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Page:
PAGE
10
/26
RECORDOFREVISION
Rev
Date
Item
Page
Comment
B
26/AUG/02
11.2.3,
11.3
21-22
Change:11.2.3InspectionParameters.
Add:11.3SamplingCondition.
26/AUG/02
13
23
NewmodelnumberingsystemupdatefromoldP/N#CM1621S1LY-J2
GENERALSPECIFICATION
DisyFormat:
16characters(W)
2lines(H)
CharacterSize:
4.84(W)
8.06(H)
mm
ViewArea:
99(W)
24(H)
mm
GeneralDimensions:
122(W)
44(H)
14.5(T)mmMax.
Weight:
76gmax.
LCDType:
STNGray
V
STNYellow
FSTN
Polarizermode:
Reflective
V
Transflective
Transmissive
Negative
ViewAngle:
V
6O’clock
12O’clock
Others
Backlight:
V
LED
EL
CCFL
BacklightColor:
V
Yellowgreen
Amber
BlueGreen
White
Others
Controller/Driver: KS0066
TemperatureRange:
Normal
V
Operating0to50CStorage -20to70C
WideTemperatureOperating-20to70CStorage -30to80C
ABSOLUTEUMRATINGS
ELECTRICALABSOLUTEUMRATINGS
VSS=0V, Ta=25C
Item
Symbol
Min.
Max.
Unit
SupplyVoltage(Logic)
Vdd-Vss
0
7
V
SupplyVoltage(LCDDriver)
Vdd-Vee
1.5
13.5
V
InputVoltage
Vi
Vss
Vdd
V
OperatingTemperature
Top
0
50
C
StorageTemperature
Tstg
-20
70
C
ENVIRONMENTALABSOLUTEUMRATINGS
Item
Operating
Storage
Comment
(Min.)
Max.)
(Min.)
(Max.)
AmbientTemp
0
50
-20
70
Note(1)
Humidity
Note(2)
Note(2)
WithoutCondensation
Vibration
--
4.9M/S2
--
19.6M/S2
XYZDirection
Shock
--
29.4M/S2
--
490M/S2
XYZDirection
Note(1) Ta
= 0C:
50HrMax.
Note(2) Ta
40C:
90%RHMax.
Ta
40C:
Absolutehumiditymustbelowerthanthehumidity
of90%RHat40C.
ElectronicStaticDischargeumrating
ESDtestmethod:IEC1000-4-2
Item
Description
Testingenvironment
Ambienttemperature:15Cto35CHumidity:30%to60%
LCM(E.U.T):Powerup
Testingequipment
Manufacture:NoiseKen,ModelNo.ESD-100L
Testingcondition
Seedrawing1
Directdischarge
0to6KV
Dischargepoint,seedrawing2
Indirectdischarge
0to12KV
Dischargepoint,seedrawing1
Passcondition
Nomalfunctionofunit.Temporarymalfunctionofunitwhich
canberecoveredbysystemreset
Failcondition
Non.RecoverablemalfunctionofLCMorsystem
FIG1ESDTESTINGEQUIPMENT
DIRECTDISCHARGE
VCPINDIRECTDISCHARGE
HCPINDIRECTDISCHARGE
HCP
ISOLATOR
ESDPOWERSUPPLY
470k
GROUNDLEVEL
WOODENTABLE(TALL0.8m)
(1)
DIRECTCONTACTDISCHARGE
CONTACTPOINT:A.B.C.D
C
D
A
B
(2)
ELECTRICALCHARACTERISTICS
Item
Symbol
Condition
Min.
Typ.
Max.
Unit
SupplyVoltage(Logic)
Vdd-Vss
2.7
5.0
5.5
V
SupplyVoltage(LCD)
Vdd-Vee
0C
4.3
4.7
4.9
V
25C
4.2
4.5
4.8
50C
3.6
3.9
4.3
InputVoltage
Vih
--
0.7VDD
--
Vdd
V
Vil
Vss
--
0.3VDD
LogicSupplyCurrent
Idd
VDD-VSS=5V
--
2.0
--
mA
ELECTRO-OPTICALCHARACTERISTICS
ITEM
Symbol
Condition
Min.
Typ.
Max.
Unit
Ref.
