工作中常用英文單詞

PreparedbyMFGTrainingCenter常用詞匯介紹

FAB區(qū)常用詞匯工作區(qū)常用詞匯

公司常用詞匯1

公司常用詞匯SMIC(SemiconductorManufacturingInternationalCorporation)

中芯囯際集成電路制造有限公司MES(ManufacturingExecutionSystem)

生產(chǎn)操作介面軟件ERC(EmergencyResponseCenter)

緊急應(yīng)變中心2HR(HumanResource) 人事部GA(GeneralAffairs)

總務(wù)部Accounting

會(huì)計(jì)部MFG(Manufacturing)

制造部ENG.(Engineering)

工程部Finance

財(cái)務(wù)部PC(productioncontrol)

生產(chǎn)控制PR(publicrelation)

公關(guān)部3Conference 會(huì)議Trainingroom 訓(xùn)練教室Trainingcourse 訓(xùn)練課程Shuttlebus 交通車Internet 國際互聯(lián)網(wǎng)絡(luò)Intranet 企業(yè)內(nèi)部互聯(lián)網(wǎng)絡(luò)ISO9000(InternationalStandardOrganization)

國際標(biāo)準(zhǔn)組織4IT(InformationTechnology)

信息技術(shù)部門TD(TechnicalDevelopment)

技術(shù)研發(fā)部門DCC(DocumentControlCenter)

文件管制中心ISEP(IndustrialSafetyEnvironmentProtection)

工安環(huán)保EAP(EquipmentAutomationProject)

機(jī)臺(tái)自動(dòng)化方案5PreparedbyMFGTrainingCenter

FAB區(qū)常用詞匯AirShower空氣潔凈室Alarm警訊Average平均APD異常處理單Abort放棄Acid酸Auto/Manual自動(dòng)/手動(dòng)AMHS自動(dòng)化物料傳輸系統(tǒng)Area區(qū)域Batch群；組Backup備用Bayrack貨架Bay工作區(qū)Bank儲(chǔ)存所“A”“B”6“C”Cancel取消Cleanroom無塵室Cassette裝晶片的晶舟Chemical化學(xué)藥劑Check檢查；核對(duì)CIM電腦整和制造Class潔凈室等級(jí)CMP化學(xué)機(jī)械研磨Childlot子批Correct正確Cycletime生產(chǎn)周期Code代碼Control控制Chip(die)晶粒Comment注解Criticallayer重要層Confirm確認(rèn)Chamber反應(yīng)室CD關(guān)鍵性尺寸Cart手推車Chart圖表ControlWafer控片7PreparedbyMFGTrainingCenter“D”Dummywafer擋片Dailycheck每天檢查Diffusion擴(kuò)散DIwater去離子水Damage損害Display展示Double重復(fù)；加倍Defect缺陷Doping摻雜Downgrade降級(jí)Duedate交期Discipline

紀(jì)律8PreparedbyMFGTrainingCenterEtch蝕刻Error錯(cuò)誤EE設(shè)備工程師Emergency緊急狀況Exit退出Entry進(jìn)入Energy能量Environment環(huán)境EQrack機(jī)臺(tái)貨架ET設(shè)備技術(shù)員EQStatus機(jī)臺(tái)狀態(tài)“E”9PreparedbyMFGTrainingCenterFoundry代工Fail失敗FAB工廠Filter過濾器Function功能Gas氣體Gowningroom更衣室“F”“G”10PreparedbyMFGTrainingCenter“H”Hold暫停Hotback烘烤I.C集成電路Idle閑置Implant植入Interbay自動(dòng)傳輸軌道系統(tǒng)ID辨認(rèn)，鑒定IPA有機(jī)清潔溶劑“I”11PreparedbyMFGTrainingCenterLayer層次Lot批Line線距Loop巡路Load載入Login/logout注冊(cè)/離開Logsheet記錄本Logo標(biāo)志Location位置Login登錄Logout退出LotStatus產(chǎn)品狀態(tài)Laundry洗衣房“L”12PreparedbyMFGTrainingCenterMachine機(jī)器Module模塊Move產(chǎn)量Monitor測機(jī)Merge合并Micron微米Metal金屬M(fèi)FG制造部Mark標(biāo)志Mask(reticle)光罩Manual手動(dòng)Measure測量Mapping映射Mode模式Message訊息Mean平均值Measure測量“M”13PreparedbyMFGTrainingCenterNon-critical非重要“N”O(jiān)xide氧化物Owner擁有者O.I操作指導(dǎo)手冊(cè)O(shè)PI操作界面OOS超出規(guī)格界線OOC超出控制界線OCAP超出管制界線的因應(yīng)對(duì)策“O”14PreparedbyMFGTrainingCenter“P”Pod裝晶舟與晶片的盒子Photo黃光或微影Particle含塵量/微塵粒子Password密碼Poly復(fù)晶Passivation保護(hù)層Polymer聚合物Profile側(cè)面Power電源Pressure壓力P.R.光阻Parentlot母批Pause暫停Process進(jìn)行/過程/程序PE制程工程師Peeling掀起Pattern圖形Priority優(yōu)先權(quán)Product產(chǎn)品PM預(yù)防保養(yǎng)PN制程通報(bào)POD晶盒15PreparedbyMFGTrainingCenter“Q”Quality品質(zhì)Certify(Qualify)取得資格Quantity(QTY)數(shù)量Queuetime等待時(shí)間“R”Recipe程式Rework再做一次/重做Robot機(jī)械手臂Run跑（貨）Release放行RunCard卡片，注明程式內(nèi)容Ready準(zhǔn)備Recycle回收Reclaim再生Remove去除Request要求Reject退回（出）Range范圍Record記錄Review重新檢查Retest再測試16PreparedbyMFGTrainingCenter“S”Semiconductor半導(dǎo)體Scrap報(bào)廢Si硅原子Start開始Spec規(guī)格Schedule指目錄或時(shí)間表Step步驟SmifArm標(biāo)準(zhǔn)機(jī)械界面SmartTag電子式標(biāo)簽Ship傳送SmartTray托盤Space空間Sidewall側(cè)壁Stocker倉儲(chǔ)Split分批Shutdown停工Sticker防錯(cuò)標(biāo)簽Stop停止Standby準(zhǔn)備，待命Scrubber洗刷Setup測試SOP標(biāo)準(zhǔn)操作程序17PreparedbyMFGTrainingCenter“S”Slot槽位Solvent溶劑Scratch刮傷Sorter晶片分片/整理機(jī)Summary總計(jì)SPC制程統(tǒng)計(jì)管制Strip剝?nèi)PC-Chart制程統(tǒng)計(jì)控制圖形“T”T.A.技術(shù)助理Transfer傳送T.M.領(lǐng)班/訓(xùn)練員Throughput產(chǎn)量Thickness厚度TestWafer測試晶片Transistor電晶體Trackin進(jìn)貨18PreparedbyMFGTrainingCenterTrackout出貨Tag電子顯示器ThinFilm薄膜Temperature溫度TECN臨時(shí)工程變更通知Tunnel(Bay)通道TurnRatio周轉(zhuǎn)率（T/R）Trolley手推車“T”“U”Unload載出Up向上Update更新資料Uniformity均勻度“V”V.L.S.I超大型積體電路Vacuum真空19PreparedbyMFGTrainingCenter“W”WAT晶圓測試Wafer晶圓WaferStart晶片投入WIP在制品WetBench酸槽Well井區(qū)W(Tungsten)鎢WPH

