PCB專業(yè)術(shù)語中英文對照

QC&FMEA中英文翻譯整理,,,,,QC&FMEA中英文翻譯整理,

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1,影響電性及外觀,Affectuponelectricalperformanceorappearance,,1,故障,failure\breakdown

,,,,,,,

2,過度的,Excessively,,2,夾頭,gripholder

,,,,,,,

3,異常,Abnormal,,3,解析度\解像度,resolution

,,,,,,,

4,規(guī)格不符,specificationisbelowstandard,,4,可靠度,reliability

,,,,,,,

5,品質(zhì)異常,qualityisbelowstandard,,5,孔位錯誤(孔偏),misholelocation

,,,,,,,

6,嚴格按照QC規(guī)定,StrictlyaccordingtoQCregulation,,6,孔徑\鉆孔直徑錯誤,HoleDiametererror

,,,,,,,

7,定期研磨,Tomakeregularlyre-sharpen,,7,離子污染度試驗,ioniccontaminationtesting

,,,,,,,

8,設(shè)備,device(另義:主動零件)\machine\equipment,,8,線距,linespace

,,,,,,,

9,參數(shù)設(shè)置錯誤,parameterssettingerror,,9,線寬,linewidth\tracewidth

,,,,,,,

10,依保養(yǎng)計劃,Accordingtothemaintainingplan,,10,感光油墨,liquidphotoimageablesolderresistink

,,,,,,,

11,壓力過小,lackofpressure,,11,批,batch\lot

,,,,,,,

12,曝光不全\過度,exposure-energyinsufficient\excessive,,12,裂痕\白斑\白點\白邊,crazing\mealing(白點)\Haloing(白邊)

,,,,,,,

13,間距不足,spacingnonenough,,13,對位不準,misregistration

,,,,,,,

14,線細,widthreduce,,14,釘頭,nailheading

,,,,,,,

15,光強度,LightIntensity,,15,數(shù)位鉆孔機,NCdrill

,,,,,,,

16,缺口,nick\chipping,,16,原稿底片,originalartwork(A/W)

,,,,,,,

17,氣泡,Bubble\blister\airinclusion,,17,鉆針重疊,overlap

,,,,,,,

18,異物,foreignparticle\foreignmaterial（壓合異物）\dust(灰塵),,18,氧化,oxidation

,,,,,,,

19,被污染,contaminated,,19,剝離\抗撕強度,peelstrength

,,,,,,,

20,干膜附著力不足,Pooradhesionofdryfilm,,20,感光起始劑,photoinitiator

,,,,,,,

21,固定點開路,fixedpositionopen,,21,凹陷,dent

,,,,,,,

22,固定點短路,fixedpositionshort,,22,塞孔,plughole\stuffing

,,,,,,,

23,線路針孔,tracepin-hole,,23,補線不良,poortouch-up

,,,,,,,

24,孔破,voidinPTHhole\BarrelCrack,,24,循環(huán)周期,Periodicallycycle

,,,,,,,

25,斷脖子,Opennearpad,,25,初始資料,protocal

,,,,,,,

26,靜置時間,Holdingtime,,26,噴砂,pumicescrub

,,,,,,,

27,識別方法,identifymethod,,27,對位孔,registrationhole

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28,膜屑反粘,Contrarytoadhereofscum,,28,文字印刷,silkscreenprinting\printingoflegend

,,,,,,,

29,"碎屑,殘材",Debris,,29,膠渣,resinsmear

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30,顯影不潔,Developinguncleanness,,30,孔壁粗糙度,roughtness

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31,外觀不良,Appearacedefective,,31,防焊文字,S/L

,,,,,,,

32,傳動\傳送速度,conveyspeed,,32,毛邊,serratededges

,,,,,,,

33,偏離,deviation\shifted,,33,跳印,skipprinting

,,,,,,,

34,單軸,singleaxis,,34,漂錫,solderfloat

,,,,,,,

35,底片漲縮,A/Wexpandorcontract,,35,噴涂,spraycoating

,,,,,,,

36,漏失率,LossRate,,36,刮刀,Squeegee

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37,補償,compensation\balancing,,37,孔規(guī),tapedholegauge

,,,,,,,

38,零件孔\面,componenthole\side,,38,薄基板\內(nèi)層板,thincore

,,,,,,,

39,"覆銅箔層壓板\

銅箔基板",coppercladlaminates(CCL),,39,"工作片

工作母片","workinggerber

workingmastergerber"

,,,,,,,

40,線路露銅,copperexposure,,40,粗化,abrade

,,,,,,,

41,織紋顯露,weaveexposure,,41,電流密度,CurrentDensity

,,,,,,,

42,光學(xué)點\基準標記,fiducialmark,,42,風(fēng)刀,AirKnife

,,,,,,,

43,環(huán)氧樹脂,epoxy,,43,獲取資格的,Qualify/qualified+n.or+to

,,,,,,,

44,蝕刻速率,etchrate,,44,現(xiàn)場,locality(PD)