RiseTime
Tr
0C
--
1100
1800
ms
Note(1)
25C
420
670
FallTime
Tf
0C
--
210
340
ms
25C
100
300
Contrast
CR
25C
--
6
--
Note(3)
ViewAngle
1~2
1,2
25C&CR≧2
--
80
--
Note(2)
--
30
--
FrameFrequency
Ff
25C
--
64
--
Hz
Note(1)&(2):Seenextpage
Note(3):Contrastrationisdefinedunderthefollowingcondition:
CR=Brightnessofnon-selectedcondition Brightnessofselectedcondition
(a). Temperature 25C
(b). Framefrequency 64Hz
(c). Viewingangle=0, =0(d). Operatingvoltage4.5V
Note(1) ResponsetimeismeasuredastheshortestperiodoftimepossiblebetweenthechangeinstateofanLCDsegmentasdemonstratedbelow:
+Vop
1/fF
-Vop
90%
100%
10%
tr
tf
0
Condition:
(a). Temperature 25C
(b). Framefrequency 64Hz
(c). ViewAngle =0,=0
(d). Operatingvoltage --4.5V
Note(2) DefinitionofViewAngle
Top–Bottomdirection Right--Leftdirection
Top
1
2
2
1
Bottom Left Right
LEDELECTRO-OPTICALCHARACTERISTIC
Ta=25C
Item
Symbol
Condition
Min.
Typ.
Max.
Unit
ForwardVoltage
Vf
IF=280mA
YellowGreen
--
4.2
4.6
V
LuminousIntensity
Iv
IF=280mA
YellowGreen
70
140
--
cd/m2
PeakEmission
P
IF=280mA
YellowGreen
--
570
--
nm
SpectrumRadiation
IF=280mA
YellowGreen
--
30
--
nm
ReverseCurrent
IR
VR=8V
YellowGreen
--
--
0.2
mA
Note:MeasuredatthebaredLEDbacklightunit.
LEDUMOPERATINGRANGE
Item
Symbol
YellowGreen
Unit
PowerDissipation
Pad
1.8
W
ForwardCurrent
Iaf
420
mA
ReverseVoltage
VR
8
V
LEDARRAYBLOCKDIAGRAM
A
2DiesX28=56
K
LEDPOWERSOURCE
LED
Option
Powersource
Jumpersetting
A
VDD/VSS
J1,J3,R9
B
15K/16A
J2,J5,J7
C
A/K
NONE
Nil
15A/16K
J2,J4,J6
GND
BZLGND
J8
FRMGND
J9
TIMINGCHARACTERISTICS
WRITETIMING
ACcharacteristics(VDD=4.5v~5.5v,Ta=-30~85C)
Item
Symbol
Condition
Min.
Max.
Unit
Ecycletime
tc
VDD=5V
500
--
ns
Epulsewidth(highlevel)
tw
230
--
Erise/falltime
tR,tF
--
20
R/WandRSSetuptime
tsu1
40
--
R/WandRSHoldtime
tH1
10
--
Datasetuptime
tsu2
80
--
Dataholdtime
tH2
10
--
ACcharacteristics(VDD=2.7v~4.5v,Ta=-30~85C)
Item
Symbol
Condition
Min.
Max.
Unit
Ecycletime
tc
VDD=3V
1000
--
ns
Epulsewidth(highlevel)
tw
450
--
Erise/falltime
tR,tF
--
25
R/WandRSSetuptime
tsu1
60
--
R/WandRSHoldtime
tH1
20
--
Datasetuptime
tsu2
195
--
Dataholdtime
tH2
10
--
Vih1
Vih1
Vil1
Vil1
tSu1
th1
Vil1
Vil1
tW
th1
tf
Vil1
Vih1
Vih1
Vil1
Vil1
tf
tsu2
th2
Vih1
Vih1
Validdata
Vil1
Vil1
tC
RS
R/W
E
DB0
toDB7
READTIMING
ACcharacteristics(VDD=4.5v~5.5v,Ta=-30~85C)
Item
Symbol
Condition
Min.
Max.
Unit
Ecycletime
tc
VDD=5V
500
--
ns
Epulsewidth(highlevel)
tw
230
--
Erise/falltime
tR,tF
--
20
R/WandRSshetuptime
tsu
40
--
R/WandRSholdtime
tH
10
--
Dataoutputdelaytime
tD
--
120
Dataholdtime
tDH
5
--
ACcharacteristics(VDD=2.7v~4.5v,Ta=-30~85C)
Item
Symbol
Condition
Min.
Max.
