2022年專業(yè)詞匯中英文對(duì)照

1、FPC 名詞中英對(duì)照1. 目的通過(guò)對(duì)行業(yè)標(biāo)準(zhǔn)的FPC工程名詞引用及我司標(biāo)準(zhǔn)的整合，旨在為我司FPC名詞的中英用語(yǔ)實(shí)現(xiàn)使用上的統(tǒng)一化 2. 適用范圍 規(guī)范 FPC相關(guān)工程上出現(xiàn)之不良項(xiàng)目， 生產(chǎn)使用之材料、 設(shè)備、治具以及可靠性試驗(yàn)等中英文名 詞 3. 定義 無(wú) 類別一： FPC不良項(xiàng)目名詞工程類別不良名稱中文英文導(dǎo)線導(dǎo)線Conductors 開(kāi)路Open 短路Short 缺口Nicks 針孔Pinholes 額外銅刺Extraneous Copper Between Conductors Visual 毛刺Spurs Inspection of 結(jié)瘤Nodules Conductors 蝕刻凹

2、痕Etched Concave 基底薄膜導(dǎo)線分層Conductor Delamination 裂紋Cracks 導(dǎo)線劃痕Scratches on Conductor 凹坑Dents 變色Discoloration 凹坑Dents Visual Inspection of 劃痕Scratches on Base Film Base Film 覆蓋層和覆蓋涂層凹坑Dents on Coverlay and Covercoat 劃痕Scratches on Coverlay and Covercoat Visual Inspection of 空洞Void Coverlay and 偏位Coverl

3、ay Misalign Covercoat 毛刺Coverlay Burrs 外來(lái)物導(dǎo)電性異物Conductive Foreign Matters Foreign Matters 非電性異物Non-conductive Foreign Matters 起泡和分層Blistering and Delamination 覆蓋層粘結(jié)劑擠出Squeeze-out of Adhesive of Coverlay 覆蓋涂層滲出 Ooze-out of Covercoat 覆蓋涂層跳漏 Skipping of Convercoat 鍍金 Gold Plating 鍍金層缺陷 Gold Plating Def

4、ects 鍍錫 Tin Plating 電鍍金屬或焊料的 滲透Penetration of Plated Metal or Solder 電鍍金屬或焊錫的變暗（變黑）Darkened Appearance (Blackening Discoloration) 鍍銅孔內(nèi)鍍層空洞Plating Voids in Plated-though Hole 表面條件鍍金粗糙Rough Gold Surface 鍍金白霧Gold Discoloration Condition of 鍍金變色Gold Discoloration Plated Mental 鍍金層龜裂Gold Crack and Solder

5、 鍍金針孔Gold Pinhole 外形和孔邊緣電鍍露銅Plated Expose Wetting 剝離Plated Peeled Off 電鍍滲入Plated Wicking 漏鍍No Plating 表面?zhèn)跴lating Scratch 電鍍粗糙Rough Plated 藥水滲入Wicking 撕裂和缺口Tears and Nicks 毛刺Burrs 絲狀毛刺Thready Burrs Visual 彎曲、變形Warpage Inspection of 微連筋不良Poor Micro-joint Edges of Outline 外形偏移Outline Misalign and Hole

6、s 外形漏沖No Outline 增強(qiáng)板反折偏位Bending Line Misalign FPC與增強(qiáng)板之間Foreign Matter Between Flexible Printed Board 的外來(lái)物and Stiffener Visual FPC與增強(qiáng)板之間Voids Between Flexible Printed Board and Imperfections 的空洞Stiffener Related to 裂紋Cracks Stiffener 缺角Chip-off Bonding 劃痕Scratches 表面附著物變形Deformation 增強(qiáng)板貼偏移Stiffener M

7、isalign 熱固膠Thermosetting Adhesive Affixed 焊劑殘?jiān)麱lux Residues Substances on 金屬粉末殘?jiān)黂esidue of Metal Powders the Surface 粘結(jié)劑殘?jiān)黂esidue of Adhesive 標(biāo)記 Marking 突起Protrusions 凹坑Dents 弓曲Bow 扭曲Twist 尺寸檢驗(yàn)Dimensional Inspections 尺寸測(cè)量Measurement of Dimensions 外部尺寸External Dimensions 厚度Thickness 孔Holes 元件孔Compone

