封裝專用英語詞匯概要

/常見封裝形式簡介DIP=DualInlinePackage=雙列直插封裝HDIP=DualInlinePackagewithHeatSink=帶散熱片的雙列直插封裝SDIP=ShrinkDualInlinePackage=緊縮型雙列直插封裝SIP=SingleInlinePackage=單列直插封裝HSIP=SingleInlinePackagewithHeatSink=帶散熱片的單列直插封裝SOP=SmallOutlinePackage=小外形封裝HSOP=SmallOutlinePackagewithHeatSink=帶散熱片的小外形封裝eSOP=SmallOutlinePackagewithexposedthermalpad=載體外露于塑封體的小外形封裝SSOP=ShrinkSmallOutlinePackage=緊縮型小外形封裝TSSOP=ThinShrinkSmallOutlinePackage=薄體緊縮型小外形封裝TQPF=ThinProfileQuadFlatPackage=薄型四邊引腳扁平封裝PQFP=PlasticQuadFlatPackage=方形扁平封裝LQPF=LowProPackage=薄型方形扁平封裝eLQPF=LowProfileQuadFlatPackagewithexposedthermalpad=載體外露于塑封體的薄型方形扁平封裝DFN=DualFlatNon-leadedPackage=雙面無引腳扁平封裝QFN=QuadFlatNon-leadedPackage=雙面無引腳扁平封裝TO=Transistorpackage=晶體管封裝SOT=SmallOutlineofTransistor=小外形晶體管BGA=BallGridArray=球柵陣列封裝BQFP=QuadFlatPackageWithBumper=帶緩沖墊的四邊引腳扁平封裝CAD=ComputerAidedDesign=計算機輔助設(shè)計CBGA=CeramicBallGridArray=陶瓷焊球陣列

CCGA=CeramicColumnGridArray=陶瓷焊柱陣列CSP=ChipSizePackage=芯片尺寸封裝

DFP=DualFlatPackage=雙側(cè)引腳扁平封裝

DSO=DualSmallOutline=雙側(cè)引腳小外形封裝

3D=Three-Dimensional=三維

2D=Two-Dimensional=二維FCB=FlipChipBonding=倒裝焊IC=IntegratedCircuit=集成電路I/O=Input/Output=輸入/輸出LSI=LargeScaleIntegratedCircuit=大規(guī)模集成電路MBGA=MetalBGA=金屬基板BGAMCM=MultichipModule=多芯片組件MCP=MultichipPackage=多芯片封裝MEMS=MicroelectroMechanicalSystem=微電子機械系統(tǒng)MFP=MiniFlatPackage=微型扁平封裝MSI=MediumScaleIntegration=中規(guī)模集成電路

