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第1頁DFM101Part1|Dec2023 CelesticaConfidentialDFM101

Part1第2頁DFM101Part1|Dec2023 CelesticaConfidentialObjective:ProvidebasictrainingonperformingmanualDFMIncluded:RelevantguidelinesfromtheDFxguidelinesdocumentIdentifywhichchecklistitemscanbeevaluatedusingValorExamplesofDFMviolationsSomehands-onDFMexercisesNotincluded:DFTandDFADFMusingValorImpactassessmentofviolationsDFM101Outline

第3頁DFM101Part1|Dec2023 ConfidentialAfterthesession,attendeesshouldbeableto:DFM101Outline

ManuallyidentifyDFMviolationsinacustomer’sdesign,usingtheDFMchecklistandthePCADFxGuideCreateaDFMreportforthecustomerusingthestandardtemplate第4頁DFM101Part1|Dec2023 CelesticaConfidentialDFMReviewProcess第5頁DFM101Part1|Dec2023 CelesticaConfidentialNosingle“best”waytoapproachaDFMreview,findyourownpreferredmethodthroughexperience.Onepossibleapproach:startatahighlevel,andprogressively“zoomin”Backgroundinformation>>definecontextforthereviewHighleveldesign>>definebasicmanufacturingprocessDetaileddesign>>identifyspecificviolations&generalpriorityImpactassessment>>quantifyimpact,inorderofpriorityInvestigatealternatives>>specificsuggestionsforchangesDFMReviewProcess

第6頁DFM101Part1|Dec2023 ConfidentialBackgroundDefinecontextforthereviewServicelevel&product“context”:Whatisexpectedbythecustomer?e.g.turnaroundtimeforthereview,levelofdetail,etc.Whattypeofproductisit?e.g.lowvolume/highmix,highvolume/lowmargin,highreliability,consumer,etc.Whatarethecustomer’s“hotbuttons”?e.g.cost,quality,schedule,productfunctionality/performance,reliability,etc.Datareview:whatdesigninformationisavailabletoincludeinthereviews?History:whatpastinformationisavailable?e.g.productiondata,previousDFMreportsDFMReviewProcess

第7頁DFM101Part1|Dec2023 CelesticaConfidentialHighLevelDesign

DefinebasicmanufacturingprocessTypicallyuseBOM,assemblydrawing&/orouterlayers(lands)Lookforparts/issuesthatmayinfluencethebasicprocessflow:PTHpartsComplexconnectorsTopsidevs.backsideDefineapreliminaryassemblyprocessflow,toensurethatcorrectguidelinesareappliedduringlaterdetailedreviewPTHparts:selectivewave,fullwave,pasteinhole,pressfit,selectivesolder(softbeam,Ersa),etc.Test/inspectstrategyDefineapreliminarypanelizationconcept,tooptimizeMasterPanelutilization&meetassemblypanelrequirementsDFMReviewProcess

第8頁DFM101Part1|Dec2023 ConfidentialDetailedDesign

Identifyspecificviolations&generalpriorityUsepreviousDFMreports,BOM,designfile&/orgerberfiles,assemblydrawing,PCBfabricationdrawing,mechanicalassemblydrawingWorkthroughChecklist,referringtoDFMGuidelinesasrequiredTransferitemsfoundtoDFMReport,identifyashot/warm/coolfocusdesigner’slimitedtimeonthemostcriticalitemsprioritizeanyadditionaldetailedworkrequired,e.g.impactassessment&alternativeskeepcustomer’sprioritiesinmind:cost,quality,schedule,etc.Requestclarificationoradditionalinformationfromdesigner&/orsuppliersifrequiredDFMReviewProcess

第9頁DFM101Part1|Dec2023 CelesticaConfidentialImpactAssessmentQuantifyimpact,inorderofpriorityTimeconsuming,notmanytoolsavailableyettoassistwiththisBusinessofficeneedstosupportprovidingthisfeedbacktothecustomer&incorporatingitintoproductquoting/pricingNeedanoverallDFxbusinessmodelinplace:whopaysfortheservice?whobenefitsfromimprovementsimplementedinthedesign?etc.Couldprovideforallitems,oronlyonitemsthatmaynotbefixedDFMReviewProcess

