世界半導(dǎo)體生產(chǎn)機(jī)臺(tái)安全設(shè)計(jì)驗(yàn)收標(biāo)準(zhǔn)

1、世界半導(dǎo)體生產(chǎn)機(jī)臺(tái)安全設(shè)計(jì)驗(yàn)收標(biāo)準(zhǔn)GlobalSemiconductorSafetyServices,LLCSEMIS2-93AProductSafetyAssessmentFinalReport世界半導(dǎo)體生產(chǎn)機(jī)臺(tái)安全設(shè)計(jì)驗(yàn)收標(biāo)準(zhǔn)AppliedMaterialsChemicalMechanicalPolishingSystemModel:MirraTrakCMP工藝應(yīng)用材料June19,1998Preparedfor:AppliedMaterials3111CoronadoDriveSantaClara,CA95054Preparedby:GlobalSemiconductorSafetySe

2、rvices,LLC1313GenevaDriveSunnyvale,CA94089GS3JobNo.980029GS3DocumentNo.980029F2Client-Confidential保密合TheinformationusedtopreparethisreportwasbasedoninterviewswithAppliedMaterialsengineers.TheinformationwasalsobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak.Thisinformationwas

3、gatheredovertheperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.ApreliminaryassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluationwerealsoused.Allobservationsandrecommendationsarebasedonconditionsanddescr

4、iptionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemiconductorSafetyServices.ThisreportssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,andtotheco

5、mprehensivenessofthetests,examinationsand/orsurveysmade.ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServicesservicemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServicesexpresswrittenconsent.Theserviceperformedhasbeenconducte

6、dinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehighlevelofskillandcareexercisedbyGlobalSemiconductorSafetyServicesstaff.Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsandforthepurposeofdocumentationtoSEMIS2-93A.Theref

7、ore,nooutsidedistributionwilloccurunlesswrittenauthorizationisprovidedbytheclient.TABLEOFCONTENTS目錄SectionPageNo.SectionMANAGEMENTSUMMARY管理摘要）SectionSCOPE范圍）SectionSYSTEMDESCRIPTION系統(tǒng)描述）SectionASSESSMENT&TESTINGMETHODOLOGIES試驗(yàn)方法）SectionSAFETYASSESSMENT安全評(píng)估）PURPOSE（目的）SCOPE（適用范圍）SAFETYPHILOSOPHY（安全體系

8、）GENERALGUIDELINES（指導(dǎo)方針）SAFETY-RELATEDINTERLOCKS（安全互鎖）CHEMICALS（化學(xué)品）IONIZINGRADIATIONNON-IONIZINGRADIATIONNOISE（噪音）VENTILATIONANDEXHAUST（通風(fēng)與排鳳）ELECTRICALEMERGENCYSHUTDOWN（緊急停機(jī)）HEATEDCHEMICALBATHSHUMANFACTORSENGINEERINGROBOTICAUTOMATIONHAZARDWARNING（危險(xiǎn)警告）EARTHQUAKEPROTECTION（地震警告）DOCUMENTATION（文件）FIR

9、EPROTECTION（消防保護(hù)）ENVIRONMENTALGUIDELINES（環(huán)境方針）SectionRECOMMENDATIONSSection-ILLUSTRATIONSILLUSTRATION1-MirraTrakSystemLayoutATTACHMENTONE一SURFACELEAKAGECURRENTTEST泄漏測試）ATTACHMENTTWO-GROUNDINGRESISTANCETEST（接地電阻測試）ATTACHMENTTHREE一VERIFICATIONOFEMO緊急按鈕確認(rèn)）ATTACHMENTFOUR一SOUNDPRESSURELEVELSURVEY聲壓測試）ATT

