Centrotherm整線設備介紹

1、1l Solar Cell ProcessingFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase2l Company LocationGermanyFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase3l Main Company Data centrotherm photovoltaics AG Johannes-Schmid-Str. 8 89143 Blaubeuren Germany Phone Fax E-mail InternetFile:PVstand_07.08e_HS+49 7344

2、9188 - 803+49 7344 9188 - 388info-pvcentrotherm.dewww.centrotherm.deAuthor: Dr. Josef J. HaaseAG4l Company Information Group Structurecentrothermcentrothermthermal solutionsGmbH + Co. KGMicroelectronicsProcess EquipmentProcess TechnologyFile:PVstand_07.08e_HScentrothermphotovoltaicsSolar CellsTurnke

3、y ProductionKey EquipmentProject ManagementFacility DesignAuthor: Dr. Josef J. Haasecentrothermclean solutionsGmbH & Co. KGExhaust TreatmentBurnerScrubberAbsorber5l Company Information StructureSolMicPoly-Si-ManufacturingConcept + DesignProject ManagementProject ExecutionGP SolarInline Measureme

4、ntEquipment / TechnologyWet Process TechnologyPrinting PasteEvaluation / Supplycentrotherm-PVAGSolar CellsTurnkey ProductionKey EquipmentProject ManagementFacility DesignFile:PVstand_07.08e_HScentrothermSiQGmbHPolySiliconSiemens ReactorsConverterscentrotherm-PVAsiaSolar Cell ManufacturingProject Man

5、agementProject ExecutionProcess SupportService / Spare PartsAuthor: Dr. Josef J. Haasecentrotherm-PVTechnologyGmbHResearch & DevelopmentTechnologyNew DevicesNew ProcessesEquipment6l Value ChainFeedstockWaferSolar CellModuleSystemFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase7l Company Informat

6、ion Services Delivery of turnkey solutions or key equipmentand technology for solar cell production Development and implementation of advanced solar cellprocesses and production technologies Process integration including optimized interfacesbetween the single process steps Consulting concerning buil

7、ding and facility Layout design for production facilities Support in start-up and future development Access to the centrotherm research networkFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase8l Company Information Merits Leading Supplier of(based on installed production capacity):Turn-key SolutionsK

8、ey Equipmentfor crystalline Solar Cell Manufacturing Experience in Photovoltaics 25 years in Solar Cell Processing 6 years in Turnkey SolutionsFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase9l Company Information ReferencesNearly all leading Cell Manufacturer outside JapanFile:PVstand_07.08e_HSAuth

9、or: Dr. Josef J. Haase10l Turnkey ProjectWhat is Turn-key ? Building (consulting) Facilities (requirements, option: design) Production Tools Production Support Tools Solar Cell Design and Technology Manufacturing Technology Process / Production Control Documentation, TrainingFile:PVstand_07.08e_HSAu

10、thor: Dr. Josef J. Haase11l Turnkey Project Project StructurCustomerCentrotherm PVEquipment + TechnologytbdBuilding and FacilitiesEquipment (EQ)Technology TransferBuildingFacilities / UtilitiesSite-Layout (CAD)EQ-SpecificationEQ-PurchaseEQ-SubcontractorsEQ-StartupFile:PVstand_07.08e_HSProcess-Specif

11、icationEQ-Layout (CAD)EQ-Utility ConsumptionsProcess-StartupProduction Ramp-UpArchitectureInfrastructureConstruction ManagementTurn-key ConstructionTurn-key InfrastructureAuthor: Dr. Josef J. HaaseGases, Chemicals, DIWWaste TreatmentControlsHook-upHeating/Cooing12l Turnkey ProjectProduction Tool Set

12、 Stack Splitter or Incoming Wafer Inspection Saw Damage etch (incl. Texturing) POCl3 Emitter diffusion (Edge Isolation) / PSG removal PECVD - SiN-AR-coating Screen printing and Paste drying Fast firing Edge isolation (Laser) Cell testing and Cell sorting Inline Measurement and MESFile:PVstand_07.08e

