QC常用單詞-中英對(duì)照

1、 品 質(zhì) 系 統(tǒng) 常 見(jiàn) 英 文 簡(jiǎn) 介1. QC : quality control 品質(zhì)管制 2.IQC : incoming quality control 進(jìn)料品質(zhì)管制 3.OQC : output quality control 出貨品質(zhì)管制4.PQC : process quality control 製程品質(zhì)管制也稱IPQC : in process quality control .5 . AQL : acceptable quality level 允收標(biāo)準(zhǔn) 6.CQA: customer quality assurance 客戶品質(zhì)保証7.MA : major defeat

2、 主要缺點(diǎn) 8. MI : minor defeat 次要缺點(diǎn)9. CR :critical defeat 關(guān)鍵缺點(diǎn) 10. SMT : surface mounting technology 表面粘貼技術(shù)11 . SMD : surface mounting device SMC : surface mounting component 表面粘貼元件12 . ECN : engineering change notice 工程變更通知 13 . DCN : design change notice 設(shè)計(jì)變更通知14 . PCB : printed circuit board 印刷電路板 15

3、 . PCBA : printed circuit board assembly裝配印刷電路板16 . BOM : bill of material 材料清單 17. BIOS : basically input and output system 基本輸入輸出系統(tǒng)18. MIL-STD-105E : 美國(guó)陸軍標(biāo)準(zhǔn),也稱單次抽樣計(jì)劃.19 . ISO : international standard organization 國(guó)際標(biāo)準(zhǔn)化組織20 . DRAM: 內(nèi)存條 21 . Polarity : 電性 22 . Icicles : 錫尖 23 . Non-wetting : 空焊24 .

4、Short circuit : 短路 25 . Missing component : 缺件 26 . Wrong component : 錯(cuò)件 27 . Excess component : 多件 28 . Insufficient solder : 錫少 29 . Excessive solder : 錫多30 . Solder residue : 錫渣 31 . Solder ball : 錫球 32 . Tombstone : 墓碑 33 . Sideward : 側(cè)立 34 . Component damage : 零件破損 35 . Gold finger : 金手指36 . SO

5、P : standard operation process 標(biāo)準(zhǔn)操作流程 37 . SIP : standard inspection process 標(biāo)準(zhǔn)檢驗(yàn)流程38 . The good and not good segregation :良品和不良品區(qū)分39 . OBW : on board writer 熸錄BIOS 40 . Simple random sampling : 簡(jiǎn)單隨機(jī)抽樣41 . Histogram : 直方圖 42 . Standard deviation : 標(biāo)準(zhǔn)差43 . CIP : Continuous improvement program 44 . SP

6、C : Statistical process control45 . Sub-contractors : 分包商 46 . SQE : Supplier quality engineering 47 . Sampling sample :抽樣計(jì)劃 48 . Loader : 治具 49 . QTS: Quality tracking system 品質(zhì)追查系統(tǒng)50 . Debug : 調(diào)試 51 . Spare parts :備用品 52 . Inventory report for : 庫(kù)存表53 . Manpower/Tact estimation 工時(shí)預(yù)算 54 . Calibrati

7、on : 校驗(yàn) 55 . S/N :serial number 序號(hào) 56 . Corrugated pad : 波紋墊 57 .Takeout tray : 內(nèi)包裝盒 58 . Outerbox : 外包裝箱 59 . Vericode : 檢驗(yàn)碼 60 . Sum of square : 平方和 61 . Range : 全距62 . Conductive bag : 保護(hù)袋 63 . Preventive maintenance :預(yù)防性維護(hù) 64 . Base unit : 基體65 . Fixture : 制具 66 . Probe : 探針 67 . Host probe : 主探

