CCM產(chǎn)品工藝知識(shí)培知識(shí)PPT課件

1、prepare by: civvy chen授課：xxxprepare by: civvy chen授課：xxx2o 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用o 產(chǎn)品的類型產(chǎn)品的類型o 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造o 產(chǎn)品的制作工藝產(chǎn)品的制作工藝o 問與答問與答o 附錄附錄:專業(yè)名詞介紹專業(yè)名詞介紹prepare by: civvy chen授課：xxx3part i 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用prepare by: civvy chen授課：xxx4part i 產(chǎn)品的應(yīng)用產(chǎn)品的應(yīng)用拆解拆解prepare by: civvy chen授課：xxx5part ii 產(chǎn)品的類型產(chǎn)品的類型 軟板定焦模式(ff) 1. b-to-b

2、 2.gold fingerprepare by: civvy chen授課：xxx6part ii 產(chǎn)品的類型產(chǎn)品的類型 軟板變焦模式 1.手動(dòng)變焦(mf) 2.自動(dòng)變焦(af)prepare by: civvy chen授課：xxx7part ii 產(chǎn)品的類型產(chǎn)品的類型 插槽模式(socket)prepare by: civvy chen授課：xxx8part ii 產(chǎn)品的類型產(chǎn)品的類型 像素分類 cif (352*288) 10萬像素 (0.1m) vga (640*480) 30萬像素 (0.3m) sxga (1280*1024) 130萬像素 (1.3m) uxga (1600*1

3、200) 200萬像素 (2.0m)prepare by: civvy chen授課：xxx9part iii 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 csp (chip scale package)chiplensbarrelholderir filterstiffenerfpcsolder ballglassprepare by: civvy chen授課：xxx10part iii 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造 cob (chip on board)chiplensbarrelholderir filterfingergold wirefpcpcbprepare by: civvy chen授課：xxx11par

4、t iii 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造鏡頭鏡頭(lens)鏡座鏡座(holder)芯片芯片(chip)電路板電路板(pcb)連接器連接器(con.)prepare by: civvy chen授課：xxx12part iii 產(chǎn)品的構(gòu)造產(chǎn)品的構(gòu)造cmos chiplens holderlens barrelthese 3 items come as an assembly1st lens element2nd lens elementir glasssubstratefpcprepare by: civvy chen授課：xxx13part iv 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 材料 1. 晶圓(wa

5、fer) 主要是由硅和鍺組成,是攝像頭模組的核心部分,稱之為影像傳感器。prepare by: civvy chen授課：xxx14part iv 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 2. 線路板 printed circuit board印刷電路板,是電子元器件的支撐體,是電子元器件電氣連接的提供者,簡(jiǎn)稱pcb.prepare by: civvy chen授課：xxx15part iv 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 3. 鏡座(holder) prepare by: civvy chen授課：xxx16part iv 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 4. 鏡頭(lens)prepare by: ci

6、vvy chen授課：xxx17part iv 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 5. 軟板(fpc) flexible circuit board軟性印制電路是以聚酰亞胺或聚酯薄膜為基材制成的一種具有高度可靠性絕佳的可撓性印刷電路。prepare by: civvy chen授課：xxx18part iv 產(chǎn)品的制作工藝產(chǎn)品的制作工藝 工藝流程 wafer清洗plasma清洗固晶固晶烘烤邦線金線檢查dam邦定dam烘烤二流體清洗ccd檢查glass貼附ccd檢查固化半成品測(cè)試prepare by: civvy chen授課：xxx19processsupply wafertrayokokokok

7、n/aokn/aokir glass attach processcm800barrel insert processcm800dispensecmos chipdispenseir glassdispense+lens barreldie attach processcm800holder attach processcm800prepare by: civvy chen授課：xxx20part iv 產(chǎn)品的制作工藝產(chǎn)品的制作工藝die bonding:使芯片 與pcb粘合。注意點(diǎn)：1.芯片方向 2.膠量 3.頂針和吸嘴印 4.芯片角度 5.芯片位置 6.芯片傾斜 prepare by: c

