ASM-自動焊線機(jī)器介紹Au-wire-bonding-process課件

27-Nov-23ASMPacificTechnologyLtd.?2009page1

Section9.3

BasicAuWireBondProcess27-Nov-23ASMPacificTechnologyLtd.?2009page2ContentsBasicIntroductionGoldWireBonderBondingSequenceMaterial&ToolsBondQuality27-Nov-23ASMPacificTechnologyLtd.?2009page3BasicIntroductionUnderstandanICPackageICManufacturingFlowWireBondingIntroduction27-Nov-23ASMPacificTechnologyLtd.?2009page4Cross-sectionofanICPackageDieGoldWireLeadFrame27-Nov-23ASMPacificTechnologyLtd.?2009page5WaferGrindingDieBondingWaferSawToasterWireBondingDieSurfaceCoatingMoldingLaserMarkSolderBallPlacement

SingulationPackingICManufacturingFlowDejunkTrimSolderPlatingSolderPlatingForming/SingulationTrim/Forming

BGASURFACEMOUNTPKGTHROUGHHOLEPKG27-Nov-23ASMPacificTechnologyLtd.?2009page6GoldWireBondingDiePadLeadGoldwireBallBond(1stBond)WedgeBond(2ndBond)27-Nov-23ASMPacificTechnologyLtd.?2009page7WedgeBonding27-Nov-23ASMPacificTechnologyLtd.?2009page8WhattechniqueisusedinGoldWireBonding?27-Nov-23ASMPacificTechnologyLtd.?2009page9WireBondingTechniquesTherearethreebasicwirebondingtechniques:Thermosonicbonding:utilizestemperature,ultrasonicandlowimpactforce,andball/wedgemethods.Ultrasonicbonding:utilizesultrasonicandlowimpactforce,andthewedgemethodonly.Thermocompressionbonding:utilizestemperatureandhighimpactforce,andthewedgemethodonly.27-Nov-23ASMPacificTechnologyLtd.?2009page10ThermocompressionvsThermosonicThermocompressionweldingusuallyrequiresinterfacialtemperatureoftheorderof>300°C.Thistemperaturecandamagesomedieattachplastics,packagingmaterials,andlaminates,aswellassomesensitivechips.Thermosonicwelding,theinterfacetemperaturecanbemuchlower,typicallybetween100to150°C,whichavoidssuchproblems.Theultrasonicenergyhelpsdispersecontaminatesduringtheearlypartofthebondingcycleandhelpscompletetheweldincombinationwiththethermalenergy.27-Nov-23ASMPacificTechnologyLtd.?2009page11AdvantagesofThermosonicMetallurgicaljoiningismorereliablethanconductiveparticlesandadhesivejoining.Processcycletimecanbereducedfromseveralminutestolessthan10seconds.Lowermanufacturingcostperunit.27-Nov-23ASMPacificTechnologyLtd.?2009page12Wirebonding

OperatingTemperatureWireMaterialsPadMaterialsNoteThermo-compression300-500°CAuAl,AuHighpressure,noultrasonicenergyUltrasonic25°CAu,AlAl,AuLowpressureinultrasonicenergyThermosonic100-240°CAu,CuAl,AuLowpressureinultrasonicenergyComparisonofDifferentWireBondingTechniques27-Nov-23ASMPacificTechnologyLtd.?2009page13WhataretheimportantparametersinGoldWireBonding?27-Nov-23ASMPacificTechnologyLtd.?2009page14BondingParametersThermosonicBondingPressure(Force)Amplify&Frequency(Power–138KHz)WeldingTime(BondTime)WeldingTemperature(Heater)

HighPower3.2WmaxLowPower1.6WmaxUltra-LowPower0.8WmaxPower-mWVib.-umPower-mWVib.-umPower-mWVib.-um32003.2116002.268001.5927-Nov-23ASMPacificTechnologyLtd.?2009page15SiO2Si