13、_HSAuthor: Dr. Josef J. Haase13l Turnkey ProjectScope of ProjectGuarantees for:Line Throughput Efficiency Production Yield Project Schedule Project Management Building and Facility Consulting Delivery of specified equipment set Equipment Installation and Startup Production Rampup Technology Transfer

14、 Detailed Staff TrainingFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase14l Turnkey Project Project ScheduleFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase15l Economic ConsiderationsCustomer selection criteriafor more than 90% of solar systemsis based on:Cost / kWhgeneratedFile:PVstand_07.08e_HSAut

15、hor: Dr. Josef J. Haase16l Turnkey ProjectCost reduction approachesWaferReduction of feedstock qualitySolar grade SiliconReduction of feedstock / waferWafer thickness String or Ribbon material Solar CellWafer sizeEfficiencyProduction line designCapacity Yield ThroughputFile:PVstand_07.08e_HSAuthor:

16、Dr. Josef J. Haase17l Economic ConsiderationsParameters considered Investment Operation Cost Upgradebility Yield Efficiency Throughput Required periodical maintenanceFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase18l Economic ConsiderationsProduction Costs Breakup (high wafer price)5,5 / wafer (156

17、mm)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase19l Economic ConsiderationsProduction Costs Breakup (low wafer price)4,0 / wafer (156mm)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase20l Economic ConsiderationsProduction Cost - SensitivityFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase21l Econo

18、mic ConsiderationsCoO Optimization (efficiency)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase22l Economic ConsiderationsCapacity of One Production Line = f (Wafer Size)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase23l Economic ConsiderationsImprovement (sensitivity analysis)YieldEfficiencyProduc

19、tivetimeSolar cell conceptIncoming Wafer inspectionEquipment setProcess & Equipment stabilityInline monitoringHandling concept (automation)Equipment interfacingStaff qualificationFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase24l Economic Considerations Fab LocationProduction Costs ComparisonFi

20、le:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase25l Turnkey ProjectFlexLine Concept Production Line ConceptHighly flexibleMono125Multi156Easy Process Sequence Modifications(work center design)Prepared for Technology Upgrades(Process, Equipment Set) Equipment Selection by PerformanceYieldEfficiencyUtil

21、ization (productive time)Highest Equipment Uptime(Minimal Periodic Service)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase26l Production Line ConfigurationHigh performance State of the Art Line Configuration Saw damage etchmono (KOH, IPA)batchmulti (acid) Diffusion (POCl3)inlinebatch PSG removalbat

22、ch or inline AR-coating (direct plasma)batch Screen Printinginline Firingshort temperature peak (1-5 sec) Edge Isolation Testing / SortingFile:PVstand_07.08e_HSlaserAuthor: Dr. Josef J. Haase27l Production Technology Roadmapcrystalline silicon solar cellsOptimizationAdvanced cell concepts required20

23、062007200820092010Waferthickness MonoWaferthickness Multi200 -240m 180-220m200 -240m 180-220m170 - 220m160 - 210m150 - 200m 120 - 180m160 - 200m 150 - 200mYield MonoYield Multi95,0%94,5%95,5%95%96,0%95,5%96,5%96,0%97,0%96,5%Efficiency Mono (IPA)Efficiency Mono (acid)Efficiency Multi (acid)16,5%16,2%

24、15,2%17,0%16,6%15,7%17,0 - 18,0%16,6 - 17,2%15,7 - 16,2%17,5 - 19,0% 18,5 - 20,0%17,0 - 17,6% 17,4 - 18,3%16,1 - 16,7% 16,5 - 17,0%Size mm156156156156156File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase28l Turnkey ProjectNew TechnologiesFine line printMetal PlatingBackside contactDielectric passivati