10、ACHMENTFIVE一ERGONOMICCHECKLIST人體功力檢査表）ATTACHMENTSIX一MANUALHANDLINGLIFTANALYSIS手動(dòng)操作分析）ATTACHMENTSEVEN一揥HATIF”HAZARDANALYSIS（危險(xiǎn)分析ATTACHMENTEIGHT一SEMIS10T296RISKASSESSMENTGUIDELINEMETHODOLOGYCONCLUSIONSectionMANAGEMENTSUMMARYAfollow-upsafetyassessmentoftheAppliedMaterialsChemicalMechanicalPolishingSyst

11、em,Model:MirraTrak(hereafterreferredtoastheMirraTrak),wasperformedfromFebruary2,1998throughFebruary4,1998.Afurtherre-inspectionofthesystemwasperformedonJune3,1998.ApreliminaryevaluationofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996,andtheresultsofthisevaluationwerealsoutilizedi

12、nthisreport.Notethatthisreportcoversonlytheconcernsraisedbyintegratingthreeseparatesystems,theAppliedMaterialsFABSandMirraCMP,andtheOnTrakSynergyIntegra,whichtogetherformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(GS

13、3ReportNo.970668TF,datedJanuary30,1998fortheFABSsystem;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMPsystem;andGS3ReportNo.980094F,fortheOnTrakSynergyIntegra.)ThisreviewwasperformedusingthecriteriaestablishedbytheSemiconductorEquipmentandMaterialsInternationalSafetyGuidelinesforSemiconductorM

14、anufacturingEquipment(SEMIS2-93AGuidelines).GS3hasusedtheSEMIS10-1296GuidelineMethodologytoperformaRiskAssessmentofanyIssuesremainingafterthereviewoftheinformationprovidedbyAppliedMaterials.NotethattheseveritywasrankedbyGS3;theLikelihood(expectedrateofoccurrence)wasprovidedbyAppliedMaterials.Itemswh

15、ichwererankedonlyasa揕owor揝light”riskassessmentcategorymaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10-1296Guidelines.DuringthesafetyassessmentofMirraTrak,GS3identifiedseveralpositiveengineeringdesigns,aswellasseveralissuesthatwillneedtobeaddressedinordertoachievefull

16、compliancewithSEMIS2-93AGuidelines.Thisdescriptionofbothpositiveengineeringdesignandnon-conformanceissuesarecomprehensivelydescribedinSectionofthisreport.ReferenceSectionforasummaryoftheoutstandingitems.SectionSCOPEGS3wascontractedbyAppliedMaterialstoconductaSEMIS2-93AProductSafetyAssessmentoftheMir

17、raTrak.NotethatthisreportcoversonlytheadditionalconcernsraisedbyintegratingtheAppliedMaterialsFABSandMirraCMPandtheOnTrakSynergyIntegratogethertoformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(G3SReportNo.970668T3F,d

18、atedJanuary30,1998fortheFABS;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMP;andGS3ReportNo.980094FfortheOnTrakSynergyIntegra).GS3isajointventurepartnershipbetweenIntertekTestingServices,.,(ITS)andEnvironmentalandOccupationalRiskManagement,Inc.(EORM).GS3isfocusedonprovidingriskmanagement-based

19、equipmentsafetyconsultingandtestingservicestosupportabroadrangeofsafetyneedsspecifictosemiconductormanufacturingequipmentanddevicemanufacturers.TheMirraTrakwasevaluatedforcompliancewiththeapplicablecodesandrequirementsoftheUnitedStates.There-inspectionassessmentwasperformedbyMr.AndrewKileyandMr.Mich

20、aelVargaofGS3andreviewedbyMr.PavolBrederandMr.AndrewMcIntyre,CIH,alsoof3G.SThesafetyassessmentwasbasedonanin-plantinspectionoftheMirraTrak,discussionswithMs.LisaPowellofAppliedMaterials,aswellasareviewofthesystemsmanuals.STANDARDSUSEDTheassessmentwasconductedinaccordancewiththeapplicableportionsofth

