PCB常用英語匯總

1、1板面凹痕dent2內(nèi)層白斑l/L white spot3線路缺口circuit nick4蝕刻不凈un deri ng etchi ng5綠油剝離S/M peel off6顯影不凈un der develop ing7基材白點lam in ate measli ng8銅面氧化copper oxide9綠油上焊盤s/m on pad10白字上焊盤c/m on pad11阻焊不良poor S/M12線路擦花track scratch13錫上線sn on circuit14聚錫sn mass15錫灰sn gray16焊盤露銅cu exposed on pad17錫上金手指sn on G/F18金手

2、指凹痕G/F dent19金手指擦花G/F scratch20金手指粗糙G/F roughness21v-cut 不良poor V-cut22倒邊不良poor milli ng23針床壓傷ET dent24拖錫不良poor touch up25補金不良poor repair ing Au26補油不良poor repairi ng s/m27針孔pin hole28膠漬paster sta in29k孔內(nèi)毛刺burrs in hole30錫珠入孔solder in hole31露銅expose Cu32露鎳expose Ni33綠油起泡solder mask blister34綠油起皺solde

3、r mask win bles35金手指氧化G/F oxidi ng36金顏色不良Au discolorati on37金面凸起Au surface blister38綠油入孔solder mask in hole39爆板board an gle damafe40翹板warp41漏印字符skip42金粗Au too big43金簿Au too thin44金手指缺口G/F voids/nick on G/F45金手指發(fā)黑G/F too black46字符印反in verse C/M47金手指針孔G/F pi nholes48標志不清symbol un clear49標志錯symbol wron

4、g50綠油鬼影ghost in S/M51手指印fin ger print52補線不良poor line repairi ng53錫咼exessive solder54孔小hole un dersize55字符錯wro ng C/M56字符印偏C/M misalig nment57字符入孔C/M in hole58字符重影C/M doubloe image59漏鍍金手指missi ng plat ing G/F60金手指發(fā)白G/F gray61焊盤脫落pad break off/pad peel off62焊盤露銅pad expose cu63斷綠油橋miss ing S/M bridge64

5、塞孔block hole65水跡water pr int66錫珠solder ball67砂孔pitti ng68油薄69聚油excess solder mask70錫粗Sn too thick71線路上錫Sn overlap scratch72綠油下雜物con tam in ati on un der S/M73焊盤損壞land damage74焊盤翹起lifted land75偏位misregistratio n76漏鉆孔missi ng hole77焊盤缺口nick on pad78線路缺口nick on track1開路ope n circuit2短路short circuit線路狗牙

6、circuit wist3線路缺口circuit nick4線路凹痕circuit dent5滲鍍plati ng Bloody6焊盤缺口pad nick7內(nèi)層白斑l/L white spot8黑化不良poor B.O9爆板measli ng10粉紅圈pinking ring11層壓起泡press blister12錯位misregistatio n13偏位shift14孔內(nèi)無銅no Cu on Pth15孔內(nèi)毛刺hole burrs16NPTH有銅Cu on NPTH17銅面露基材exposed lam in ate18銅面凹痕dent on Cu surface19膠漬gum residu

7、e20夾膜D/F nip21蝕刻不盡un der etch ing22線幼li ne too thin23孔大hole oversize24孔小hole un dersize25偏孔hole misregistrati on26銅面瘤粒Cu no dule27顯影不盡un der develop ing28銅面刮傷scratch on Cu surface29塞孔hole plugged30修理不良poor repairi ng31銅薄copper too thin32內(nèi)層擦花l/L scratch33內(nèi)層偏位l/L misregistati on34內(nèi)層雜物I/L in clusi ons3

8、5掉膜film off36干膜碎D/F meak ing37退錫不盡poor Sn stripp ing38間隙小space too marrow39板薄board too thi n40板厚board too thick ness41針孔pi nhole42崩孔breakout43側蝕un drcut44鍍層粗糙plat ing layer rough ness45亞色dull colour46焊盤翹起lifted land47漏鉆孔miss ing hole48露布紋weave exposure49鉆偏孔hole misregistratiio n50孔損害hole damage51基材分

9、層delam in ati on52蝕刻過度over etchi ng53多孔hole too much54殘銅remai n Cu55孔內(nèi)露基材lam in ate exposure in hole56焊盤脫落pad break off57焊盤凹痕pad dent58焊盤凸起pad bulge59焊盤損壞pad damaged60焊盤缺口pad nick61焊盤露銅pad exposeCuPCB及 PCBA常用英語匯總1內(nèi)層開路Inner open2內(nèi)層斷路Inner short3外層開路Outer ope n4外層斷路Outer short5內(nèi)層蝕刻過度Inner over ecth in

10、g6夕卜層蝕刻過度Outer over ecth ing7內(nèi)層樹脂氣泡Resi n void8內(nèi)層雜物Foreig n material9 內(nèi)層圖形移位Inner pattern mis-registrati on10 層與層移位Layer to layer mis-registratio n11 打孔不良Improper target ing12 內(nèi)層蝕刻不凈Inner un der etch ing13 露布紋 Weave texture/exposure14 檫花(氧化膜面)Scratch(Oxide surface)15 板損壞 Damaged board16分層（物料）Delam i

11、n ati on (Raw material)17內(nèi)層不配套Excessive inner core18板過厚Over thickness19白點（壓板）Measling (Pressing)20白點（噴錫）Measling (HSAL)21板曲Warpage22板焦黃 Burnt23起皺 Wrinkle24起泡（壓板）Blistering (Pressing)25鍍層起泡Blistering (Cu plating)26噴錫起泡Blistering (HSAL)27 板面凹痕 DENT (Pressing profilling G/F)28 白斑 Crazing29 膠渣 Gum resid

12、ue30 孔未穿 Incomplete drilling31 披鋒 Burr39孔粗糙 （ 鍍銅）Hole roughnessCu plating)40孔粗糙（機械鉆孔）Hole roughness(mechanical drill)33偏孔Hole shift34孔徑大Hole oversize35孔徑小Hole undersize36少孔Missing Hole37塞孔Block hole32多孔 Extra hole38崩孔 Hole breakout4942缺口 Nick/ void on pad43曝光過度Over-exposure44曝光不良Under exposure45顯影不足Under develop46干膜脫落D/F Peel off47干膜碎D/F Rds