Unit
Ecycletime
tc
VDD=3V
1000
--
ns
Epulsewidth(highlevel)
tw
450
--
Erise/falltime
tR,tF
--
25
R/WandRSsetuptime
tsu
60
--
R/WandRSholdtime
tH
20
--
Dataoutputdelaytime
tD
--
Dataholdtime
tDH
5
--
Vih1
Vih1
Vil1
Vil1
tSU
tH
Vih1
Vih1
tw
tH
tF
Vih1Vil1
tR
Vih1
Vil1
tH
Vil1
tDH
tD
Vih1
Vih1
Validdata
Vil1
Vil1
tc
RS
R/W
E
DB0
ToDB7
PINCONNECTIONS
No.
Symbol
Function
1
VSS
Ground,0V
2
VDD
Logicpowersupply,+5V
3
VEE
VoltageforLCDdrive
4
RS
Data/Instructionregisterselect
5
R/W
Read/Write
6
E
Enablesignal,startdataread/write
7
DB0
DataBusLine
8
DB1
9
DB2
10
DB3
11
DB4
12
DB5
13
DB6
14
DB7
15
LEDA
LEDAnode,powersupply+
16
LEDK
LEDCathode,ground0V
POWERSUPPLY
LEDALEDK
Vee
Vss
Vdd
+5V
VR
+5.0V
VR=10K
BLOCKDIAGRAM
Com16
ControlLSI
Seg40
LCD
Driver
LCD
16characters2line
VSS
VDDVEERS
R/WE
DB0DB7
Seg40
Page:
PAGE
13
/26
INSTRUCTIONS
Instruction
InstructionCode
DESCRIPTION
ExecutedTime(fosc
=270KHz)
RS
R/W
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
ClearDisy
0
0
0
0
0
0
0
0
0
1
Write“20H”toDDRAMandsetDDRAMaddressto“00H”fromAC
1.53mS
CursorAtHome
0
0
0
0
0
0
0
0
1
-
SetDDRAMaddressto“00H”fromACandreturncursortoitsoriginalPositionifshifted.
ThecontentsofDDRAMarenotchanged.
1.53mS
EntryModeSet
0
0
0
0
0
0
0
1
I/D
SH
Assigncursormovingdirectionandenabletheshiftofentiredisy.
39S
DisyOn/OffControl
0
0
0
0
0
0
1
D
C
B
Setdisy(D),cursor(C),andBlinkingofcursor(B)ON/OFFcontrolbit.
39S
CursororDisy
Shift
0
0
0
0
0
1
S/C
R/L
-
-
Setcursormovinganddisyshiftscursorbit,andthedirection,without
changingofDDRAMdata.
39S
FunctionSet
0
0
0
0
1
DL
N
F
-
-
Setsinterfacedatalength
(DL:8-BIT/4-BIT),numberofdis y
lines(N:2-line/1-line)and,dis yfonttype(F:5x11dots/5x8dots).
39S
SetCGRAM
Address
0
0
0
1
AC5
AC4
AC3
AC2
AC1
AC0
SetCGRAMaddressinaddresscounter.
39S
SetDDRAM
Address
0
0
1
AC6
AC5
AC4
AC3
AC2
AC1
AC0
SetDDRAMaddressinaddresscounter.
39S
ReadBusyFlagandAddress
0
1
BF
AC6
AC5
AC4
AC3
AC2
AC1
AC0
WhetherduringinternaloperationornotcanbeknownbyreadingBF.
Thecontentsofaddresscountercanalsoberead.
0S
WriteDatatoRAM
1
0
D7
D6
D5
D4
D3
D2
D1
D0
WritedataintointernalRAM(DDRAM/CGRAM)
43S
ReadDatafromRAM
1
1
D7
D6
D5
D4
D3
D2
D1
D0
ReadsdatafrominternalRAM(DDRAM/CGRAM).
43S
*"-":don’tcare
NOTE:WhenanMPUprogramwithcheckingtheBusyFlag(DB7)ismade,itmustbenecessary1/2Foscisnecessaryforexecutingthenextinstructionbythefallingedgeofthe‘E’signalaftertheBusyFlag(DB7)goesto“LOW”.
8-BitOperation,8-Digit2-LineDisyExample
Step
Instruction
No
RS
R/W
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
Disy
Operation
1
Powersupplyon(theICisinitializedbytheInternalresetcircuit)
Initialized.Nodisy.
2
Functionset
0 0 0 0 1 1 1 0
Setsto8-bitoperationandselects2-linedisyand
58dotcharacterfont.
