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Page:

PAGE

10

/26

RECORDOFREVISION

Rev

Date

Item

Page

Comment

B

26/AUG/02

11.2.3,

11.3

21-22

Change:11.2.3InspectionParameters.

Add:11.3SamplingCondition.

26/AUG/02

13

23

NewmodelnumberingsystemupdatefromoldP/N#CM1621S1LY-J2

GENERALSPECIFICATION

DisyFormat:

16characters(W)

2lines(H)

CharacterSize:

4.84(W)

8.06(H)

mm

ViewArea:

99(W)

24(H)

mm

GeneralDimensions:

122(W)

44(H)

14.5(T)mmMax.

Weight:

76gmax.

LCDType:

STNGray

V

STNYellow

FSTN

Polarizermode:

Reflective

V

Transflective

Transmissive

Negative

ViewAngle:

V

6O’clock

12O’clock

Others

Backlight:

V

LED

EL

CCFL

BacklightColor:

V

Yellowgreen

Amber

BlueGreen

White

Others

Controller/Driver: KS0066

TemperatureRange:

Normal

V

Operating0to50CStorage -20to70C

WideTemperatureOperating-20to70CStorage -30to80C

ABSOLUTEUMRATINGS

ELECTRICALABSOLUTEUMRATINGS

VSS=0V, Ta=25C

Item

Symbol

Min.

Max.

Unit

SupplyVoltage(Logic)

Vdd-Vss

0

7

V

SupplyVoltage(LCDDriver)

Vdd-Vee

1.5

13.5

V

InputVoltage

Vi

Vss

Vdd

V

OperatingTemperature

Top

0

50

C

StorageTemperature

Tstg

-20

70

C

ENVIRONMENTALABSOLUTEUMRATINGS

Item

Operating

Storage

Comment

(Min.)

Max.)

(Min.)

(Max.)

AmbientTemp

0

50

-20

70

Note(1)

Humidity

Note(2)

Note(2)

WithoutCondensation

Vibration

--

4.9M/S2

--

19.6M/S2

XYZDirection

Shock

--

29.4M/S2

--

490M/S2

XYZDirection

Note(1) Ta

= 0C:

50HrMax.

Note(2) Ta

40C:

90%RHMax.

Ta

40C:

Absolutehumiditymustbelowerthanthehumidity

of90%RHat40C.

ElectronicStaticDischargeumrating

ESDtestmethod:IEC1000-4-2

Item

Description

Testingenvironment

Ambienttemperature:15Cto35CHumidity:30%to60%

LCM(E.U.T):Powerup

Testingequipment

Manufacture:NoiseKen,ModelNo.ESD-100L

Testingcondition

Seedrawing1

Directdischarge

0to6KV

Dischargepoint,seedrawing2

Indirectdischarge

0to12KV

Dischargepoint,seedrawing1

Passcondition

Nomalfunctionofunit.Temporarymalfunctionofunitwhich

canberecoveredbysystemreset

Failcondition

Non.RecoverablemalfunctionofLCMorsystem

FIG1ESDTESTINGEQUIPMENT

DIRECTDISCHARGE

VCPINDIRECTDISCHARGE

HCPINDIRECTDISCHARGE

HCP

ISOLATOR

ESDPOWERSUPPLY

470k

GROUNDLEVEL

WOODENTABLE(TALL0.8m)

(1)

DIRECTCONTACTDISCHARGE

CONTACTPOINT:A.B.C.D

C

D

A

B

(2)

ELECTRICALCHARACTERISTICS

Item

Symbol

Condition

Min.

Typ.

Max.

Unit

SupplyVoltage(Logic)

Vdd-Vss

2.7

5.0

5.5

V

SupplyVoltage(LCD)

Vdd-Vee

0C

4.3

4.7

4.9

V

25C

4.2

4.5

4.8

50C

3.6

3.9

4.3

InputVoltage

Vih

--

0.7VDD

--

Vdd

V

Vil

Vss

--

0.3VDD

LogicSupplyCurrent

Idd

VDD-VSS=5V

--

2.0

--

mA

ELECTRO-OPTICALCHARACTERISTICS

ITEM

Symbol

Condition

Min.

Typ.

Max.

Unit

Ref.

