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臺(tái)灣本土半導(dǎo)體設(shè)備發(fā)展過(guò)程與未來(lái)蕭恩信董事長(zhǎng)東昇應(yīng)材經(jīng)濟(jì)與產(chǎn)業(yè)之關(guān)係與趨勢(shì)科技新創(chuàng)途徑-育成中心資金來(lái)源與取得科技創(chuàng)業(yè)之建議產(chǎn)業(yè)發(fā)展,經(jīng)濟(jì)成長(zhǎng)經(jīng)濟(jì)成長(zhǎng)與創(chuàng)業(yè)活動(dòng)之關(guān)係新創(chuàng)事業(yè)既有產(chǎn)業(yè)產(chǎn)業(yè)升級(jí)轉(zhuǎn)型新興技術(shù)導(dǎo)向、高附加價(jià)值之中小企業(yè)不斷出現(xiàn)生存困難結(jié)束營(yíng)業(yè)外移補(bǔ)充另起爐灶經(jīng)濟(jì)發(fā)展正循環(huán)我國(guó)產(chǎn)業(yè)發(fā)展趨勢(shì)產(chǎn)業(yè)升級(jí)發(fā)展年代資源驅(qū)動(dòng)投資驅(qū)動(dòng)(資本)創(chuàng)新驅(qū)動(dòng)(知識(shí))臺(tái)灣現(xiàn)階段科技創(chuàng)業(yè)產(chǎn)業(yè)升級(jí)趨動(dòng)力歷程
產(chǎn)業(yè)升級(jí)刻不容緩,藉由發(fā)展服務(wù)業(yè),
再創(chuàng)「臺(tái)灣奇蹟」-微笑曲線的再闡釋附加價(jià)值因應(yīng)知識(shí)經(jīng)濟(jì)的發(fā)展在產(chǎn)業(yè)價(jià)值鏈中自我定位產(chǎn)業(yè)微笑曲線圖附加價(jià)值高替代性低創(chuàng)新研發(fā)中心
全球運(yùn)籌管理中心發(fā)展知識(shí)密集服務(wù)業(yè)製造組裝物流、品牌、商流、行銷創(chuàng)新、市調(diào)、研發(fā)、設(shè)計(jì)產(chǎn)業(yè)價(jià)值鏈協(xié)助傳統(tǒng)產(chǎn)業(yè)轉(zhuǎn)型高附加價(jià)值產(chǎn)品製造中心政府核定政策年份93年90年88年新創(chuàng)企業(yè)尋求技術(shù)協(xié)助傳統(tǒng)企業(yè)轉(zhuǎn)型大學(xué)/研究機(jī)構(gòu)創(chuàng)新育成中心學(xué)研機(jī)構(gòu)Spin-off企業(yè)創(chuàng)新與再造-市場(chǎng)模式政府單位策略聯(lián)盟育成資源育成中心內(nèi)外部資源整合校內(nèi)專家實(shí)驗(yàn)室研究室育成中心設(shè)備育成人才育成中心之選定概念活絡(luò)新創(chuàng)事業(yè)育成資源政府資金融通新創(chuàng)事業(yè)之資金取得問(wèn)題新創(chuàng)事業(yè)前景不明,難以取得創(chuàng)投青睞供給面缺乏資源整合,無(wú)法將創(chuàng)新成果轉(zhuǎn)化為高品質(zhì)投資案需求面缺乏組織與整合創(chuàng)業(yè)天使,提高新事業(yè)的投資效率創(chuàng)投媒合機(jī)制欠缺區(qū)域性佈區(qū)考量,無(wú)法協(xié)助解決風(fēng)險(xiǎn)資金,有區(qū)域分佈不均的問(wèn)題創(chuàng)業(yè)投資資金來(lái)源特質(zhì)型態(tài)出資者投資對(duì)象個(gè)人創(chuàng)業(yè)投資家富有之個(gè)人風(fēng)險(xiǎn)性事業(yè)大公司屬創(chuàng)業(yè)投資部門(mén)大型企業(yè)相關(guān)事業(yè)或高科技事業(yè)小型企業(yè)投資公司自有資本/政府貸款新興中小企業(yè)高科技共同基金保險(xiǎn)基金/退休基金新興科技企業(yè)投資銀行銀行/金融機(jī)構(gòu)新興中小型科技公司知識(shí)型科技創(chuàng)業(yè)社會(huì)之建議鼓勵(lì)學(xué)術(shù)界投入本土創(chuàng)業(yè)管理之研究,鼓勵(lì)知識(shí)推廣跨領(lǐng)域人才之培訓(xùn)建構(gòu)成功創(chuàng)業(yè)資料庫(kù),交流分享創(chuàng)業(yè)觀點(diǎn)檢視經(jīng)營(yíng)規(guī)模發(fā)現(xiàn)核心價(jià)值利用知識(shí)力與創(chuàng)造力成為競(jìng)爭(zhēng)優(yōu)勢(shì)強(qiáng)化產(chǎn)業(yè)供應(yīng)鏈角色臺(tái)灣的實(shí)例說(shuō)明