第10頁DFM101Part1|Dec2023 CelesticaConfidentialInvestigateAlternativesSpecificsuggestionsforchangesVerytimeconsuming,shouldonlybeperformedifappropriate&astimepermitsStartwithhighestimpactissues,oronesmostlikelytohaveanalternativethatwecansuggestDFMReviewProcess

第11頁DFM101Part1|Dec2023 CelesticaConfidentialDFMChecklist第12頁DFM101Part1|Dec2023 CelesticaConfidentialData&HistoryComponentsProcessFlowPTHAssemblySMTAssemblyLayout&SpacingLandPatternsSilkscreenBoardOutlinePCBFabricationDrawingMechanicalAssembly(notcoveredinthissession)DFMChecklistTopics

第13頁DFM101Part1|Dec2023 ConfidentialDFMChecklistTheDFMChecklistisusedtoensurethatacomprehensivereviewisdone,coveringallimportantareasEachitemontheDFMChecklistshouldbeverifiedonthedesignbeingreviewed,eitherusingValorautomatedanalysisorbymanualcheckingTheDFMChecklistisatooltouseduringthereview,itshouldNOTbeincludedintheDFMReportgiventothecustomer第14頁DFM101Part1|Dec2023 ConfidentialHigherpriorityitemsareshowninboldtext.Iftimeislimitedandafullreviewcannotbeperformed,thehigherpriorityitemsshouldbecoveredfirst.RefertotheCLSDFxGuidefordetailedguidelines.ItemscoveredbyValorautomatedanalysiswilllistthenameofthecheck,e.g.‘c2toep’.ItemsnotcoveredbyValoraremarked‘M’andmustbecheckedmanually.Note:thepriorityofalineitemonthechecklistdoesnotnecessarilycorrespondtoa“hot/warm/cool”severitylevelofaparticularissue(severityleveldependsonthespecificissuefound).DFMChecklist第15頁DFM101Part1|Dec2023 ConfidentialCheckoffeachitemasitisreviewed,toensureallitemsarecoveredduringthereview.Notescanbemadeduringthereview,togatherinformationforwritingtheDFMReportforthecustomer.TheChecklistcanbefilledinsoftcopyorhardcopy(printed),whicheverismoreconvenient.IssuesfoundthatarenotcoveredintheDFMChecklistshouldalsobenotedandincludedintheDFMReportforthecustomer.DFMChecklist第16頁DFM101Part1|Dec2023 ConfidentialPuttingan‘X’intheseboxeswillautomatically‘X’theitemscoveredbyValoranalysis.DFMChecklist第17頁DFM101Part1|Dec2023 ConfidentialData&History第18頁DFM101Part1|Dec2023 ConfidentialData&History第19頁DFM101Part1|Dec2023 ConfidentialCADdata(intelligentandappropriateforinputtoValor)AVLBOMwithRefDesAssemblydrawingsPCBfabricationdrawing,includingoutlinedimensions,holesizes/tolerances,surfacefinishComponentdrawingsofcomplexoruniquecomponentsCustomcomponentinformationDFxGuide:10.1DataPackageforDFMManualcheckDataAdequateforDFMReview第20頁DFM101Part1|Dec2023 ConfidentialThiswillbecoveredinmoredetailsintheCLSValorDFMtrainingsession.DataAdequateforDFMReview第21頁DFM101Part1|Dec2023 ConfidentialIfanyDFMreviewshavepreviouslybeenperformedontheboard,theyshouldbereviewedagainforthenewdesign.Ifthesestillexistinthenewdesign,theyshouldbeincludedinthenewDFMreport.Itemsthatwerenotimplementedpreviouslymaybecandidatestoaddressinthenewdesign.PreviousDFM第22頁DFM101Part1|Dec2023 ConfidentialReviewanyexistingproductionproblemstodetermineifanyaredesign-related:Qualityproblems,majoryielddetractorsOperationtimeadders,e.g.manualoperations,inefficientprocessflowSupplychainproblems,e.g.componentquality,single/solesourceparts,deliveryproblemsEtc.Design-RelatedProductionIssues第23頁DFM101Part1|Dec2023 ConfidentialRoHS=RestrictionofHazardousSubstancesAEuropeanUnionDirective,effectivefromJuly2023Bans6materials,includingleadandcertainbrominatedflameretardantsAppliestoabroadrangeofelectricalproducts-someexemptionsapplyCoversproductsbothmanufacturedinorimportedintoEuropeSimilarlegislationcoveringotherregionsbeingimplementedorunderdevelopmentWhatisRoHS?RoHS/Pb-freeCompliance第24頁DFM101Part1|Dec2023 ConfidentialComponents:Mustnotcontainanyofthe6materialsprohibitedbyRoHSMustmeetrequirementsforhigh-yieldPb-freeassembly,including:compatiblesurfacefinish,highertemperatureresistancewithminimalwarping,adequateMSLratingsatPb-freereflowtemperatures,adequatereliabilityafterPb-freeassemblyAllcomponentsmustbeclearlyidentifiedasPb-free,RoHScompliant,orRoHSexempt.Ifacomponentcannotbeclearlyidentified,thenitcannotbeusedinRoHScompliantproducts.PCBs:Mustnotcontainanyofthe6materialsprohibitedbyRoHSMustbecompatiblewithPb-freeassembly,including:compatiblesurfacefinish,highertemperatureresistancewithminimalwarping,adequatereliabilityafterPb-freeassemblyRoHS/Pb-freeCompliance第25頁DFM101Part1|Dec2023 ConfidentialThecustomermustclearlydefinetheproductrequirements:RoHScompliantornot?AssemblewithSnPborPb-freesolder?ThecustomermustverifythattheBOM&PCBarecompliantandcompatiblewiththechosenassemblyManycomponentsintendedforSn/PbassemblyarenotForwardCompatible,i.e.abletobeattachedtoaPCBusing