21、efollowingcodesandstandards:SEMIS2-93A,SafetyGuidelinesForSemiconductorManufacturingEquipment(1996Edition)ANSI,MethodsfortheMeasurementofSoundPressureLevels(1986Edition)ANSI/UL1262,SafetyStandardforLaboratoryEquipment(ThirdEdition)ANSI/NFPA79,ElectricalStandardforIndustrialMachinery(1994Edition)ANSI

22、/NFPA70,NationalElectricalCode(1996Edition)UL50,SafetyStandardforEnclosuresforElectricalEquipment(TenthEdition)SEMIDoc.S8-95,SafetyGuidelineforErgonomics/HumanFactorsEngineeringofSemiconductorManufacturingEquipment.(1995Edition)SEMIS1-90,SafetyGuidelineforVisualHazardAlerts(1993Edition)ANSI/UL73,Saf

23、etyStandardforMotor-OperatedAppliances(EighthEdition)ANSI/,SpecificationsforAcousticalCalibrators21CFR,CodeofFederalRegulations.Part1000to1050.ANSI/UL3101-1,SafetyStandardforElectricalEquipmentforLaboratoryUse(FirstEdition)SEMIS10-1296,SafetyGuidelinesforRiskAssessment(1996Edition)TESTSPERFORMEDInor

24、dertoverifycompliancewithSEMIS2-93AGuidelinesandtheotherapplicablestandards,thefollowingtestswereperformed:SurfaceLeakageCurrentTestGroundingResistanceTestVerificationofEMOsSoundPressureLevelSurveyNotethatonlythetestsnotedabovewererepeated,asthetestingoftheindividualassemblies(FABS,Mirra,andOnTrakSy

25、nergyIntegra)wasperformedasapartoftheindividualevaluationsforeach.Referencetheindividualreportsforeachfortestresults.SectionSYSTEMDESCRIPTIONTheMirraTrakconsistsofaFABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP),andanOnTrakSynergyIntegra.Anoperatorcanloaduptofour8”wafercassettesatthefr

26、ontoftheFABSmoduleatonetime.CassettesmaybemovedintopositionforhandlingbytheFABSusinganoptionalergoloaderorbymanualrotationofthecassette.TheFABSrobotthenpicksupthewafersfromthecassettes,placestheminanalignmenttool,andthenpassesthewaferstotheCMP擔(dān)extendedrobotwaferhandlingmoduleforconveyancetotheCMP.Th

27、eCMPsystemismodularandconsistsofawaferhandlingmodule(whichmovesbetweentheFABS,SynergyIntegra,andCMP),apolishingmodule,aslurrydeliverymodule,andacontrolsystemmodule.Thesystemusesde-ionizedwater,cleandryair(CDA),nitrogen,vacuum,andslurry.Theslurryisprovidedbytheend-usertothesystemthroughabulkheadfacil

28、ityconnection.TheCMPisdesignedforoxideetchingandmetaletchingandisintendedforusewithavarietyofslurrychemistries,includingbasicandacidicslurries,butthissystemwasdesignedonlyfortheuseofapotassiumhydroxide(KOH)slurry,eventhoughotherchemistriescouldbeused.Thewaferhandlingmoduleisanexternalrobotictoolthat

29、manipulatesthewafercassettesfordeliverytothepolishingmodule.Thepolishingmoduleconsistsofthreepolishingheadsarrangedonamechanicalpositionercalledacarrousel.Apolishingheadpicksupawaferanddeliversittoapolishingpadwhereitispolished.Asthewaferispolished,theslurrydeliverymoduledispersesameasuredflowofslur

30、ry.Whenallpolishingstepsarecomplete,thecarouseltransfersthewaferbacktotheexternalCMProbotwhereitisdeliveredtotheOnTrakSynergyIntegra.TheOnTrakSynergyIntegraisadoublesidedwafercleanerusingoptionsforavarietyofchemicalprocesseswhichoperateinconjunctionwiththemechanicalprocesses.TheSynergyIntegrausesCDA