BondingPrincipleAlPressure(Force)Vibration(Power)ContaminationMoistureAl2O3GlassHeat27-Nov-23ASMPacificTechnologyLtd.?2009page16NexttoGoldWireBonder27-Nov-23ASMPacificTechnologyLtd.?2009page17GoldWireBonderMachineRoadmapUnderstandIndividualPartMachineSpecificationBondingTemperature27-Nov-23ASMPacificTechnologyLtd.?2009page18ASMGoldWireBonderRoadmapMachineModel(ATS)AB308

AB309

AB309A

AB339

AB339Eagle

Eagle60

Eagle60AP

Harrier

TwinEagle

HummingBird

Eagle50??27-Nov-23ASMPacificTechnologyLtd.?2009page19ASMGoldWireBonderMachineModel(ATS)DescriptionEagle60-00ICApplicationsEagle60-01TO-92Eagle60-02Opto(BentLeadframe)ApplicationsEagle60-03VerticalLEDorOptoApplicationsEagle60-08Power&HybridDeviceApplicationsEagle60-09Power&HybridDeviceApplications27-Nov-23ASMPacificTechnologyLtd.?2009page20MatchingEagle60APEagle60-03HummningBirdHarrierTwinEagle.....ACEDB27-Nov-23ASMPacificTechnologyLtd.?2009page21Eagle60AP

MachineIntroduction27-Nov-23ASMPacificTechnologyLtd.?2009page22Eagle60vsEagle60AP

Eagle60Eagle60APFinepitch35μm.30μm.Speed60+ms.<60ms.BondheadDigitalbondheadNewbondheadwith8~10%fasterBondPlacementAccuracy±3μm@3sigma±2.5μm@3sigmaLoopTypesStandardloopingdatabaseAdditionalEscargot,Flex,BellloopOptics

ProgrammableBallFormationMonitoringStandard8xfasterCapacitancenon-stickdetectionStandard10xfaster27-Nov-23ASMPacificTechnologyLtd.?2009page23LowimpactforceRealtimeBondingForcemonitoringHighresolutionz-axispositionwith0.4micronperencoderstepFastcontactdetectionSuppressedForcevibration&FastForceresponseFastresponsevoicecoilwireclampBondHeadASSY27-Nov-23ASMPacificTechnologyLtd.?2009page24XYTableLinearMotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX-Ypositioningaccuracyof+/-3um@3sigmaResolutionof0.2umperencoderstep27-Nov-23ASMPacificTechnologyLtd.?2009page25W/HASSYIndexingresolutionof1umperencoderstepFullyprogrammableindexer&tracksMotorizedwindowclampwithsoftclosefeatureOutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevice27-Nov-23ASMPacificTechnologyLtd.?2009page26BondingSystemBondingMethod

Thermosonic(TS)BQMMode

Multi-modewithprogrammableBQMBdWireSize 15.2umupto76.2um(Au,Cu)WireLength 0.6to8mmBondingAccuracy +/-2.5um@3sigmaBondingArea 54mmX65mm(LFWidth72mm) 54mmX(137-LFWidth)mmBondingSpeed +60msfor2mmWire(Qloop)BondForceRange 1~400gramLoopType

Q-Auto,Square&PentaLoopHeightRange

3~16milXYResolution

0.2umZResolution

0.4umFinePitchCapability

30umpitch@0.6milwireNo.ofBondingWires

upto3000ProgramStorage

1000programsonHardDiskTransducerSystem 138KHZEagle60APMachineSpecifications(1)27-Nov-23ASMPacificTechnologyLtd.?2009page27VisionSystemPatternRecognitionTime

60ms/pointPatternRecognitionAccuracy

0.37umLeadLocatorDetection

12ms/leadMinimumLeadPitch 80umPostBondInspection

1st,2ndBondandWire TracingDepthofField

3.5X(320um) 8X(100um)FacilitiesSinglePhase110VAC(optional100/120/200/210/220/230/240VACFloorSpacing 720mm(width)X 820mm(length)X 1600mm(height)Eagle60APMachineSpecifications(2)27-Nov-23ASMPacificTechnologyLtd.?2009page28MaterialHandlingSystemIndexerResolution