8、nt Holes 導(dǎo)通孔Via Holes 導(dǎo)通孔偏移Via Hole Misalign 安裝孔Mounting Holes 導(dǎo)線寬度Conductor Widths 導(dǎo)線之間的間距Clearances Between Conductors 孔中心間距 Distance Between Hole Centers 板邊和導(dǎo)線之間的Minimum Distance Between Board Edges and 定位精度最小距離Conductors 標(biāo)記錯(cuò)誤Wrong Marking 字符不清晰Unclear Letter 孔的定位精度Positional Accuracy of Holes 孔與

9、焊盤的重合性Registration of Hole to Land Positional 覆蓋層與焊盤的重Registration of Coverlay (or Covercoat) to Accuracy 合性Land 增強(qiáng)板與 FPC的重孔的重合性Registration of Holes 外形的重合性Registration of Outlines 沖外形與導(dǎo)線圖形Registration of Punched Outline to Conductor 的重合性Patterns 合性壓敏膠或熱固膠與Registration of Pressure Sensitive or Heat

10、Registration of FPC和增強(qiáng)板的重Stiffener to FPC Activated Adhesives to FPC and Stiffener 合性鍍通孔的鍍銅層厚Plating Thickness of Copper Panted-through 其它 Other 度Holes 短裝Shortage 混裝Mixed Stowage/Packing 離型紙脫落Released Paper Peeled off 材料錯(cuò)誤Wrong Material 類別二： PFC工程用語(yǔ)工程類別中文英文板單面板Single Sided Flex Circuits Board Type 單

11、面雙接觸Double Access or Back-bared Flex Circuits 模具雙面板Double Sided Flex Circuits 軟硬結(jié)合板Rigid-flex Circuits 模具圖紙Die Drawing 量產(chǎn)模具M(jìn)ass Production Die 樣品模具Prototype Die 鋼模Steel Die 刀模Die 上模Top Die 下模Bottom Die 線切割Wire Cut 外形模具Outline Cut Die 保護(hù)膜模具Coverlay Die 治具膠紙模具Pressure Sensitive Adhesive Die 補(bǔ)強(qiáng)模具Stiffe

12、ner Die 銀漿模具Silver Die 導(dǎo)柱Post 沖頭Punch 分割刀模Cutting Steel Rule Die 銷釘Pin 貼合治具Lamination Jig 電測(cè)治具Electrical Check Jig 假貼治具Tacking Jig Jig( Fixture) 曝光治具Exposure Jig 孔絲印網(wǎng)框Screen Printing Frame 曝光定位孔Guide Hole for Exposure 模具定位孔Guide Hole for Die 假貼定位孔Guide Hole for Tacking 貼合定位孔Guide Hole for Adhesive H

13、ole 電測(cè)定位孔Guide Hole for Electrical Test 制程絲印定位孔Guide Hole for Screen Printing 孔環(huán)Lifted Land 滲錫孔Stannize Hole 裝配孔Fitting Hole 下料Material Preparation 鉆孔Drilling 鍍銅Copper Plating 化學(xué)銅le Eletcroless Plating Copper 貼干膜Sensitive Dry Film 絲印阻焊油墨Liquid Photosensitive Soldermask 曝光Exposure Manufacture 顯影Devel

14、oping Procedure 蝕刻Etching 脫膜Stripping 貼保護(hù)膜Tacking Coverlay 粗化Abrade 層壓Lamination 固化( 烘烤）Curing 黑孔 Black Hole 表面處理 Surface Treatment 循環(huán)水洗 Cascade Rinse 微蝕 Micro-etch 酸洗 Acid Cleaning 水洗 Water Cleaning 防銹處理 Anti-corrosion Treatment 前處理 Pre-treatment 刷板 Brushing 干燥 Dry up 電鍍（金、錫、鎳）(Gold 、Solder 、Nickel