25、onPhysical depositionSelective EmitterFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase29l Solar Cell TechnologyFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase0l Solar Cell Technology- Process Sequence 1Wafer inspection- 2D inspection- 3D inspection- Resistivity- LifetimeWet chemical etching-

26、 Saw damage etch- Texturization(acid, cooled bath)- Texturization(alkaline + IPA, heated bath)P-n-junction formation- all sided diffusion from POCl3- single sided diffusion from POCl3- spray dopend and belt diffusion(for low efficiency)File:PVstand_07.08e_HSpoly-crystalline Simono-crystalline SiAuth

27、or: Dr. Josef J. Haaseraw waferdamaged surface layerraw waferdamaged surface layerp-doped siliconetched wafertextured wafer (poly-Si)textured wafer (mono-Si)Diffused wafer all sidesp-base materialn-doped layerphosphorous silicat glass4.5.Remolaophphroslgas6.AR-coitg(slicnntrid)7.Pirtningfersecotacs8

28、.Dringoraridconcts9.Pirtninglauinumase-wtehmaetcn-PCDoscotindeuae-LCVosontinefrBSfrmtinmdfcanhdroepsvonPDficyfesetaoFoaooito,ygnaaitEVifilnir,rscanoievfosouseclhgcioraidntimiliid irptifpoyrytaliesilconmoncrslaineilsco-lcsno-ytlinndpdyepdpdilscA-cangreadecncps(dryA-Rongreasdcncps(weauinupa(ee)toearoe

29、-roitmmsw-dpdlenoeayrrieotatatetrsotatate)lctiailn ot5.6.31l Solar Cell Technology Process Sequence 2Removal of front-rear side short- plasma etching- wet etch (single sided)- laser cutting(before cell clsassificaionpoly-crystalline Simono-crystalline Sishort along the cell edgesshort removed (plasm

30、a etch)integrated in classifier)short removed (wet etch)Removal of phosphorous glass- wet chemical etchingAR-coating (silicon nitride)- PECVD of silicon nitride,- antireflective coating- surface modification,- hydrogen passivation- LPCVD of silicon nitride- antireflective coatingFile:PVstand_07.08e_

31、HSAuthor: Dr. Josef J. Haasen-doped layerAr-coatingn-doped layerp-doped siliconAr-coatingn-doped layerp-doped silicon0.32l Solar Cell Technology Process Sequence 3poly-crystalline Simono-crystalline Sifront sidecontact paste (wet)Printing of front side contactsfront sidecontact paste (dry)Dry

32、ing of front side contactsPrinting of rear side contactsAR-coatingrear side contact paste (wet)Drying of rear side contactsrear side contact paste (dry)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase33l Solar Cell Technology Process Sequence 4poly-crystalline Simono-crystalline Si11.12.Printing alu

33、minum pastefor BSF formationDrying aluminum pastealuminum paste (wet)aluminum paste (dry)AR-coating13. Sintering of contacts- cofiring front and rear side contacts- sintered through the AR-coating- Hydrogen passivation14. Optional removal offront-rear side shortby laser cutting15. Solar Cell Classif

34、ication- efficiency- fill factor- optical appearanceFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haasen-layerp+-layer, Al-dopedAl-Si-eutectic34l Production Line ConfigurationFile:PVstand_07.08e_HS EquipmentAuthor: Dr. Josef J. Haase35l Production Line ConfigurationFlexLine Solar Cell Processing (multi

35、, acid texturing)BufferBufferStack Splitting,InspectionBufferSaw damageetch / textureBufferDiffusionPOCl3BufferOxideremovalAR-coatingPECVD-SiNPrint frontside contactsDryingPrint rearside contactsDryingPrintAl-BSFBufferBufferDryingFast FiringEdge isolationby LaserTestingSortingInline measurementFile:

36、PVstand_07.08e_HSAuthor: Dr. Josef J. Haase36l Production Line ConfigurationFlexLine Solar Cell Processing (mono, KOH/IPA texturing)BufferBufferStack Splitting,InspectionBufferSaw damageetch / textureBufferDiffusionPOCl3BufferOxideremovalAR-coatingPECVD-SiNPrint frontside contactsDryingPrint rearsid

37、e contactsDryingPrintAl-BSFBufferBufferDryingFast FiringEdge isolationby LaserTestingSortingInline measurementFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase37l Future Production TechnologyAdvanced FlexLine Solar Cell ProcessingStack Splitting,InspectionAR-coatingPECVD-SiNDryingSaw damageetch / tex

38、turePrint frontside contactsFast FiringSelectiveEmitterDryingPlatingDiffusionPOCl3Print rearside contactsEdge isolationEdge isolationwet etchDryingTestingOxideremovalPrintAl-BSFby LaserSortingInline measurementFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase38l Production Line ConfigurationFlexLine

39、Solar Cell Processing SequenceStack Splitting,InspectionSaw damageetch / textureDiffusionPOCl3OxideremovalAR-coatingPrint frontDryingPrint rearDryingPrintPECVD-SiNDryingside contactsFast FiringFile:PVstand_07.08e_HSside contactsEdge isolationby LaserAuthor: Dr. Josef J. HaaseTestingSortingAl-BSF39l

40、Production Line EquipmentIncoming Wafer Inspection / Stack SplittingFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase40l Production Line EquipmentIncoming Wafer Inspection / Stack Splitting - Features 2D inspection Resistivity and TTV Lifetime measurement Mechanical wafer integrity Microcrack detecti

41、on Automatic stack splitting Loading to wet bench (inline or carrier)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase41l Production Line EquipmentIncoming Wafer Inspection / Stack Splitting - Advantages 100% inspection No processing of out of spec wafer No processing of pre-damaged wafer No human op

42、eration Low breakage rate High and constant throughputFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase42l Production Line ConfigurationFlexLine Solar Cell Processing SequenceStack Splitting,InspectionSaw damageetch / textureDiffusionPOCl3OxideremovalAR-coatingPrint frontDryingPrint rearDryingPrintPE

43、CVD-SiNDryingside contactsFast FiringFile:PVstand_07.08e_HSside contactsEdge isolationby LaserAuthor: Dr. Josef J. HaaseTestingSortingAl-BSF43l Production Line Equipment SDE/TextureSaw Damage Etching Selection Criteria Batch system Carrier required Alkaline (mono-cryst.), Acid (multi-cryst.) texturi

44、ng in development Inline system No carrier required Only acid texturing available (multi cryst.)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase44l Production Line Equipment SDE/TextureEtch Carrier for Batch Wet ProcessingFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase45l Production Line Equipment

45、SDE/TextureEtch Carrier - Advantages Stable design due to stainless steel core This is the basis to use this carrier as input magazine for thesubsequent equipment without additional wafer handling Point contacts between wafers and carriers This is essential for good access of chemicals/good dryingwi

46、thout residues and maculas Double covered by plastics Halar for chemical resistivity carbon reinforced PP for mechanical resistivity Big size for 100 wafers This enables movement through the wet bench without additional basketsFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase46l Production Line Equip

47、ment SDE/TextureWet Bench (batch) for Saw Damage Etching - Features Pre - etch / cleaning basin To remove the first dirty Si-skin without contamination of the main bath Main etch basin with optional texturization (silk-like shiny surfaces) Alkaline for mono-crystalline wafer Acid for multi-crystalli

48、ne wafer HCl and additional HF-Basin Neutralization of KOH, removal of impurities and surface-hydrophobation Fully automatic work mode No manual handling Automatic inline measurement of the etch removal (only batch) By weighing of the carriers with the wafers before and after etching Input and outpu