8、針 68 . Golden card : 樣本卡69 . Diagnostics program : 診斷程序 70 . Frame : 屏面 71 . Lint-free gloves : 靜電手套 72 .Wrist wrap : 靜電手環(huán) 73 . Target value : 目標(biāo)值 74. Related department : 相關(guān)部門75. lifted solder 浮焊 76.plug hole孔塞 77. Wrong direction 極性反 ponent damage or broken 零件破損 79.Unmeleted solder熔錫不良 80.flux res

9、idue松香未拭 81.wrong label or upside down label貼反 82.mixed parts機(jī)種混裝 83. poor solder mask綠漆不良 84. oxidize 零件氧化 85.stand off height浮高 86. IC reverse IC反向 87.supervisor課長(zhǎng) 88. Forman組長(zhǎng) 89. WI=work instruction作業(yè)指導(dǎo) 90. B.P.V:非擦除狀態(tài) 91. Internal notification:內(nèi)部聯(lián)絡(luò)單92. QP :Quality policy品質(zhì)政策 93.QT: Quality targ

10、et 品質(zhì)目標(biāo) 94. Trend:推移圖 95.Pareto:柏拉圖 96. UCL: Upper control limit管制上限 97.LCL:Lower control limit管制下限 98. CL: Center line中心線 99.R.T.Y: Rolled throughout yield直通率100. PPM: Parts per million 不良率 101.DPU: Defects per unit 單位不良率102.Resistor: 電阻 103.Capacitor:電容 104. Resistor array : 排阻 105. Capacitor arra

11、y: 排容 106. DIODE: 二極管 107.SOT: 三極管 108. Crystal:震盪器 109. Fuse:保險(xiǎn)絲 110.Bead: 電感 111.Connector:聯(lián)結(jié)器112.ADM: Administration Department行政單位 113. CE: Component Engineering零件工程 114. CSD :Customer Service Department客戶服務(wù)部 115. ID: Industrial Design工業(yè)設(shè)計(jì) 116.IE: Industrial Engineering工業(yè)工程 117. IR: Industrial R

12、elationship工業(yè)關(guān)係118. ME: Mechanical Engineering機(jī)構(gòu)工程 119. MIS :Management Information System資訊部 120. MM: Material Management資材 121. PCC: Project Coordination/Control專案協(xié)調(diào)控制 122. PD: Production Department生產(chǎn)部 123. PE: Product Engineering產(chǎn)品工程 124. PM: Product Manager產(chǎn)品經(jīng)理 125. PMC: Production Material Cont

13、rol生產(chǎn)物料管理 126. PSC: Project Support & Control產(chǎn)品協(xié)調(diào) 127.Magnesium Alloy:鎂合金128. Metal Shearing:裁剪 129.CEM: Contract Electronics Manufacturing 又稱電子製造服務(wù)企業(yè) EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企業(yè)資源規(guī)劃 SCM+CRM+ERP+EAI=Network direct TM links procurement , produc

14、tion ,Logistics and sales採(cǎi)購(gòu),生產(chǎn),后勤管理及市場(chǎng)行銷的融合 EAI: Enterprise application Intergration 企業(yè)應(yīng)用系統(tǒng)整合 CRM: Customer Relationship Planning 客戶服務(wù)規(guī)劃 SCM : Supply chain management 供應(yīng)鏈管理 131. OJT: On job training 在職培訓(xùn) 132.Access Time: 光碟搜尋時(shí)間 133. B2CEC:Business to consumer electronic commerce 企業(yè)對(duì)消費(fèi)者的電子商務(wù) B2BEC:Bu

15、siness to business electronic Commerce 企業(yè)間的電子商務(wù)134.CCL:Copper Clad Laminate 銅箔基板 135. Intranet: 企業(yè)內(nèi)部通訊網(wǎng)路136. ISP: Internet Service Provider網(wǎng)絡(luò)服務(wù)提供者 ICP: Internet Content Provider網(wǎng)絡(luò)內(nèi)容提供者137. GSM: Global System for Mobile Communication 泛歐數(shù)位式行動(dòng)電話系統(tǒng) GPS: 全球衛(wèi)星定位系統(tǒng)138. Home Page: 網(wǎng)路首頁(yè) 139.Video Clip:影像檔 14

