抗ImpedanceMatch阻抗匹配Impinge沖打Impregnate含浸In-circuitTesting組裝板電測Inclusion異物,夾雜物InterconnectionDefect(ICD)孔壁與孔環(huán)互連處之缺失IndexingHole基準(zhǔn)孔,參考孔Inductance(L)電感In-feedRate(Down-feedRate)進(jìn)刀速率InformationAppliance(IA)信息家電Infrared(IR)紅外線Input/Output輸入/輸出Insert,Insertion插接,插裝InspectionOverlay重合套檢底片InsulationResistance絕緣電阻IntegratedCircuit(IC)集成電路器Interconnection互連Interface界面IntermatallicCompound(IMC)界面合金共化物InternalStress內(nèi)應(yīng)力Interposer互連導(dǎo)電物,互連體InterstitialViaHole(IVH)/InnerHole局部層間導(dǎo)通孔,內(nèi)通孔Invar殷鋼IonCleanliness離子清潔度IonExchangeResins離子交換樹脂IonMigration離子遷移Ionizable(Ionic)Contaimination離子性污染Ionization游離,電離IonizationVoltage(CoronaLevel)電離化電壓(電暈水平)IPC美國印刷電路板協(xié)會Isolation隔離性,隔絕性IsotropicConductiveAdhesive均向?qū)щ娔zJ-LeadJ型接腳,彎鉤型接腳JEDEC聯(lián)合電子組件工程委員會JobShop專業(yè)工廠,職業(yè)工廠Joule焦耳JumpWire跳線Junction接(合)面,接頭Just-In-Time(JIT)適時(shí)供應(yīng),及時(shí)出現(xiàn)Kapton聚亞酰胺軟材Karat克拉,開Kauri-ButanolValue考立丁醇值(簡稱K.B值)Kerf切形,裁截Kevlar聚酰胺纖維Key電鍵KeyBoard鍵盤,鍵盤板KissPressure吻壓,低壓KnoopHardness努普硬度KnownGoodDie(KGD)已知之良好芯片Kovar科伐合金KraftPaper牛皮紙LamdaWave延伸平波LaminarFlow平流LaminarStructure片狀結(jié)構(gòu)LaminateVoid板材空洞LaminationVoid壓合空洞Laminate(s)基板/積層板Laminator壓膜機(jī)Land孔環(huán)焊墊,表面(方型)焊墊LandGridArray(LGA)承墊(焊墊)格列封裝法LandlessHole無環(huán)通孔LargeWindow開大窗Laser雷射,激光LaserAblation雷射燒蝕,雷射成孔LaserAblationThresholds燒蝕起限LaserAbsorption(Absortance)雷射吸收度LaserBeamDivergence雷射散射光束LaserConformalMask銅窗LaserDirectImaging(LDI)雷射直接成像LaserFluence能量密度LaserHeatAffedtedZone雷熱感應(yīng)LaserMachining雷射加工法LaserPhotochemicalAblation光化性裂蝕LaserPhotogenerator(LPG),LaserPhotoplotter雷射曝光機(jī)LaserPhotothermalAblation光熱性燒蝕LaserPowerDensity功率密度LaserPulseFrequency脈沖頻率LaserPulsetoPulseStability脈沖穩(wěn)定性LaserPulseWidth,PulseLength(orPulseDuration)脈沖長度LaserSoldering雷射焊接法LaserStructuring雷射成線術(shù)LaserTrepanning雷射環(huán)鋸成孔法LayBack刃角磨損,突刃LayUp迭合Layout布線,布局LayertoLayerRegistration層間對準(zhǔn)度LayertoLayerSpacing層間距離Leaching焊點(diǎn)熔滲,漂出,溶出Lead引腳,接腳LeadFrame腳架LeadPitch腳距,中距,跨距LeadingEdge尖端,先鋒LeakageCurrent漏電電流LearningCurve學(xué)習(xí)階段,學(xué)習(xí)曲線Legend文字標(biāo)記,符號Leveling整平LiftedLand孔環(huán)(或焊墊)浮起Ligand錯離子附屬體LightIntegrator光能累積器,光能積分器LightEmittingDiodes,LED發