49、t-buffers integrated (only batch) Important to overcome discontinuities in the production flowFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase47l Production Line Equipment SDE/TextureWet Bench Configuration (No Texturing, Mono- and Multi-crystalline)Pre-cleaningSaw damage etchHCL-cleaningHF-cleaning

50、DryingTensidKOHH2OKOHH2OHClH2OHFH2OH2OhotInput bufferCascadeCascadeCascadeOutput bufferHot airBypassacidic wateracidic waterHot DI waterwith soft-liftcontains HFdose-pumpHeated tankNormal-for bathexchangeFile:PVstand_07.08e_HSSilicatedraindrainAuthor: Dr. Josef J. Haase48l Production Line Equipment

51、SDE/TextureWet Bench Configuration (Texturing, Mono-crystalline)Pre-cleaningSaw damage etchTexturingHCL-cleaningHF-cleaningDryingInput bufferTensidKOHH2O KOH IPACascadeH2OHClCascadeH2OHFCascadeH2OOutput bufferHot airBypassacidic wateracidic waterHot DI waterwith soft-liftcontains HFdose-pumpHeated t

52、ankNormal-for bathIPAdrainexchangeFile:PVstand_07.08e_HSdrainAuthor: Dr. Josef J. Haase49l Production Line Equipment SDE/TextureBatch Saw Damage Etch (IPA or Acid Texture)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase50l Production Line Equipment SDE/TextureInline Saw Damage Etch (Acid Texture) Te

53、xturization with acid, cooled bath Alkaline clean Rinse 1 (DI-water) Acid clean Rinse 2 (DI-water) bDryingFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase51l Production Line Equipment SDE/TextureInline Saw Damage Etch (Acid Texture)File:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase52l Production Line

54、ConfigurationFlexLine Solar Cell Processing SequenceStack Splitting,InspectionSaw damageetch / textureDiffusionPOCl3OxideremovalAR-coatingPrint frontDryingPrint rearDryingPrintPECVD-SiNDryingside contactsFast FiringFile:PVstand_07.08e_HSside contactsEdge isolationby LaserAuthor: Dr. Josef J. HaaseTe

55、stingSortingAl-BSF53l Production Line Equipment POCl3- DiffusionBatch-type Tube Diffusion SystemFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase54l Production Line Equipment POCl3- DiffusionBatch-type Tube Diffusion Soft LandingMovement into the tubepaddle (upper position)Lowering the paddleMoving t

56、he paddle outof the tube (lower position)File:PVstand_07.08e_HSAuthor: Dr. Josef J. HaaseScavenger55l Production Line Equipment POCl3- DiffusionBatch-type Tube Diffusion Closed TubeTo exhaustGas inletTo exhaustCondensation vesselHeaterInsulationDiffusion tubeDoorGas cabinetFile:PVstand_07.08e_HSFurn

57、aceAuthor: Dr. Josef J. Haase56l Production Line Equipment POCl3- DiffusionBatch-type POCl3-Tube Diffusion - Advantages Best available Phosphorus diffusionGas-phase diffusion without residuesChlorine as in situ cleaning componentHigher efficiency Easy realization of high emitter resistivitiesLower l

58、ight absorption, lower carrier recombinationHigher efficiency Diffusion on both wafer sidesExtended gettering effect of Phosphorous improves material qualityHigher efficiency Excellent clean diffusion environmentOnly quartz is used inside the diffusion roomHigher efficiency Improved cleannessThe uni

59、que closed tube system prevents contaminationfrom the environmentHigher efficiencyFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase57l Production Line Equipment POCl3- DiffusionBatch-type POCl3-Tube Diffusion - Advantages Wafer handling configurations Fully automatic wafer handling Manual boat loadin

60、g System configurationAdjustable to production capacity (No. of tubes)Back to Back loading option+ 50% capacityFull automatic boat handling (lift)Input and output-buffers integrated Inline measurement Resistivity Integrated in loading systemFile:PVstand_07.08e_HSAuthor: Dr. Josef J. Haase58l Production Line Eq