1umLeadframePositionAccuracy

2milApplicableLeadframe

W=23~90mm@bondingareainY=65mmL=140~295mmT=0.1~0.8mmApplicableMagazine

W=16~100mm(Maximum) L=140~295mm H=180mm(Maximum)MagazinePitch

2.4~10mm(0.09”~0.39“)DeviceChangeover

<4minutes(withinsameLFtype)PackageChangeover

<5minutes(betweenLFtype)NumberofBufferMagazine

3(max.435mm)Eagle60APMachineSpecifications(3)27-Nov-23ASMPacificTechnologyLtd.?2009page29SPCCapabilityMTBF:168HoursMTBA:2HoursMTTA:1MinuteMTTR:30MinutesOthersAbletolinkuptoformInlineSystem(IDEALine)CompatibletoOLP(OfflineProgrammingSoftware)PowerFailureProtectionEagle60APMachineSpecifications(4)27-Nov-23ASMPacificTechnologyLtd.?2009page30TheWireBondTemperatureMaterial Preheat Bondsite CUL/F 200+/-10 200+/-10 ALL/F 210+/-10 230+/-10 BGA 150+/-10 160+/-10 TFBGA 150+/-10 160+/-10 LBGA 150+/-10 160+/-10NotIncludeDedicateLine27-Nov-23ASMPacificTechnologyLtd.?2009page31NexttoBondingSequence27-Nov-23ASMPacificTechnologyLtd.?2009page32BondingSequence27-Nov-23ASMPacificTechnologyLtd.?2009page33PadLeadBondingSequenceWireClampCapillaryGoldWireFreeAirBall27-Nov-23ASMPacificTechnologyLtd.?2009page34PadLeadMovefromResetPositionFirst,wireclampopenSecond,bondheadmovedownto1stbondpositionThird,FABiscapturedatthechamfer27-Nov-23ASMPacificTechnologyLtd.?2009page35Approachto1stBondSearchHeightPadLeadSearchHeight27-Nov-23ASMPacificTechnologyLtd.?2009page36Goingto1stBondPositionSearchSpeed1SearchTol.1PadLead27-Nov-23ASMPacificTechnologyLtd.?2009page37SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition27-Nov-23ASMPacificTechnologyLtd.?2009page38SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition27-Nov-23ASMPacificTechnologyLtd.?2009page39SearchSpeed1SearchTol.1PadLeadGoingto1stBondPosition27-Nov-23ASMPacificTechnologyLtd.?2009page40TouchDownSearchSpeed1SearchTol.1PadLead27-Nov-23ASMPacificTechnologyLtd.?2009page41ImpactForcePadLeadFormationof1stBond27-Nov-23ASMPacificTechnologyLtd.?2009page42heatPressureUltraSonicVibrationPadLeadFormationof1stBond(ContactPhase)27-Nov-23ASMPacificTechnologyLtd.?2009page43heatPressureUltraSonicVibrationPadLeadFormationof1stBond(BondPhase)27-Nov-23ASMPacificTechnologyLtd.?2009page44CapillaryrisestoReverseHeightPositionPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page45PadLeadCapillaryrisestoReverseHeightPosition27-Nov-23ASMPacificTechnologyLtd.?2009page46PadLeadCapillaryrisestoReverseHeightPosition27-Nov-23ASMPacificTechnologyLtd.?2009page47PadLeadCapillaryrisestoReverseHeightPosition27-Nov-23ASMPacificTechnologyLtd.?2009page48PadLeadCapillaryrisestoReverseHeightPosition27-Nov-23ASMPacificTechnologyLtd.?2009page49RHPadLeadCapillaryrisestoReverseHeightPosition27-Nov-23ASMPacificTechnologyLtd.?2009page50GoingtoReverseDistancePositionRD(ReverseDistance)PadLead27-Nov-23ASMPacificTechnologyLtd.?2009page51FormationofaLoopPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page52PadLeadFormationofaLoop27-Nov-23ASMPacificTechnologyLtd.?2009page53CalculatedWireLengthWireClampClosePadLeadGoingtoLoopTop27-Nov-23ASMPacificTechnologyLtd.?2009page54CalculatedWireLengthPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page55SearchDelayTrajectoryPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page56PadLeadTrajectoryAtthismoment,starttocheck1stbondstickdetection27-Nov-23ASMPacificTechnologyLtd.?2009page57PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page58PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page59PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page60PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page61PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page62PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page63PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page64PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page65PadLeadTrajectory27-Nov-23ASMPacificTechnologyLtd.?2009page662ndSearchHeightApproachto2ndSearchHeightPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page67SearchSpeed2SearchTol2PadLeadGoingto2ndBondPosition27-Nov-23ASMPacificTechnologyLtd.?2009page68SearchSpeed2SearchTol2PadLeadGoingto2ndBondPosition27-Nov-23ASMPacificTechnologyLtd.?2009page69PadLeadheatFormationof2ndBond27-Nov-23ASMPacificTechnologyLtd.?2009page70heatPadLeadFormationof2ndBond(ContactPhase)27-Nov-23ASMPacificTechnologyLtd.?2009page71heatheatPadLeadFormationof2ndBond(BondPhase)27-Nov-23ASMPacificTechnologyLtd.?2009page72TailLengthPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page73TailLengthPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page74TailLengthPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page75TaillengthTailLengthPadLead27-Nov-23ASMPacificTechnologyLtd.?2009page76DisconnectionoftheTailPadLeadAtthismoment,starttocheck2ndbondstickdetection27-Nov-23ASMPacificTechnologyLtd.?2009page77PadLeadDisconnectionoftheTail27-Nov-23ASMPacificTechnologyLtd.?2009page78PadLeadDisconnectionoftheTail27-Nov-23ASMPacificTechnologyLtd.?2009page79FormationofaNewFreeAirBallPadLeadApply5000Vtogeneratethesparktomeltthegoldwire27-Nov-23ASMPacificTechnologyLtd.?2009page80PadLeadFormationofaNewFreeAirBall&BacktoResetPosition27-Nov-23ASMPacificTechnologyLtd.?2009page81ChipInter-connectionUsingWireBonding27-Nov-23ASMPacificTechnologyLtd.?2009page82NexttoMaterial&Tools27-Nov-23ASMPacificTechnologyLtd.?2009page83Material&ToolsLeadFrameCapillaryGoldWireWindowClamp&TopPlate27-Nov-23ASMPacificTechnologyLtd.?2009page84LeadFrame(1)27-Nov-23ASMPacificTechnologyLtd.?2009page85LeadFrame(2)27-Nov-23ASMPacificTechnologyLtd.?2009page86Capillary(1)CapillaryManufacturer(SPT,GAISER,PECO,TOTO…)CapillaryData(Tip,Hole,CD,CA,FA&OR,IC)27-Nov-23ASMPacificTechnologyLtd.?2009page87Capillary(2)Capillariesaretypically1/16"(.0625"/1.587mm)indiameterand.437"(11.10mm)inlength.27-Nov-23ASMPacificTechnologyLtd.?2009page88HowToDesignYourCapillaryCapillary(3)TIP