15、) Plating 原材料 Material 閃鍍(Gold ) Flash Plating/Strike Plating 局部電鍍Pattern Plate 化學(xué)鎳金Immersion Gold 有機(jī)保焊膜Organic Solderability Preservatives (OSP) 絲印字符Printing of Legend 貼補(bǔ)強(qiáng)板Back Board Lamination 電性能測(cè)試Electrical Inspection 貼膠紙Double Faced Adhesive Tape 打孔Punching 雷射切割Laser Cut 自動(dòng)光學(xué)檢驗(yàn)Automatic Optical

16、 Inspection （AOI）表面貼裝Surface Mounting Technology （SMT）外形沖切Punching 沖孔Punching 外觀檢查Final Inspection 目視檢查Visual Inspection（Final Inspection) 線路顯微鏡檢Conductor Microscope Inspection 驗(yàn)（鏡檢）性能測(cè)試Reliability Test 包裝Packing 銅箔Copper Foil (CU) 電解銅Electro-deposited Copper Foil (ED) 壓延銅Rolled Annealed Copper Foil

17、 (RA) 保護(hù)膜Coverlay (CVL) 基材Base Material 撓性覆銅板Flexible Copper Clad Laminate (FCCL) 無(wú)膠基材Adhesiveless FCCL 粘接劑（膠）Adhesives (Ad) 壓克力Acrylic 頂層補(bǔ)強(qiáng)Top Stiffener 底層補(bǔ)強(qiáng)Bottom Stiffener 頂層銀漿膜Top Silver Paste 底層銀漿膜Bottom Silver Paste 銀漿油墨Sliver Ink 頂層線路 Top Circuits/Conductors 底層線路 Bottom Circuits/Conductors 半固

18、化片 Bonding Film (BOD) 聚酰亞胺 Polyimide(PI) 聚酯 Polyester Film (PET) 鋼片 Sheet Steel 玻璃纖維布 Woven Glass Cloth FR4補(bǔ)強(qiáng)板 Fiberboard 液態(tài)感光油墨 Liquid Photoimageable Resist Ink 壓敏膠 Pressure Sensitive Adhesive（PSA）離型膜 Release Paper 導(dǎo)電膠 Conducting Resin 導(dǎo)電布 Electric Fabric 泡棉 Foam 導(dǎo)向?qū)щ娔z Anisotropic Conductive Film （

19、ACF）導(dǎo)電泡棉 Conductive/Electric Foam 屏蔽膜 Shield Film ( 金屬 ) 薄膜開(kāi) 關(guān)Metal Dome （DOME）其它連接器Connector （IC）電容Capacitance ( C ) 電阻Resistance ( R ) 集成電路Integrated Circuit 二極管Diode (D) （ESD）靜電Electro-Static Discharge機(jī)械方向Machine Direction （MD）垂直方向Transverse Direction （TD）進(jìn)刀Feed （ AQL）進(jìn)刀量Chip Load 轉(zhuǎn)速Speed 焊接Solde

20、ring 手工焊接Hand Soldering 波焊Wave Soldering 品質(zhì)允收標(biāo)準(zhǔn)Acceptable Quality Level菲林Film 字符Legend Others 烘箱Oven 溫度Temperature 濕度Humidity 速度Speed 壓力Pressure 噴淋壓力Spouting Pressure 濃度Concentration 原理圖紙Schematic Diagram 線寬Line Space 線距Line Width 線路間距 Pitch 類 別 三 ： FPC 可 靠 性 測(cè) 試 項(xiàng) 目中 文 英 文電氣性能 Testing of Electrical Performance 導(dǎo)線電阻 Conductor Resistance 表面層絕緣電阻 Surface Insulation Resistance (SIR) 表面介質(zhì)層耐電壓強(qiáng)度 Dielectric Withstanding Voltage of Surface Layers 機(jī)械性能測(cè)試 Testing of Mechanical Property 剝離強(qiáng)度 Peel Strength 孔和焊墊的拉脫強(qiáng)度 Pull-out Strength for Plain Hole