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45,網(wǎng)布,fabric,,45,濃度偏低,Conc.Lower

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46,助焊劑不均勻,fluxcoatinguneven,,46,濃度偏高,Conc.Higher

,,,,,,,

47,過濾,filtration,,47,人員疏忽,Operatorcareless

,,,,,,,

48,電測治具,fixture,,48,經(jīng)緯向錯誤,longitudeandlatitudecontrary

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49,鉆尖分離,gap,,49,上件不良,failedcomponmtmounting

,,,,,,,

50,標準板,goldenboard,,50,防呆孔,Poka-Yokehole\mistakeproofinghole

,,,,,,,

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1,影響上件及外觀,affectuponmountingorappearance,,1,假性露銅,unrealcopperexposure

,,,,,,,

2,銅厚測量儀,CopperthicknessMeasuringInstrument,,2,積墨,inkaccumulation

,,,,,,,

3,佐證,evidence,,3,印偏,inkprintingdeviated

,,,,,,,

4,微蝕量,microetchingquantity,,4,遵照現(xiàn)場作業(yè)規(guī)範,complywiththehandlingstandardization

,,,,,,,

5,濕度,humidity,,5,放置時間,Holdingtime

,,,,,,,

6,內(nèi)部校正周期(校驗矯正),internalproofreadcycle\calibrationsystemcycle,,6,烘乾溫度不足,Insufficientindrytemperature

,,,,,,,

7,板面刮傷,SurfaceScratch,,7,設(shè)備故障,breakdownofmachine

,,,,,,,

8,制定handling標準,Definestandardofhandling,,8,壓膜滾輪,D/Flaminatedroller

,,,,,,,

9,目視檢查\目檢,visualinspection,,9,sth.受損或污染,Damagedorcontaminated

,,,,,,,

10,規(guī)定頻率,definedfrequency,,10,粘塵壓力,stickypressure

,,,,,,,

11,壓力計\表,pressuregauge,,11,曝光燈管,exposurefluorescenttube

,,,,,,,

12,工程程式,designedprogram,,12,光階,lightstepcondition

,,,,,,,

13,超規(guī)格,outofthetolerance,,13,曝偏,Exposuremisregistration

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14,毛頭\去毛頭,burr\deburring,,14,層間對準度,alignmentregistration

,,,,,,,

15,影響下工序製作,difficulttoproductinthefollowingprocess,,15,吸氣不良,vacuumtreatmentabnormal

,,,,,,,

16,化學(xué)銅,electrolessplating,,16,曝光藏點,Exposureshelter

,,,,,,,

17,除膠速率,desmearingrate,,17,人員動作不當(dāng),improperhandling

,,,,,,,

18,電流,current,,18,顯影,Developing

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19,分層,delamination\bulge,,19,蝕刻,Etching

,,,,,,,

20,濕潤,Damped,,20,去膜,stripping

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21,預(yù)浸,Pre-dipped,,21,Mylar未撕,Mylarnontearingoff

,,,,,,,

22,活化液,activator,,22,教育訓(xùn)練,instructionandtrainning

,,,,,,,

23,速化,accelerator,,23,進行顯破點測試,conductdevelopingpointbrokentest

,,,,,,,

24,漂錫,solderfloat,,24,噴壓,Sprayingpressure

,,,,,,,

25,熱應(yīng)力測試,thermalstresstest,,25,蝕刻不潔,Etchingincompletely\underetch

,,,,,,,

26,孔環(huán)(焊墊),Liftedland\annularring,,26,蝕刻液,Etchants

,,,,,,,

27,熱水洗,Hotwaterrinsing,,27,首件確認,Firstarticleconfirm

,,,,,,,

28,震動馬達,vibratingmotor,,28,電性不良,Electricalperformancedefective

,,,,,,,

29,銅渣,copperresidue(coppersplash)\cosmeticsisland獨立銅渣,,29,去膜不凈,Filmstrippinguncleanness