OLB=OuterLeadBonding=外引腳焊接PBGA=PlasticBGA=塑封BGA

PC=PersonalComputer=個人計算機

PGA=PinGridArray=針柵陣列

SIP=SystemInaPackage=系統(tǒng)級封裝SOIC=SmallOutlineIntegratedCircuit=小外形封裝集成電路

SOJ=SmallOutlineJ-LeadPackage=小外形J形引腳封裝

SOP=SmallOutlinePackage=小外形封裝

SOP=SystemOnaPackage=系統(tǒng)級封裝WB=WireBonding=引線健合

WLP=WaferLevelPackage=晶圓片級封裝常用文件、表單、報表中英文名稱清除通知單Purgenotice工程變更申請ECR(EngineeringChangeRequest)持續(xù)改善計劃CIP(continuousimprovementplan)戴爾專案DellProject收據(jù)Receipt數(shù)據(jù)表Datasheet核對表Checklist文件清單Documentationchecklist設(shè)備清單Equipmentchecklist調(diào)查表，問卷Questionnaire報名表Entryform追蹤記錄表Trackinglog日報表Dailyreport周報表Weeklyreport月報表Monthlyreport年報表Yearlyreport年度報表Annualreport財務(wù)報表Financialreport品質(zhì)報表Qualityreport生產(chǎn)報表Productionreport不良分析報表FAR(Failureanalysisreport)首件檢查報告Firstarticleinspectionreport初步報告（或預(yù)備報告）Preliminaryreport一份更新報告Anundatedreport一份總結(jié)報告Afinalreport糾正及改善措施報告(異常報告單)CAR(CorrectiveActionReport)出貨檢驗報告OutgoingInspectionReport符合性報告（材質(zhì)一致性證明）COC(CertificateofCompliance)稽核報告Auditreport品質(zhì)稽核報告Qualityauditreport制程稽核報告Processauditreport5S稽核報告5Sauditreport客戶稽核報告Customerauditreport供應(yīng)商稽核報告Supplierauditreport年度稽核報告Annualauditreport內(nèi)部稽核報告Internalauditreport外部稽核報告ExternalauditreportSPC報表(統(tǒng)計制程管制)Statisticalprocesscontrol工序能力指數(shù)(Cpk)Processcapabilityindex（規(guī)格)上限Upperlimit（規(guī)格）下限Lowerlimit規(guī)格上限UpperSpecificationLimit(USL)規(guī)格下限LowerSpecificationLimit(LSL)上控制限（或管制上限）UpperControlLimit(UCL)下控制限（或管制下限）LowerControlLimit(LCL)最大值Maximumvalue平均值A(chǔ)veragevalue最小值Minimumvalue臨界值Thresholdvalue/criticalvalueMRB單(生產(chǎn)異常通知報告)MaterialReviewBoardReport工藝流程圖ProcessFlowDiagram物料清單（產(chǎn)品結(jié)構(gòu)表/用料結(jié)構(gòu)表）BOM(BillofMaterials)合格供應(yīng)商名錄AVL(ApprovedVendorList)異常報告單CAR工程規(guī)范報告通知單（工程變更通知）ECNTECN自主點檢表SelfCheckList隨件單（流程卡）TravelingCard(RunCard)壓焊圖Bondingdiagram晶圓管制卡Waferinspectioncard晶圓進料品質(zhì)異常反饋單FeedbackReportforWaferIncomingQualityProblems訂購單PO(PurchaseOrder)出貨通知單AdvancedShipNotice送貨單/交貨單DO(DeliveryOrder)詢價單RFQ(Requestforquotation)可靠性實驗報告ReliabilityMonitorReport產(chǎn)品報廢單PSB特采控制表CRB返工單PRB異常處理行動措施OCAP減?。篧afer

[‘weif?]

n.威化餅干、電子晶片（晶圓薄片）Grind

[ɡraind]

vt.&vi.磨碎;嚼碎n.磨,碾Crack

[kr?k]

vt.&vi.

(使…)開裂,破裂n.

裂縫,縫隙Ink

[i?k]

n.

墨水,油墨Die[dai]

vt.&vi.

死亡（芯片）Dot

[d?t]

n.

點,小圓點Mounting

[‘maunti?]

n.

裝備,襯托紙Tape

[teip]

n.

帶子；錄音磁帶;錄像帶Size

[saiz]

n.

大小,尺寸，尺碼Thick

[θik]

adj.厚的，厚重的Thickness

[‘θiknis]

n.

厚(度),深(度)寬(度)Position

[p?‘zi??n]

n.

方位，位置Rough

[r?f]

adj.

粗糙的;不平的Fine

[fain]

adj.

美好的,優(yōu)秀的,優(yōu)良的,杰出的Speed[spi:d]

n.

速度,速率Spark[spɑ:k]

n.

火花;火星Out

[aut]

adv.離開某地,不在里面；(火或燈)熄滅Grindstone

[‘ɡraindst?un]

n.

磨石、砂輪Mount[maunt]

vt.&vi.

裝上、配有Mounter

裝配工;安裝工;鑲嵌工Mounting

[‘maunti?]

n.

裝備,襯托紙Magazine

[,m?ɡ?‘zi:n]

n.