PadPitchx1.3~TIPHole

Wirediameter+40%10%CD

Padsize/open/1stBallCD+0.4~0.6=1stBondBallsizeFA&OR

Padpitch(um) FA >100 0,4 ~90/100 4,8,11 <90 11,15ICtype

looptype27-Nov-23ASMPacificTechnologyLtd.?2009page89Capillary(4)WireDiameter(mil)RecommendedHole(mil)MinRecommendedHole(mil)2.03.02.41.52.21.81.31.81.51.21.71.41.11.61.31.01.51.20.91.21.10.81.00.950.70.90.8527-Nov-23ASMPacificTechnologyLtd.?2009page90Capillary(5)MatteFinishenlargesEffectiveFaceandcreatesbetterfrictionwiththegoldwireduringbondformation.PolishFinishprovidessmooth2ndbondandprolongsthecapillarylifespanduetoreducecontaminationaccumulationrate.27-Nov-23ASMPacificTechnologyLtd.?2009page91

CapillaryParameterswhichAffecttheBondingProcess

LoopingFeedholeInnerChamferOuterRadiusandFaceAngle27-Nov-23ASMPacificTechnologyLtd.?2009page92

CapillaryParameterswhichAffecttheBondingProcessSmallerORSharperEdgeLikelihoodofCracksBiggerORReducesCracksReducesEffectiveFaceIncreaseFACompensateSmallerTipAreaHigherCrossSection27-Nov-23ASMPacificTechnologyLtd.?2009page93

CapillaryCondition27-Nov-23ASMPacificTechnologyLtd.?2009page94GoldWireGoldWireManufacturer(MKE,MEM,Nippon,SUMITOMO,TANAKA….

)GoldWireData(WireDiameter,Type,EL,TS)27-Nov-23ASMPacificTechnologyLtd.?2009page95PropertiesofVariousWireTypesPropertyCuAuAlAgElectricConductivity(%IACS)103.173.464.5108.4ThermalConductivity(W/mK)398.0317.9243.0428.0ThermalExpansionCoeff(mm/mK)16.514.223.619.0TensileElasticModulus(GPa)11578627127-Nov-23ASMPacificTechnologyLtd.?2009page96GoldWire(ApplicationofWireType)27-Nov-23ASMPacificTechnologyLtd.?2009page97GoldWire(FreeAirBall)Thediameterofthefree-airballrangesfor1.5times(forsmallballultra-finepitchapplication)to2.5times(forlargeballnon-finepitchapplication)ofwirediameter(WD).27-Nov-23ASMPacificTechnologyLtd.?2009page98GoldWire(HeatAffectedZone)Sourcefrom:MKElectron27-Nov-23ASMPacificTechnologyLtd.?2009page99GoldWire(ElectricalResistance)Sourcefrom:MKElectron27-Nov-23ASMPacificTechnologyLtd.?2009page100WindowClamp&TopPlate27-Nov-23ASMPacificTechnologyLtd.?2009page101WindowClampDimension(1)27-Nov-23ASMPacificTechnologyLtd.?2009page102WindowClampDimension(2)27-Nov-23ASMPacificTechnologyLtd.?2009page103TopPlateDimension(1)27-Nov-23ASMPacificTechnologyLtd.?2009page104TopPlateDimension(2)27-Nov-23ASMPacificTechnologyLtd.?2009page105NexttoBondQuality27-Nov-23ASMPacificTechnologyLtd.?2009page106BondQualityBasicRequirementforSuccessfulWireBondingBasicMeasurementWirePull&BallShearTestBondFailure27-Nov-23ASMPacificTechnologyLtd.?2009page107BasicRequirementforSuccessfulWireBondingCleaningProperTemperatureSettingProperForceSettingProperPowerSettingProperClampingProperTooling27-Nov-23ASMPacificTechnologyLtd.?2009page108CleaningMethodsThemetallizationmustbefreeoforganicandinorganiccontamination.Forexample,fingerprintoilonthebondingareareducesthereliabilityoftheinterconnection.Plasmacleaningiseffectiveforremovingepoxybleed-out,whichiscausedbyoutgassing.Gasestypicallyusedinplasmascanincludecombinationsofargon,nitrogen,hydrogen,oxygen,andotherlesscommongasesUVozonecleaningemitssignificantamountsofradiation(wavelengths1848Aand2537A)toremoveorganiccontaminants.27-Nov-23ASMPacificTechnologyLtd.?2009page109ProperTemperatureSettingThermosonicbonding–100