Pb-freeassembly.NotallcomponentsintendedforPb-freeassemblyareBackwardCompatible,i.e.abletobeattachedtoaPCBusingSnPbassembly.Forexample:Pb-Free(SAC)BGAsarenot‘drop-in’compatiblewithstandardSnPbassembly.TheycanproducesatisfactorysolderjointsifthereflowTmaxisgreaterthan227°C,butthismaycauseothercomponentsontheboardtobeoverheated.CLSGreenServicescanassistthecustomerbyprovidingBOManalysistoverifycompliance&compatibilityRoHS/Pb-freeCompliance第26頁DFM101Part1|Dec2023 ConfidentialComponents第27頁DFM101Part1|Dec2023 ConfidentialComponents第28頁DFM101Part1|Dec2023 ConfidentialExamplesofnewcomponentpackages:Newadvancedpackages(BGAs,CSPs)NewconnectorsNewoddformparts,e.g.RFcomponentsLeadlesscomponentsNewPackagesDFxGuide:N/AManualcheck第29頁DFM101Part1|Dec2023 ConfidentialInproductionattargetsite?Inproductionatanothersite?(3)PerformProcess/TechnologyTransfer(1)(2)Create&ExecuteDevelopment/QualificationPlan(2)(3)(4)Development/Qualificationrequired?(3)YNYNOKYOKN(1)ConsultdocumentsCELQ-001-PROC-1293GlobalProductTransferProcessforguidance(2)ConsultdocumentCELQ-001-SPEC-16NewTechnologyDevelopmentandQualificationforguidance(3)ContactCorporateProcessDevelopmentforassistance(ThiloSack&AlexChen(Americas),None(Europe),TengHoonNg&DanielTan(Asia))(4)ShouldbeperformedbytheManufacturingEngineerresponsiblefortheproduct.Priortostartingexecution,proposedPlanshouldbeapprovedbytheappropriateEngineeringManagerandbytheCustomer.ProgramManagerorOperationsManagershouldaddresshowtheworkwillbefunded,andobtainCustomerapprovalforanycharges.NewPackages第30頁DFM101Part1|Dec2023 ConfidentialProcessDevelopment&AssemblyQualificationconsiderations:Processset-up&optimizationTooling(e.g.stencildesign,placementnozzle/gripper,reflownozzle)Processparameters(e.g.screeningparameters,wavesolderparameters,pressfitforceparameters,profilesforassemblyandrework)AssemblyreliabilityMechanicalintegrityoftheinterconnectionbetweenthecomponentandthePCB(e.g.solderjoints,pressfitconnection)isusuallythefocusNewPackages第31頁DFM101Part1|Dec2023 ConfidentialSourcesforlandpatterndesigninformation:PCADFxGuidelinesdocument,Chapter6ComponentLibraryCreation(standardcomponentpackagetypes)OthersitesalreadyusingthesameorsimilarpartComponentsupplier’srecommendedlandpattern,fromspecsheetIPClandpatterncalculatorwebsiteIPC-7351(replacementforIPC-SM-782)DFxTechnicalForumdatabaseonLotusNotes:NewPackages第32頁DFM101Part1|Dec2023 ConfidentialComponentsthatarewashablearepreferredoverthosethatarenot.Thisprovidesmaximumprocessflexibility.Componentsmustbeabletowithstandthemanufacturingprocessandtemperatureprofiles.TherequiredprocessingtemperaturesaretypicallyhigherforPb-freeassembly.WashableandReflowableDFxGuideSection:2.1.6ProcessCompatibilityRequirementsManualCheck第33頁DFM101Part1|Dec2023 ConfidentialNote:1.ComponentsshouldbespecifiedtoJ-STD-020,whichstatesamaximumtemperatureof220oCforSnPband260oCforPb-free(unlessotherwisespecifiedbymanufacturer).2.SnPbmoisturesensitivepartsareacceptableat220oC3.Pb-freemoisturesensitivepartsareacceptableat260oCComponentTemperatureRequirementsWashableandReflowable第34頁DFM101Part1|Dec2023 ConfidentialShipmentPackagingDFxGuideSection:2.1.13ComponentSupply/PackagingFormatsManualCheck第35頁DFM101Part1|Dec2023 ConfidentialRemoveanynon-productionpartspriortofinalBOMreleasePartswhichmaybecandidatesforremoval:Headerpinsusedonlyfordebugofthedesign,e.g.groundingofoscilloscopeprobesSockets,e.g.toenablefrequentupgradeofmicrocodeduringdesigndebugDiagnosticconnectors,e.g.tologicanalyzersSmallheaders/connectorsspreadacrosstheboard,e.g.formeasurementofsignalintegrityorpowerdistributionandnoiseAskthedesignerifanypartsarenotrequiredforproductionDFxGuideSection:2.4.5ManualCheckPartRemovalfromBOM第36頁DFM101Part1|Dec2023 ConfidentialDFxGuide:2.5.1WaveSolderPTHComponentsValorcheck:c_pitch(ComponentAnalysis)CorrectpinprotrusionanduseofsolderthievesarecriticalforfinepitchwavesolderSolderthievesarecurrentlyrequiredforallPTHcomponentsforPb-freesoldering(needsmorestudy)Defectrateforfinepitchtypically10Xtherateforstandardpitch(SnPbdata)FinePitchComponentsFinePitchPTHComponents第37頁DFM101Part1|Dec2023 ConfidentialDFxGuide:2.1.9Non-PreferredComponents,2.2.1PackageSelectionValorcheck:c_pitch(ComponentAnalysis)SMTperipheralleadedcomponents(gullwings,leadless):