雜志,期刊，彈藥庫（傳遞料盒）Cassette

[k?‘set]n.盒式錄音帶；盒式錄像帶Inspect

[in‘spekt]

vt.檢查，檢驗，視察Inspection

[in‘spek??n]

n.

檢查，視察Card

[kɑ:d]

n.

卡,卡片,名片劃片：Saw

[s?:]

n.

鋸vt.&vi.

鋸，往復(fù)運動Sawing

['s?:i?]

n.

鋸,鋸切,鋸開Film

[film]

n.

影片,電影（薄膜，藍膜）Frame[freim]

n.

框架，骨架，構(gòu)架Clean

[kli:n]

adj.

清潔的,干凈的；純凈的Cleaner

[‘kli:n?]

n.

作清潔工作的人或物Oven

[‘?v?n]

n.

烤箱,爐Cassette

[k?‘set]n.

盒式錄音帶；盒式錄像帶Handler[‘h?ndl?]n.(物品、商品)的操作者Scribe

[skraib]

n.抄寫員,抄書吏Street

n.

大街,街道Blade

[bleid]

n.

刀口,刀刃,刀片Cut

[k?t]

vt.&vi.

切,剪,割,削Speed[spi:d]n.

速度,速率Spindle

[‘spindl]

n.

主軸，(機器的)軸Size

[saiz]

n.

大小,尺寸

,尺碼Cooling

['ku:li?]adj.

冷卻(的)Kerf

[k?:f]

n.

鋸痕,截口,切口Width

[widθ]

n.

寬度,闊度,廣度Chip

[t?ip]

n.

碎片、缺口Chipping[‘t?ipi?]n.

碎屑,破片Crack[kr?k]vt.(使…)開裂,破裂n.裂縫,縫隙Missing

[‘misi?]adj.失掉的,失蹤的,找不到的Die[dai]

vt.&vi.

死亡（芯片）Saw

[s?:]

n.

鋸vt.&vi.

鋸，往復(fù)運動Street

[stri:t]n.

大街,街道Film

[film]

n.

影片,電影（薄膜，藍膜）Frame[freim]

n.

框架，骨架，構(gòu)架Tape

[teip]

n.

帶子；錄音磁帶;錄像帶Bubble

['b?bl]n.

泡,水泡,氣泡mount貼wafer晶圓

frame框架blade刀片tape膜cassette盒子completion完成loader上料un-loader出料initial初始化open打開air空氣pressure壓力failure失敗vacuum真空alignment校準ink黑點die芯片error錯誤limit限制cover蓋子device產(chǎn)品data數(shù)據(jù)saw切割water水elevator升降機spindle主軸sensor感應(yīng)器wheel輪子setup測高rotary旋轉(zhuǎn)check檢查feed進給

cutter切割speed速度height高度new新shift輪班pause暫停clean清洗

center中心chip崩邊

change變換enter確認Offcenter偏離中心broken破的alarm報警上芯：Attach

[?‘t?t?]

vt.&vi.

貼上;系;附上Bond

[b?nd]

n.

連接,接合,結(jié)合vt.

使粘結(jié),使結(jié)合Bonder

[‘b?nd?]

n.聯(lián)接器,接合器,粘合器Dieattachmaterialepoxy粘片膠Epoxy

[e‘p?ksi]

n.環(huán)氧樹脂（導電膠）Material

[m?‘ti?ri?l]

n.

材料,原料Non-conductiveepoxy絕緣膠Conductive

[k?n‘d?ktiv]

adj.傳導的Dispenser

[dis‘pens?]

n.

配藥師,藥劑師Nozzle

[‘n?zl]

n.

管嘴,噴嘴Rubber

[‘r?b?]

n.

(合成)橡膠，橡皮Tip

[tip]

n.

尖端,末端Diepick-uptool吸嘴Tool

[tu:l]

n.

工具,用具Collect

[k?‘lekt]

vt.

收集,采集（吸嘴）Ejector

[i‘d?ekt?]

n.