3
Disyon/offcontrol
0 0 0 0 0 0 1 1 1 0
Turnsondisyandcursor.Alldisyisinspacemodebecauseofinitialization.
4
Entrymodeset
0 0 0 0 0 0 0 1 1 0
SetsmodetoincrementtheaddressbyoneandtoshiftthecursortotherightatthetimeofwritetotheDD/CGRAM.
Disyisnotshifted.
5
WritedatatoCGRAM/DDRAM
1 0 0 1 0 0 1 0 0 0
H
WritesH.DDRAMhasalreadybeenselectedbyinitializationwhenthepowerwasturnedon.Thecursorisincremented
byoneandshiftedtotheright
6
.
.
7
WritedatatoCGRAM/DDRAM
1 0 0 1 0 0 1 0 0 1
HITACHI
WritesI.
8
SetDDRAMaddress
0 0 1 1 0 0 0 0 0 0
HITACHI
SetsDDRAMaddresssothatt
Thecursorispositionedatthe
Headofthesecondlime.
9
WritedatatoCGRAM/DDRAM
1 0 0 1 0 0 1 1 0 1
HITACHIM
WritesM.
10
.
.
11
WritedatatoCGRAM/DDRAM
1 0 0 1 0 0 1 1 1 1
HITACHIMICROCO
WritesO.
12
Entrymodeset
0 0 0 0 0 0 0 1 1 1
HITACHIMICROCO
Setsmodetoshiftdisyatthetimeofwrite.
WritedatatoCGRAM/DDRAM
1
ITACHI
WritesM.Disyisshiftedtotheleft.Thefirstandsecondlinesbothshiftatthesame
time.
14
.
.
Returnhome
0
HITACHI
Returnsbothdisyandcursortotheoriginalposition
(address0).
InterfacingtotheMPU
TheICcansenddataineithertwo4-bitoperations,thusallowinginterfacingwith4-or8-bitMPUs.
For4-bitinterfacedata,onlyfourbuslines(DB4toDB7)areusedfortransfer.BuslinesDB0toDB3aredisabled.ThedatatransferbetweentheICandtheMPUiscompletedafterthe4-bitdatahasbeentransferredtwice.Asfortheorderofdatatransfer,thefourhighorderbits(for8-bitoperation,DB4toDB7)aretransferredbeforethefourloworderbits(for8-bitoperation,DB0toDB3).
Thebusyflagmustbechecked(oneinstruction)afterthe4-bitdatahasbeentransferredtwice.Twomore4-bitoperationsthentransferthebusyflagandaddresscounterdata.
RS
R/WE
DB7
IR7
IR3
BF
AC3
DR7
DR3
DB6
IR6
IR2
AC6
AC2
DR6
DR2
DB5
IR5
IR1
AC5
AC1
DR5
DR1
DB4
IR4
IR0
AC4
AC0
DR4
DR0
Instructionregister(IR)write
Busyflag(BF)andAddresscounter(AC)read
Dataregister(DR)read
4-BitTransferExample
1-LineDis y
00
01
02
03
04
05
06
07
40
41
42
43
44
45
46
47
Dis y
position
DDRAM
Address(hexadecimal)
1 2
3 4 5 6 7 8 9 10111213141516
161–Line
00
01
02
03
04
26
27
40
41
42
43
44
66
67
2-LineDisy
Disy
position 1 2 3 4 5 8162024 39 40
DDRAM
Address(hexadecimal)
82–Line
162–Line202–Line
242–Line
4-LineDisy
Disyposition
1
2
3
15
16
DDRAM
Address(hexadecimal)
00
01
02
0E
0F
40
41
42
4E
4F
14
15
16
1E
1F
54
55
56
5E
5F
164Line
Disyposition
1
2
3
19
20
DDRAM
Address(hexadecimal)
00
01
02
12
13
40
41
42
52
53
14
15
16
26
27
54
55
56
66
67
204Line
Page:
PAGE
17
/26
CGRAM
RelationshipbetweenCGRAMAddresses,CharacterCodes(DDRAM)andPatterns(CGRAMData)
CharacterCodes(DDRAMdata)
CGRAMAddress
CharacterPatterns(CGRAMdata)
76543210
High Low
543210
High Low
76543210
High Low
0
0
0
1
1
1
1
0
0
0
1
1
0
0
0
1
0
1
0
1
0
0
0
1
0000000
000
0
1
1
1
1
1
1
0
1
0
0
1
0
1
0
0
1
0
1
1
0
0
1
0
1
1
0
1
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
1
0
0
0
1
0
0
1
0
1
0
1
0
0
1
0
1
1
1
1
1
0000001
001
0
1
1
0
0
1
0
0
1
0
0
1
1
1
1
1
1
0
1
0
0
1
0
0
1
1
0
0
0
1
0
0
1
1
1
0
0
0
0
0
0
0
0
0
0
1
For58dotcharacterpatterns
CharacterPattern(1)
Cursorposition
CharacterPattern(2)
Cursorposition
0000111
111
1
0
0
1
0
1
1
1
0
1
1
1
Notes1.Charactercodebits0to2correspondtoCGRAMaddressbits3to5(3bits:8types).