,,,,,,,

30,清潔濾網(wǎng),purifyingfilters,,30,幾臺漏測,Equipmenttestleaking

,,,,,,,

31,定期換水,replacewaterregularly,,31,領(lǐng)班,Foreman

,,,,,,,

32,回收槽,recoverytank,,32,主管,Chief

,,,,,,,

33,加強管控,tostrengthenthecontrolofsth.,,33,穩(wěn)定性,Stability

,,,,,,,

34,酸洗\鹼洗,acid\alkalirinse,,34,誤判,Misjudgement

,,,,,,,

35,定期分析濃度,AnalyzeConc.regularly,,35,混料,Mixture

,,,,,,,

36,金屬雜質(zhì)污染,Contaminationofmetalimpurities,,36,鋁粉濃度(火山灰),Aluminumpercentage

,,,,,,,

37,碳化物,carbide,,37,超音波測試(錫箔紙),Tinfoilperforatingtest

,,,,,,,

38,碳處理,carbontreatment,,38,水破測試,waterbrokentest

,,,,,,,

39,整流器(電流矯正),Currentrectifier,,39,油墨黏度,inkviscosity

,,,,,,,

40,銅厚測量儀,CopperThicknessMeasuringInstrument,,40,黏度計,viscosimeter

,,,,,,,

41,刷磨速度,BrushSpeed,,41,數(shù)孔機,holecounter

,,,,,,,

42,速度控制器,velocitycontroller,,42,振動馬達,vibrationmotor

,,,,,,,

43,電流控制器,currentcontroller,,43,網(wǎng)版調(diào)偏,netscreenmisregistration

,,,,,,,

44,吸水滾輪破舊,water-absorptiverollerworn-out,,44,試印膜,trialprintingfilm

,,,,,,,

45,新水補充不足,Insufficientforwaterreplenishment,,45,機臺未清潔,worktableuncleaness

,,,,,,,

46,濾芯,Filterelement,,46,萬用塞孔墊板,universalpluggingback-up

,,,,,,,

47,化學(xué)藥液,chemicalsliquid,,47,預(yù)烤,Precure

,,,,,,,

48,孔塞(孔內(nèi)異物),dirtyhole,,48,上錫\焊錫性不良,poorsolderability

,,,,,,,

49,多與\少與1mil厚度,Less\Morethan1milThickness,,49,溫度均勻性,Temp.uniformability

,,,,,,,

50,色差,colorvariation,,50,10倍放大鏡,10Xmagnifier

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1,板面粘油墨屑(顯影段),stickyinkdebris,,1,捲尺,measuringtape

,,,,,,,

2,擋水滾輪,waterapartroller,,2,千分尺,micrometer

,,,,,,,

3,網(wǎng)板高度,Screenheight,,3,剝離強度,Peelingstrength

,,,,,,,

4,網(wǎng)板張力不足,Screentensioninsufficient,,4,尺寸安定性,Dimensionalstability

,,,,,,,

5,刮刀行程,Squeegeedistance,,5,有害物質(zhì),Hazardoussubstance

,,,,,,,

6,刮刀刃鈍化,Squeegeeedgeblunt,,6,元素分析儀,elementanalyzinginstrument

,,,,,,,

7,油墨黏度過大,viscosityofinktoothick,,7,顯微鏡,microscope

,,,,,,,

8,張力應(yīng)力,tensilestress,,8,遊標卡尺,verniercaliper

,,,,,,,

9,后烤,Postcure,,9,膜厚測量儀,membranethicknessmeasuringintrument

,,,,,,,

10,印C面,PrintingTop(COMP)Side,,10,銑刀,millingcutter\routingbit

,,,,,,,

11,印S面,Printing(SOLD)BottomSide,,11,鉆針,drillbit

,,,,,,,

12,靜電噴涂,SprayCoating,,12,化學(xué)元素,chemicalelements

,,,,,,,

13,印可剝膠,PeelableSolderMask,,13,化學(xué)藥水,chemicalliquid

,,,,,,,

14,風(fēng)刀,airknife,,14,裁切刀具,cuttingtool

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15,隔離環(huán),clearance,,15,控制面板,controlpanel

,,,,,,,

16,燒焦,burning,,16,日點檢表,dailychecklist

,,,,,,,

17,化鎳金,immersionnickelandgold,,17,光面油墨,glossygreenink\resist(阻焊劑防染劑)

,,,,,,,

18,銅鎳層接著不良,Poorcombinationthecopperandnickel,,18,公差\誤差,tolerance\variance\bias(偏差)

,,,,,,,

19,刷磨滾輪,brushroller,,19,量產(chǎn),massproduction

,,,,,,,

20,刷幅測試,brushbreadth\widthtest,,20,白色文字,whiteident

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21,脫脂溫度,DefattingTemp.,,21,成型外型,routedoutline

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22,流量計,flowmeter,,22,連片尺寸,PNLdrawingdimension

,,,,,,,

23,執(zhí)行\(zhòng)導(dǎo)電,Conduct,,23,折斷邊,break-awaytabs

,,,,,,,

24,助焊劑\熔合液,rosin(天然松香)\flux\fusingfluids,,24,檢查表,inspectionsheet

,,,,,,,

25,錫粗,Tinroughness,,25,記錄表,datasheet\recordchart

,,,,,,,

26,焊料中銅離子含量過高,Thecu2+contentoutofupperinsolder,,26,報表,reportforms

,,,,,,,

27,機臺異常,machine-motionerror,,27,點檢表,Checklist

,,,,,,,

28,缺點標示卡,nominalcardofdefects,,28,磨邊機,Grind-edgingmachine\Edger

,,,,,,,

29,程序\程式錯誤,Programbug,,29,打磨機,polisher

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30,人員疏忽,operator'scarelessness,,30,板面光滑,Boardsurfacesmooth