8、ivvy chen授課：xxx21part iv 產(chǎn)品的制作工藝產(chǎn)品的制作工藝wire bonding: 通過金線焊接使芯片與pcb線路導(dǎo)通。注意點(diǎn)：1.接線是否正確 2. 線弧 3.金球大小 4.金球厚度 5.金線拉力 6.金球推力 prepare by: civvy chen授課：xxx22solder pastescreen printpassive placementfordie attachpassivesolder pastepassivesubstrateprepare by: civvy chen授課：xxx23die attachwire bondingwet cleanch

9、ipsensorareaau wirechipsensorareaau wireprepare by: civvy chen授課：xxx24ir glass mountir glass sawwaferringirglassirglassprepare by: civvy chen授課：xxx25glue dispenseir glass attachholderholderglueglueir cut glassirglassprepare by: civvy chen授課：xxx26glue dispenseholder attachgluegluebarrel insertbarrelh

10、olderprepare by: civvy chen授課：xxx27singlationcutcutprepare by: civvy chen授課：xxx28focus adjustbarrelbarrel fixationmotorlighting（percolation method)chartachromatic lensnd4（adjustment of light quantity）laserprepare by: civvy chen授課：xxx29part v 問與答問與答prepare by: civvy chen授課：xxx30part vi 專業(yè)名詞介紹專業(yè)名詞介紹pr

11、epare by: civvy chen授課：xxx31prepare by: civvy chen授課：xxx32bonding processprepare by: civvy chen授課：xxx33free air ball is captured in the chamferprepare by: civvy chen授課：xxx34free air ball is captured in the chamfersearch heightprepare by: civvy chen授課：xxx35free air ball is captured in the chamfersear

12、ch speed1search tol 1prepare by: civvy chen授課：xxx36free air ball is captured in the chamfersearch speed1search tol 1prepare by: civvy chen授課：xxx37free air ball is captured in the chamfersearch tol 1search speed1prepare by: civvy chen授課：xxx38free air ball is captured in the chamfersearch tol 1search

13、speed1prepare by: civvy chen授課：xxx39free air ball is captured in the chamfersearch tol 1search speed1prepare by: civvy chen授課：xxx40formation of a first bondsearch speed1search tol 1prepare by: civvy chen授課：xxx41formation of a first bondsearch speed1search tol 1impact forceprepare by: civvy chen授課：xx

14、x42formation of a first bondcontact prepare by: civvy chen授課：xxx43formation of a first bondbase prepare by: civvy chen授課：xxx44capillary rises to loop height positionprepare by: civvy chen授課：xxx45capillary rises to loop height positionprepare by: civvy chen授課：xxx46capillary rises to loop height posit

15、ionprepare by: civvy chen授課：xxx47capillary rises to loop height positionprepare by: civvy chen授課：xxx48capillary rises to loop height positionprepare by: civvy chen授課：xxx49capillary rises to loop height positionprepare by: civvy chen授課：xxx50formation of a looprd (reverse distance)prepare by: civvy ch

16、en授課：xxx51formation of a loopprepare by: civvy chen授課：xxx52prepare by: civvy chen授課：xxx53calculated wire lengthwire clamp closeprepare by: civvy chen授課：xxx54calculated wire lengthprepare by: civvy chen授課：xxx55search delayprepare by: civvy chen授課：xxx56trajectoryprepare by: civvy chen授課：xxx57trajector

17、yprepare by: civvy chen授課：xxx58trajectoryprepare by: civvy chen授課：xxx59trajectoryprepare by: civvy chen授課：xxx60trajectoryprepare by: civvy chen授課：xxx61trajectoryprepare by: civvy chen授課：xxx62trajectoryprepare by: civvy chen授課：xxx63trajectoryprepare by: civvy chen授課：xxx64trajectoryprepare by: civvy c

18、hen授課：xxx65trajectoryprepare by: civvy chen授課：xxx662nd search heightsearch speed 2search tol 2prepare by: civvy chen授課：xxx67search speed 2search tol 2prepare by: civvy chen授課：xxx68search speed 2search tol 2prepare by: civvy chen授課：xxx69formation of a second bondprepare by: civvy chen授課：xxx70formation of a second bondcontactprepare by: civvy chen授課：xxx71prepare by: civvy chen授課：xxx72prepare by: civvy chen授課：xxx73prepare by: civvy chen授課