驅(qū)逐者,放出器,排出器Pin

[pin]

n.針,大頭針,別針LeadFrame引線框架Lead

[li:d]

vt.&vi.

帶路,領(lǐng)路,指引Frame[freim]

n.

框架，骨架，構(gòu)架Magazine

[,m?ɡ?‘zi:n]

n.雜志,期刊（料盒）Curing

[‘kju?ri?]

n.

塑化,固化,硫化,硬化Oven

[‘?v?n]n.

烤箱,爐Scrap

[skr?p]

n.

小片,碎片,碎屑Dent

[dent]

n.

凹痕,凹坑DieLift-off晶粒脫落（芯片脫落，掉芯）Skew

[skju:]

adj.

歪,偏,斜Misorientation

[mis,?:rien‘tei??n]

n.

定向誤差,取向誤差Presqueezedel寫膠前氣壓延時Postsqueezedel寫膠后氣壓延時Squeeze

[skwi:z]

vt.榨取,擠出n.

擠,榨,捏Eject

[i‘d?ekt]

vt.&vi.

彈出,噴出,排出Delay

[di'lei]

n.

延遲Height

[hait]

n.

高度,身高Level

[‘levl]

n.

水平線,水平面;水平高度Head

[hed]

n.

頭部，領(lǐng)導,首腦Ejectupdelay頂針延遲Ejectupheight頂針高度Bondlevel粘片高度PickLevel撿拾芯片高度Headpickdelay粘接頭拾取延遲Headbonddelay粘接頭粘接延時Pickdelay撿拾芯片延時Bonddelay粘接芯片延時Index

[‘indeks]

n.

索引;標志,象征;量度Clamp

[kl?mp]

vt.&vi.

夾緊;夾住n.

夾具Indexclampdelay步進夾轉(zhuǎn)換延時Indexdelay框架步進延時Shear

[?i?]

vt.

剪羊毛,剪n.

大剪刀Test

[test]

n.

測驗,化驗,試驗,檢驗Diesheartest推晶試驗Thickness

['θiknis]

n.

厚(度),粗Coverage

[‘k?v?rid?]

n.

覆蓋范圍Epoxythickness&coverage導電膠厚度和覆蓋率Orientation[,?:rien‘tei??n]

n.

方向,目標DieOrientation芯片方向Void

[v?id]adj.

空的,空虛的n.

太空,宇宙空間;空隙,空處;

空虛感,失落感Epoxyvoid導電膠空洞Chip

[t?ip]

n.

碎片Damage[‘d?mid?]

vt.&vi.

損害,毀壞,加害于n.損失,損害,損毀Chipdamage芯片損傷Backside

[‘b?ksaid]

n.

臀部,屁股，背面Chipbacksidedamage芯片背面損傷Tilt

[tilt]

vt.&vi.

(使)傾斜Tilteddie芯片歪斜Epoxyondie芯片粘膠Crack

[kr?k]

vt.&vi.

(使…)開裂,破裂n.

裂縫,縫隙Crackdie芯片裂縫/芯片裂痕Lift

[lift]

vt.&vi.

舉起,抬起n.

抬,舉Lifteddie翹芯片Misplace

[,mis‘pleis]

vt.

把…放錯位置Misplaceddie設(shè)置芯片NOdieonL/F空粘Insufficient

[,?ns?‘fi??nt]

adj.

不足的,不夠的Insufficientepoxy導電膠不足Epoxycrack導電膠多膠Epoxycuring銀漿烘烤Edge

[ed?]

n.

邊,棱,邊緣Partial

[‘pɑ:??l]

adj.

部分的,不完全的Mirror

[‘mir?]

n.

鏡子Missing

[‘misi?]adj.

失掉的,失蹤的,找不到的Edgedie/partialdie邊緣片/邊沿芯片Mirrordie光片/鏡子芯片Missingdie掉芯/漏芯/掉片Splash[spl??]vt.使(液體)濺起vi.(液體)濺落Splatter

[‘spl?t?]vt.&vi.

(使某物)濺潑Diagram[‘dai?ɡr?m]

n.

