SMT回流焊工藝中英文對照

1、SMT回流焊工藝中英文對照1.FundamentalsofSoldersandSoldering（焊料及焊接基礎(chǔ)知識）SolderingTheory（焊接理論）MicrostructureandSoldering（顯微結(jié)構(gòu)及焊接）EffectofElementalConstituentsonWetting（焊料成分對潤濕的影響）EffectofImpuritiesonSoldering（雜質(zhì)對焊接的影響）SolderPasteTechnology（焊膏工藝）SolderPowder（錫粉）SolderPasteRheology（錫膏流變學(xué)）SolderPasteComposition&

2、Manufacturing（錫膏成分和制造）SMTProblemsOccurredPriortoReflow（回流前SMT問題）FluxSeparation（助焊劑分離）PasteHardening（焊膏硬化）PoorStencilLife（網(wǎng)板壽命問題）PoorPrintThickness（印刷厚度不理想）PoorPasteReleaseFromSqueegee（錫膏脫離刮刀問題）Smear（印錫模糊）Insufficiency（印錫不足）NeedleClogging（針孔堵塞）Slump（塌落）LowTack（低粘性）ShortTackTime（粘性時間短）SMTProblemsOccur

3、redDuringReflow（回流過程中的SMT問題）ColdJoints（冷焊）Nonwetting（不潤濕）Dewetting（反潤濕）Leaching（浸析）Intermetallics（金屬互化物）Tombstoning（立碑）Skewing（歪斜）Wicking（焊料上吸）Bridging（橋連）Voiding（空洞）Opening（開路）SolderBalling（錫球）SolderBeading（錫珠）Spattering（飛濺）SMTProblemsOccurredatPostReflowStage（回流后問題）WhiteResidue（白色殘留物）CharredResidu

4、e（炭化殘留物）PoorProbingContact（探針測接問題）SurfaceInsulationResistanceorElectrochemicalMigrationFailure（表面絕緣阻抗或電化遷移缺陷）Delamination/Voiding/Non-curingOfConformalCoating/Encapsulants（分層/空洞/敷形涂覆或包封的固化問題）ChallengesatBGAandCSPAssemblyandReworkStage（BGA、CSP組裝和翻修的挑戰(zhàn)）StarvedSolderJoint（少錫焊點）PoorSelf-Alignment（自對位問題）

5、PoorWetting（潤濕不良）Voiding（空洞）Bridging（橋連）UnevenJointHeight（焊點高度不均）Open（開路）PopcornandDelamination（爆米花和分層）SolderWebbing（錫網(wǎng)）SolderBalling（錫球）ProblemsOccurredatFlipChipReflowAttachment（倒裝晶片回流期間發(fā)生的問題）Misalignment（位置不準(zhǔn)）PoorWetting（潤濕不良）SolderVoiding（空洞）UnderfillVoiding（底部填充空洞）Bridging（橋連）Open（開路）UnderfillCrack（底部填充裂縫）Delamination（分層）FillerSegregation（填充分離）InsufficientUnderfilling（底部填充不充分）OptimizingReflowProfileviaDefectMechanismsAnalysis（回流曲線優(yōu)化與缺陷機理分析）FluxReaction（助焊劑反應(yīng)）PeakTemperature（峰值溫度）CoolingStage（冷卻階段）HeatingStage（加熱階段）TimingConsiderations（時間研究）OptimizationofProfile（曲線優(yōu)化）Com