真空鍍膜潛在失效模式及影響分析

1、POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)FMEA 編虢 FMEA Number： 次 Page:填表人 Prepared By： 更新版本日期FMEA Date :屋品名再Item :晶片電阻走品模務(wù)且 Model(s)/Program(s) : AC跨功能小務(wù)且Core Team :裂程任 Process Responsibility :真空 鼬日期Key Date：裂程/功能ProcessStep / Function要求 Requireme nt潛在 失效模 式 Potential Failure Mode潛在失效影

2、警Potential Effect(s) of FailureDO 廄重度(S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 CurrentDesignRPN建B室寸策RecommendedAction人及琪 期完成日期 Responsibility & TargetCompletion Date改善完成日期Actions Taken Completion Date廄 重 度(S)畿 生 度 (O)值 測 度 (D)R PN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (D)

3、P22真空膜/端 極面漉上一屑 金屠薄膜 Sputtering/The side sputtering a layer of metal film凰殳有 破洞No hole on sputtering film,屑有 破洞 Sputterin g film holes走生露基板不良， 影警焊性Poor solderability8側(cè)辱表面有粉崖 dust on the side surface燧內(nèi)壁NiCr掉落(遒用秋式真檄) NiCr fall down in inner wall of sputtering chamber1.料品誰烤箱畤，用麻榆 作表面清理Cleaning surface

4、 with air gunbefore sputtering2.1真上板每周更換 一次，防止燧內(nèi)壁掉落 NiCr屑(逾用秋式真檄) Every week, replace the up protection broad of sputtering to avoid the drop of NiCr(for horizontal sputtering machine)2.2真上倡合金板每周 噴砂清理一次(逾用秋式真 鼬)The upper alloy plateis cleaned once a week (for horizontal sputtering machine)2每lot真 前、彳

5、爰自主檢 查Self inspection per lot before and after sputtering每班誰行附 著力測就 perform the adhesion test by shift7112料品誰烤箱畤，用吸 bwb行表面清 理，替代麻榆清理， 避免用麻榆清理 畤，走生彳伯A黑占吹 到B黑占的冏題 When the material enters the oven, clean the surface with a vacuuming mechanism Replace air gun cleaning Avoid blowing from point A to poin

6、t B when cleaning with an air gun田春峰2018/12/302018/12/3081756走品名 Item :晶片電阻POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)FMEA 編虢 FMEA Number：次 Page:填表人 Prepared By：裂程任 Process Responsibility :真空走品模務(wù)且 Model(s)/Program(s) : AC 跨功能小務(wù)且Core Team :裂程/功能ProcessStep / Function要求 Requireme nt潛在 失效模

7、 式 Potential Failure Mode潛在失效影警Potential Effect(s) of FailureDO廄重度(S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 CurrentDesignR PN建B室寸策 Recommended Action人及予期 完成日期 Responsibility & Target CompletionDate改善完成日期Actions TakenCompletion Date廄 重 度(S)畿 生 度 (O)值 測 度 (D)R PN控制琪防Controls Prevention畿 生 度 (O)

8、控制檢測Controls Detection值 測 度 (D)P22真空膜/端 極面漉上一屑 金屠薄膜 Sputtering/The side sputtering a layer of metal film薄膜屑阻 抗在規(guī)定 簸圉內(nèi) film resistance within control specificati on阻抗超 出規(guī)定 上限 Film resistanc e beyond the prescribe d ceiling走生露基板不良，景 掣旱性Poor solderability81.氤麻流量超出關(guān)兄 定下限The argon flow exceeds the lower

9、limit 2源射畤真 空度超出規(guī)定上 限The vacuity of sputtering exceeds the upper limit 3功 率，雷流值超出 定下限Power, current exceeding theupper limit4.干燥溫度超遺規(guī) 定下限drying temperature exceeds the lower limit1.每班誰行自主檢查 Make machine setting self check every shift.21.每燧誰行自主 檢查Make machine setting self check every furnace。2. 用固定量測