每小時(shí)機(jī)臺(tái)產(chǎn)出晶片數(shù)

Wait等待Warning警告Wiper無塵布“Y”Yield良率20PreparedbyMFGTrainingCenterConfidential工作區(qū)常用詞匯DIFFArea（擴(kuò)散區(qū)）單字解釋單字解釋PadOxide墊氧化層GateOxide閘氧化層FieldOxide場氧化層Density密化BPSG含硼及磷的硅化物BacksideEtch背面蝕刻Anneal回火Nitride(Si3N4)氮化硅Furnace爐管Alloy融合：電壓與電流成線性關(guān)系，降低接觸的阻值TEOS四乙基氧化硅：在IC里通常當(dāng)作絕緣曾使用21PreparedbyMFGTrainingCenterETCHArea（蝕刻區(qū)）單字解釋單字解釋AEI蝕科后檢查UnderEtch蝕刻不足ASI光阻去除后檢查MetalVia金屬接觸窗ContactHole接觸窗OverEtch過蝕刻Descum預(yù)處理Plasma電漿DryClean干洗Season暖機(jī)SEM掃描式電子顯微鏡Selectivity選擇比EndPoint蝕刻終點(diǎn)Electrode電極22PreparedbyMFGTrainingCenterConfidentialIMPLANTArea（植入?yún)^(qū)）單字解釋單字解釋A.M.U原子質(zhì)量數(shù)High-Current高電流Angle角度High-Energy高能量Beam-Current電子束電流Mid-Current中電流Depth深度Magnet磁場Dose劑量Source-Head離子源High-Voltage高壓23PreparedbyMFGTrainingCenterConfidentialPHOTOArea（黃光區(qū)）單字解釋單字解釋ADIAfterdevelopinspection顯影后檢視Exhaust排氣（將管路中的空氣排除）Alignment排成一直線，對(duì)平Exposure曝光Break中斷，stepper機(jī)臺(tái)內(nèi)中途停止鍵H.M.D.SHexamethyldisilazane,經(jīng)去水烘烤的晶片，將涂上一層增加光阻與晶片表面附著力的化合物，稱H.M.D.SBackside晶片背面Finished完成，貨已執(zhí)行完成24PreparedbyMFGTrainingCenterConfidentialPHOTOArea（黃光區(qū)）單字解釋單字解釋Coating涂布，光阻覆蓋Execute執(zhí)行Coater光阻覆蓋（機(jī)臺(tái)）Flatness平坦度Developer顯影液；顯影（機(jī)臺(tái)）Focus焦距Development顯影Local當(dāng)?shù)氐模镜氐腄iagnosis診斷，診斷結(jié)果，stepper機(jī)臺(tái)執(zhí)行測機(jī)時(shí)之按鍵Localdefocus局部失焦因機(jī)臺(tái)或晶片造成之臟污25PreparedbyMFGTrainingCenterConfidentialPHOTOArea（黃光區(qū)）單字解釋單字解釋Dose曝光量Lamp燈Offset彌補(bǔ)Overflow溢出Overlay測量前層與本層之間曝光的準(zhǔn)確度Spin旋轉(zhuǎn)SpinDry旋干P.R.Photoresisit