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31,日保養(yǎng),dailymaintainance,,31,滴定法分析,Titrationanalysis

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32,人員技能不熟練,Operatorisnotskilled,,32,溫度計,Temp.meter\Thermograph

,,,,,,,

33,口頭考核,examineorally,,33,壓力計,Pressuremeter

,,,,,,,

34,阻抗異常,ImpedanceAbnormal,,34,能量格測試,Energy-steptablettest

,,,,,,,

35,阻抗測量儀,impedancemeasuringinstrument,,35,黏紙,viscositypaper

,,,,,,,

36,漏氣,puncture,,36,六點測溫儀,SixpointsTemp.uniformabilitytestInstrument

,,,,,,,

37,受潮,moistureabsorption,,37,催化劑,catalyst

,,,,,,,

38,膜面污染,filmsurfacecontaminated,,38,穩(wěn)定劑\安定劑,stabilizer

,,,,,,,

39,漏檢,Leakinginspection,,39,硫酸銅回收機,CuSO4retrieveequipment

,,,,,,,

40,二次元,2D(biaxial)dimension-measuringinstrument,,40,秒錶,stopwatch

,,,,,,,

41,工單,runcard\workorder,,41,預(yù)熱,preheat

,,,,,,,

42,飛針,FlyingProbe,,42,計時器,chronograph\timepiece

,,,,,,,

43,目檢,VisualInspection,,43,能量計,energymeter

,,,,,,,

44,專用治具測試,DedicatedTester,,44,靶孔機,targetholeequipment

,,,,,,,

45,特殊特性,CriticalFeature,,45,銅含量,ThecontentsofCu

,,,,,,,

46,重要特性,ImportantFeature,,46,液體比重計,hydrometer

,,,,,,,

47,銅箔厚度,CopperfoilThickness,,47,比重測定法,stereometry

,,,,,,,

48,板彎翹,BowandTwist(warp),,48,殺菌劑,sterilant

,,,,,,,

49,尺寸(含對角),Size(Diagonal)\dimensions(成型),,49,蝕刻因子,Etchingfactor\value\element

,,,,,,,

50,拉力計\張力計,tensilemeter,,50,自動光學(xué)檢測,Automaticalopticalinspection(AOI)

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1,棕化\黑化,Brow\blackoxide,,1,精度,Precision

,,,,,,,

2,循環(huán)水洗,circulatingwaterrinsing,,2,棧板,pallet

,,,,,,,

3,PP膠片,Prepreg,,3,電動拖車\叉車,electrictrailer\forklifter

,,,,,,,

4,物理性質(zhì)\化學(xué)性質(zhì),physical\chemicalcharacter,,4,針盤,bitholder

,,,,,,,

5,暫存時間,Temporarystoretime,,5,放置架,placementrack

,,,,,,,

6,鉚釘組合,Eyelet,,6,靜止消泡時間,static\restdefoamingtime

,,,,,,,

7,疊板結(jié)構(gòu),stacking(layup)structure,,7,轉(zhuǎn)板,Transferplate

,,,,,,,

8,鉚釘,rivet,,8,水性筆,Markpen

,,,,,,,

9,熱熔機,heat-meltingmachine,,9,尼龍\不織布\陶瓷,nylon\non-wovenfabric\ceramic

,,,,,,,

10,有用壽命,usefullife,,10,比色計,chromometer

,,,,,,,

11,印製電路板,PrintedCircuitBoard(PCB),,11,濕度卡,HumidityIndicatorCards

,,,,,,,

12,根本原因\真因,RootCause,,12,測溫儀,Thermoscope

,,,,,,,

13,圍堵措施,ContainmentPlan,,13,龍門吊,gantrycrane

,,,,,,,

14,現(xiàn)狀,CurrentStatus,,14,搖擺\擺動,swing

,,,,,,,

15,原因分析,GapAnalysis,,15,PIN孔重合,pinholesuperposing

,,,,,,,

16,內(nèi)部稽核\外部稽核,Internal\outsideAudit,,16,首躺,firstcycle

,,,,,,,

17,修改\變更,Modify,,17,中和洗,neutralizationcleaning

,,,,,,,

18,無鹵素,HalogenFree,,18,流量,flowamount

,,,,,,,

19,更新\修訂,Update/Revise,,19,除膠速率,desmearrate

,,,,,,,

20,改進措施,urePlan,,20,濕潤(電鍍),moisten

,,,,,,,

21,長期異常,Chronic,,21,獲準供應(yīng)商,supplierwarrant

,,,,,,,

22,突發(fā)異常,Excursion,,22,供應(yīng)商批準程序書,SupplierPartApprovalProcess(SPAP)