CGRAMaddressbits0to2designatethecharacterpatternlineposition.The8thlineisthecursorpositionanditsdisyisformedbyalogicalORwiththecursor.Maintainthe8thlinedata,correspondingtothecursordisyposition,at0asthecursordisy.
Ifthe8thlinedatais1,1bitswilllightupthe8thlineregardlessofthecursorpresence.
CharacterpatternrowpositionscorrespondtoCGRAMdatabits0to4(bit4beingattheleft).
AsshownTable5,CGRAMcharacterpatternsareselectedwhencharactercodebits
4to7areall0.However,sincecharactercodebit3hasnoeffect,theRdisyexampleabovecanbeselectedbyeithercharactercode00Hor08H.
1forCGRAMd orrespondstodisyselectionand0tonon-selection.
Indicatesnoeffect.
Page:
PAGE
18
/26
CorrespondencebetweenCharacterCodesandCharacterPatterns(ROMCode:A00)
Page:
PAGE
19
/26
QUALITYASSURANCE
TestCondition
TemperatureandHumidity(AmbientTemperature)Temperature : 205C
Humidity : 655%
Operation
Unlessspecifiedotherwise,testwillbeconductedunderfunctionstate.
Container
Unlessspecifiedotherwise,vibrationtestwillbeconductedtotheproductitselfwithoutputtingitinacontainer.
TestFrequency
Incaseofrelatedtodeteriorationsuchasshocktest. Itwillbeconductedonlyonce.
TestMethod
No.
Parameter
Conditions
Regulations
1
HighTemperatureOperating
502C
Note3
2
LowTemperatureOperating
02C
Note3
3
HighTemperatureStorage
702C
Note3
4
LowTemperatureStorage
-202C
Note3
5
VibrationTest
(Non-operationstate)
Totalfixedamplitude:1.5mmVibrationFrequency:10~55HzOnecycle60secondsto3directions
ofX.Y.Z.foreach15minutes
Note3
6
DampProofTest(Non-operationstate)
40C2C,90~95%RH,96h
Note1,2
7
ShockTest
(Non-operationstate)
Tobemeasuredafterdropfrom60cmhighonceconcretesurfaceinpackingstate
Note3
Note1:Returnedundernormaltemperatureandhumidityfor4hrs.Note2:Nodewcondensationtobeobserved.
Note3:Nochangeondisyandinoperationunderthetestcondition
Page:
PAGE
20
/26
Inspectioncondition
Inspectionconditions
TheLCDshallbeinspectedunder40Wwhitefluorescentlight.
45
DefinitionofapplicableZones
B
A
LCD
BEZELPCB
A:DisyArea
B:Non-DisyArea
Zone
X(mm)Y(mm)
Acceptablenumber
Class
OfDefects
AQL
Level
A
B
0.04W
Minor
2.5
3.0L
0.06W
4
4
2.0L
0.08W
2
3
0.1W
0
1
Zone
Dimension
Acceptablenumber
Classof
Defects
AQL
Level
A
B
D0.15
Minor
2.5
0.15D0.25
2
0.25D
0
1
Zone
Dimension
Acceptablenumber
ClassOfDefects
AQL
Level
A
B
D<0.15
Minor
2.5
0.15D<0.2
4
4
0.2D0.25
2
2
D0.3
0
1
InspectionParameters
No
. Parameter
Criteria
1
BlackorWhitespots
D=(Long+Short)/2 *:Disregard
2
Scratch,Substances
X:Length Y:Width :DisregardTotaldefectsshouldnotexceed4/module
3
AirBubbles
(betweenglass&polarizer)
:Disregard
Totaldefectsshallnotexcess3/module.