Minimumrecommendedpitchis0.5mmPitchesdownto0.4mmcanbeassembled,butwithloweryieldsAreaarraycomponents:Pitchesof1.0mmandabovearerecommended,astheycanbeassembledwithverylowdefectratesPitchesbelow1.0mmcanbeusedwithcaution:MayhavelowerassemblyyieldsDifficulttomixwithhighpastevolumeparts,e.g.CBGA(stepstencil)LandpatterndesignismorechallengingMayrequireadvancedPCBtechnology,e.g.micro-via,highcapabilitysoldermask(webwidth®istration)Pitchesof0.5mmandbelowarenotrecommended,astheyarechallengingtoassemblewithhighyieldsFinePitchComponentsFinePitchSMTComponents第38頁DFM101Part1|Dec2023 ConfidentialQFPAssemblyDefectsbyPitchFinePitchComponents第39頁DFM101Part1|Dec2023 ConfidentialDFxGuideSection:2.5.2Paste-in-HoleComponents,2.6.4SMTConnectorsManualCheckPick-upmethodforplacementintheSMTline,inorderofpreference:Auto-placeablepartswithaflatsurfaceonthetopofthepartforvacuumpick-up(minimumdiameter7.5mm(0.3”)).Somepartshavearemovablepick-upcaptoprovideapick-uparea.FlatsurfaceonthesideforsidevacuumSpecialgripperdesignedforthepart,ormanualplacementNotethatametalpick-upcapwillinterferewithTestJetorOpensExpress(capacitive)testingatICT.SMTconnectorwithremovablepick-upcapAutoplacement第40頁DFM101Part1|Dec2023 ConfidentialComponents第41頁DFM101Part1|Dec2023 ConfidentialComplexconnectorsmaysignificantlyimpact:NRE(assembly&/orrepair),e.g.customtooling,processdevelopmentoroptimization,operatortrainingforcustomizedoperationOperationtime(assemblyand/orrepair)YieldOftenverylittleopportunitytochangeconnectors,astheycanbeanintegralpartofthesystemmechanicaldesign.However,feedbackshouldstillbeprovidedontheirimpacttomanufacturing.DFxGuideSection:2.6.4SMTConnectors,2.6.5PTHConnectorsManualCheckComplexConnectors第42頁DFM101Part1|Dec2023 ConfidentialFinepitchSMTconnectorwithrivetmechanicalretentionConnectormustberivetedinplacepriortoreflowduetotheleadconfiguration-ifnotriveted,itwouldnotsitflatonthePCBsurface.Rivetingmustthereforebedonewithallcomponentsplacedinwetpaste.Example:SMTMicropaxTM