SemiconductorEquipmentandPartsLocalizationinTaiwan
TedHsiaoTaiwanSemiconductorIndustryInfrastructureTaiwanITIndustryStrategyTaiwan’sSemiconductorIndustryClusterTaiwanFoundryServiceTaiwanSemiconductorEquipmentIndustryEquipmentIndustryClusters&LaborSupportMajorSectorsofTaiwanEquipmentIndustry
-DevelopmentHistory-Equipment-KeyComponentsHeadingintothe21stCentury–TaiwanITIndustryStrategy–Two-trillion&Two-starIndustriesTwo-trillion+Two-starIndustriesinTaiwanThenewphilosophyofTaiwan’sindustrialdevelopmentofthenewmillenniumwillbebasedupontechnologydevelopmentandresearch.Two-trillionIndustries-
StartingfromourexistingstrengthandrootsintheICanddisplays,wewilldevelopglobalmanufacturingandR&Dcentersaroundtheseareas.Two-starIndustries–
Ontheotherhand,Taiwanhasdevelopedgreatenvironmentfortechnologyinnovation&societalapplicationenvironment.Thisiskeytodevelopthedigitalcontent&bio-technologyindustries.TaiwanITIndustryStrategyUniqueDisintegratedInfrastructureinTaiwanSource:ITISProject,IEK,ITRI,March2002Crystal
GrowingWaferSlicingDesign
LeadframeTestingPackagingManufactureMaskWaferChemicalsEDASIPMaterialsEquipment/InstrumentsCapital/HumanResourcesService&SupportShippingCustomsScience-basedIndustrialParks
180
4
154536
8
4
19
board
15Taiwan’sSemiconductorIndustryClusterTaiwanFoundryService
LowCostHighYieldShortCycleTimeLargeCapacityFlexibleCustomerServiceTaiwanFoundryServiceGlobalCustomerBaseContinuestoExpandLongtermrelationshipwithfablesscompaniesMoreDRAMfoundryordersfromJapanIDMsexpandoutsourcingMoreWaferCapabilityForecastedMore12”waferfabstobebuiltCurrentEquipmentIndustryClusters&LaborSupportMajorSectorsofTaiwanEquipmentIndustryDevelopmentHistoryEquipmentKeyComponentsTaiwanSemiconductorEquipmentIndustryLocalProductionofSemiconductorEquipment(NTD$Bil.)
