pcb壓合工藝英文

PCBlaminationprocessinEnglish目錄CONTENTSIntroductiontoPCBLaminationProcessPCBLaminatingMaterialPCBlandingequipmentandtoolsPCBLaminationProcessFlowPCBlandingqualityinspectionTheFutureDevelopmentofPCBPressingTechnology01IntroductiontoPCBLaminationProcessDefinitionofPressingProcessPressingProcess:Theprocessofcompressinglayersofcopper,fiberglass,andpreparingmaterialstogetherunderheatandpressuretoformarigidstructurePressuretransmissionPressureisappliedtocompressthelayerstogether,promotinguniformbondingandrefiningairbubblesThermalconductivityHeatisconductedthroughthelayerstopromoteuniformheatingandcuringoftheadhesiveHeatactivationHeatisappliedtoactivatetheadhesiveintheprematerial,ensuringgoodbondingbetweenlayersTheprincipleofpressingprocessPCBmanufacturing01Thepressingprocessiscommonlyusedinthemanufacturingofprintedcircuitboards(PCBs)tobondthelayerstogetherHighdensityinterconnects02TheprocessissuitableforcreatinghighdensityinterconnectsinPCBs,asitprovidesarigidanddimensionallystablestructureElectricalinsulation03ThepressedPCBsprovidegoodelectricalinsulationbetweenlayers,ensuringreliableperformanceinvariousapplicationsTheapplicationofpressingprocess02PCBLaminatingMaterialFR4ThemostcommonlyusedsubstrateinPCBplating,flameretardancy,gooddimensionalstability,butpoorheatresistanceKaptonHightemperatureresistance,goodchemicalresistance,butexpensiveanddifficulttoprocessPolyamideHightemperatureresistance,goodchemicalresistance,butexpensiveanddifficulttoprocessSelectionofsubstrateCyanoacrylateFastcuring,goodmoistureresistance,butpoorheatresistanceandmechanicalpropertiesPolyurethaneGoodelasticity,goodabrasionresistance,butpronetofoamingandcrackingEpoxyStrongadhesivestrength,goodheatresistanceandchemicalresistance,butnonetoyellowingandpackagingTypeofadhesiveCopperThemostcommonlyusedmetallayermaterialinPCBlayout,goodelectricalconductivityandutilityGoldHighelectricalconductivity,corrosionresistance,butexpensiveandeasytooxidizeSilverHighestelectricalconductivity,corrosionresistance,butexpensiveandeasytooxidize010203Materialofmetallayer03PCBlandingequipmentandtoolsThelayingmachineisaprecisionequipmentthatusespressureandheattobondmultiplelayersofcopperfoilandinsulatingmaterialstogethertoformaprintedcircuitboard(PCB)Theheatandpressurecausedbytheadhesiveintheinsulatingmaterialtoactivate,allowingthelayerstobondtogether,creatingasolidandunifiedPCBTheworkingprincipleoftheleasingmachineinvolvespassingthelayersofcopperfoilandinsulatingmaterialsthroughaseriesofheatedrollersunderhighpressureTheworkingprincipleoftheleasingmachineTherearetwomaintypesofleasingmachines:manualandautomaticManualleasingmachinesrequiremanualoperationandaresuitableforsmallscaleproductionAutomaticleasingmachinesaremoreeffectiveandcanproducePCBsinlargequantities,buttheyrequiremoreinvestmentinequipmentandoperatingcostsThetypeofleasingmachineSelectionofpressingtoolsWhenselectingpressingtoolsfortheplatingprocess,itisimportanttoconsiderthesizeandshapeofthePCB,aswellasthematerialusedfortheinsulatinglayerSelectionofpressingtools010203Pressingtoolscomeinvariousshapesandsizes,suchasflatplates,curvedplates,androllersFlatplatesaresuitableforPCBswithasmallsurfacearea,whilecurvedplatescanbeusedforPCBswithalargesurfaceareaorodshapesRollersareusedforcontinuousplatingprocessesWhenselectingpressingtools,itisalsoessentialtoconsidertheirmaterialproperties,suchashardness,thermalconductivity,andresistancetowearandtear04PCBLaminationProcessFlow123ThecoppersurfaceofthePCBmustbecleanandfreeofanyimpuritiestoensuregoodbondingbetweenthelayersCleaningofcoppersurfaceAnadhesiveisappliedtothecoppersurfacetopromoteadhesionbetweenthelayersofthePCBApplicationofadhesiveCoppersheetsarelayeredtogetherwiththehelpofheatandpressuretoformamultilayerPCBLaminationofCopperSheetsPreparationphaseCompressionoflayersThelayersofthePCBarecompressedunderhighpressuretoensuregoodbondinganduniformthicknessControloftemperatureandpressureThetemperatureandpressureduringcompressionarecarefullycontrolledtopreventdamagetothelayersandmaintainthedesiredthicknessMonitoringofprocessparametersProcessparameterssuchastemperature,pressure,andtimingareconsistentlymonitoredtoensurethequalityofthePCBCompressionstagePostprocessingstageThePCBisallowedtocooldownaftertheplatingprocesstopreventwarpingorcurlingTrimmingandshapingTheedgesofthePCBaretrimmedandshapedtoremoveanyexcessmaterialandachievethedesireddimensionsQualityinspectionTheplatingprocessisfollowedbyaqualityinspectiontocheckforanydefectsordefectsinthelayersorbondingCooling05PCBlandingqualityinspectionAppearanceinspectionTheplatingprocessshouldbefreefromforeigninclusionssuchasdust,hair,orotherdebrisInspectionforforeigninclusionsThesurfaceofthePCBshouldbefreefromwriters,bubbles,andothersurfaceregulationsSurfacesmoothnessThePCBshouldhaveaconsistentcolorandgloss,ensuringthatthefinishisaestheticallypleasingandsuitableforitsintendeduseColorandglossUniformityThethicknessofthePCBshouldbeuniformacrossitssurface,ensuringconsistentelectricalperformanceandstructuralstrengthThicknessshouldbemeasuredatmultiplepointsonthePCB,includingthecenterandedgestoensureoveralluniformityThethicknessofthePCBshouldfallwithinthespecifiedtolerancerange,whichistypically±0.05mmformostapplicationsMeasuringpointsToleranceThicknesstesting要點(diǎn)三AdhesionstrengthTheadhesionstrengthbetweenthecopperlayerandthesubstratematerialshouldbesufficienttostandthecoursesanddemandsoftheintendeduse要點(diǎn)一要點(diǎn)二AdhesiontestingmethodsAdhesioncanbetestedusingvariousmethodssuchaspeertests,crosscutsheartests,orindentationtestsAdhesionfailureanalysisIfadhesionisfoundtobeinadequate,failureanalysisshouldbeconductedtodeterminethecauseoftheproblemandimplementationcorrectivemeasures要點(diǎn)三Adhesiontesting06TheFutureDevelopmentofPCBPressingTechnologyPolymerMaterialsTheuseofhighperformancepolymerslikePEEKandPAEKwillincrease,replacingtraditionalepoxymaterialsduetotheirbetterthermalandmechanicalpropertiesIntroducingCeramicMaterialsCeramicmaterialslikeAlNandSi3N4arebeingusedinhighendPCBstoimprovetherm