31、,nitrogen,orargon.Italsouses.waterandammoniumhydroxide(NH4OH)ata2%or29%concentration.WhiletheSynergyIntegraisabletousehydrofluoricacid(HF)inoneofitsprocesses,thecurrentMirraTrakconfigurationisnotdesignedtouseHFandwasnotevaluatedforitsuse.TheSynergyIntegraconsistsofaninputstation,twobrushstations,asp

32、instation,anunloadhandler,andanoutputstationwhichpassesthewafersbacktotheFABSwhichreturnsthewaferstotheiroriginalcassetteswheretheyareunloadedbytheoperator.FacilitiesRequirements:ElectricalPower:208VAC,200A,3phase,60Hz.ExternalFluids:Cleandryair:90-110psi,cfmNitrogen:90-110psi,1cfmVacuum:25inch.HgDI

33、water:75psi,6gpmSlurry:0-5psi,lpmSectionASSESSMENT&TESTINGMETHODOLOGIESThecriteriaforthisevaluationwasbasedupontheSemiconductorEquipmentandMaterialsInternationalSEMIS2-93AGuidelines.SEMIS2-93AGuidelinesareperformance-basedguidelinesdesignedtoidentifypotentialhazardsduringtheoperationandmaintenanceof

34、equipment,sothattheeffectivenessoftheengineeringcontrolsandfail-safesystemscanbemaximized.Theguidelinesaddressthefollowingaspects:APPLICABLESECTIONSSafety-RelatedInterlocksChemicalsAudioNoiseVentilationandExhaustNON-APPLICABLESECTIONSIonizingRadiationNon-IonizingRadiationHeatedChemicalBathsRoboticsa

35、ndAutomationElectricalEmergencyShutdownErgonomics/HumanFactorsHazardWarningEarthquakeProtectionDocumentationFireProtectionEnvironmentalThenon-applicablesectionsaresupportedbyengineeringrationaleprovidedwithinthisreport.Toverifycompliancewiththeapplicableguidelinesandstandards,thefollowingtestswerepe

36、rformed.Thetestdatasheetsareincludedintheattachmentstothisreport.SurfaceLeakageCurrentTest(SectionofS2-93AandSectionofUL1262)-Surfaceleakagecurrentmeasurementsweremadebetweenallaccessiblemetalpartsandground,toverifycompliancewiththemaximumacceptablesurfaceleakagecurrentofmilliamperes.(AttachmentOne)

37、GroundingResistanceTest(SectionofS2-93AandSectionofUL1262)-Groundingresistancemeasurementsweremadebetweenallaccessiblemetalpartsandground,toverifycompliancewiththemaximumacceptablegroundpathresistanceofohm.(AttachmentTwo)VerificationofEMO/Interlocks(Sectionsand-Withthesystemrunningatmaximumnormalloa

38、d,theemergencyoffbuttonswereactivatedtoverifyproperoperation.(AttachmentThree)SoundPressureLevelSurvey(Section-SoundpressurelevelsweremeasuredperANSI(R1986),MethodsfortheMeasurementofSoundPressureLevels.Soundpressurelevelswererecordedwiththesystemrunningatmaximumnormalloadtoverifycompliancewiththema

39、ximumacceptablenoiselevelof80dB(A).(AttachmentFour)Notethatonlythetestsnotedabovewererepeatedasthetestingoftheindividualassemblies(FABS,MirraandOnTrakSynergyIntegra)wasperformedasapartoftheindividualevaluationsforeach.Referencetheindividualreportsforeachfortestresults.SectionSAFETYASSESSMENTAnassess

40、mentoftheMirraTrakwasperformedinaccordancewiththeSEMIS2-93AGuidelinesandotherapplicablestandardsnotedinSection(Scope).EXPLANATIONOFREPORTFORMATUnlessotherwisespecified,allreferencedsectionsbelowrefertotheSafetyGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines).Thereportstructurei