16、0.HTML:超文標(biāo)記語(yǔ)言141.Domainname: 網(wǎng)域名稱 142.IP: 網(wǎng)絡(luò)網(wǎng)域通訊協(xié)定地址 143.Notebook:筆記型電腦144.VR:Virtual Reality虛擬實(shí)境 145.WAP:Wireless Application Protocol 無(wú)線應(yīng)用軟體協(xié)定 146. LAN : Local area network區(qū)域網(wǎng)路 WWW: World Wide Web世域網(wǎng) WAN: Wide Area Network 廣域網(wǎng)路147.3C: Computer, Communication , Consumer electronic 電腦, 通訊, 消費(fèi)性電子三大產(chǎn)品

17、的整合148.Information Supplier Highway:信息高速公路 149.UPS:Uninterrupted power system不斷電系統(tǒng)150.Processed material: 流程性材料 151.Entity/Item:實(shí)體 152.Quality loop:質(zhì)量環(huán)153.Quality losses: 質(zhì)量損失 154.Corrective action:糾正措施 155. Preventive action:預(yù)防措施156.PDCA:Plan/Do/Check/Action計(jì)劃/實(shí)施/檢查/處理 157. Integrated circuits(IC):

18、集成電路158.Application program:應(yīng)用程序 159.Utilities:實(shí)用程序160.Auxiliary storage/Second storage:;輔助存儲(chǔ)器 161.Silicon chip:硅片162Diskette drive:軟驅(qū) 163.Display screen/Monitor:顯示器 164.Foreground:前面 165.Montherboard:母板 166.Mermory board:內(nèi)存板 167.Slot:插槽168.Bus:Data-bus/address-bus/Control bus:總線/數(shù)據(jù)總線/地址總線/控制總線169.P

19、lotter:繪圖 170.MPC:Multimedia personal computer多媒體171.Oscillator:振盪器 172.Automatic teller terminal:自動(dòng)終端(出納)機(jī)173.Joystick port:控制端口 174.VGA: Video Graphics Array顯示卡175.Resolution:分辨率 176.Register:寄存器 177.ISA: Industry Standard Architecture:工業(yè)標(biāo)準(zhǔn)結(jié)構(gòu) 178.EISA:Extended Industry Architecture 179.Adapter: 適配

20、器 180.Peripheral:外部設(shè)備 181.Faxmodem:調(diào)制解調(diào)器 181.NIC:Network interface card網(wǎng)絡(luò)接口卡182.SCSI:Small computer system interface 183.VESA:Video Electronic Standards Association184.SIMM:Single in-line memory module單排座存儲(chǔ)器模塊(內(nèi)存條) 185.Casing:外箱 186.Aluminum:鋁質(zhì) 187.Ceramic: 陶瓷的 188.Platter:圓盤片 189.Actuator:調(diào)節(jié)器 190.S

21、pindle:軸心 191.Actuation arm: 存取臂 192.Default code: 缺省代碼 193.Auxiliary port:輔助端口194. Carriage return : 回車 195.Linefeed:換行 196.ASCII:American Standard Code for Information Interchange197.Video analog: 視頻模擬 198.TTL:Transistor- Transistor logic晶體管-晶體管邏輯電路 199.Three-prong plug:三芯電插頭 200.Female connector:

22、連接插座201.Floppy disk:軟盤 202.Output level:輸出電平 203.Vertical/Horizontal synchronization:場(chǎng)/行同步 204.H(Horizontal)-Phase:行相位205.Compatible:兼容機(jī) 206.Hardware Expansion Card: 硬件擴(kuò)充卡207.Buffer:緩沖 208.CRM:Customer relationship Management 客戶關(guān)係管理209.WIP: Work in process半成品 210.Waiver:特別採(cǎi)用211.CXO系列CEO: Chief Execu