2.8%3%4.6%6%LocalizationFrontendwaferprocess19%Parts&components43%Backend23%Year2000Opto-electronicequipment15%R+D&ProductionofEquipmentinTaiwanEquipmentDemand(Unit:NTD$billion)*R+DbyICfoundriesarenotincluded.TaiwanUSAEquipmentMarket1,5003,000EquipmentProductionFrontend20TL:906,000Backend20Parts&Components50R+DFundingGovernment10TL:30600Industry20Production/Market6%200%R+DFunding/Production-10%R+DFunding/Market2%-IndustryClusters&IndustrialParks晶研科技﹑和立聯(lián)合﹑慶康﹑臺(tái)科半導(dǎo)體﹑臺(tái)灣應(yīng)材﹑科林﹑科磊﹑漢民﹑亞泰﹑崇越元利盛﹑中科院臺(tái)灣飛利浦﹑公準(zhǔn)精密﹑長(zhǎng)興化工﹑鈦昇﹑錄海臺(tái)灣應(yīng)用材料﹑和立聯(lián)合華東半導(dǎo)體﹑鈦昇﹑盟立﹑弘塑﹑拓技﹑嵩展﹑崇越﹑誠(chéng)遠(yuǎn)﹑恩德﹑聚昌﹑力智FrontendBackend/Others群錄﹑鉅基﹑楊鐵﹑優(yōu)力特﹑上銀﹑科強(qiáng)﹑臺(tái)灣暹勁﹑漢翔﹑臺(tái)翔﹑臺(tái)灣精銳均豪﹑榮眾科技LocalLaborMarket
HighlyeducatedworkforceinTaiwan-Plentyofhighlytrainedtechnicalpersonnelavailableformanufacturingpurposes.-Designengineersareabound,butneedtobetrainedtohandledifferentmanufacturingprocessesinmakingsemiconductorprocessequipment.-Manycollegeortradeschoolgraduateworkforceavailable.-AvailabilityofR+Dpersonnel,engineers,andtechniciansOn-the-jobtraining
-Specialpost-schoolvocationaltrainingprograms
-Cost-sharingSupports
-Specifictraining/educationalprojectsbetweengovernmentandprivateinstitutions
-Technicaleducationprovidedbyuniversity-industryallianceMulti-chamberclusterSPUTTER、ECREtcher、CMPTFT-LCDvacuumequipmentdry&wetcleaneq.WaferreclaimprocessLPCVD、ETCH、asher、UVpassivationAuto.waferclean&Particleremovaleq.、Eq.SEMIS2certificateGlasssubstratepolishingeq.High-kmaterialCVDNewwafermaterials&ingots、RTP,highprecisioningotwiresaw、ionimplantercomponents、newprocesseq.Wirebonder,ICdieattach、automold、leadcutter、laserengraving、loader/unloader。ICdieattachSMTSMTChipMounterAutomoldLaserengravingeq.Dicingeq.Wafer&BGAsubstratecuttermicroBGAFlipchip、CSP、WLPeq.、SOCpackagingNewdevicepackageeq.:3Dpackage、MEMS/NanodevicepackageSemiconductoreq.Componentsupplychainqualification:quartz、MFC、coating&treatment、mirrorpolisheq.Moduleassy、partscleaning&modification、valve&fittingMfgqual-precisionmetalmachining、quartz、ceramic、anodizing、EPSemiconductorgradeEPgas-linesVacuumchambercomponentDrypump&turbopump、Filter、MFC、temp、pressuremeasurementgageLinearmotor、atm&vacuumrobotEq.foundryElectronicpanelgaspanelRFGenerator/MatchNewcomponentdevelopment-TFT-LCDproductioneq.interfaceLargewafersizeeq.mfg-SPUTTER、PECVDⅢ-Ⅴcompoundsemiconductorprocesseq.SMTchipmounter、probecard&testeq.、prober、opticalsubstratetesteq.、testprobe&sorter、visioninspection、testloader/unloader、BGAsubstratetestSMIFpod、SMIFPodCleaner、AMHS、factoryproductionmonitoringsystem、APCsoftware、wafertransport、PDMPackagingEquipmentSub-assemblyKeyComponentTFT-LCD&Opto-electr.ICEquipmentTestEquipmentAutomationEquipmentFrontendEquipment2000200220061996DevelopmentHistory–Semicon.EquipmentWaferdicingWaferreclaimcleanThinfilmcoaterPhotolithoetchDiffusionashingMeasurement&test晶圓切斷設(shè)備線切斷機(jī)