圖解,簡圖,圖表Inksplash/inksplatter墨濺Diebondingdiagram上芯圖Dieshesrtest推片實驗/推晶試驗Diesheartester推片試驗機Dieshesrtool推片頭Metalcorrosion晶粒腐蝕/芯片腐蝕Wafermappingsystem芯片分級系統(tǒng)System

['sist?m]

n.

系統(tǒng);體系wafer晶圓

die芯片attach粘貼glue銀膠substrate基板

magazine盒子inspection檢查parameter參數(shù)manual操作手冊reset重設(shè)enter確定error錯誤input輸入speed速度stop停止pressure壓力vacuum真空sensor傳感器backside背面pin針statistics統(tǒng)計calibration校正bond貼片conversion改機thickness厚度tilt傾斜度shape形狀adjust調(diào)整contact接觸cover覆蓋device產(chǎn)品chip崩邊pause暫停elevator升降機initial初始化alignment校準cassette盒子tape膜frame框架ring鐵圈temperature溫度rubbertip吸嘴frametype框架型號nozzle點膠頭writer劃膠頭壓焊：Wire

[‘wai?]

n.

金屬絲,金屬線;電線,導線Bond

[b?nd]

n.

接合,結(jié)合vt.

使粘結(jié),使結(jié)合Wirebond/Wiringbonding壓焊/焊絲/球焊Goldwire金絲Pad

[p?d]

vt.

給…裝襯墊,加墊子n.墊,護墊Bondpad焊點、鋁墊1stbond第一焊點Padsize焊點尺寸/鋁墊尺寸Capillary

[k?‘pil?ri]

n.毛細管;毛細血管（劈刀）Pitch

[pit?]

程度;強度;高度Padpitch鋁墊間距/焊點間距Elongation

[i:l??‘ɡei??n]n.延長;延長線;延伸率Breaking

[‘breiki?]

n.

破壞,阻斷Load[l?ud]

n.

負荷;負擔;工作量,負荷量BreakingLoad破斷力Pull

[pul]

vt.&vi.拉,扯,拔Shear

[?i?]

vt.

剪羊毛,剪n.

大剪刀Wirepull/ballpull（焊絲）拉力Wireshear/ballshear（焊絲）推力Ultrasonic

[,?ltr?‘s?nik]

adj.

(聲波)超聲的Power

[‘pau?]

n.

功力,動力,功率Force

[f?:s]

n.

力;力量;力氣Ultrasonicpower超聲功率Bondingforce壓力Bondingtime時間Temperature

[‘temp?rit??]

n.

溫度,氣溫Bondingtemperature溫度Ultrasonicwirebonding超聲波壓焊EFO打火燒球loop

[lu:p]

n.

圈,環(huán),環(huán)狀物Loopheight孤高Wirepulltest拉力試驗Ballsheartest金球推力試驗PIN1第一腳Ballheight球高Balldiameter球徑Cratering

[‘kreit?ri?]

n.

縮孔;陷穴（彈坑）KOHetchingtestKOH腐蝕試驗BondCrateringtest壓焊腐蝕試驗(彈坑試驗)Thermal

[‘θ?:m?l]

adj.熱的，熱量的Compression

[k?m‘pre??n]

n.

擠壓,壓縮TCB（ThermalCompressionBond）熱壓焊BondingDiagram壓焊圖/布線圖WrongBonding布線錯誤Incomplete[,?nk?m‘pli:t]adj.不完全的,未完成的Incompletebond焊不牢Nobonding無焊N2BOX氮氣柜RTPC實時過程監(jiān)控Tray

[trei]

n.

盤子,托盤HandingTray產(chǎn)品盤FBI壓焊后目檢FBIinsp-M/C壓焊檢驗機Microscope

[‘maikr?sk?up]

n.

顯微鏡LowPowerMicroscope低倍顯微鏡Flux

[fl?ks]

n.

熔劑、焊劑；助熔劑，助焊劑Hook

[huk]

vt.&vi.