LeadsarenotflatonthecomponentLeadsmustbepressedintoaflatpositionwhenmountedonthePCARivetlocationLeadsextendunderneaththeconnectorbody,makingvisualinspectionandtouch-upofsolderbridgesverydifficult.ComplexConnectors第43頁DFM101Part1|Dec2023 ConfidentialPandaconnectorFourrowsofinterlaced“buttjoint”connections(pinnedSMTjoints).Visualinspectionandtouch-upofinner2rowsisalmostimpossibleduetopitchandinterlacingonpinsMetalclampmustbeplacedaroundtheconnectortokeepitfrombowingfromthecardandproducingopensduringreflow.ClampactsasaheatsinkmakingitmoredifficulttogettheconnectorleadstoreflowComplexConnectorExamplesComplexConnectors第44頁DFM101Part1|Dec2023 ConfidentialConnectorMechanicalRetention第45頁DFM101Part1|Dec2023 ConfidentialOtherconsiderations:Forpasteinholeattach:avoidusingsnap-inlegsunlessrequired,astheymaypushsolderoutoftheholeKinkedPTHleadsmaybecheaperthanaddingaseparatehold-downfeatureScrews,rivscrews,&rivetsmayrequireadditionalassemblytime,e.g.toinverttheassembly,installthehardware,applymaskingforwaveScrewsmayneedtobere-torqueafterwavesolderAvoidrivetsduetoreworkdifficulty;tryrivscrewsinsteadIfusingscrews,usecaptivenutsorpemnutstoreduceassemblytimeConnectorMechanicalRetention第46頁DFM101Part1|Dec2023 ConfidentialOtherconsiderations:Snap-inmechanismsshouldaccommodatethePCBthicknessandtolerance(typically+/-10%)IfthePCBistoothick,thepartmaynotengageproperlyIfthePCBistoothin,thepartmayfloatduringsolderingInstallretentionhardwarebeforethepartissoldered,toavoidinducingstressinthesolderjointsthatcouldleadtoearlyfailurePegsthatmustbedeformedafterinsertionshouldbeavoidedastheyrequireadditionalassemblytimeandmayrequirespecialequipment,e.g.ultrasonicbonderAlignmentpinsshouldhaveataper