RiseTime

Tr

0C

--

1100

1800

ms

Note(1)

25C

420

670

FallTime

Tf

0C

--

210

340

ms

25C

100

300

Contrast

CR

25C

--

6

--

Note(3)

ViewAngle

1~2

1,2

25C&CR≧2

--

80

--

Note(2)

--

30

--

FrameFrequency

Ff

25C

--

64

--

Hz

Note(1)&(2):Seenextpage

Note(3):Contrastrationisdefinedunderthefollowingcondition:

CR=Brightnessofnon-selectedcondition Brightnessofselectedcondition

(a). Temperature 25C

(b). Framefrequency 64Hz

(c). Viewingangle=0, =0(d). Operatingvoltage4.5V

Note(1) ResponsetimeismeasuredastheshortestperiodoftimepossiblebetweenthechangeinstateofanLCDsegmentasdemonstratedbelow:

+Vop

1/fF

-Vop

90%

100%

10%

tr

tf

0

Condition:

(a). Temperature 25C

(b). Framefrequency 64Hz

(c). ViewAngle =0,=0

(d). Operatingvoltage --4.5V

Note(2) DefinitionofViewAngle

Top–Bottomdirection Right--Leftdirection

Top

1

2

2

1

Bottom Left Right

LEDELECTRO-OPTICALCHARACTERISTIC

Ta=25C

Item

Symbol

Condition

Min.

Typ.

Max.

Unit

ForwardVoltage

Vf

IF=280mA

YellowGreen

--

4.2

4.6

V

LuminousIntensity

Iv

IF=280mA

YellowGreen

70

140

--

cd/m2

PeakEmission

P

IF=280mA

YellowGreen

--

570

--

nm

SpectrumRadiation

IF=280mA

YellowGreen

--

30

--

nm

ReverseCurrent

IR

VR=8V

YellowGreen

--

--

0.2

mA

Note:MeasuredatthebaredLEDbacklightunit.

LEDUMOPERATINGRANGE

Item

Symbol

YellowGreen

Unit

PowerDissipation

Pad

1.8

W

ForwardCurrent

Iaf

420

mA

ReverseVoltage

VR

8

V

LEDARRAYBLOCKDIAGRAM

A

2DiesX28=56

K

LEDPOWERSOURCE

LED

Option

Powersource

Jumpersetting

A

VDD/VSS

J1,J3,R9

B

15K/16A

J2,J5,J7

C

A/K

NONE

Nil

15A/16K

J2,J4,J6

GND

BZLGND

J8

FRMGND

J9

TIMINGCHARACTERISTICS

WRITETIMING

ACcharacteristics(VDD=4.5v~5.5v,Ta=-30~85C)

Item

Symbol

Condition

Min.

Max.

Unit

Ecycletime

tc

VDD=5V

500

--

ns

Epulsewidth(highlevel)

tw

230

--

Erise/falltime

tR,tF

--

20

R/WandRSSetuptime

tsu1

40

--

R/WandRSHoldtime

tH1

10

--

Datasetuptime

tsu2

80

--

Dataholdtime

tH2

10

--

ACcharacteristics(VDD=2.7v~4.5v,Ta=-30~85C)

Item

Symbol

Condition

Min.

Max.

Unit

Ecycletime

tc

VDD=3V

1000

--

ns

Epulsewidth(highlevel)

tw

450

--

Erise/falltime

tR,tF

--

25

R/WandRSSetuptime

tsu1

60

--

R/WandRSHoldtime

tH1

20

--

Datasetuptime

tsu2

195

--

Dataholdtime

tH2

10

--

Vih1

Vih1

Vil1

Vil1

tSu1

th1

Vil1

Vil1

tW

th1

tf

Vil1

Vih1

Vih1

Vil1

Vil1

tf

tsu2

th2

Vih1

Vih1

Validdata

Vil1

Vil1

tC

RS

R/W

E

DB0

toDB7

READTIMING

ACcharacteristics(VDD=4.5v~5.5v,Ta=-30~85C)

Item

Symbol

Condition

Min.

Max.

Unit

Ecycletime

tc

VDD=5V

500

--

ns

Epulsewidth(highlevel)

tw

230

--

Erise/falltime

tR,tF

--

20

R/WandRSshetuptime

tsu

40

--

R/WandRSholdtime

tH

10

--

Dataoutputdelaytime

tD

--

120

Dataholdtime

tDH

5

--

ACcharacteristics(VDD=2.7v~4.5v,Ta=-30~85C)

Item

Symbol

Condition

Min.

Max.

