PCB基板厚度包括芯板及半固化片

1、PCB板材厚度規(guī)格：? 0.5mm , 0.7mm , 0.8mm , 1.0mm, 1.2mm, 1.5mm, 1.6mm , 2.0mm , 2.4mm , 3.2mm , 6.4mmPCB板上銅箔的厚度規(guī)格：? 18um, 25um, 35um, 70um 和 105um常用半固化片規(guī)格：型號(hào)10802116L2116A2116H15007628L7628A7628H7628M厚mil344.55677.59.38板厚一般分為含銅和不含銅兩種厚度一.含銅厚度：規(guī)格配料結(jié)構(gòu)規(guī)格配料結(jié)構(gòu)0.1H/H1 X 1061.31/16X76280.21/11 X2116H/H7X7628H/12 X

2、 10801.42/27X7628H/H1 X 15061/17X7628T/T1 X 7628H/H7X76282/21 X 1061.52/27X76280.32/21 X 15061/18X7628H/21 X 7628H/H8X76281/12X2116T/T8X7628H/12X21161.62/28X7628H/H1080+2116+10801/18X7628T/T1080+2116+1080H/H8X76280.42/21080+2116+10801.72/28X76281/11080+7628+1080H/H2 X 76281/19X7628T/T2 X 7628H/H9X76

3、280.52/22 X 76281.82/29X76281/17628+1080+76281/19X7628H/H7628+1080+7628H/H9X76280.62/27628+1080+76281.92/29X76281/13 X 76281/110X 7628H/H3 X 7628H/H10X 76280.72/23 X 76282.02/210X 76281/12116+2 X7628+21161/110X 7628H/H1080+3X7628+1080H/H11X 76280.82/21080+3X7628+10802.21/111X 76281/14 X 7628H/H12X 7

4、628H/H4 X 76282.32/212X 76280.92/24 X 76281/112X 76281/12X7628+1080+2 X 7628H/H12X 7628H/H2X7628+2116+2 X 76282.42/212X 76281.02/22X7628+2116+2 X 76281/113X 76281/15 X 7628H/H13X 7628H/H5 X 76282.52/213X 76281.12/25 X 76281/113X 76281/15 X 7628H/H13X 7628H/H6 X 76283.02/216X 76281.22/26 X 76281/116X

5、 76281/16 X 7628H/H16X 7628H/H6 X 76283.21/117X 76282/217X 7628,不含銅厚度厚度mil厚度mm配料結(jié)構(gòu)備注20.0501 X 106不含2OZ銅箔30.0750.076主：1 X 1080 次:1 X 1086不含2OZ銅箔厚度mil厚度mm配料結(jié)構(gòu)備注40.100.102主：1 X 2116 次：1 X 3313 或 2X 106 或 1 X 2113 或 1X 2313 或 1080+10650.127主：1 X 2116 次:2 X 108060.1500.152主：1 X 1506 次:2 X 108070.178主:1 X

6、 7628 次:1080+211680.2000.203主：1 X 7628 次:2 X 2116或 2X211390.2280.2302X2116100.250.2542X2116110.280主:1080+2116+1080 次:2 X 2165120.3000.305主：2 X 1506 次:2116+1080+2116130.33主：1080+7628+1080 次:2 X 1506140.3560.362 X 7628150.382 X 7628160.4060.41主:2 X 7628 次:3 X 2116170.43主:7628+1080+7628 次:2 X 7628180.4

7、570.467628+1080+7628190.487628+2116+7628200.5080.51主：7628+2116+7628 次:7628+2 X 1080+7628或 3 X 7628210.533 X 7628220.563 X 7628230.583 X 7628240.600.61主：3 X 7628 次:2116+2 X 7628+2116250.64主：3 X 7628 次:2116+2 X 7628+2116260.661080+3X7628+1080270.691080+3X7628+1080280.710.711主:4 X 7628 次:4 X 7628300.76