,,,,,,,

23,陶爾(壓力單位),Torr,,23,V-cut殘厚,RemainthicknessofV-cut

,,,,,,,

24,靶孔距,Spacebetweentargetholes,,24,冷媒油,refrigerantoil

,,,,,,,

25,層偏,misalignment,,25,壓力腳,pressurefoot

,,,,,,,

26,組合線,Combinedproducingline,,26,塊規(guī),blockgauge

,,,,,,,

27,鋼板\隔板,steelplate\caulplate\separator,,27,高度規(guī),vernierheightgage

,,,,,,,

28,板厚測量儀,Board-thicknessmeasuringinstrument,,28,金剛砂,carborundum\Emery

,,,,,,,

29,鋼印機,steelsealmachine,,29,火山灰,volcanicash

,,,,,,,

30,品質(zhì)檢驗,qualityexamination,,30,高阻計,highresistancemeter

,,,,,,,

31,介質(zhì)厚度,dielectricthickness,,31,模具圖,molddraw

,,,,,,,

32,吸水性,moistureabsorbability,,32,支架,Chassis

,,,,,,,

33,耐磨性,wearresistance,,33,治具,fixture

,,,,,,,

34,剝離強度,strippingstrength,,34,超音波浸洗,ultrasonicdip

,,,,,,,

35,焊錫耐熱性,heat-resistantofsolder,,35,酸浸,aciddipping

,,,,,,,

36,抗麻斑測試,spot-resistanttest,,36,電流強度,currentamperage

,,,,,,,

37,信賴性測試,reliabilitytest,,37,化驗分析表,Assayanalysisreportforms

,,,,,,,

38,介電常數(shù)測量儀,dielectricconstantmeasuringdevice,,38,加壓水洗,Pressurizedwaterrinsing

,,,,,,,

39,包裝標籤,packingtag,,39,酸洗,acidrinsing

,,,,,,,

40,電子天平,electricalbalances,,40,溢流水洗,cascadewaterrinsing\overflow

,,,,,,,

41,焊錫爐,solderfurnace,,41,沉淀缸,sedimenttank

,,,,,,,

42,孔徑規(guī),callipergauge,,42,沖污水,wastewaterrinsing

,,,,,,,

43,比色計,colorcomparingmeter,,43,水柱式?jīng)_洗,Jetcleaning

,,,,,,,

44,密度計,densitymeter,,44,高壓水柱式?jīng)_洗,Highpressurerotatingjetrinse

,,,,,,,

45,蝕刻均勻性,Etchinguniformability,,45,清水洗,Freshwaterrinsing

,,,,,,,

46,化驗單,laboratorylist,,46,干板組合,Dryingmodule

,,,,,,,

47,出貨單,manifest,,47,抗腐蝕測試,acceleratedcorrosiontest

,,,,,,,

48,雙面板\多層板,ReversibleBoard\Multilayerboard,,48,速化反應(yīng),acceleration

,,,,,,,

49,定位孔,LocationHole,,49,實際在製品,activeworkinprocess

,,,,,,,

50,疊板數(shù),stackboardscount,,50,總量,amount

,,,,,,,

1,硝基戊烷,amylnitrite,,1,高性能(電子)工業(yè)級,highperformanceindustrial

,,,,,,,

2,陽極泥,anodeslime(sludge),,2,高延展性銅箔,hightemperatureelongationcopper(HTEC)

,,,,,,,

3,液態(tài)光阻,aqueousphotoresist,,3,高溫樹脂,hightemperatureepoxy(HTE)

,,,,,,,

4,縱橫比,aspectratio,,4,孔數(shù),holenumber

,,,,,,,

5,預(yù)留在製品,bankedworkinprocess,,5,哈氏槽,hullcell

,,,,,,,

6,貝他射線照射法,betabackscattering,,6,水解,hydrolysis

,,,,,,,

7,斜邊,beveling,,7,改善方案,implementation

,,,,,,,

8,吹孔,blowhole,,8,努普(硬度單位),Knoop(Hardness)

,,,,,,,

9,黏結(jié)層,bondingplies,,9,牛皮紙,kraftpaper

,,,,,,,

10,焊橋,solderbridge,,10,壓膜機,laminator

,,,,,,,

11,接單生產(chǎn),BuildToOrder(BTO),,11,刃角磨損,layback

,,,,,,,

12,金手指斜邊\倒角,chamfering,,12,牽引\定位螺絲,leadscrew

,,,,,,,

13,網(wǎng)框,chase,,13,平整劑,levellingadditive

,,,,,,,

14,螯合劑,chelator,,14,線性可變差動轉(zhuǎn)換器,linearvariabledifferentialtransformer(LVDL)

,,,,,,,

15,化學(xué)鍵,chemicalbond,,15,刷磨清潔法,machinescrub

,,,,,,,

16,熱膨脹,ThermalExpansion,,16,鉆頭刃帶,margin

,,,,,,,

17,同心圓,concentriccircle,,17,主圖\機構(gòu)圖,masterdrawing

,,,,,,,

18,密貼性,conformance,,18,基材利用率,materialusefactor

,,,,,,,

19,消費類產(chǎn)品,consumerproducts,,19,濕度與絕緣電阻測試,moistureandinsulationresistancetest