內(nèi)周刃切斷機(jī)晶圓表面研磨設(shè)備雙面研磨機(jī)單面研磨機(jī)清洗設(shè)備清洗設(shè)備乾燥裝置薄膜設(shè)備
CVD.PVD氧化設(shè)備磊晶設(shè)備光阻塗佈設(shè)備光阻塗佈機(jī)烘烤爐微影設(shè)備步進(jìn)機(jī)
EB描畫(huà)機(jī)顯影機(jī)蝕刻設(shè)備乾式蝕刻機(jī)濕式蝕刻機(jī)離子摻雜設(shè)備離子植入機(jī)回火設(shè)備擴(kuò)散爐光阻剝離設(shè)備光阻去除機(jī)晶圓測(cè)試設(shè)備晶圓測(cè)試機(jī)repeat拓技科技(wetbench)弘塑(wetbench)等二十家晶研科技(CVD)和立聯(lián)合(PVD)倍強(qiáng)(e-gunevap)聚昌(e-gun)亞泰金屬(CMP)臺(tái)科(UVpassivation)東臺(tái)精機(jī)、中科院(CMP)臺(tái)科半導(dǎo)體(PRromover)上宜雷射(Excimerlaserasher)鑫測(cè)科技(logictester)群立積體電路(mix-signaltester)聯(lián)測(cè)(ICTester)等數(shù)家廠商晶研科技
(plasmaetch)慶康(etch)中科院(plasmaeq.)clustertool+ECRFactoryAutomation鐠德、外商三家、機(jī)械所(SMIF)群錄(wafertransport)健昇自動(dòng)化(eq.electroniccontrol)上尚科技(materialtrackingsystem)盟立(cleanroomtransport)KeyComponents科強(qiáng)精密(MFC)科程科技、東元電機(jī)(Chiller,dry&turbopump)慶康科技(E-Chuck)公準(zhǔn)、昂承等(metalmachining:WaferLift)崇越石英、圓益石英等數(shù)家(quartz)大甲永和、榮科科技(ultracleangas-line)榮眾科技、華航、公準(zhǔn)(anodize、EP、coating)機(jī)械所(MFC、drypump)資料來(lái)源:工研院機(jī)械所ITIS計(jì)畫(huà)Frontend
SemiconductorProcessEquipment金敏科技昇陽(yáng)半導(dǎo)體(waferreclaim&grianding)和立聯(lián)合
DNSKaijoTELAMTNovellusTELTELCanonNikonTELAMTLAMTELAMTEatonVarianPSCMattsonKEMKLAAdvantestTeradyneEquipmentGlobalSupplierTaiwanSupplierProcess均豪基丞高工鉅基鈦昇錄海資料來(lái)源:工研院機(jī)械所ITIS計(jì)畫(huà)Dic-ingDieBondBakeWireBondMold-ingPlat-ingEngravingTrimFormTest切割機(jī)半自動(dòng)切割全自動(dòng)切割黏晶機(jī)黏晶機(jī)LOC黏晶機(jī)LED黏晶機(jī)烘烤機(jī)傳統(tǒng)烤箱SnapCureOven銲線機(jī)金線銲線機(jī)鋁線銲線機(jī)封膠機(jī)傳統(tǒng)封膠設(shè)備自動(dòng)封膠機(jī)(AutoMolding)電鍍?cè)O(shè)備掛架式AutoPlating蓋印機(jī)油墨蓋印雷射蓋印剪切/成型剪切機(jī)成型機(jī)測(cè)試設(shè)備O/S測(cè)試外觀檢測(cè)DiscoK&S東京精密SEIKO精機(jī)ESECNEC機(jī)械A(chǔ)SMAlphasemK&SToshiba日立東京電子ESECASMPacificFICOLAMDAK&S新川ESECKaijoASMTOWAAPICYAMADAFICOASA第一精工ESECASMPacificLite-OnFUJITSUPASCONKOTAKI富士機(jī)工MARKEMLUMONICS東芝NECNEC機(jī)械FICOLAMDABIDServiceFujitsuASMASM-FICOHan-MiPASCONTOWAInterconKRASSANTECFICOMICROVISIONVISIONENGINEERINGNAVITAR優(yōu)力特力智斯利康華東(機(jī)械所)冠西華東科技(機(jī)械所)新美化(手動(dòng))京華超音波(半自動(dòng))基丞均豪鉅基均豪基丞盛技鈦昇格瑞乘遠(yuǎn)東捷(機(jī)械所)鑫測(cè)柏格彥亞志聖友大BackendSemiconductorProcessEquipmentEquipmentGlobalSupplierTaiwanSupplierProcessCompoundSemiconductorProcessEquipmentDicingSawProcessGrindingCleanThinFilmPRCoatingLithoEtchDiffu-sionAshingInspec-tionTaiwanSupplier韋僑科技同上同上晶研科技(CVD)和立聯(lián)合(PVD)慶康(PVD)倍強(qiáng)(e-gunevap)亞泰金屬(CMP)臺(tái)科(UVpassivation)臺(tái)中精機(jī)(光學(xué)鍍膜)晶研科技/Novellus