4
UniformityofPixel
(1)Pixelshape(withDent)
0.152
Page: 21/26
Page:
PAGE
22
/26
4
UniformityofPixel
Pixelshape(withProjection)
Shouldnotbeconnectedtonextpixel
0.152
Pinhole
X
Y
(X+Y)/20.02mm
(Lessthan0.1mmisnocounted)
Deformation
X(X+Y)/20.3mm
Y
Totalacceptablenumber:1/pixel,5/cell
Classofdefects
Major
AQL0.65%
Definition
Itisadefectthatislikelytoresultinfailureorto
reducemateriallytheusabilityoftheproductfortheintendedfunction.
AQL1.00%
Itisadefectthatislikelytoassemblysizeandnotresultinfunctioningproblem.
Minor
AQL2.5%
Itisadefectthatwillnotresultinfunctioningproblemwithdeviationclassified.
SamplingCondition
Unlessotherwiseagreeinwritten,thesamplinginspectionshallbeappliedtothe inginspectionofcustomer.
Lotsize:tyofshipmentlotpermodel.Samplingtype:normalinspection,singlesamplingInspectionlevel:LevelII
Samplingtable:MIL-STD-105E
LOTNUMBERINGSYSTEM
9
7
4
2
Productionweeknumber
LCMNUMBERINGSYSTEM
Productionyear
CM160200 S F A Y A–01
VERSION:01
MODE
Viewdirection&Temp.RangeA–Bottomview6H&Normaltemp.B–Bottomview6H&Widetemp.C–TopView&Normaltemp.
D–TopView&Widetemp.
BacklightColor
B–BlueW–WhiteY–Yellow
Backlight
S–edgelightLEDB/LE–EL
A–ArrayLEDB/L
M–transmissive R–ReflectiveF–transflective N-Negative
LCDtype
P–FSTNPaperwhiteF–FSTN
S–STNYellowG–STNGray
Seriescode
160200–16charactersX2lines;0LCDType,0PCBType
Modeltype
CM–CharacterModule
GM–GraphicModule
TG–SingleTABGraphicModuleTX–CustomSingleTABGraphicModule
PRECAUTIONFORUSINGLCM
LIQUIDCRYSTALDISY(LCD)
LCDismadeupofglass,organicsealant,organicfluid,andpolymerbasedpolarizers.Thefollowingprecautionsshouldbetakenwhenhanding,
Keepthetemperaturewithinrangeofuseandstorage.Excessivetemperatureandhumiditycouldcausepolarizationdegredation,polarizerpeelofforbubble.
DonotcontacttheexposedpolarizerswithanythingharderthananHBpencillead.Tocleandustoffthedisysurface,wipegentlywithcotton,chamoisorothersoftmaterialsoakedinpetroleumbenzin.
Wipeoffsalivaorwaterdropsimmediay.Contactwithwateroveralongperiodoftimemaycausepolarizerdeformationorcolorfading,whileanactiveLCDwithwatercondensationonitssurfacewillcausecorrosionofITOelectrodes.
Glasscanbeeasilychippedorcrackedfromroughhandling,especiallyatcornersandedges.
DonotdriveLCDwithDCvoltage.
LiquidCrystalDisyModules
MechanicalConsiderations
LCMareassembledandadjustedwithahighdegreeofprecision.Avoidexcessiveshocksanddonotmakeanyaltionsormodifications.Thefollowingshouldbenoted.
Donottamperinanywaywiththetabsonthemetalframe.
DonotmodifythePCBbydrillingextraholes,changingitsoutline,movingitscomponentsormodifyingitspattern.
Donottouchtheelastomerconnector,especiallyinsertanbacklightpanel(forexample,EL).
WhenmountingaLCMmakesurethatthePCBisnotunderanystresssuchasbendingortwisting.Elastomercontactsareverydelicateandmissingpixelscouldresultfromslightdislocationofanyoftheelements.
Avoidpressingonthemetalbezel,otherwisetheelastomerconnectorcouldbedeformedandlosecontact,resultinginmissingpixels.
2.2.StaticElectricity
LCMcontainsCMOSLSI’sandthesameprecautionforsuchdevicesshouldapply,namely
Theoperatorshouldbegroundedwheneverhe/shecomesintocontactwiththemodule.NevertouchanyoftheconductivepartssuchastheLSIpads,thecopperleadsonthePCBandtheinterfaceterminalswithanypartsofthehumanbody.
Themodules
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