鉤住,吊住,掛住Wirepullhook線鉤（測拉力）Ballsheartool推球頭（測推力）Metal

[‘metl]

n.

金屬Discolor

[dis‘k?l?]

v.使脫色;(使)變色,(使)褪色Oxide

[‘?ksaid]n.

氧化物MetalDiscolor鋁條變色BondPadDiscolor鋁墊變色BondPadOxide鋁墊氧化Stick

[stik]

vt.&vi.

粘貼,張貼Peeling

[‘pi:li?]n.剝皮,剝下的皮Cratering

[‘kreit?ri?]n.

縮孔;陷穴（彈坑）Nonstickbondonpad鋁墊不粘Bondpadpeeling鋁墊脫落Bondpadcratering鋁墊彈坑Limit

[‘limit]

vt.

限制;限定Scratch

[skr?t?]

vt.&vi.

抓,搔，

刮傷Overreworklimit超過返工數(shù)Bondremove/scratch剔球劃傷Ballbondnon-stick金球脫落Balltolarge（small）金球過大（小）Ballbondshort金球短路Non-stickonlead引腳脫落（魚尾脫落）misplace

[,mis‘pleis]

vt.

把…放錯位置connection

[k?‘nek??n]

n.連接,聯(lián)結(jié)MisplacedbondonLD壓焊打偏Wirebroken斷線Missingwire漏打Wrongconnection錯打defective

[di‘fektiv]

adj.

有缺陷的，欠缺的Defectivelooping弧度不良Sagging

[‘s?ɡi?]

n.

下垂[沉,陷],松垂,垂度Loopsagging弧度下陷Lowloop弧度太低Highloop弧度太高Loopshort弧度短路Overhang

[,?uv?‘h??]vt.伸出;懸掛于…之上Residue

[‘rezidju:]

n.剩余,余渣Distortion

[dis‘t?:??n]

n.歪曲,曲解WireoverhangonLD跨越引線框架Wireresidue殘絲LFdistortion引線框架變形Quantity

[‘kw?ntiti]

n.

數(shù)目,數(shù)量Mismatch

[‘mis’m?t?]

vt.使配錯,使配合不當Scrap

[skr?p]

n.

廢料vt.

廢棄,丟棄Scratch

[skr?t?]vt.刮傷QuantityMismatch數(shù)量不符EmptyM.notscrap空粘未報廢GoldWireScratch金絲受損Parameter參數(shù)Statistics統(tǒng)計Utility應(yīng)用Teach教習Bondtipoffset—焊線點糾偏Contactsearch接觸測高Zoomoffcenter放大倍數(shù)偏心校準Calibration校準BQM焊接質(zhì)量控制PR—patterrecognition—圖像識別Alignmenttolerance—對點偏差PRindexing—圖像控制下的步進Capillary焊線劈刀Wirespool—送線卷軸Windowclamp—窗口夾板Transducer—功率換能器FTN功能鍵Wirethreading—送線器EFO電子打火Linearpower線性馬達Vacuumsensor真空感應(yīng)器Stepdriver—步進驅(qū)動Postbondinspection—焊接后檢查Wirepull—拉線Ballshape—推球Ballsize—焊球大小Ballthickness—焊球高度Loopheight—線弧高度Loopshape—線弧形狀Neckcrack—線頸折損Fineadjust–精確調(diào)整Conversion–換產(chǎn)品1stbondnonstick—第一點不粘2ndbondnonstick—第二點不粘peeling拔鋁墊（扯皮）Bondoff脫焊Balldeformation—焊球變形servomotor—伺服電機weldoff管腳脫焊crater裂縫goldwire金線missingball球未燒好weakbond虛焊塑封：Mold

[m?uld]

n.

模子,鑄型vt.

澆鑄,塑造Molding

[‘m?uldi?]

n.

成型（塑封）Compound

[‘k?mpaund]

n.

復(fù)合物,化合物MoidingM/C；MoldPress塑封機Press

[pres]

n.