,,,,,,,

20,庫倫定理,coulombslaw,,20,鋸齒\蝕刻缺口,mousebite

,,,,,,,

21,喇叭孔,countersink,,21,負片,negativefilm

,,,,,,,

22,試樣,coupon\sample,,22,結(jié)瘤\銅瘤,nodule

,,,,,,,

23,覆蓋力,coveringpower,,23,流膠量百分比,resinflowpercentage

,,,,,,,

24,挖空,cut-outs,,24,膠含量,resincontent

,,,,,,,

25,交期縮短,cycle-timereduction,,25,報廢因素,obsolescencefactor

,,,,,,,

26,專用型,dedicated,,26,一銅,panelplating

,,,,,,,

27,縮錫,dewetting,,27,二銅,patternplating

,,,,,,,

28,介質(zhì)常數(shù),dielectricconstant,,28,透電率\介電常熟,permittivity

,,,,,,,

29,孔黑\孔灰,discolorhole,,29,極性吸引力,polar-polarinteraction

,,,,,,,

30,停機\稼動時間,downtime\uptime,,30,聚酯類,polyester

,,,,,,,

31,鉆針切削面,drillfacet,,31,孔變形,poordrill

,,,,,,,

32,鉆針研磨機,drillpointer,,32,預(yù)聚合物,prepolymer

,,,,,,,

33,裸板(未鍍銅),blankboard,,33,原始資料,protocal

,,,,,,,

34,延展性,ductility\Elongation,,34,噴砂清潔法,pumicescrub

,,,,,,,

35,留邊寬度,edgespacing,,35,掛架,rack

,,,,,,,

36,金手指,edge-boardcontact(goldfinger)\tab,,36,折光率,refraction

,,,,,,,

37,電化學(xué)反應(yīng)器,electrochemicalreactor,,37,對位元用標記,registermark(對位點)

,,,,,,,

38,脆性,embrittlement,,38,孔內(nèi)沾文字,S/Lonhole

,,,,,,,

39,植PIN法\外部插梢法,externalpinmethod,,39,孔內(nèi)防焊,S/Monhole

,,,,,,,

40,織維突出,fiberprotrusion,,40,干膜屑\透明殘膜,scum

,,,,,,,

41,成品,finalboard,,41,漏印\跳印,skipprinting

,,,,,,,

42,固著,fixing,,42,表面附著元件,SMD(surfacemountdevice)

,,,,,,,

43,燃燒等級,flammabilityrating,,43,表面附著技術(shù),SMT(surfacemounttechnology)

,,,,,,,

44,抗菌性\抗酶性,fungusresistance,,44,錫突,solderbump

,,,,,,,

45,膠化時間,geltime,,45,漂錫,solderfloat

,,,,,,,

46,一般阻焊油墨,generalresistink,,46,油墨附著力,soldermaskadhesion

,,,,,,,

47,玻璃態(tài)轉(zhuǎn)換溫度,glasstransitiontemperature(Tg),,47,金手指上錫,solderonG/F

,,,,,,,

48,多孔\少孔,Extra/MissingHole,,48,線路沾錫,solderontrace

,,,,,,,

49,硬化劑,hardener,,49,錫塞,solderplug

,,,,,,,

50,空氣濾清器\過濾器,hepafilter,,50,統(tǒng)計制程管控,SPC(StatisticalProcessControl)

,,,,,,,

1,規(guī)範,specification\standard,,1,自檢,Self-examine

,,,,,,,

2,銑靶,spotface,,2,檸檬酸濃度,Citricacidconc.

,,,,,,,

3,衝壓\鋼印,stamping,,3,液位,LiquidLevel

,,,,,,,

4,標準液壓法,standardhydrauliclamination,,4,析出物,educt

,,,,,,,

5,缺膠,starvation,,5,垂直的,perpendicular

,,,,,,,

6,應(yīng)力\應(yīng)度,strain,,6,噴砂能力,pumicecapability

,,,,,,,

7,應(yīng)力計,stressmeter,,7,閥門,Valve

,,,,,,,

8,板面突起,surfaceconvex\swelling,,8,外包加工,contract-production

,,,,,,,

9,板面檢查,surfaceexamination,,9,退貨拒收,REJ(reject)

