Flip Chip Process Briefing Introduce

1、Flip Chip Process Briefing IntroduceFCOS PackagePackage Drawing NumberActual TapeSuppliersMFC3.1MFC5.6MFC5.8Contact SideChip SideModule MFC3.1: Module ConstructionPackage Items:Pitch:9.5 mmTyp. Chip Size:2.3 x 3.3 mmDimension: 11 x 8.3 mmThickness: max. 0.50 mmContact-Surface: Ni/Au improvedActivech

2、ip sideICViaISO contacts(Cu/Ni/Au)PETsubstrateHotmeltElectrical chip connection via bumpsChipNCP (Non Conductive Paste)Contact SideChip SideModule MFC5.6: Module ConstructionNCP (Non Conductive Paste)Activechip sideICViaISO contacts(Cu/Ni/Au)PETsubstrateHotmeltElectrical chip connection via bumpsChi

3、pCard bodyPackage Items:Pitch:9.5 mmMax. Chip Size: 3.2 x 4.5 mmDimension: 11 x 8.3 mmThickness: max. 0.50 mmContact-Surface: Ni/Au improvedContact SideChip SideModule MFC5.8: Module ConstructionNCP (Non Conductive Paste)Activechip sideICViaISO contacts(Cu/Ni/Au)PETsubstrateHotmeltElectrical chip co

4、nnection via bumpsChipCard bodyPackage Items:Pitch:14.25 mmMax. Chip Size: 4.20 x 4.60 mm Dimension: 13 x 11.8 mmThickness: max. 0.50 mmContact-Surface: Ni/Au improvedStudbump for FCOS products(at preassembly)chippadchippadbumpMachine Type:l AT Premier Capability: l6 & 8 WaferAttention lower Spe

5、c limitmin. average valuetarget valuemax. average valueUpper Spec limitNail head diameter m707584100105Nail head height m1215192326Bump height m2527313537Shear force gr35 45 ParameterSample sizeFrequency (valid for all parameters)Nail head high10 bumps per wafer 2 wafer per machine und shift.Nail he

6、ad diameter10 bumps per wafer additionally after product change-overBump high10 bumps per wafer additionally by machines downtimes 8 hours.Nail head shear force10 bumps per wafer additionally after every maintenance service.Check the area around the reference die to make sure the wafer map correct.F

7、COS ProcedureReturnWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDeliveryReturnFCOS ProcedureWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDelivery3*Quantum OEE: 68%Model: 8800FCManufacturer：Dataconn (Germany)U

8、PH: 8800 pcsCapacity:10 pcsReturnFCOS ProcedureWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDelivery3*Curing OEE: 68%Model: Smart-card Line 7007Manufacturer：eurotec (Germany)UPH: 8800 pcsWeekly Capacity:10 pcsReturnWafer receivingQuantumCuring& Inlin

9、e TestOptical InspectionElectrical TestingOQAPackingDeliveryFCOS ProcedureReturn3*Electrical Testing OEE: 70%Model: CMT 6550/O + C320MXManufacturer：Muhlbauer (Germany)+SPEA (Italy)UPH: 17270 pcsWeekly Capacity:41pcsWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAP

10、ackingDeliveryFCOS ProcedureReturnWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDeliveryFCOS ProcedureReturnWafer receivingQuantumCuring& Inline TestOptical InspectionElectrical TestingOQAPackingDeliveryFCOS ProcedureWB Training Material WB簡介簡介 wire b

11、ond的目的 用導(dǎo)線將半導(dǎo)體芯片上的電極（第一焊點）與外部引腳（第二焊點） 相連接，完成芯片與封裝外引腳間的電流通路。 1st bond 2nd bond wire bond的原理 利用USG，壓力，時間，溫度四個參數(shù)的共同作用，將相互接觸的兩種 金屬發(fā)生軟化變形,同時兩種金屬間發(fā)生原子擴散形成金屬化合物或 合金,保證焊線鍵合是可靠的電路連接.WB 過程過程leadleadleadFree air ball formationBall BondLoop formationWedge Bond 基本術(shù)語基本術(shù)語Ball bondFree air ballWedge bond材料材料 劈刀 1.

12、型號選擇 目前Assembly只有一種劈刀，型號為：UTS 90-15A-C-1/16 XL 2. 壽命管控 (設(shè)備計數(shù))：500K 3. 安裝：扭力扳手 金線 1.直徑:24um 2.型號選擇 目前有兩種型號: HD5 & HD3 根據(jù)loop parameter上的要求進行選擇和確認 貼有芯片的載帶 設(shè)備設(shè)備 設(shè)備型號 ESEC3006/ESEC3088 參數(shù)設(shè)定 1. 參數(shù)包括Loop 參數(shù)和bonding 參數(shù) 2. 設(shè)備型號不同，bonding參數(shù)設(shè)定也不同 3. bonding 參數(shù)和Loop 參數(shù)的選用根據(jù)chip sheet 上的指示 來選擇 參數(shù)的檢查 1.作業(yè)員在每