印刷機Heater

[‘hi:t?]

n.

加熱器;爐子Pre-heater預(yù)熱機Chase

[t?eis]

n.

追捕,追獵Molddie/Moldchase塑封模具MGPmoldMGP多缸模具Automold自動包封機load

[l?ud]vt.&vi.

1

把…裝上車[船]2

裝…loader

['l?ud?]

n.

裝貨的人,裝貨設(shè)備,裝彈機AutoL/Floader自動排片機handler

[‘h?ndl?]

n.

(動物)馴化者（抓手）temperature

[‘temp?rit??]

n.

溫度,氣溫Pre-heatTemperature料餅預(yù)熱溫度MoldTemperature模具溫度Clamp

[kl?mp]vt.&vi.

夾緊;夾住n.

夾具Pressure[‘pre??]n.壓(力),壓強ClampPressure合模壓強Transferpressure注塑壓強Transfer[tr?ns‘f?:]vt.&vi.轉(zhuǎn)移;遷移n.

轉(zhuǎn)移Curing[‘kju?ri?]

n.

塑化,固化,硫化,硬化Curingtime固化時間Curingtemperature固化溫度Pre-heatTime（料餅）預(yù)熱時間Transferspeed注塑速度Transfertime注塑時間PMCtime(PostMoldCureTime)后固化時間Load/unload上料/下料Sweep

[swi:p]

vt.&vi.

掃,打掃,拂去WireSweep沖絲Open開路Short短路Fill

[fil]vt.&vi.

(使)充滿,(使)裝滿,填滿Underfill

['?nd?fil]

n.

(孔型)未充滿Bodyunderfilled膠體未灌滿Incomplete[,?nk?m‘pli:t]adj.不完全的,未完成的Incompletemold未封滿Chip

[t?ip]

n.

碎片，缺口Chippackage/bodychip-out崩角Porosity[p?:‘r?siti]

n.

多孔性,有孔性PorosityBody膠體麻點Bubble[‘b?bl]

n.

泡,水泡,氣泡Blister

[‘blist?]

n.

氣泡vt.&vi.

(使)起水泡Smear[smi?]

vt.

弄臟,弄污n.

污跡,污斑Surface

[‘s?:fis]

n.

面,表面Rooughsurface不均勻（表面）Delaminate[di:‘l?m?neit]

v.

將…分層,分成細層Delaminating分層Void[v?id]adj.

空的,空虛的PKGVoid膠體空洞Deep[di:p]

adj.

深的Scratch[skr?t?]

vt.刮傷Bodydeepscratch膠體刮痕Dimension[di‘men??n]

n.

尺寸,度量MoldPKGdimension塑封體尺寸BTMwidth/length背面寬/長Topwidth/length正面寬/長PKGthick塑封體厚度Mismatch[‘mis’m?t?]vt.

使配錯,使配合不當Moldmismatch/PKGmismatch包封偏差(膠體錯位)Offset[‘?fset]vt.

抵消,補償Misalignment[‘mis?lainm?nt]

n.

未對準Moldoffset/PKGmisalignment偏心PMC（postmoldcure）后固化Dummy[‘d?mi]

n.

人體模型Strip[strip]

vt.

剝?nèi)?

剝奪,奪走Dummymoldedstrip空封Moldflash廢膠Gate[ɡeit]

n.

門,柵欄門Moldgate注澆口、進澆口Remain[ri‘mein]

n.

剩余物;殘余Gateremain小腳Compound

[‘k?mpaund]

n.

復(fù)合物,化合物Aging[‘eid?i?]

n.

老化,成熟的過程Compound

Aging料餅醒料（回溫過程）Locator[l?u‘keit?]

n.

表示位置之物,土地Block[bl?k]n.

大塊(木料、石料、金屬、冰等)LocatorBlock定位塊Ejector[i‘d?ekt?]

n.

驅(qū)逐者,放出器Pin[pin]n.

大頭針,別針，針Depth[depθ]

n.