,,,,,,,

10,板面粗糙度,surfaceroughness,,10,植PIN深度,Depthofexternalpin

,,,,,,,

11,熱震蕩試驗,thermalshock,,11,上PIN,beatPIN

,,,,,,,

12,厚度不均,uneventhicknessdistribution,,12,精確度,Precision

,,,,,,,

13,抗污抗氧化劑,tarnishandoxideresist,,13,準確度,accuracy

,,,,,,,

14,透光度,transmittance,,14,操作員技術(shù)不嫻熟,operatortechniqueunskilled

,,,,,,,

15,裁切線,trimline,,15,套環(huán)深度,depthofsleeve-ring

,,,,,,,

16,測試,undercut,,16,精修(成型),finelycouting

,,,,,,,

17,萬用型,universal,,17,漏鉆\漏撈,Leakingdrilling\routing

,,,,,,,

18,有形庫存,visibleinventory,,18,多鉆\多撈,surplusdrilling\routing

,,,,,,,

19,倉庫,warehouse,,19,排屑,chipload

,,,,,,,

20,濕化學(xué)制程,wetchemistryprocess,,20,排屑槽,flute

,,,,,,,

21,燈芯\滲銅,wicking,,21,蜂鳴器,checkbeeper

,,,,,,,

22,縱橫比,width-to-thicknessratio,,22,建立檔案資料(建檔),Archivedatabuilding

,,,,,,,

23,良率,yield,,23,合格,qualified

,,,,,,,

24,點燈次數(shù),TimesofLightswitch,,24,電子稱,Electronicscale

,,,,,,,

25,真空延遲時間,Vacuumdelayedtime,,25,封口時間,sealingtime

,,,,,,,

26,+/-2周,Thefrontorreartwoweeks,,26,超出範圍,outofscope

,,,,,,,

27,無塵室,cleanroom,,27,微蝕速率,Micro-etchingratio

,,,,,,,

28,上噴壓,Upperspraypressure,,28,變色\褪色,discolor

,,,,,,,

29,下噴壓,Lowerspraypressure,,29,破損,breakage

,,,,,,,

30,顯影劑,developer,,30,電導(dǎo)率,conductanceratio

,,,,,,,

31,主軸轉(zhuǎn)速(RPM),SpindleRevolutionSpeed\RevolutionPerMinuteRPM,,31,履歷表,biographicsketch

,,,,,,,

32,光電耦合器,(ChargeCoupleDevice)CCD,,32,公式,formula

,,,,,,,

33,90°孔切破,90degreebreakage,,33,擴孔針,reamingdrillbit

,,,,,,,

34,缺點偵測\檢測,defectdetection,,34,電木板,bakeliteboard

,,,,,,,

35,聚焦,focus,,35,允收水準,generalcriteria

,,,,,,,

36,光校正,calibration,,36,理想狀況,TargetCondition

,,,,,,,

37,極性,Polarity,,37,模板\模具,Template

,,,,,,,

38,正極\陽極,Positive,,38,基準孔,referenceholes

,,,,,,,

39,負極\陰極,Negative,,39,壓敏開關(guān),Piezo-switch

,,,,,,,

40,下鉆點\下刀點,entry,,40,指示燈,indicator

,,,,,,,

41,量杯,measuringcup,,41,直方圖,Histogram

,,,,,,,

42,微切片,Microsection,,42,并聯(lián)導(dǎo)體,parallelconductors

,,,,,,,

43,爆孔,holebreakout(鑽孔)\holeoverflow(防焊油墨),,43,導(dǎo)體連接處,areaofadjacentconductors

,,,,,,,

44,溫差,temperaturedifference,,44,金屬導(dǎo)體,Metalconductors

,,,,,,,

45,文字不清,marking(symbol)blurred,,45,防焊側(cè)露(焊墊\線路),Adjacentisolatedlandsorconductorsexposed

,,,,,,,

46,文字白點,S/Lwhitepoint,,46,有害物質(zhì)公約,RestrictionofHazardousSubstances(RoHS)

,,,,,,,

47,補充顯影,additionaldeveloping,,47,預(yù)防措施,Precaution

,,,,,,,

48,烘烤,baking,,48,生物可降解,Biodegradability

,,,,,,,

49,確認檢修系統(tǒng),VisualRepairSystem(VRS),,49,生態(tài)環(huán)境,ecology

,,,,,,,

50,圖表,Diagram,,50,(垃圾\廢棄物)處理,Disposal

,,,,,,,

1,腐蝕,Corrosive,,1,浸焊,ImmersionSoldering

,,,,,,,

2,致癌物,carcinogenic,,2,焊接點,SolderJoint

,,,,,,,

3,有機體突變的,Mutagenic,,3,焊錫絲,SolderWire

,,,,,,,

4,染色體錯位,chromosomeaberration,,4,待工溫度,IdleTemp.\+Time(空轉(zhuǎn)時間)

,,,,,,,

5,畸形,teratogenic,,5,靜電釋放,ElectrostaticDischarge(ESD)

,,,,,,,

6,有害氣體,poisonousgas,,6,靜電壓力,ElectrostaticOverstress(ESO)

,,,,,,,

7,易燃性,Inflammability,,7,電阻係數(shù),ElectricalResistivity

,,,,,,,

8,爆炸性,explosion,,8,內(nèi)應(yīng)力,InternalStress

,,,,,,,

9,吸入\吸入劑,inhalation,,9,導(dǎo)熱係數(shù),ThermalConductivity

,,,,,,,

10,護目鏡,goggle,,10,磷含量,Phosphorous

,,,,,,,

11,棉手套,Cottonglove,,11,顆粒大小,GrainSize(μm)