41、smodeledafterthedocumentationrequirementsofSEMIS2-93AGuidelines.EachparagraphoftheSEMIS2-93AGuidelinesiseitherpresentedverbatimorparaphrasedinaboxontheleftofthepage.TheparagraphsfromtheSEMIS2-93AGuidelinesarepresentedwiththeircorrespondingnumbersfromtheGuidelines,withtheexceptionthatthesenumbersarep

42、roceededbya5.DirectlytotherightofthisboxisasecondboxwhichisusedtoindicatethestatusoftheequipmentwithrespecttothegivenrequirementoftheGuidelines.SEMIS2-93AParagraphNo.(precededby5.)MEETSStatementoftherequirement.ISSUEINFOREQUIREDRESPONDEDN/AADD|refBelowtheseboxes,anexplanationisgivenwhichexplainswhyt

43、hatparticularstatusboxwaschecked.Thisexplanationtakesoneofthefollowingnineformswhichcorrespondtotheninestatusboxesabove.MEETSAsectionmarkedMEETSwithrespecttoagivenparagraphoftheGuidelinessignifiestheconstructionfeaturescriticaltocompliancewiththeSEMIS2-93Acriteriaweredirectlyobservedbytheengineerdur

44、ingtheevaluation.Thesecriticalfeaturesareidentifiedanddescribed.ISSUESIfaconstructionfeaturedoesnotmeetthespecifiedparagraph,thewayinwhichitdeviatesfromtheGuidelinescriteriaisdescribed.ISSUESwererankedusingariskassessmentmethodologybaseduponSEMIS10-1296.Eachitemwasassignedanoverallriskrankingbasedup

45、onadeterminationoftheseverityofthehazardposedbytheIssueandthelikelihoodthatthehazardwouldoccurresultinginahazardousconsequence.,injury,equipmentdamageorenvironmentalhazard).Issueswith揕ow”or揝light”riskassessmentcategoriesmaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10

46、-1296Guideline.AsummaryoftheriskassessmentmethodologyusedforthisevaluationisincludedinAttachmentEightofthisreport.INFORMATIONREQUIRED(INFOREQUIRED)Ifinadequateinformationisavailabletodeterminecomplianceornon-compliance,thenINFORMATIONREQUIREDismarked.Theadditionalinformationwhichisneededtoevaluateth

47、esystemisalsoidentified.RESPONDEDIftheoriginalevaluationrevealedthatthesystemdoesnotmeetaparticularrequirementoftheGuidelinesandthemanufacturerhascommittedtomakingsuitablechangeswhichwillbringthesystemintocompliance,thenthisparticularrequirementoftheGuidelinesismarkedRESPONDED.TheRESPONDEDdesignatio

48、nrequiresthatthemanufacturerscorrectiveactionadequatelyaddresstheissuesraisedintheoriginalevaluation.Also,themanufacturermustcommittoanactiondatebywhichtheconstructionchangeswillbefullyimplemented.AllRESPONDEDsectionswilldescribetheoriginalissuesraised,theconstructionchangesproposedbytheequipmentman

49、ufacturer,andthedatebywhichthosechangeswillbeimplemented.NON-APPLICABLE(N/A)AnyrequirementsoftheGuidelineswhichdonotapplytoaparticularsystemareidentifiedasNON-APPLICABLE.ADDRESSED(ADD)IftherequirementsstatedinagivenparagraphoftheGuidelinesaremoreappropriatelydiscussedindetailunderanothersection,then

50、thissectionoftheGuidelinesisidentifiedasADDRESSED.Theparagraphunderwhichtheseissuesarediscussediscitedforreferencepurposes.REFERENCEONLY(REF)SomeparagraphsoftheGuidelinespresentdefinitionsonsafetyorphilosophyandareforreferenceonly.Therearenospecificrequirementsdesignatedbytheseparagraphs.Allsections