C~150

C.Ultrasonicbonding–25

Corambienttemperature.Thermocompressionbonding–300

C~500

C.27-Nov-23ASMPacificTechnologyLtd.?2009page110ProperPowerSettingToensurequalitybonds,increasethepowersettingwithoutexertingorover-stressingthewire.Youwillknowover-stressingistakingplacewhenthepulltestingdeviceindicatesalowbreak.27-Nov-23ASMPacificTechnologyLtd.?2009page111ProperClampingMakesuretheunitisproperlyclampedintheworkholder,asitiscriticalthatnomovementtakesplace.Youcanverifythisbynudgingtheobjectwithtweezers.Ifmovementtakesplace,theunitmustbesecuredduringhighspeedbonding.27-Nov-23ASMPacificTechnologyLtd.?2009page112ProperToolingMakesurethetool(thecapillary)isinfunctionalcondition.Thepropertoolselectionisessentialforconsistentwirebonding.27-Nov-23ASMPacificTechnologyLtd.?2009page113BasicMeasurementProcessstabilityismeasuredaccordingtothefollowingperformancespecifications:FreeAirBalldiameter(min,max,std,Cpk)Balldiameter&height(min,max,std,Cpk)Loopheight&shape(min,max,std,Cpk)Ballshearforce&Strength(min,Cpk)Wirepullforce(min,Cpk)Ballplacementaccuracy(min,Cpk)Confirmationrun(stability,numberofassists,visualinspection,UPH)Capillarydimensionstolerances(SPECs,effectonprocess,lifetime)Overallprocessfeasibility(cost,demand,timetomarket)27-Nov-23ASMPacificTechnologyLtd.?2009page114BondPadOpen&BondPadPitchUnit:umorMilBPO:

InternaldimensionofthepadinXandYaxisBPP:

DistanceofthepadcentertotheothernearbypadcenterBondPadPitchBondPadOpenBondPadOpen27-Nov-23ASMPacificTechnologyLtd.?2009page115BallSizeBallThicknessBallSizeBallSize&BallThicknessUnit:um,Mil

MeasureMagnification:50XBallThicknessCalculateFormula:

60umBPP:WD=50%

60umBPP:WD=40%~50%BallSize=PadSize–6umBondPadPitchWireDiameter27-Nov-23ASMPacificTechnologyLtd.?2009page116LoopHeightUnit:um,Mil

MeasureMagnification:20XLoopHeight線長27-Nov-23ASMPacificTechnologyLtd.?2009page117WirePullTestNeckPull WirePull StitchPullDieLead1/3ofwirelengthGoldwire27-Nov-23ASMPacificTechnologyLtd.?2009page118WirePullTestFactorsaffectingtheF:WirediameterWirelengthLoopheightPadtoleadplanegapProcessHooklocationTestercalibration,accuracyandvacuum27-Nov-23ASMPacificTechnologyLtd.?2009page119WirePullTestGradeBrokenatReasonQuality1BallLiftBadprocessPoor2BallNeckH.A.Z.Good3WireDependsonconditionVerygood4WeldWelddeformationGood5StitchLiftBadprocessPoor27-Nov-23ASMPacificTechnologyLtd.?2009page120WirePullTestGoodwedgesizecangiveoutstrong2ndbondAfterstitchpull,thewedgestillremainonlead(2ndbond)27-Nov-23ASMPacificTechnologyLtd.?2009page121BallShearTestUnit:gramorg/mil2Inter-metallic(Coverageshouldhavemorethan75%,ShearStrength＞6.0g/mil2)SHEARSTRENGTH＝BallShear/Area(g/mil2)BallShear=x;BallSize=y;Area=π(y/2)2x/π(y/2)2=zg/mil227-Nov-23ASMPacificTechnologyLtd.?2009page122Inter-metallicatGoldBallPoorcoverage(34%)Goodcoverage(>75%)27-Nov-23ASMPacificTechnologyLtd.?2009page123Inter-metallicLayerThicknessX=Kt1/2WhereXistheinter-metalliclayerthickness,tisthetimeandKistherateconstantwhichiscalculatedbyfollowing:

K=Ce-E/KT

WhereCistherateconstant,eistheactivationenergy,KistheBoltzmanconstant,andTisthetemperatureinabsolutescale.27-Nov-23ASMPacificTechnologyLtd.?2009page124CBallbondTestspecimenSpecimenclampShearing

ramWireBondshoulderInterfacialcontact

ballbondweldareaBondingpadh(A)UnshearedCLCBallbondCLTestspecimenSpecimenclampBondingpadFullballattachedtowire-exceptforregions

ofintermetallicvoidingBallseparatedatbondingpad-Ballinterface-residualintermetallic(andsometimesportionofunalloyedballandmetal)onpadinbondinteractionarea(D)Ballbond-bondingpadinterfaceseparation(typicalAutoAl)CTestspecimenSpecimenclampShearingramWireMinorfragmentofball

attachedtowireBondingpadCLBallshearedtoohigh

(offline,etc.)onlya

portionofshoulderand

balltopremovedInterfacialcontact

ballbondweldarea(B)Wire(balltopand/orside)shearCBallbondCLTestspecimenSpecimenclampShearing

ramBondingpadMajorportionofballattachedtowireInterfacialcontact-

ballbondweldareaintact(C)Belowcenterlineshear,ballshearedthrough(typicallyAutoAu)CBallbondCLTestspecimenSpecimenclampBondingpadPadmetallizationseparatesfrom

underlyingsurfaceResidualpadonballball-padinterface

remainsintact(E)BondpadliftsTestspecimenSpecimenclampCBallbondCLBondingpadBondingpadlifts,takingportionofunderlyingsubstratematerialwithit(F)CrateringResidualpadandsubstrateattached

toball,ball-padinterfaceremains

intactShearFailureModes27-Nov-23ASMPacificTechnologyLtd.?2009page125NormalCondition27-Nov-23ASMPacificTechnologyLtd.?2009page126MaterialProblem27-Nov-23ASMPacificTechnologyLtd.?2009page127WithBallWirePadSizeMissingBallWireBrokenBondingBallInspectionBallDetection27-Nov-23ASMPacificTechnologyLtd.?2009page128BallSizePadCenterBallCenterBallPlacement(X,Y)BallOffPadBondingBallInspection(cont.)BallMeasurement27-Nov-23ASMPacificTechnologyLtd.?2009page129

Peeling1stBondFail(1)PossibleCauses:PowertoomuchBaseForcenotenoughAlpadnotfullycuredorcontaminationbetweenAlandoxidelayer27-Nov-23ASMPacificTechnologyLtd.?2009page130

BallLift1stBondFail(2)BallLiftBallLiftWithPadPeelingPossibleCauses:BasePowernotenoughMaterialproblem27-Nov-23ASMPacificTechnologyLtd.?2009page1311stBondFail(3)NeckCrackPossibleCauses:RDtoohighRHtoolowWrong/overusedcapillaryWireClampgaptoosmallWireproblemEFOCurrenttoolarge27-Nov-23ASMPacificTechnologyLtd.?2009page132OffCenterBallPossibleCauses:TailLengthtoolongWireorWirePathcontaminationEFOBoxorcableconnectionproblemAirTensionerflowtoolow1stBondFail(4)OffCenterBall(GolfBall)27-Nov-23ASMPacificTechnologyLtd.?2009page1331stBondFail(5)SmashBallPossibleCauses:TailLengthtooshortWireorE-torchcontaminationTipoftaillengthswingawayfromE-torchSmashBall27-Nov-23ASMPacificTechnologyLtd.?2009page1341stBondFail(6)MissingBallPossibleCauses:TailLengthtooshortFireLeveltoolowortoohighE-torchtipdirty2ndBondPower/Force/SearchSpeedtoohigh27-Nov-23ASMPacificTechnologyLtd.?2009page135WithWeldWireCapillaryMarkMissingWeldBrokenWedgeLeadSufficientWedgeWidth&LengthSecureToolImpressionNoFishTailNoDamage/BrokenWedgeBondingWeldInspectionWeldDetection27-Nov-23ASMPacificTechnologyLtd.?2009page136BrokenWedgePossibleCauses:2ndBondPower/ForcetoohighLeadclampingnotenough2ndBondFail(1)BrokenWedge27-Nov-23ASMPacificTechnolog