,,,,,,,

12,化學(xué)特性,Chemicalproperties,,12,X光測量,X-rayDiffraction

,,,,,,,

13,熔點,Meltingpoint,,13,抗拉強度,TensilStrength(N/mm2)

,,,,,,,

14,抽樣檢查,spotcheck,,14,介面化合物,IntermstallicCompound(IMC)

,,,,,,,

15,沸水,boilingwater,,15,賈凡尼效應(yīng),GalvanicEffect(不同金屬電位差加速腐蝕)

,,,,,,,

16,沖模,Punching,,16,高頻信號,HighFrequencySignal

,,,,,,,

17,氫溴化物,hydrochloride,,17,肌膚效應(yīng),SkinEffect(高頻線路沿道題表面?zhèn)鬏?

,,,,,,,

18,醇\酒精,alcohol,,18,阻隔效應(yīng),BarrierEffect(合金層可有效減低離子遷移度)

,,,,,,,

19,持續(xù)改進,continualimprovement,,19,銀,Silver

,,,,,,,

20,糾正措施,correctiveaction,,20,硫酸,sulfuricacid

,,,,,,,

21,環(huán)境因素\影響\方針,environmentaspect\impact\policy,,21,儀器,Apparatus(測試用儀器)

,,,,,,,

22,環(huán)境管理體系,environmentmanagementsystem,,22,拋光,Polish

,,,,,,,

23,污染預(yù)防,preventionofpollution,,23,磨切片,grindmicrosection

,,,,,,,

24,品質(zhì)關(guān)鍵點,criticaltoquality(CTQ),,24,文件保存期限,Documentationofage

,,,,,,,

25,客戶需求分析,CustomerNeedsMapping(CNM),,25,內(nèi)部管理政策,InternalPolicies

,,,,,,,

26,質(zhì)量功能分布,QualityFunctionDeployment(QFD),,26,工資支付,Salarypayments

,,,,,,,

27,失效模式及後果分析,FailureMode&EffectsAnalysis(FMEA),,27,責(zé)任書,Responsibility

,,,,,,,

28,跨功能小組,Cross-functionalinvolvement,,28,法定最小年齡,Thelegalminimumage

,,,,,,,

29,傳感器,sensor,,29,熟練\技能,Facility

,,,,,,,

30,點陣圖,tallychart,,30,隱私權(quán),righttoprivacy

,,,,,,,

31,全面品質(zhì)管理,TotalQualityManagement(TQM)如QC七大手法,,31,貪污\腐敗,corruption

,,,,,,,

32,柏拉圖,ParetoChart,,32,有效日期,validperiod

,,,,,,,

33,因果圖\魚骨圖,CauseandEffectdiagrams,,33,溫度循環(huán)實驗,TemperatureCyclingTest(TCT)

,,,,,,,

34,腦力激蕩,Brainstorming,,34,熱衝擊實驗,ThermalShockTest(TST)

,,,,,,,

35,散布圖,Scatterdiagrams,,35,離子遷移試驗,ElectrochemicalMigrationTest(ECM)

,,,,,,,

36,全面設(shè)備保養(yǎng),TotalProductiveMaintenance(TPM),,36,絕緣電阻試驗,SurfaceInsulationResistance(SIR)

,,,,,,,

37,控製圖,ConttrolChart,,37,陽極燈絲,ConductiveAnodeFilament(CAF)

,,,,,,,

38,測定系統(tǒng)分析,GageRepeatability&Reproducibility(GRR),,38,爆板,popcorn

,,,,,,,

39,印製電路板協(xié)會,Instituteofprintedcircuit(IPC),,39,生產(chǎn)車間,FabricatingPlant

,,,,,,,

40,有機保焊膜,OrganicSolderabilityPreservative(OSP),,40,吊車,crane

,,,,,,,

41,進刀,Feed,,41,危險物品,hazardoussubstance

,,,,,,,

42,金鹽,PotassiumGoldCyanide(金氰化鉀PGC),,42,文字脫落,symbolfading

,,,,,,,

43,輻射式紅外線焊接,Radiation(輻射)InfraredRays(IR)Reflow(焊接),,43,鋸齒,Worm-Eaten-Crack

,,,,,,,

44,錫膏熔焊,ReflowSoldering,,44,經(jīng)緯方向,GrainDirection

,,,,,,,

45,縮錫,Dewetting,,45,V-cut,Slit

,,,,,,,

46,錫爐浮渣,Dross,,46,幻燈片,slide

,,,,,,,

47,錫尖,SolderIcicle,,47,預(yù)算,budget

,,,,,,,

48,錫球,SolderBall,,48,運輸工具,transport

,,,,,,,

49,電容器,capacitor,,