51、ofthistypearemarkedREFERENCEONLY.PURPOSETheseguidelinesareintendedasaminimumsetofperformancebasedenvironmental,healthandsafetyconsiderationsforequipmentinsemiconductormanufacturing.MEETSISSUEINFOREQUIREDRESPONDEDN/AADDREFXREFERENCEONLYAnassessmentofAppliedMaterialsMirraTrak,wasconductedinaccordancew

52、iththeSafetyGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines)basedonsoundengineeringanddesignpractices.ReferenceswerealsomadetoanyknownapplicableIndustrySafetyStandards,Building,Fire,andElectricalCodes,aswellasanyGovernmentRegulatoryRequirements.SCOPETheseguidelinesapplytoequipm

53、entinthemanufacturing,metrology,assemblyandtestingofsemiconductorproducts.MEETSISSUEINFOREQUIREDRESPONDEDN/AADDREFXREFERENCEONLYTheintegrationoftheindividualmodules(FABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP),andanOnTrakSynergyIntegra)wasevaluatedagainsttheSEMIS2-93AGuidelinesandot

54、herapplicablestandards.SAFETYSAFETYSAFETYPHILOSOPHYTheseguidelinesshouldbeusedtohelpeliminateknownsafetyandhealthhazardsinherentintheoperationandmaintenanceofprocessequipment.Industrystandards,building,electricalandfirecodes,governmentregulatoryrequirements,andgoodpracticeshouldbeconsideredinallequi

55、pmentdevelopmentprograms.MEETSISSUEINFOREQUIREDRESPONDEDN/AADDREFXREFERENCEONLYTheintentofSEMIS2-93AGuidelinesistominimizeoreliminateknownsafetyandhealthhazardsbyhavingthemanufacturerdesigntheequipmentwiththeapplicableindustrialsafetystandards,codes,andregulatoryrequirementsinmind.Aspartofthissafety

56、assessment,GS3hasevaluatedtheMirraTrakagainstseveralapplicablestandards,codes,andregulatoryrequirements,asnotedinSectionSCOPEofthisreport.ResultsofourfindingsaresummarizedinthisS2-93AEngineeringReport.-NosinglepointfailureoroperationalerrorshouldMEETSallowimmediateexposuresituationofpersonnel,facili

57、tiesorcommunitytohazardsordirectlyresultininjury,deathorequipmentloss.Allequipmentshouldbefail-safeorofafault-tolerantdesign.ISSUEINFOREQUIREDRESPONDEDN/AADDXREFADDRESSED-ThefollowingareasofconcernintheoperationandMEETSmaintenanceoftheequipmentareaddressed:Chemicalshazards/Radiationhazards/Electrica

58、lhazards/Physicalhazards/Mechanicalhazards/Environmentalhazards/Fireandexplosions/Seismicactivityhazards/VentilationandErgonomics.ISSUEINFOREQUIREDRESPONDEDN/AADD|refxREFERENCEONLYThisS2-93AEngineeringReportdocumentsanyapplicablesafetyconcernsrelatingtothesemiconductormanufacturingequipment.Refertot

59、hespecificsectionsofthisreportfordetails.GENERALGENERALGENERALGUIDELINES-TheseguidelinesshouldbeincorporatedbyreferenceMEETSinallstandardequipmentpurchasespecifications.Theintentisfortheendusertobuyasafedesign,notdesigntheequipment.Theuserandsuppliershoulddocumentwhenitisnecessarytodeviatefromthisgu

60、ideline.ISSUEINFOREQUIREDRESPONDEDN/AADDREFXREFERENCEONLYTheguidelinesstatethattheequipmentistomeetthesegeneralsafetycriteria.Anydeviationfromtheseguidelinesshouldbedocumented.Thisreportwillservetoidentifyanyknowndeviationsatthetimeoftheinspectionoftheequipment.Documentationofacceptanceofanydeviatio