13、次開班時需要檢查參數(shù)，并將其記錄在相應(yīng)記錄表內(nèi) 2. 檢查參數(shù)并不僅僅是將數(shù)據(jù)抄錄在記錄表上，同時也需要核對參 數(shù)規(guī)范，如果超過spec范圍，需要立刻停機，通知技術(shù)員調(diào)整。 失效模式失效模式Golf ballRound ball Wire scratch Stitch lifting Sagging wireNeck bond 失效模式失效模式TailingcrateringDie crackPad offset過程控制過程控制 換型時 1. 技術(shù)員根據(jù)Set-up card和Set-up流程完成Set-up 并在Set-up card上對已完成的項目打勾，并簽字。 2. 在一些墨點芯片上打上

14、金線送至SPC，SPC需要測量和檢查的項目有: 球高；球徑；弧高； 金球推力; 金線拉力；弧形檢查. 以上項目通過后SPC記錄并簽字 3. SPC通過并正常生產(chǎn)100粒后，作業(yè)員需要檢查以下項目: ISO面失效；塌絲； 金線焊接位置； 金線受破壞； 金球位置超過PAD 30%, 墨點芯片; 金線漏焊；雙金線；弧形。 以上項目通過后簽字 4. 第二技術(shù)員的雙重檢查 檢查項目:球形； Wedge non-stick; Ball non-stick; 弧形， 參數(shù)檢查，有否斷線 以上項目通過后簽字 5. 開始正常生產(chǎn) 過程控制過程控制 開班時 1. 參數(shù)的檢查與記錄 2. 球形，弧形，金球位置；斷線

15、；pad/lead open；金線刮傷 等項目檢查 3. 金線型號確認 Visual inspection 1. 頻率 1X/30min 2. 樣本數(shù) =12pcs 3. 工具：顯微鏡 4. 記錄檢查狀況 Wire Bond Process鍵合工藝詳解Wire bond detail informationWire bond detail informationWire bond detail informationWire bond detail informationWire bond detail informationWire bond detail informationWire b

16、ond detail informationWire bond detail informationPerfect Ball ShapeWire bond detail informationAcceptance Ball ShapeWire bond detail informationBad Ball!Wire bond detail informationAction:Increase the air pressure of wire tensionIncrease the EFO parameter to get a bigger free air ballIncrease the w

17、edge force and ultrasonic power to straighten the wire tailChange the capillaryFCOS 工藝流程及常見產(chǎn)品Wafer receivingQuantumCuring& Inline TestVisual InspectionElectrical TestingOQAPackingDeliveryMFC3.1MFC5.6MFC5.8Work Station LayoutFCOSFCOS Datacon Line Zone Area Area Owner: FCOS Working Station Input B

18、uffer Output Buffer TesterFCOS Datacon Line Inspection Area Area Owner: FCOS Working Station Input Buffer Output Buffer TesterFuguai HolderLead tape HangerCurrent ProcessLot Traveler Scissor Pen Marker Pen Module GaugeTFMAir Gun HolderFCOS Datacon Line Working Area Area Owner: FCOS Working Station I

19、nput Buffer Output Buffer TesterTechnician Tool.Equipment Parts. During RepairNew ColletTechnician Tool.Equipment Parts. During RepairTechnician Tool.Equipment Parts. During RepairQuantumEurotecCommunication SheetCommunication SheetFCOS Line Working Station Area Owner: FCOS Working Station Input Buf

20、fer Output Buffer TesterCollet recording FileChip Sheet Pen Marker Pen TweezersEpoxy Holder Ethanol Acetone Cotton StickMasking TapeRed/ WhiteHigh TemperatureTapeTapeProduction recording FilecolletFinger cordOperator / Technician stationaryCleaning RagsSkeleton WaferCassetteNew lot TravelerFCOS Muhl

21、bauer Line Zone Area Area Owner: FCOS Working Station Input Buffer Output Buffer TesterFCOS Muhlbauer Line Inspection Area Area Owner: FCOS Working Station Input Buffer Output Buffer TesterFuguai HolderLead tape Hanger Scissor Pen Marker Pen Module GaugeCurrent ProcessLot TravelerTFMFCOS Muhlbauer L

22、ine Working Area Area Owner: FCOS Working Station Input Buffer Output Buffer TesterTechnician Tool.Equipment Parts. During RepairTechnician Tool.Equipment Parts. During RepairCommunication SheetTraining Material for FCOS FCOS 簡介簡介 FCOS技術(shù)是與傳統(tǒng)的用金線健合技術(shù)不同的一種新工藝。它先是在芯片正面的焊盤上植金球，然后在把芯片從晶圓上拾起后倒轉(zhuǎn)180度，讓植好的金球直接與引線框或叫載帶焊接，從而省去了金線健合的步驟。工藝流程如下所示:植球倒裝焊接chippadFCOS 簡介簡介固化在線電性能測試Flip Chip Theory 倒裝焊原理Place 貼片貼片Pick 拾取拾取Wafer 晶圓Ejector 頂針Flip 倒置倒置Pick 拾取拾取Collect 吸嘴Gyre Collect 回轉(zhuǎn)吸嘴Tape 載帶材料材料 膠水（Glue) 規(guī)格型號及在常溫下的壽命：Nagase T693/UFR302