Unit

Ecycletime

tc

VDD=3V

1000

--

ns

Epulsewidth(highlevel)

tw

450

--

Erise/falltime

tR,tF

--

25

R/WandRSsetuptime

tsu

60

--

R/WandRSholdtime

tH

20

--

Dataoutputdelaytime

tD

--

Dataholdtime

tDH

5

--

Vih1

Vih1

Vil1

Vil1

tSU

tH

Vih1

Vih1

tw

tH

tF

Vih1Vil1

tR

Vih1

Vil1

tH

Vil1

tDH

tD

Vih1

Vih1

Validdata

Vil1

Vil1

tc

RS

R/W

E

DB0

ToDB7

PINCONNECTIONS

No.

Symbol

Function

1

VSS

Ground,0V

2

VDD

Logicpowersupply,+5V

3

VEE

VoltageforLCDdrive

4

RS

Data/Instructionregisterselect

5

R/W

Read/Write

6

E

Enablesignal,startdataread/write

7

DB0

DataBusLine

8

DB1

9

DB2

10

DB3

11

DB4

12

DB5

13

DB6

14

DB7

15

LEDA

LEDAnode,powersupply+

16

LEDK

LEDCathode,ground0V

POWERSUPPLY

LEDALEDK

Vee

Vss

Vdd

+5V

VR

+5.0V

VR=10K

BLOCKDIAGRAM

Com16

ControlLSI

Seg40

LCD

Driver

LCD

16characters2line

VSS

VDDVEERS

R/WE

DB0DB7

Seg40

Page:

PAGE

13

/26

INSTRUCTIONS

Instruction

InstructionCode

DESCRIPTION

ExecutedTime(fosc

=270KHz)

RS

R/W

DB7

DB6

DB5

DB4

DB3

DB2

DB1

DB0

ClearDisy

0

0

0

0

0

0

0

0

0

1

Write“20H”toDDRAMandsetDDRAMaddressto“00H”fromAC

1.53mS

CursorAtHome

0

0

0

0

0

0

0

0

1

-

SetDDRAMaddressto“00H”fromACandreturncursortoitsoriginalPositionifshifted.

ThecontentsofDDRAMarenotchanged.

1.53mS

EntryModeSet

0

0

0

0

0

0

0

1

I/D

SH

Assigncursormovingdirectionandenabletheshiftofentiredisy.

39S

DisyOn/OffControl

0

0

0

0

0

0

1

D

C

B

Setdisy(D),cursor(C),andBlinkingofcursor(B)ON/OFFcontrolbit.

39S

CursororDisy

Shift

0

0

0

0

0

1

S/C

R/L

-

-

Setcursormovinganddisyshiftscursorbit,andthedirection,without

changingofDDRAMdata.

39S

FunctionSet

0

0

0

0

1

DL

N

F

-

-

Setsinterfacedatalength

(DL:8-BIT/4-BIT),numberofdis y

lines(N:2-line/1-line)and,dis yfonttype(F:5x11dots/5x8dots).

39S

SetCGRAM

Address

0

0

0

1

AC5

AC4

AC3

AC2

AC1

AC0

SetCGRAMaddressinaddresscounter.

39S

SetDDRAM

Address

0

0

1

AC6

AC5

AC4

AC3

AC2

AC1

AC0

SetDDRAMaddressinaddresscounter.

39S

ReadBusyFlagandAddress

0

1

BF

AC6

AC5

AC4

AC3

AC2

AC1

AC0

WhetherduringinternaloperationornotcanbeknownbyreadingBF.

Thecontentsofaddresscountercanalsoberead.

0S

WriteDatatoRAM

1

0

D7

D6

D5

D4

D3

D2

D1

D0

WritedataintointernalRAM(DDRAM/CGRAM)

43S

ReadDatafromRAM

1

1

D7

D6

D5

D4

D3

D2

D1

D0

ReadsdatafrominternalRAM(DDRAM/CGRAM).

43S

*"-":don’tcare

NOTE:WhenanMPUprogramwithcheckingtheBusyFlag(DB7)ismade,itmustbenecessary1/2Foscisnecessaryforexecutingthenextinstructionbythefallingedgeofthe‘E’signalaftertheBusyFlag(DB7)goesto“LOW”.

8-BitOperation,8-Digit2-LineDisyExample

Step

Instruction

No

RS

R/W

DB7

DB6

DB5

DB4

DB3

DB2

DB1

DB0

Disy

Operation

1

Powersupplyon(theICisinitializedbytheInternalresetcircuit)

Initialized.Nodisy.

2

Functionset

0 0 0 0 1 1 1 0

Setsto8-bitoperationandselects2-linedisyand

58dotcharacterfont.