(fā)光二極管LightIntensity光強(qiáng)度LimitingCurrentDensity極限電流密度Lipophilic親油性LiquidCrystalDisplay,LCD液晶顯示器LiquidCrystalPolyesterFiber(LCP)液晶聚酯類纖維LiquidDielectrics液態(tài)介質(zhì)LiquidPhotoimagibleSolderMask,LPSM液態(tài)感光防焊綠漆Lithography影像轉(zhuǎn)移,網(wǎng)印技術(shù)LocalAreaNetwork局域網(wǎng)絡(luò)Logic邏輯LogicCircuit邏輯電路Loop回路LossTamgent(TanδDk)損失正切LotSize批量Luminance發(fā)光強(qiáng)度,耀度Lyophilic可親水性膠體Macro-throwingPower巨觀分布力MajorDefect嚴(yán)重缺點(diǎn),主要缺點(diǎn)MajorWeaveDirection主要纖向Margin刃帶,脈筋Marking標(biāo)記Mask阻劑MassFinishing大量整面,大量拋光MassLamination大型壓板(層壓)MassTransport質(zhì)量輸送MasterDrawing主圖Mat席MatteSide毛面Mealing泡點(diǎn)MeanTimeToFailure故障前可使用之平均時(shí)數(shù)Measling白點(diǎn)MechanicalStretcher機(jī)械式張網(wǎng)機(jī)MechanicalWarp機(jī)械性纏繞Mechanism機(jī)理MembraneSwitch薄膜開關(guān)MeniscographTest弧面狀沾錫試驗(yàn)Meniscus彎月面,上凹面MercuryVaperLamp汞氣燈MeshCount網(wǎng)目數(shù)MetalcoreBoad(Sulstrate)金屬夾心板MetalHalideLamp金屬鹵素?zé)鬗etallization金屬化MetallizedFabric金屬化網(wǎng)布Metalphototool金屬底片Micelle微胞MicroBGE(μ-BGA)微型BGAMicro–electronics微電子Microetching微蝕Microsectioning微切片法Microstrip微條線,微帶線MicrostripLine微條線,微帶線MicrothrowingPower微分布力Microvia微盲孔,微孔Microwave微波MicrowireBoard復(fù)線板,微封線(漆包線)路板Migration遷移MigrationRate遷移率Mil英絲,條MinimumAnnularRing孔環(huán)下限MinimumElectricalSpacing下限電性間距,最窄電性間距MinorWeaveDirection次要纖向Misregistration失準(zhǔn),對不準(zhǔn)MixedComponentMountingTechnology混合零件之組裝技術(shù)Modelling模型法,模式法Modem調(diào)變及解調(diào)器,調(diào)制解調(diào)器Modification修改,改質(zhì)Module模塊ModulusofElasticity彈性模數(shù),彈性系數(shù)MoistureAbsorption吸濕率,吸水率(又名WaterAbsorption)MoistureandInsulationResistanceTest濕氣與絕緣電阻試驗(yàn)(MIR)MoldRelease脫模劑,離型劑Mole摩爾,克分子,克原子Monofilament單絲MotherBoard主構(gòu)板,母板,主機(jī)板MouldedCircuit模造立體電路板MountingHole組裝孔,機(jī)裝孔MouseBite鼠齒Multi-Chip-Module(MCM)多芯片(芯片)模塊MultiwiringBoard(orDiscreteWiringBoard)復(fù)線板NailHead釘頭N.C數(shù)值控制NearIR近紅外線NeedleDispense針管注射法Negative負(fù)片,鉆尖第一面外緣變窄Negative-actingResist負(fù)性作用之阻劑,負(fù)型阻劑NegativeEtchback反回蝕NegativeStencil負(fù)性感光版膜Network網(wǎng)狀組件Newton(N)牛頓NewtonRing牛頓環(huán)NewtonianLiquid牛頓流體Nick缺口N-MethylPyrrolidine(NMP)N-甲基四氫比咯NobleMetalPaste貴金屬印膏Node節(jié)點(diǎn)Nodule瘤NoiseBudget噪聲上限Nomencleature標(biāo)示文字符號,命名