牙體牙髓課件實習指導

Resin-bondedcomposite?After?Afterobservingtheindustrialusephosphoricacidtoimproveadhesionofpaintsandresincoatingtometalsurfaces.?In1955,Buonocoreappliedacidtoteethrenderthetoothsurfacemorereceptivetoadhesion.Buoncore’spioneeringworkingledtomajorchangesisthepracticeofdentistry.AfterobservingtheindustrialuseofphosphoricAfterobservingtheindustrialuseofphosphoricacidtoimproveadhesionofpaintsandresincoatingtometalsurfaces.In1955,Buonocoreappliedacidtoteethtorenderthetoothsurfacemorereceptivetoadhesion.In1955,Buonocoreappliedacidtoteethtorenderthetoothsurfacemorereceptivetoadhesion.Buoncore’spioneeringworkingledtomajorchangesisthepracticeofdentistry.extent,bytoothconservingadhesiverestorativematerialshaveextent,bytoothconservingadhesiverestorativematerialshavebeenTraditionalmechanicalmethodsof?Today,Weareced,toaofadhesivepreparationsandmoreconservativegraduallybeen?Theconceptsoflargepreparationsandmoreconservativegraduallybeen?Theconceptsoflargepreparationsandforprevention,proposedbyblack,in1917,cedbyconceptsof Esthet-XPremisaVenusTetricCeramFourSeasonsVitalescenceGRADIAFiltekSupreme(3MEsthet-XPremisaVenusTetricCeramFourSeasonsVitalescenceGRADIAFiltekSupreme(3M ?

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便于操作的材料。FiltekZ350,Filtek?SupremeXT,Ceram?X,GRADIADIRECT,收縮，高強度，耐磨性好。quixfil,FiltekP60，P90納米樹 Ceram?X,FlitekZ350,GRADIADIRECT,Venus,Filtek?Supreme60%）,具有較好的濕潤性，彈性和阻射性。）No-etch↓Total-etchbonding(1980s(3↓Total-etchwetbonding(3↓(2↓Oneadhesivesystems(2000s)(1steps)酸蝕＋處理＋TotalEtch系列二酸蝕∕處理＋粘接∕） ““

(conservemore Bettertransmitanddistributefunctionalstressesacrossthebondinginterfacetotheteeth 2.6 2.6%~7.1Vol

6%~7.1Vol4．Mechanicalproperty,suchas4．Mechanicalproperty,suchasenergyoftheifitssurfacetensionislessthantheAnimportantrequirementforadhesionenergyoftheifitssurfacetensionislessthantheAnimportantrequirementforadhesionisthetwomaterialsbeingjoinedmustbeinsufficientlyclose.Besidesanintimatecontact,sufficientwettingoftheadhesivewilloccurContactDifferentcontactangle,different(acid-etching(acid-etching(acid-etching “污染拴(2-7μm)，使牙本質表面dd酸SmearConditioner：弱酸EDTA如0.5mol/LEDTA,10底膠粘接劑(adhesive 形成氧阻聚層(oxygen-inhibitedresin resin

3MESPESingleBond2兩遍，15

模式，300mW/cm23秒,600mW/cm240秒；牙本質mW/cm240秒

???預預輸分與光存光儲。

2-3mm合面洞緣不短斜面，局限于釉