3

Disyon/offcontrol

0 0 0 0 0 0 1 1 1 0

Turnsondisyandcursor.Alldisyisinspacemodebecauseofinitialization.

4

Entrymodeset

0 0 0 0 0 0 0 1 1 0

SetsmodetoincrementtheaddressbyoneandtoshiftthecursortotherightatthetimeofwritetotheDD/CGRAM.

Disyisnotshifted.

5

WritedatatoCGRAM/DDRAM

1 0 0 1 0 0 1 0 0 0

H

WritesH.DDRAMhasalreadybeenselectedbyinitializationwhenthepowerwasturnedon.Thecursorisincremented

byoneandshiftedtotheright

6

.

.

7

WritedatatoCGRAM/DDRAM

1 0 0 1 0 0 1 0 0 1

HITACHI

WritesI.

8

SetDDRAMaddress

0 0 1 1 0 0 0 0 0 0

HITACHI

SetsDDRAMaddresssothatt

Thecursorispositionedatthe

Headofthesecondlime.

9

WritedatatoCGRAM/DDRAM

1 0 0 1 0 0 1 1 0 1

HITACHIM

WritesM.

10

.

.

11

WritedatatoCGRAM/DDRAM

1 0 0 1 0 0 1 1 1 1

HITACHIMICROCO

WritesO.

12

Entrymodeset

0 0 0 0 0 0 0 1 1 1

HITACHIMICROCO

Setsmodetoshiftdisyatthetimeofwrite.

WritedatatoCGRAM/DDRAM

1

ITACHI

WritesM.Disyisshiftedtotheleft.Thefirstandsecondlinesbothshiftatthesame

time.

14

.

.

Returnhome

0

HITACHI

Returnsbothdisyandcursortotheoriginalposition

(address0).

InterfacingtotheMPU

TheICcansenddataineithertwo4-bitoperations,thusallowinginterfacingwith4-or8-bitMPUs.

For4-bitinterfacedata,onlyfourbuslines(DB4toDB7)areusedfortransfer.BuslinesDB0toDB3aredisabled.ThedatatransferbetweentheICandtheMPUiscompletedafterthe4-bitdatahasbeentransferredtwice.Asfortheorderofdatatransfer,thefourhighorderbits(for8-bitoperation,DB4toDB7)aretransferredbeforethefourloworderbits(for8-bitoperation,DB0toDB3).

Thebusyflagmustbechecked(oneinstruction)afterthe4-bitdatahasbeentransferredtwice.Twomore4-bitoperationsthentransferthebusyflagandaddresscounterdata.

RS

R/WE

DB7

IR7

IR3

BF

AC3

DR7

DR3

DB6

IR6

IR2

AC6

AC2

DR6

DR2

DB5

IR5

IR1

AC5

AC1

DR5

DR1

DB4

IR4

IR0

AC4

AC0

DR4

DR0

Instructionregister(IR)write

Busyflag(BF)andAddresscounter(AC)read

Dataregister(DR)read

4-BitTransferExample

1-LineDis y

00

01

02

03

04

05

06

07

40

41

42

43

44

45

46

47

Dis y

position

DDRAM

Address(hexadecimal)

1 2

3 4 5 6 7 8 9 10111213141516

161–Line

00

01

02

03

04

26

27

40

41

42

43

44

66

67

2-LineDisy

Disy

position 1 2 3 4 5 8162024 39 40

DDRAM

Address(hexadecimal)

82–Line

162–Line202–Line

242–Line

4-LineDisy

Disyposition

1

2

3

15

16

DDRAM

Address(hexadecimal)

00

01

02

0E

0F

40

41

42

4E

4F

14

15

16

1E

1F

54

55

56

5E

5F

164Line

Disyposition

1

2

3

19

20

DDRAM

Address(hexadecimal)

00

01

02

12

13

40

41

42

52

53

14

15

16

26

27

54

55

56

66

67

204Line

Page:

PAGE

17

/26

CGRAM

RelationshipbetweenCGRAMAddresses,CharacterCodes(DDRAM)andPatterns(CGRAMData)

CharacterCodes(DDRAMdata)

CGRAMAddress

CharacterPatterns(CGRAMdata)