8、4 X 7628310.790.804 X 7628友情備注：1 foot = 12 inch = 304.8 mmlinch = 25.4 mm1 mil=0.0254 mm1 inch=1000 mil1OZ=28.375g1 OZ銅箔其真正厚度為 1.38mil或35 am一、芯板、半固化片規(guī)格：.生益芯板常見(jiàn)規(guī)格：mm （含銅厚）0.2mm5.120.3mm9.060.4mm12.990.5mm16.930.6mm20.870.7mm24.80.8mm28.740.9mm36.611mm44.49mm52.36mm56.3mm60.242mm75.982.4mm91.73.半固化片：1

9、0803.0mil21164.2mil76287.0mil.流膠厚：10802.5mil76286.5mil0.14mm=2*10800.21mm=2*21160.24mm=7628+10800.36mm=2*76280.4mm=2*7628+1080二、常用半固化片在不同銅厚、不同圖形厚度變化. HOZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76287.37.06.86.76.621164.64.44.24.03.833133.93.83.73.53.310802.82.62.52.42.27628H7.67.37.17.06

10、.92116H4.94.74.54.34.13313H4.14.03.93.73.51018H2.92.72.62.52.37628C7.16.86.66.56.43313C3.73.63.53.23.11OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76287.16.86.66.56.421164.54.34.13.93.733133.83.73.63.43.210802.82.62.52.42.27628H7.47.16.96.86.72116H4.84.64.44.24.03313H4.03.93.83.63.41018H2

11、.92.72.62.52.37628C6.96.66.46.36.23313C3.63.53.43.23.02OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76286.86.56.36.16.021164.24.03.83.53.333133.53.43.33.12.810802.62.42.32.11.97628H7.16.86.66.46.32116H4.54.34.13.83.63313H3.73.63.53.33.01018H2.72.52.42.22.07628C6.66.36.15.95.83313C3.33.23.1

12、2.92.63OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76286.56.26.05.75.621164.03.83.63.23.033133.33.23.12.82.510802.42.22.11.81.67628H6.86.56.36.05.92116H4.34.13.93.53.33313H3.53.43.33.02.71018H2.52.32.21.91.77628C6.36.05.85.55.43313C3.13.02.92.62.3注：Gnd為65%以上的大銅箔，H為高樹(shù)脂含量，C為低樹(shù)脂含量S0401粘結(jié)片壓合厚

13、度（100%殘銅率）樹(shù)脂含量壓合厚度a m/ 20 n m壓合厚度Mil10671 3502.0 0.41080L61 3712.8 0.41080A64 3783.1 0.41080H68 3903.5 0.42116L50 31134.4 0.62116A52 31204.7 0.62116H56 31335.2 0.6331355 31004.0 0.67628L41 31857.3 0.87628A43 31957.7 0.87628M46 32108.3 0.87628H50 32309.1 0.81506A45 31606.3 0.81506H49 31756.9 0.8S0701

14、粘結(jié)片壓合厚度（殘銅率100%標(biāo)樹(shù)脂含量壓合厚度a m/ 20 n m壓合厚度Mil10671 3512.0 0.41080L61 3722.8 0.41080A64 3803.1 0.41080H68 3923.6 0.42116L50 31154.5 0.62116A52 31214.8 0.62116H56 31355.3 0.6331355 31024.0 0.67628L41 31887.4 0.87628A43 31987.8 0.87628M46 32138.4 0.87628H50 32359.3 0.81506A45 31626.4 0.81506H48 31756.9 0.

15、8S1000B粘結(jié)片壓合厚度（殘銅率100%）標(biāo)樹(shù)脂含量壓合厚度a m/ 20 n m壓合厚度Mil10671 3471.9 0.41080L63 3712.8 0.41080A66 3783.1 0.41080H68 3833.3 0.42116L52 31124.4 0.62116A55 31214.8 0.62116H58 31325.2 0.6331355 3943.7 0.67628L43 31857.3 0.87628A46 31987.8 0.87628M48 32078.1 0.87628H50 32188.6 0.81506A45 31515.9 0.81506H48 31626.4 0.8S0155粘結(jié)片壓合厚度（100%殘銅率）樹(shù)脂含量壓合厚度a m/ 20 n m壓合厚度Mil10671 3491.9 0.4108