andshouldbelongerthanthe

functionalpins,sothatthey

engagefirstConnectorMechanicalRetentionAlignmentPin第47頁DFM101Part1|Dec2023 ConfidentialOtherconsiderations:Retentionmechanismsshouldbelowforce,sothatanyfunctionalPTHpinsbentduringinsertioncanbedetectedToreduceincidenceofbentPTHpins,themaximuminstallationforceshouldbeappliedonlyafterthetipsofthefunctionalpinsareinsidethebarrelsofthePCBMechanicalretentionforSMTconnectorsischallenging:Absenceofmechanicalretention,orinstallationofmechanicalretentionaftersolderingcanbothleadtoearlysolderjointfailureInstallationofmechanicalretentionpriortoreflowriskssmearingofsolderpasteandincurringdefectsinotherplacedcomponentsonthePCBSomepreferredmethodsaresolderedPTHpins(withoutlatchesorbarbs)orSMTtabs.Tofacilitaterework,PTHpinsshouldnotbeconnectedtoplanes,orataminimummusthavethermalreliefs.ConnectorMechanicalRetention第48頁DFM101Part1|Dec2023 ConfidentialCeramic:Partslargerthan1210sizemayneedadditionalanalysisofCTEmismatchandstresscrackingsusceptibilitytounderstandpotentialreliabilityeffects.Avoidusinghighvoltagesurfacemountceramiccapacitors.Theyrequirespecialprocesses(encapsulation)topreventvoltageflashover.Notallceramiccapacitorsarewavesolderable.Refertothemanufacturer’sspecifications.Film:Notrecommendedduetopoorsolderabilityandreworkissues.Closeattentionshouldbegiventospecifiedsolderingconditions.Moisturesensitive-themanufacturer’sstoragerequirementsshouldbefollowed.Oftennotsuitableforwavesoldering.DFxGuideSection:2.4.6CapacitorSelectionManualCheckCapacitors第49頁DFM101Part1|Dec2023 ConfidentialTantalum:Moldedpartsarerecommendedoverconformallycoatedparts.Forlowervoltagevalues(<10V),NiobiumOxidecapacitorsmaybeconsidered.Theyoffercomparableelectricalcharacteristics,aresafer,morereliable,andrequireasmallerderatingthantantalums.AluminumElectrolytic:Integralstandoff>0.38mm(0.015")requiredonPTHpartstoraisethepartoffthePCBduringwash.DFxGuideSection:2.4.6CapacitorSelectionManualCheckCapacitors第50頁DFM101Part1|Dec2023 ConfidentialDFxGuideSection:2.1.9Non-PreferredComponentsManualcheckAvoidtheunnecessaryuseofdiscretecomponentsizesbelow0603.SmallChipDiscrete第51頁DFM101Part1|Dec2023 ConfidentialDFxGuideSection:2.1.8ComponentCountReductionManualCheckAddedPlacementTimeforDiscretesvs.RpacksUseresistorpacksratherthanindividualresistorswhereanumberofthesamevalueofresistorexist.SmallChipDiscrete第52頁DFM101Part1|Dec2023 ConfidentialLeadPrepping/PreformingDFxGuideSection:N/AManualCheckLeadpreppingorpre-formingrequiresextraoperationtimeandshouldbeavoidedwherepossibleEventheshortestavailableleadlengthwillrequiretrimming.第53頁DFM101Part1|Dec2023 ConfidentialDFxGuideSection:8.1.3HeightLimitationsValorcoverage:c_height_p,c_height_s(ComponentAnalysis)ComponentHeight第54頁DFM101Part1|Dec2023 ConfidentialSelectiveWaveSolderComponenttobesolderedSolderwaveprofile04/12/1998SelectivewavesolderfixtureMaximumcomponentheight=0.375”(9.53mm)ComponentHeight第55頁DFM101Part1|Dec2023 ConfidentialCeramicColumnGridArrayonSecondarySideofPCBProblem:Componentheightis0.482”(12.24mm)Maximumallowableheightis0.375”(9.53mm)forselectivewavesolderComponentmustbeattached