76543210

High Low

543210

High Low

76543210

High Low

0

0

0

1

1

1

1

0

0

0

1

1

0

0

0

1

0

1

0

1

0

0

0

1

0000000

000

0

1

1

1

1

1

1

0

1

0

0

1

0

1

0

0

1

0

1

1

0

0

1

0

1

1

0

1

0

0

0

1

1

1

1

0

0

0

0

0

0

0

0

1

0

0

0

1

0

0

1

0

1

0

1

0

0

1

0

1

1

1

1

1

0000001

001

0

1

1

0

0

1

0

0

1

0

0

1

1

1

1

1

1

0

1

0

0

1

0

0

1

1

0

0

0

1

0

0

1

1

1

0

0

0

0

0

0

0

0

0

0

1

For58dotcharacterpatterns

CharacterPattern(1)

Cursorposition

CharacterPattern(2)

Cursorposition

0000111

111

1

0

0

1

0

1

1

1

0

1

1

1

Notes1.Charactercodebits0to2correspondtoCGRAMaddressbits3to5(3bits:8types).

CGRAMaddressbits0to2designatethecharacterpatternlineposition.The8thlineisthecursorpositionanditsdisyisformedbyalogicalORwiththecursor.Maintainthe8thlinedata,correspondingtothecursordisyposition,at0asthecursordisy.

Ifthe8thlinedatais1,1bitswilllightupthe8thlineregardlessofthecursorpresence.

CharacterpatternrowpositionscorrespondtoCGRAMdatabits0to4(bit4beingattheleft).

AsshownTable5,CGRAMcharacterpatternsareselectedwhencharactercodebits

4to7areall0.However,sincecharactercodebit3hasnoeffect,theRdisyexampleabovecanbeselectedbyeithercharactercode00Hor08H.

1forCGRAMd orrespondstodisyselectionand0tonon-selection.

Indicatesnoeffect.

Page:

PAGE

18

/26

CorrespondencebetweenCharacterCodesandCharacterPatterns(ROMCode:A00)

Page:

PAGE

19

/26

QUALITYASSURANCE

TestCondition

TemperatureandHumidity(AmbientTemperature)Temperature : 205C

Humidity : 655%

Operation

Unlessspecifiedotherwise,testwillbeconductedunderfunctionstate.

Container

Unlessspecifiedotherwise,vibrationtestwillbeconductedtotheproductitselfwithoutputtingitinacontainer.

TestFrequency

Incaseofrelatedtodeteriorationsuchasshocktest. Itwillbeconductedonlyonce.

TestMethod

No.

Parameter

Conditions

Regulations

1

HighTemperatureOperating

502C

Note3

2

LowTemperatureOperating

02C

Note3

3

HighTemperatureStorage

702C

Note3

4

LowTemperatureStorage

-202C

Note3

5

VibrationTest

(Non-operationstate)

Totalfixedamplitude:1.5mmVibrationFrequency:10~55HzOnecycle60secondsto3directions

ofX.Y.Z.foreach15minutes

Note3

6

DampProofTest(Non-operationstate)

40C2C,90~95%RH,96h

Note1,2

7

ShockTest

(Non-operationstate)

Tobemeasuredafterdropfrom60cmhighonceconcretesurfaceinpackingstate

Note3

Note1:Returnedundernormaltemperatureandhumidityfor4hrs.Note2:Nodewcondensationtobeobserved.

Note3:Nochangeondisyandinoperationunderthetestcondition

Page:

PAGE

20

/26

Inspectioncondition

Inspectionconditions

TheLCDshallbeinspectedunder40Wwhitefluorescentlight.

45

DefinitionofapplicableZones

B

A

LCD

BEZELPCB

A:DisyArea

B:Non-DisyArea

Zone

X(mm)Y(mm)

Acceptablenumber

Class

OfDefects

AQL

Level

A

B

0.04W

Minor

2.5

3.0L

0.06W

4

4

2.0L

0.08W

2

3

0.1W

0

1

Zone

Dimension

Acceptablenumber

Classof

Defects

AQL

Level

A

B

D0.15

Minor

2.5

0.15D0.25

2

0.25D

0

1

Zone

Dimension

Acceptablenumber

ClassOfDefects

AQL

Level

A

B

D<0.15

Minor

2.5

0.15D<0.2

4

4

0.2D0.25

2

2

D0.3

0

1

InspectionParameters

No

. Parameter

Criteria

1

BlackorWhitespots

D=(Long+Short)/2 *:Disregard

2

Scratch,Substances

X:Length Y:Width :DisregardTotaldefectsshouldnotexceed4/module

3

AirBubbles

(betweenglass&polarizer)

:Disregard

Totaldefectsshallnotexcess3/module.