23、tive Office首 COO :Chief Operating OfficeCFO: Chief Finance Officer CBO: Chief Business OfficerCTO: Chief Technology Officer CIO: Chief Information OfficerCGO: Chief Government Officer 212.NASDAQ: 納斯達(dá)克證券市場(chǎng)NASDAQ Automated Quotation system 213.VC:Venture Capital 風(fēng)險(xiǎn)投資214.PDA:Personal Date Assistant個(gè)人數(shù)字

24、助理 PLA: Personal Information Assistant個(gè)人信息助理215.PPAP:Advanced Product Quality Planning and Control Plan 生產(chǎn)性零組件核準(zhǔn)程序216.FMEA:Protentical Failure Mode and Effects Analysis失效模式與效應(yīng)分析217.MSA: Measurement Systems Analysis 量測(cè)系統(tǒng)分析218.QAS:Quality System Assessment 品質(zhì)系統(tǒng)評(píng)鑑219.Cusum: 累計(jì)總合圖 220.Overall Equipment

25、Effectiveness設(shè)備移動(dòng)率221.Benchmarking:競(jìng)爭(zhēng)標(biāo)竿 Analysis of motion/Ergonomics動(dòng)作分析/人體工程學(xué)222.Roka Yoke 防錯(cuò)法 MCR: machine capability ratio 機(jī)器利用率 223.Mistake Proofing 防呆法 Taguchi methods田口式方法224,Vertical integration垂直整合 Surveillance定期追蹤審查225.EMS: Electronics Manufacturing Supply-chain226.Cause&Effects charts

26、特性要因圖227.Scattle: 散佈圖 Fool-Proof System防呆系統(tǒng) 228.VE:Value Engineering 價(jià)值工程 QFP:Quality Function Development 品質(zhì)機(jī)能展開(kāi)229.Arrow Chart 箭頭圖法 Affiliate Chart親和圖法230.PDPC:Process Decision Program Chart System Chart系統(tǒng)圖法231.Relation Chart 關(guān)邊圖法 Matrix Chart矩陣圖法232.Matrix Data Analysis矩陣數(shù)據(jù)分析法234.Brain-storm 腦風(fēng)暴法

27、 JIT: Just In Time:及時(shí)性生產(chǎn)模擬235.Deming Prize: 戴明獎(jiǎng) Prototype技術(shù)試作236 BPM:Business Process Management .業(yè)務(wù)流程管理 MBO:目標(biāo)管理 237. MBP:方針管理 FTA:故障樹(shù)分析 QSCV: 服務(wù)品質(zhì)238.IPPB:Information 情況 Planning策劃 Programming規(guī)劃 Budget預(yù)算239.EQ:Emotion Quotient:情商 IQ: Intelligence Quotient:智商240.Implied Needs:隱含要求 Specified Require

28、ment:規(guī)定要求241.Probation:觀察期 Incoming Product released for urgent production 緊急放行242.Advanced quality planning 先進(jìn)的質(zhì)量策劃 243. AOQ: Average Outgoing Quality 平均檢出質(zhì)量 AOQL: Average Outgoing Quality Limit 平均檢出質(zhì)量界限244.Approved Supplier List 經(jīng)核準(zhǔn)認(rèn)可的供應(yīng)商名單245.Attribute date 特征 Benchmarking 基準(zhǔn)點(diǎn) Calibration 校準(zhǔn)246.C

29、apable process 工序能力 Capability Index 工序能力指數(shù) Capability ratio 工序能力率247.CHANGE CYCLE TIME 修改的時(shí)間周期 Continuous improvement 持續(xù)改進(jìn)248. Control plans 控制策劃 Cost of quality 質(zhì)量成本249. Cycle time reduction 減少周期時(shí)間250. Design of experiments 實(shí)驗(yàn)設(shè)計(jì) Deviation / Substitution 偏差 / 置換251. ESD: Electrostatic discharge 靜電釋