10、治 具，每天誰行阻抗 測量(H管 控)Measure the resistance every day with stable jig (mediate drawing control)s112室寸氟麻、真空度、功 率、雷流等參敷，采 用系統(tǒng)，自勤監(jiān)控， 超出控制范圉畤自 勤停檄幸艮警Argon, vacuum, power, current and other parameters, the system, automatic monitoring, automatic shutdown alarm when out of control range制帽2019/06/30阻抗超 出規(guī)定 下

11、限 Film resistanc e beyond the limit走生外翟良延伸不 良，良品率下降Poor yield71.MM流量超出關(guān)兄 定上限The argon flow exceeds the upper limit 2源射房真 空度超出規(guī)定下 限The vacuity of sputtering exceeds the lower limit 3功 率，雷流值超出 定上限Power, current exceeding theupper limit1.每班誰行自主檢查 Make machine setting self check every shift21.每燧誰行自主 檢查M

12、ake machine setting self check every furnace。2. 用固定量測治 具，每天誰行阻抗 測量(H管 控)Measure the resistance every day with stable jig (mediate drawing control)98室寸氟麻、真空度、功 率、雷流等參敷，采 用系統(tǒng)，自勤監(jiān)控， 超出控制范圉畤自 勤停檄幸艮警 Argon, vacuum, power, current and other parameters, the system, automatic monitoring, automatic shutdown

13、alarm when out of control range制帽2019/06/30導(dǎo)建日期Key Date：更新版本日期FMEA Date :POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)座品名布甫Item :晶片電阻走品模務(wù)且 Model(s)/Program(s) : AC跨功能小務(wù)且Core Team :裂程任 Process Responsibility :真空膜鼬日期Key Date：FMEA 做 FMEA Number 次 Page:填表人 Prepared By： 更新版本日期FMEA Date :裂程/功能P

14、rocessStep / FunctionP22真空膜/端 極面漉上一屑 金屠薄膜 Sputtering/The side sputtering a layer of metal film要求 Requireme nt潛在 失效模 式Potential Failure Mode潛在失效影警Potential Effect(s) of Failure真屑不真屑可有延伸延伸走生外不良，良noOver品率下降over-sputtesputterinPoor yieldring,g治具內(nèi)料品不可走治具內(nèi)生粘速料品有No sticky粘速影警折粒效率material instickyEffect of

15、2ndthe jigmaterialbreaking efficiencystockin the jig stock2廄 重 度(S)(C)不良/失效原因Potential Cause(s) ofFailure1.MM流量超出關(guān)兄 定上限The argon flow exceeds the upper limit 2.漉射房真 空度超出規(guī)定下 限The vacuity of sputtering exceeds the lower limit 3功 率，雷流值超出 規(guī)定上限 Power, current exceeding theupper limit干燥溫度超遺規(guī)定 上限drying tem

16、perature exceeds the upper limit現(xiàn)行管控 CurrentDesign控制琪防ControlsPrevention每班誰行自主檢查 Make machine setting self check every shift.烤箱超溫自勤警幸艮Oven over temperature automatic alarm畿 生 度 (O)控制檢測ControlsDetection值測度(D)建B室寸策RecommendedAction人及予期完成日期Responsibility &Target CompletionDate改善完成日期Actions TakenComplet

17、ion Date廄 重 度(S)畿生度(O)值測度(D)1每燧誰行自主 檢查Make machine setting self check every furnace。 2更換強(qiáng)片替換 強(qiáng)簧功能，每月保 餐。Replace spring function with shrapnel and maintain it monthly.3.測包 CCD 100% 檢查Taping AOI 100% inspection干燥溫度每班誰 行自主檢查 temperature self check every shift3232瞄麻、真空度、功 率、雷流等參敷，果 用系統(tǒng)，自勤監(jiān)控， 超出控制范圉畤自 勤停檄幸艮警Argon, vacuum, ， power, curre