法NominalCuredThickness標(biāo)示厚度Non-circularLand非圓形孔環(huán)焊墊Non-contactTesting非接觸性電性測試Non-flammable非燃性Non-Flow非流性Non-recurringEngineeringCost非經(jīng)常性工程成本Non-Wetting不沾錫NormalConcentration(Strength)標(biāo)準(zhǔn)濃度,當(dāng)量濃度NormalDistribution常態(tài)分配,常態(tài)分布Novolac酯醛樹脂Nucleation,Nucleating核化NumericalControl數(shù)值控制,數(shù)控Nylon耐龍Occlusion吸藏Off-contact架空Offset第一面大小不均OFHC無氧高導(dǎo)電銅Ohm奧姆Oilcanning蓋板彈動OLB(OuterLeadBond)外引腳結(jié)合Oligomer寡聚物OmegaMeter離子污染檢測儀OmegaWave振蕩波On-contactPrinting密貼式印刷Opaquer不透明劑,遮光劑OpenCircuits斷線OpticalComparator光學(xué)對比器(光學(xué)放大器)OpticalDensity光密度OpticalFiber光纖OpticalInspection光學(xué)檢驗(yàn)OpticalInstrument光學(xué)儀器OrganicSolderabilityPreservatives有機(jī)保焊劑Osmosis滲透Outgassing出氣,吹氣Outgrowth懸出,橫出,側(cè)出Output產(chǎn)出,輸出Overflow溢流Overhang總浮空Overiap鉆尖點(diǎn)分離Overpotential(Overvoltage)過電位,過電壓Oxidation氧化OxidationReductionPotential(ORP)氧化還原電位Oxygenlnhibitor氧氣抑制現(xiàn)象OzoneDepletion臭氧層耗損OzoneKiller臭氧層殺手Packaging封裝,構(gòu)裝PackagingEfficiency封裝效率Pad焊墊,圓墊PadMaster圓墊底片(孔位底片)PadsonVia蓋盲孔,反盲孔PadsOnlyBoard唯環(huán)板Palladium鈀Panel生產(chǎn)板面,制程(排)板,一個(gè)大片板PanelPlating全板鍍銅,PanelProcess全板電鍍法PaperPhenolic紙質(zhì)酚醛樹脂(板材)ParasiticsCapacity(Capacitance)寄生電容PartingAgent脫膜劑Passivation鈍化,鈍化處理PassiveDevice(Conponent)被動組件(零件)Paste膏,糊Pastevia銅膏導(dǎo)孔Pattern板面圓形PatternPlating線路電鍍(大陸術(shù)語稱圓形電鍍)PatternProcess線路電鍍法PeakVoltage峰值電厭PeelStrength 抗撕強(qiáng)度PeriodicReverse(PR)Current周期性反電流PeelableResist可剝膠,可撕阻劑PerimeterArray周邊排列,四周排列PeriodicReverse(PR)Current周期性反向電流Peripheral周邊附屬設(shè)備Permeability透氣性,導(dǎo)磁率Permittivity容電率(日文為誘電率)Phase相PhaseDiagram相圖Phenolic酚醛樹脂PhValue酸堿值Photofugitive感光褪色PhotographicFilm感光成像之底片Photo-imagibleDielectric(PID)感光介質(zhì)(材料)Photoinitiator感光啟始劑Photomask光罩Photoplotter,Plotter光學(xué)繪圖機(jī)Photoresist光阻PhotoresistChemicalMachining(Milling)光阻式化學(xué)(銑刻)加工Phototool底片Photo-Via感光孔,感光成孔PickandPlace拾取與放置Piezoelectric壓電性Pin接腳,插梢,插針PinGridArray(PGE)針腳格列封裝體Pin-In-Paste(PIP)錫膏中插腳Pinhole針孔PinkRing粉紅圈Pitch跨距,腳距,墊距,線距,中距Pits凹點(diǎn)PlainWeave平纖Planarity平坦性Planarization精密磨平,精密壓平Plasma電漿Plasticizers可塑劑,增塑劑PlatedThroughHole,PTH鍍通孔Platen熱盤Plating鍍Plotting標(biāo)繪Plowing犁溝Plug插腳,塞柱PlugGauge孔規(guī)Ply層,股PneumaticStretcher氣動拉伸器PogoPin伸縮探針PointAngle鉆尖角PointSourceLight點(diǎn)狀光源Point鉆尖Poise泊PolarSolvent極性溶劑Polarity電極性Polarization分極化,極化PolarizingSlot偏槽PolySolder聚合物焊料PolyesterFilms聚酯類薄片Polyimide(PI)聚亞酰胺PolymerThickFilm(PTF)厚膜糊Polymerization聚合,聚合反應(yīng)PopcornEffect爆米花效應(yīng)PorosityTest疏孔度試驗(yàn)PositiveActingResist正型(性)光阻劑PostSeparation后制程分離,事后分離PostTreatment后處理Postcure后續(xù)硬化,后烤PotLife適用期,堪用時(shí)段Potting鑄封,模封Porcelain瓷材,瓷面PowerSupply電源供應(yīng)器Preform預(yù)制品Preheat預(yù)熱Prepreg膠片,樹脂片PressPlate鋼板Press-FitContact擠入式接觸PressureCookerTest壓力銅試驗(yàn)Pre-tinning預(yù)先沾錫Primaryimage線路成像Probe探針PressureFoot壓力腳PrintandEtch印后即蝕,成像后立即蝕刻PrintThrough壓透,過度擠壓PrismHoleInspector九孔鏡ProcessCamera制程用照像機(jī)ProcessWindow操作范圍ProductionMaster生產(chǎn)底片Profile輪廓,剖面圖,升溫曲線圖,棱線Propagation傳播PropagationDelay傳播延遲PuddleEffect水坑效應(yīng)PullAway拉離PulsePlating脈沖電鍍法PumicePowder浮石粉Punch沖切Purge,Purging凈空,凈洗PurplePlague紫疫Pyrolysis熱裂解,高溫分解Q-Factor(QualityFactor)(板材之)質(zhì)量因素QuadDensity四倍密度QuadFlatPack(QFP)方扁形封裝體Qualification資格認(rèn)可QualificationAgency資格認(rèn)證機(jī)構(gòu)Qualificationinspection資格檢驗(yàn)QualifiedProductsList合格產(chǎn)品(供應(yīng)者)名單QualitativeAnalysis定性分析QualityAssurance質(zhì)量保證QualityConformanceTestCircuitry(Coupon)質(zhì)量符合之試驗(yàn)線路(樣板)QualityControl質(zhì)量管理QualityInspection質(zhì)量檢查,質(zhì)量檢驗(yàn)QuantitativeAnalysis定量分析Quench淬火,驟冷QuickDisconnect快速接頭Quill緯紗繞軸Rack掛架RadialLead放射狀引腳RadioFrequencyInterference(RFL)射頻干擾Radiometer輻射計(jì),光度計(jì)RakeAngle(orHelixAngle)耙起角,盤旋角,摳角,耙角RatedTemperature,Voltage額定溫度,額定電壓Reactance電抗RealEstate板面空地,底材面,基板面Real-TimeSystem實(shí)時(shí)系統(tǒng)Reclaiming再生,再制ReeltoReel卷輪(盤)式操作ReferenceDimension參考尺度,參考尺寸ReferenceEdge參考邊緣Reflection反射ReflowProfile熔焊溫度曲線ReflowSoldering重熔焊接,熔焊Refraction折射RefractiveIndex折射率RegisterMark對準(zhǔn)用標(biāo)記Registration對準(zhǔn)度Reinforcement補(bǔ)強(qiáng)物,補(bǔ)強(qiáng)材Rejection剔退,拒收Relamination(Re-Lam)多層板壓合RelativePermitivity(ε)相對容電率Relaxation松馳,緩和Relay繼電器ReleaseAgent,ReleaseSheets脫模劑,離型膜Reliability可靠度,信賴度Relief削空ReliefAngle浮角,切削浮角,浮空角Repair修理RepeatedInsertion多次插觸ResinCoatedCopperFoil背膠鉛箔ResinContent膠含量,樹脂含量ResinFlow膠流量,權(quán)脂流量ResinRecession樹脂縮陷ResinRichArea樹脂豐富區(qū),多膠區(qū)ResinSmear膠糊渣,膠渣ResinStarvedArea樹脂缺乏區(qū),缺膠區(qū)Resist陰劑,陰膜Resistivity電阻系數(shù),電阻率Resistor電阻器,電阻ResistorDrift電阻漂移ResistorPaste電阻印膏Resolution解像,解像度,分辨率ResolvingPower解析力,解像力(分辨力)RetractionRate退刀(針)速率ReturnPath歸路,回程ReverseBlindHole反盲孔,壓合盲孔ReverseCurrentCleaning反電流(電解)清洗ReverseEtchback反回蝕Reverselmage負(fù)片影像(阻劑)ReverseOsmosis(RO)逆滲透Reversion反轉(zhuǎn),還原Revision修正版,改訂版Rework(ing)重工,再加工Rhology流變學(xué),流變性質(zhì)RibbionCable圓線纜帶Rigid-FlexPrintedBoard硬軟合板Ring套環(huán)Rinsing水洗,沖洗Ripple紋波RiseTime(tr)升起時(shí)間,上升時(shí)間Roadmap產(chǎn)品變化趨勢Robber輔助陰極RolltoRoll(ReeltoReel)卷軸對卷軸(連續(xù)生產(chǎn)位)RolledandAnnealedCopperFoil(RAFoil)輥輾銅箔,壓延銅箔RollerCoating滾筒涂布法,輥輪涂布法RollerCutter輥切機(jī)(業(yè)界俗稱鋸板機(jī))RollerTinning輥錫法,滾錫法Rosin松香RotaryDipTest擺動沾錫試驗(yàn)RouteandRetainStiffeners(軟板)切術(shù)外形之補(bǔ)強(qiáng)模板Routing切外型Runout偏轉(zhuǎn),累積距差Rupture進(jìn)裂SacrificialProtection犧牲性保護(hù)層SaltSprayTest鹽霧試驗(yàn)SandBlast噴砂Saponification皂化作用Saponifier皂化劑SatelliteHandset衛(wèi)星行動電話手機(jī)SatinFinish緞面處理ScaledFlowTest比便流量試驗(yàn)Scavening刮凹,刮走,刮凹帶走SchematicDiagram電路概略圖Scoring刻溝,刻槽,V型刻槽Scratch刮痕ScreenPrinting網(wǎng)版印刷Screenability網(wǎng)印能力Scrubber磨刷機(jī),磨刷器SculpturedFlexCircuit雕刻式軟板Scum透明殲?zāi)ealing封孔SecondarySide第二面Seeding下種SelectivePlating選擇性電鍍Self-Alignment自我回正Self-Distinguishing自熄性Selvage布邊Semi-additiveProcess半加成制程Semiconductor半導(dǎo)體Sensitizing敏化SeparableComponentPart可分離式零件SeparatorPlate隔板,鋼板,鏡板SequentialBuild-UP(SBU)完工后(逐次)增層SequentialBuriedVia(SBV)增層后之埋孔SequentialElectrochemicalReductionAnalysis(SERA)順序性電化學(xué)還原分析法SequentialLamination接續(xù)壓合法,鍍后壓合式制程SequesteringAgent螫合劑SerpentineLine蛇形線路Shadowing陰影,回蝕死角ShadowMoire(orTherMoire)莫瑞光影法ShearStrength抗剪(力)強(qiáng)度ShelfLife儲齡Shield遮蔽,屏遮ShoreHardness蕭氏硬度Short短路ShoulderAngle肩斜角Shunt分路SideWall側(cè)壁Siemens電阻值Sigma(StamdardDeviation)標(biāo)準(zhǔn)差Signal訊號SignalIntegrity(SI)訊號完整性Silane硅烷SilicaGel硅膠砂Silicon硅SiliconPlatforms封裝載板,硅芯片平柜Silicone硅銅SilkScreen絲網(wǎng)SilverMigration銀遷移SilverPaste銀膏SilverFhroughHole(STH)銀膠貫孔,銀膠通孔Single-InlinePackage(SIP)單邊插腳封裝體Singulation單片化,裁切單片Sintering燒結(jié)Sizing上漿處理,上漿Skew(訊號)正時(shí)歪斜,錯時(shí)SkinEffect集膚效應(yīng),表皮效應(yīng)SkipPrinting,SkipPlating漏印,漏鍍SkipSolder缺錫,漏焊SlashSheet(規(guī)范)附列規(guī)格單Slashing漿經(jīng)SleeveJint套接Sliver邊絲,邊條Slot,Slotting槽口,開槽Sludge沉殿物,淤泥Smear膠糊渣,膠渣Smudging錫點(diǎn)沾污Snap-off彈回高度Socket插座SoftContact輕觸SoftGlass軟質(zhì)玻璃(鉛玻璃)Solder焊錫SolderBall焊錫球,錫球SolderBridging錫橋SolderBump焊錫凸塊SolderColumnPackage錫柱腳封裝法SolderConnection焊接點(diǎn)SolderCoat焊錫皮膜SolderDam防焊,錫堤,阻焊堤SolderFillet填錫SolderJointDensity焊點(diǎn)密度SolderLevelling噴錫,熱風(fēng)整平SolderMask(S/M)綠漆,防焊膜SolderPaste錫膏SolderPlug錫塞,錫柱SolderPreforms預(yù)焊料SolderProjection焊錫突點(diǎn)SolderSag焊錫垂流物SolderSide焊錫面SolderSpatter濺錫SolderSplash濺錫SolderSpreadTest散錫試驗(yàn)SolderWebbing錫網(wǎng)SolderWicking焊錫之燈芯效應(yīng),滲錫SolderWire焊錫絲,軟焊絲Solderability焊錫性,可焊性Soldering軟焊,焊接SolderingFluidSolderingoil助焊液,護(hù)焊油Solderingiron烙鐵,焊槍SolidContent固體含量,固形份,固形物SolidusLine固相線SolubilityProduct溶解度乘積,溶解度積Spacing間距Span跨距SparkOver閃絡(luò)Specification(Spec)規(guī)范,規(guī)格SpecificHeat比熱Specimen樣品,試樣Spectrophotometry分光光度計(jì)檢測法Spindle鉆軸,主軸SpinningCoating自轉(zhuǎn)涂布Splay斜鉆孔SpokeConnection輪輻狀連接墊SprayCoating噴著涂裝,噴射涂裝Spur底片圖形邊緣突出SpursandNodules突刺與殲瘤Sputtering濺射Squeege刮刀StackedHeight迭高StackedMicrovia迭置式微盲孔StackedCSP(StackedChips)重迭式芯片級封裝體StaggerGrid蹣跚格點(diǎn)Stalagometer滴管式表面張力計(jì)Stand-offTerminals直立型端子Starvation缺膠StateoftheArt藝術(shù)境界StaticEliminator靜電消除器SteelRuleDie(鋼)刀模Stencil版膜StepandRepeat逐次重復(fù)曝光StepMicrovia(Via)梯階式微盲孔(盲孔)StepPlating梯階式鍍層StepTablet階段式(光密度)曝光表Stiffener補(bǔ)強(qiáng)條,補(bǔ)強(qiáng)板Stop-off阻劑,防鍍膜Strain變形,應(yīng)變Strand絞StrayCurrent迷走電流,散雜電流StressCorrosion應(yīng)力腐蝕StressRelief消除應(yīng)力Strike預(yù)鍍,打底Stringing拖尾,牽絲Stripline條線,帶線Stripper剝除液,剝除器Stub支線,線腳Sublimates升華SubstractiveProcess減成法Substrate板材,素材,底材,封裝載板SuperSolder超級焊錫SupportedHole(金屬)支助通孔SurfaceEnergy表面能SurfaceInsulationResistance(SIR)表面絕緣電阻SurfaceMountDevice表面黏裝零件SurfaceMountingTechnology表面黏(貼)裝技術(shù)SurfaceResistivity表面電阻率SurfaceSpeed鉆孔表面(切線)速度SurfaceTension表面張力Surfactant表面潤濕劑Surge突流,突壓SwagedLead壓扁式引腳SwellingAgents,Sweller膨松劑Swimming線路滑移SwitchingNoise(高低準(zhǔn)位間)交換噪聲SyntheticResin合成樹脂Syringe擠漿法,擠膏法,注漿法Tab接點(diǎn),金手指TaberAbraser泰伯磨試器TackDry預(yù)干,預(yù)硬化Tackiness黏著性,黏手性TapeAutomaticBonding(TAB)卷帶自動結(jié)合TapeCasting帶狀鑄材TapeTest撕膠帶試驗(yàn)Tape-upMaster原始手貼片TapedComponents卷帶式連載零件TaperPinGauge錐狀孔規(guī)TapingandReeling帶卷式載料(小零件)TargetPad(微盲孔)底墊Tarnish污化,污著Teflon鐵氟龍Telegraphing浮印,隱印Temperature-TimeProfile溫度時(shí)間曲線Template模板TensileStrength抗拉強(qiáng)度Tensiomenter張力計(jì)Tenting蓋孔法Terminal端子TerminalClearance端子空環(huán),端子讓環(huán)Tetra-Etch氟樹脂粗蝕劑TetrafunctionalResin四功能樹脂Texturing粗化,紋理化ThermalCoefficientofExpansion(TCE)熱膨脹系數(shù)ThermalConductivity導(dǎo)熱率ThermalCycling熱循環(huán),熱震蕩ThermalDirectImage(TDI)感熱式直接成像ThermalMismatch感熱不同,感熱失諧ThermalPad孔環(huán)十字橋,抗熱墊ThermalRelief散熱式鏤空ThermalShockTest熱震蕩試驗(yàn)ThermalStress熱應(yīng)力ThermalStressTest熱應(yīng)力試驗(yàn)ThermalVia導(dǎo)熱孔,散熱孔ThermalZone感熱區(qū)ThermocompressionBonding熱壓結(jié)合Thermocouple熱電偶Thermode發(fā)熱體ThermodeSoldering熱模焊接法ThermogravimetricAnalysis(TGA)熱重分析法ThermomechanicalAnalysis(TMA)熱機(jī)分析法Thermoplastic熱塑性Thermosetting熱固性ThermosonicBonding熱超音波結(jié)合Thermount聚酰胺短纖席材(紙材)Thermo-Via導(dǎo)熱孔ThickFilmCircuit厚膜電路Thief輔助陰極ThinCopperFoil薄銅箔ThinCore薄基板ThinFilmTechnology薄膜技術(shù)ThinSmallOutlinePackange(TSOP)薄小型體積電路器Thinner調(diào)薄劑,稀釋劑Thixotropy抗垂流性,搖變性,搖溶性,靜凝性Three-LayerCarrier三層式載體ThreePointBending三點(diǎn)壓彎試驗(yàn)ThresholdLimitValue(TLV)極限值ThroughHoleMounting通孔插裝Throughput物流量,物料經(jīng)過量ThrowingPower分布力TieBar分流條TinDrift錫量漂失TinImmersion浸鍍錫TinPest錫疫TinWhishers錫須Tinning熱沾焊錫Tolerance公差Tombstoning墓碑效應(yīng)ToolingFeature工具標(biāo)的物,工具諸元,工具成員TopView俯視圖Topography表面地形,粗糙度TorsionStrength抗扭強(qiáng)度TotalIndicatedRunout(TIR)總體標(biāo)示偏轉(zhuǎn)值TouchUp觸修,簡修,小修Trace線路,導(dǎo)線Traceability追溯性,可溯性Track線路Transducer轉(zhuǎn)能器TransferBump移用式突塊,轉(zhuǎn)移式突塊TransferLaminatiedCircuit轉(zhuǎn)壓式線路TransferSoldering移焊法Transistor晶體管Translucenc半透性TransmissionLine傳輸線Transmittance透光率TrapzoidShape梯形Treament,Treating含浸處理Treeing枝狀鍍物,鍍須Trim修整,修改數(shù)值,精修TrimLine裁切線Trimming修整,修迭TruePosition真位Tungsten鎢TungstenCarbide碳化鎢TurnkeySystem(Solution)包辦式系統(tǒng),整本解決方案,委外全包式做法TurretSolderTerminal塔立式焊接端子TwillWeave斜纖法,菱纖法Twist板翹,板扭TwoLayerCarrier兩層式載體ULSymbol‘保險(xiǎn)業(yè)試驗(yàn)所’標(biāo)志UltimateTensileStrength(UTS)極限抗拉強(qiáng)度UltraHighFrequency(UHF)特高頻率UlraVioletCuring(UVcuring)紫外線硬化UltrasonicBonding超音波結(jié)合UltrasonicCleaning超音波清洗UltrasonicSoldering超音波焊接UnbalancedTransmissionLine非平衡式