30、放252. EH&S: Environmental, Health, and Safely 環(huán)境,健康.安全253. ESS: Environmental Stress Screening 環(huán)境應(yīng)力篩選254. FMEA: Failure Mode Effect Analysis 失誤模式效應(yīng)分析255. First Article approval 產(chǎn)品的首次論證 First pass yield 一次性通過(guò)的成品率256. First sample inspection 第一次樣品檢驗(yàn)257. FMECA: Failure mode effect and critically an

31、alysis 失誤模式,效應(yīng)及後果分析 258. Gauge control 測(cè)量?jī)x器控制 GR&R: Gauge repeatability and reproducibility 測(cè)量?jī)x器重復(fù)性和再現(xiàn)性259. HALT: Highly Accelerated Life Test 高加速壽命試驗(yàn) HAST: Highly Accelerated Stress Test 高加速應(yīng)力試驗(yàn)260. IN-CONTROL PROCESS 受控制工序261. INDUSTRIAL AVERAGE 工業(yè)平均數(shù)262. JIT (just in time) manufacturing (即時(shí))制

32、程263. Key characteristic 關(guān)健特征 Key component 關(guān)健構(gòu)件264. Life Testing 壽命試驗(yàn) Lot traceability 批量可追溯性265. Material review board 原材料審查部門 MCR: machine capability ratio 機(jī)械能力率266. NONCONFORMANCE 不符合267. OUT-OF-CONTROL PROCESS 失控工序268. Pilot Application 試產(chǎn)(試用)269. PPM: Parts per million 百萬(wàn)分之一270. Preventive vs

33、detection 預(yù)防與探測(cè) Preventive maintenance 預(yù)防維護(hù)271. Process capability index 工序能力指數(shù)272. Process control 工序控制 Process improvement 工序改進(jìn) Process simplification 過(guò)程簡(jiǎn)化273. Quality Clinic Process Chart (QCPC) 質(zhì)量診斷過(guò)程圖274. Quality information system 質(zhì)量資料體系275. Quality manual 質(zhì)量手冊(cè) Quality plan 質(zhì)量計(jì)劃 Quality planni

34、ng 質(zhì)量策劃276. Quality policy 質(zhì)量方針 Quality system 質(zhì)量體系277. Reliability 可靠性 RUN Chart 趨勢(shì)表 Skill Matrix 技能表278. Statistical quality control (SQC) 統(tǒng)計(jì)質(zhì)量控制279. Teamwork 團(tuán)隊(duì)工作280. Total quality management 全面質(zhì)量管理281. Variable data 變量數(shù)據(jù) Variation 影響變量282. Value Analysis 價(jià)值分析 Visual Factory 形象化工廠283. Survey Inst

35、ructions 調(diào)查指引284. Profile 概況285. Improvement Plan 改進(jìn)計(jì)劃 286. Evaluation 評(píng)估 Implementation 實(shí)施 Compliance 符合287. Supplier Audit Report 供方審核報(bào)告288. Site Audit 現(xiàn)場(chǎng)審核289. Typical agenda 典型的議事日程290. Internal and external failure costs 內(nèi)部和外部的失誤成本291. Failure rate percentage 失誤百分率292. Productivity (output / in

36、put) 生產(chǎn)率(產(chǎn)出/投入)293. Customer complaints 客戶投訴 Customer satisfaction indices 客戶滿意度指數(shù)294. Root cause analysis of failures 失誤根原分析 Nominal:名目的295. Enumeration:列舉 Screening stage:篩選階段296. Screening materials:屏蔽材料 Nonparametric comparative experimental:非參數(shù)實(shí)驗(yàn)297. Pitfall:缺陷 Fractional factorial experiments:部份隨機(jī)實(shí)驗(yàn)298. Management by communication:溝通管理技術(shù) Management by objective:目標(biāo)管理技術(shù)299. Management by result:績(jī)效管理技術(shù) Human relationship skill:人際技術(shù)