4

UniformityofPixel

(1)Pixelshape(withDent)

0.152

Page: 21/26

Page:

PAGE

22

/26

4

UniformityofPixel

Pixelshape(withProjection)

Shouldnotbeconnectedtonextpixel

0.152

Pinhole

X

Y

(X+Y)/20.02mm

(Lessthan0.1mmisnocounted)

Deformation

X(X+Y)/20.3mm

Y

Totalacceptablenumber:1/pixel,5/cell

Classofdefects

Major

AQL0.65%

Definition

Itisadefectthatislikelytoresultinfailureorto

reducemateriallytheusabilityoftheproductfortheintendedfunction.

AQL1.00%

Itisadefectthatislikelytoassemblysizeandnotresultinfunctioningproblem.

Minor

AQL2.5%

Itisadefectthatwillnotresultinfunctioningproblemwithdeviationclassified.

SamplingCondition

Unlessotherwiseagreeinwritten,thesamplinginspectionshallbeappliedtothe inginspectionofcustomer.

Lotsize:tyofshipmentlotpermodel.Samplingtype:normalinspection,singlesamplingInspectionlevel:LevelII

Samplingtable:MIL-STD-105E

LOTNUMBERINGSYSTEM

9

7

4

2

Productionweeknumber

LCMNUMBERINGSYSTEM

Productionyear

CM160200 S F A Y A–01

VERSION:01

MODE

Viewdirection&Temp.RangeA–Bottomview6H&Normaltemp.B–Bottomview6H&Widetemp.C–TopView&Normaltemp.

D–TopView&Widetemp.

BacklightColor

B–BlueW–WhiteY–Yellow

Backlight

S–edgelightLEDB/LE–EL

A–ArrayLEDB/L

M–transmissive R–ReflectiveF–transflective N-Negative

LCDtype

P–FSTNPaperwhiteF–FSTN

S–STNYellowG–STNGray

Seriescode

160200–16charactersX2lines;0LCDType,0PCBType

Modeltype

CM–CharacterModule

GM–GraphicModule

TG–SingleTABGraphicModuleTX–CustomSingleTABGraphicModule

PRECAUTIONFORUSINGLCM

LIQUIDCRYSTALDISY(LCD)

LCDismadeupofglass,organicsealant,organicfluid,andpolymerbasedpolarizers.Thefollowingprecautionsshouldbetakenwhenhanding,

Keepthetemperaturewithinrangeofuseandstorage.Excessivetemperatureandhumiditycouldcausepolarizationdegredation,polarizerpeelofforbubble.

DonotcontacttheexposedpolarizerswithanythingharderthananHBpencillead.Tocleandustoffthedisysurface,wipegentlywithcotton,chamoisorothersoftmaterialsoakedinpetroleumbenzin.

Wipeoffsalivaorwaterdropsimmediay.Contactwithwateroveralongperiodoftimemaycausepolarizerdeformationorcolorfading,whileanactiveLCDwithwatercondensationonitssurfacewillcausecorrosionofITOelectrodes.

Glasscanbeeasilychippedorcrackedfromroughhandling,especiallyatcornersandedges.

DonotdriveLCDwithDCvoltage.

LiquidCrystalDisyModules

MechanicalConsiderations

LCMareassembledandadjustedwithahighdegreeofprecision.Avoidexcessiveshocksanddonotmakeanyaltionsormodifications.Thefollowingshouldbenoted.

Donottamperinanywaywiththetabsonthemetalframe.

DonotmodifythePCBbydrillingextraholes,changingitsoutline,movingitscomponentsormodifyingitspattern.

Donottouchtheelastomerconnector,especiallyinsertanbacklightpanel(forexample,EL).

WhenmountingaLCMmakesurethatthePCBisnotunderanystresssuchasbendingortwisting.Elastomercontactsareverydelicateandmissingpixelscouldresultfromslightdislocationofanyoftheelements.

Avoidpressingonthemetalbezel,otherwisetheelastomerconnectorcouldbedeformedandlosecontact,resultinginmissingpixels.

2.2.StaticElectricity

LCMcontainsCMOSLSI’sandthesameprecautionforsuchdevicesshouldapply,namely

Theoperatorshouldbegroundedwheneverhe/shecomesintocontactwiththemodule.NevertouchanyoftheconductivepartssuchastheLSIpads,thecopperleadsonthePCBandtheinterfaceterminalswithanypartsofthehumanbody.

Themodules

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