post-SMTwithareworktool.Impact:$30-40costadderperpart0.482”ComponentHeight第56頁DFM101Part1|Dec2023 ConfidentialMolex52837-0609FCIBerg54102-G08-02PanasonicERJ2RKF102VAVX18255C223MAT2AComponentsComponentSelectionExerciseAssessthefollowingpartsformanufacturability.Datasheetsareprovided.第57頁DFM101Part1|Dec2023 Confidentialunclearwhetherthecovercanbeusedasavacuum

pick-upcap,contactsuppliertoverifyifnot&itwillbemanuallyplaced,prefertubepackaging

overtape&reeldoesthiscomponenthavethethermalresistanceforreflow?FCIBerg54102-G08-02ComponentsComponentSelectionExerciseAssessthefollowingpartsformanufacturability.Datasheetsareprovided.Operatingtemperature,notprocessingtemperatureMolex52837-0609maynotberequiredinproduction,verifywithdesigner-ensureremovalfromproductionBOMifnotrequiredifusingwave,willlikelyfloat:recommendchangetoretentivelegoption(seeNote5ondrawing)第58頁DFM101Part1|Dec2023 ConfidentialComponentSelectionExercisePanasonicERJ2RKF102VAVX18255C223MAT2AComponentsnoconcerns-0402resistoryieldapproximatelyequalto0603,providinglandpatternsareacceptabledependingonquantityofthesameresistancevalue,considerchangingtoRpackceramiccap>1210mayneedadditionalanalysistounderstandpotentialreliabilityeffects,ifpossiblereplacewithsmallerpackage(s)suggestP/N12105C223MAT2AwedonotrecommendhavingpackaginginformationintheP/N,butifitisrequired,thenrecommendchangingthe2nd-lastnumbertoa4-fora13”reelComponentsAssessthefollowingpartsformanufacturability.Datasheetsareprovided.第59頁DFM101Part1|Dec2023 CelesticaConfidentialProcessFlow第60頁DFM101Part1|Dec2023 ConfidentialProcessFlow第61頁DFM101Part1|Dec2023 ConfidentialExampleswheremanualsolderingisrequired:TemperaturesensitivecomponentsDouble-sidedsolderedPTHcomponentsSecondarysidecomponenttooheavySecondarysidecomponenttootall,onaselectivewavesolderboardFewSMTcomponentsplacedonsecondaryside(toofewforautomatedline)Etc.DFxGuideSection:1.13ProcessFlowHierarchyManualCheckMinimizehandsolderandsolderfountainattachbyselectingcomponentsanddesigningboardlayoutforhigheryielding,moreautomatedbatchprocesses,e.g.autoSMT,pasteinhole,fullorselectivewavesolder,pressfitHandsolder,SolderFountain第62頁DFM101Part1|Dec2023 ConfidentialExamplesofnewprocesses:HeatsinkattachusingnewadhesivematerialLowtemperatureattachandreworkusingdifferentsolderalloyManualattachmethod,requiringnewequipment/toolingEtc.DFxGuideSection:1.13ProcessFlowHierarchyManualCheckNon-standardProcessesProcedurefordeterminingwhetherapackageis“new”,andrequiresanydevelopment/qualificationworkisthesameasfornewprocesses.NewAssemblyProcesses第63頁DFM101Part1|Dec2023 ConfidentialInproductionatanothersite?(3)PerformProcess/TechnologyTransfer(1)(2)Create&ExecuteDevelopment/QualificationPlan(2)(3)(4)Development/Qualificationrequired?(3)YNYNYOKN(1)ConsultdocumentsCELQ-001-PROC