(電漿蝕刻機(jī))慶康(蝕刻機(jī))臺(tái)科半導(dǎo)體/PSC(光阻清洗設(shè)備)致茂科技(邏輯測(cè)試機(jī))等數(shù)家廠商和立聯(lián)合
(擴(kuò)散爐)志聖(LCD光阻塗佈)GlobalSupplierOxfordInstrumentAixtronetc.MarketisFilledMostlybyUsedEquipmentOxfordInstrumentAixtronetc.Automation鐠德、外商三家、機(jī)械所 SMIF群錄 WaferTransportSystems,AMHS,AGV健昇自動(dòng)化 Equipmentcontrolmodules上尚科技 Materialsupplyandtrackingsystems&Equipmentcontrol盟立 AGV,transportationsystemsMaincomponents上銀科技 X-ytables,ballscrews,linearguide&linearmotors科強(qiáng)精密 MFC科程科技、東元電機(jī) Chiller、drypump、turbopump、equipmentpowermodule慶康科技 E-Chuck公準(zhǔn)、昂承等 specialtymetalmachining&vacuumcomponents崇越石英、圓益石英等數(shù)家 quartz&ceramic大甲永和、榮科科技 gasline&gaspanel榮眾科技、華航、公準(zhǔn) anodizing、electropolish、specialtycoatingAutomation&Componentsvisionsystems,alignmentsystems,opticallenses,pinprobes,displays&monitors,industrialcomputer,wireandharness,electricswitchboards,PCBtowers,pneumaticcomponents,structures,watermanifold,piping,MFC,etc.
Takeintoconsideration:GoodKnowledge,BetterCost,GoodLocation,andHighQualityLaborManufacturability(SAP/ERP)andReliabilityMachiningofmetalliccomponentsofallsizesisnoproblem,someoftheworld'sbestCNCmachinecentresareMIT.BasedintheTaichungarea,butmanycompaniesspreadouttheislandMachininglargesizeisnoproblem:machinecentreaslargeas5~50m.Posttreatmentisalsoavailable(suchascoating).Anodizationisavailable(smallerthan3meters).Servicesavailable:EP&largeceramiccomponents.Travelwithin3~5hoursdrivingdistanceInfrastructure:SuppliersofComponentsISOqualified-ISO9000,9001,9002,or14001qualified.PeopleareveryfamiliarwiththeISOqualifiedconcept.ManysmallermanufacturersinHsin-Chu&Taipeihaveexcellentknowledgeaboutultra-cleanlinessrequirement.Thesizesofcompaniesrangesquiteabit,anywherefroma5personoperationtoseveralhundredpersonnelcompaniesManyhaveexperienceworkingwithinternationalcustomersInfrastructure:SuppliersofComponentsSummary
WorldwidesystemsuppliersarepresentinTaiwaneitherastradeagentsorbranchoffices.MajorcomponentsuppliersarepresentinTaiwaneitherasdistributors,tradeagents,branchoffices,andsomelocalmanufacturing.TaiwanlocalcomponentsuppliersaregraduallyshifttoOEMsourcingpartnersandbecomingqualifiedsuppliers.WiththedrivingforceofTwo-TrillionandTwo-Stars,thelocalizationofequipmentcomponentsspeedup.
Two-trillion+Two-starIndustriesThenewphilosophyofTaiwan’sindustrialdevelopmentofthenewmillenniumwillbebasedupontechnologydevelopmentandresearch.Two-trillionIndustries-
StartingfromourexistingstrengthandrootsintheICanddisplays,wewilldevel
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