M004雷射鉆孔教材

機(jī)臺(tái)廠商型式軸vs

床臺(tái)數(shù)量MitsubishiCO21/14CO22/14CO22/211HitachiCO22/23CO24/24Siemens

CO21/13UV1/18Kinsus現(xiàn)有雷射機(jī)臺(tái)數(shù)量及型式：Comment：CO2機(jī)臺(tái)共6種型式29臺(tái)，UV機(jī)臺(tái)共2種型式8臺(tái)2/4/20231機(jī)臺(tái)光路設(shè)計(jì)的差異YXGalvanoscannerFθlensYXWorkLaserbeamResonatorTop-hatopticsystem

ImprovedenergyefficiencyDevelopmentofhighpowerresonator＋DoubledenergyYXEnergyattheprocessingpointissimilartothesinglemachineBeamsplitSinglemachine2-workmachineMaskResonatorGaussianopticsystem2/4/20232TophatbeamVsGaussianHoleshapebytophatbeamHoleshapebygaussianbeamAcrylicbarnpatternResultofenergydistributionsimulationResinDamageontheinternalcopperNodamageontheinternalcopperGaussianbeamCopperResinResinCopperTophatbeam2/4/20233ＸＹtableXYGalvanoscannerFθlensVisionsensorVisionsensorGalvanoscannerFθlensXYtableXYFθlensXYtableVisionsensorGalvanoscannerXY機(jī)臺(tái)型式設(shè)計(jì)原理比較2/4/20234雷射共振腔CollimationlensMask

LaserbeamScanningareafθlensGalvanomirrorProtectlensCollimationlens：決定雷射光能量分佈Mask：決定LaserBeam的大小Galvanomirror：決定雷射定位精度(20um)fθlens：使雷射光垂直於工件Protectlens：保護(hù)fθlens主要部品的名稱及功能簡介2/4/20235Workpiecedistance

fθlensGalvanomirror決定加工速度的因素有二：Galvanomirror的定位速度現(xiàn)有規(guī)格：1000Hz/1200Hz/1400HzGalvanomirror涵蓋的區(qū)塊面積

可用規(guī)格：10~70×10~70mm

現(xiàn)在生產(chǎn)：50mm×50mm?Area大小對(duì)加工有何影響?2/4/20236※IncaseofCO2laser,resultofaprocessingchangesbythesurfacetreatmentconditionofcopperfoil.ImagingCopperdirectBVHConformalProcess350400450500Diameter(μm)ResinThickness:50μmCopperfilm:5～9μmPossibleVia-holeDiameter50100150250300700サイクル＆バーストパルス2000CO2laserUV-YAGlaser雷射鑽孔加工方式2/4/20237雷射鑽孔加工流程入料取隔紙及板面檢查有無參數(shù)通知工程師設(shè)定參數(shù)測試並新增機(jī)臺(tái)參數(shù)是否有程式程式轉(zhuǎn)檔設(shè)定該料號(hào)參數(shù)檔校正能量設(shè)定自動(dòng)排程生產(chǎn)首件檢驗(yàn)品質(zhì)是否正常繼續(xù)生產(chǎn)通知工程師處理出貨有無無有是不是PS：1．能量校正1次/4HR2．精度校正1次/4HR1．1/10pnl/pnls2．量測上下孔徑2/4/20238Mis-alingmentResinresidueonstoppadStoppaddamageOverhangtoobig雷射品質(zhì)項(xiàng)目簡介2/4/20239OpticalSystemCameraLaserShutterBeamExpanderDichroicMirrorMirrorSurfaceDeflectionHeadF-ThetaObjectiveQuarterWavePlateAchromatIlluminationRingImagesection4.3*2.8mm.Resolution:5.5/pixel.Illumination:verticaland60o,30oanglediodeslighting.Wavelength:λ=880nm.HighresolutionCCDcamerawithaPROFIBUSvisionsensormodelSIMATIC-VS710fromSiemensisusedasaprocessingsystem.

2/4/202310X,Y-axesLinearmotorwithlinearscalesystemtotravelthevacuumplateisonthetransportunit.

2/4/202311The3ndstep: Cleanedthebottomsideofhole(OutofFocus)

ResinremoveThe2ststep: Copperandfibercuttingprocesstomaketheholeshape(InFocus)The1ststep: Copperopeningandfibercuttingprocesstomaketheholeshape(InFocus)UV雷射鑽孔加工方式2/4/202312※Theorem908070605040302010035510649400Absorption(%)WavelengthinNanometersCopperDielectricGlassCO2LaserUVLaser10600PS：利用UVLaser和CO2Laser的不同波長及其波長對(duì)Copper、Glass及Dielectric的不同吸收率，來達(dá)到開銅窗及除膠的目的。2/4/202313UV和CO2加工方式比較2/4/202314UV和CO2加工孔徑的比較?ThroughputVisnotincludingXY-tablepositioningtime,

alignmenttimeandL/ULtime.01002003004000305080100150UV-YAGCO2Epoxy-resin：ｔ30～60μmCopperfoil:t6～9μmHolediameter(μm)ThroughputV(holes/sec)2002/4/2023151．CO2雷射鑽孔機(jī)適用於預(yù)開銅窗的盲孔加工

(目前廠內(nèi)生產(chǎn)的為65um~250um，ABF的產(chǎn)品孔徑為50um)2．UV雷射鑽孔適用