深,深度EjectorPin頂針E-pinDepth頂針深度Storage[‘st?:rid?]

n.

儲藏處,倉庫Coldroom/compoundstorage冷藏庫/料餅存放庫Air

[??]

n.

空氣

Gun[ɡ?n]

n.

槍,炮Coating[‘k?uti?]

n.

涂層,覆蓋層Material

[m?‘ti?ri?l]

n.

材料,原料,素材,資料AirGun氣槍DieCoating芯片涂膠AutodiecoatingM/C芯片涂膠機DieCoatingMaterial覆晶膠Cart[kɑ:t]

n.

手推車ASS’YBCart后站推車Tablet[‘t?blit]

n.

藥片、膠囊Loader[‘l?ud?]

n.

裝貨的人,裝貨設(shè)備,裝彈機Preheater[‘pri:’hi:t?]

n.預(yù)熱器Fixture[‘fikst??]n.(房屋等的)固定裝置AutoTabletLoader自動排膠粒機CompoudPreheater高頻預(yù)熱機Load/UnloadFixture上料/下料架TabletMagazine膠粒盒CompoudTablets塑封料餅MoldingCleaningCompoud洗模餅misorientation

[mis,?:rien‘tei??n]

n.定向誤差,取向誤差PKGMisorientation膠體壓反Moldflashonlead塑封溢膠Moldcrack膠體裂痕Semiconductor半導體Molding–模封Onload上料Offload–出料Belt—皮帶Preheaterturntable–預(yù)熱轉(zhuǎn)盤Transfer傳送SafetyDoor安全門Pickandplace–機械手Motor馬達Station–模腔Cleaningbrush—清潔刷Cylinder氣缸Sensor傳感器Solenoid電磁閥Turnover–翻轉(zhuǎn)器Degate–切料口Bearing軸承Picker爪子Pusher–推動器Cullbin–垃圾箱Pin針Vacuumpump—真空泵Mornitor–顯示器Cable–導線Pro溫度曲線Alarm報警Error錯誤Driver驅(qū)動Sensor–感應(yīng)器Inspection檢查Parameter參數(shù)Manual手動,手冊Reset復(fù)位Initialing初始化Guide–導軌Substrate基板Device產(chǎn)品種類LotTraveller隨工單Magazine盒子Cylinder–汽缸Bearing–軸承Stop停止EmergencyStop緊急停止Gripper--夾子Heat–加熱器Pipe–管子Temperature溫度Hopper–漏斗Compressair–壓縮空氣Overflow—反面漏膠Semiconductor半導體Molding–模封Operation–操作Flange–法蘭盤Pump–泵Chamber–腔體Vent–氣孔Value–值A(chǔ)larm報警Error錯誤Inspection檢查Parameter參數(shù)Manual手動,手冊Reset復(fù)位Initialing初始化Incompletefill模封不全inching扭曲Overflow漏膠Misalignment模封錯位Packagemismatch模封錯位ResinHole/Void氣孔Foreignmaterials外來物Wiresweep線彎曲Roughsurface表面粗糙WrongOrientation模封方向反Eng.Sample工程師樣品Stain/Dirtyonpackage表面臟污Resinburr樹脂有毛刺Resinflashes毛刺DamageframeFRAME損壞Scratchonpackage樹脂表面劃傷Evaluation評估Crackpackage樹脂開裂SPCsampleSPC樣品切筋Trim-Form1切筋TrimmingDambarcut2切筋模Trimdie3成形模Formdie4分離模singulate5沖廢De-junk6檢測Inspection外觀檢測7再成型機模具ReformDie8再成型機Reformsystem9料盤Plastictray10連筋Uncutdambar11毛刺burr14溢料Junk15裂紋Crack16離層（分層）Delaminating17管腳反翹Leadtipbend18筋未切Dam-baruncut19筋凸出Dam-barprotrusion20筋切入Dam-barcutin打印Marking1打印Marking2印章Markinglayout3激光打印Lasermarking4油墨打印Ink(UV)marking5正印Topsidemark6背印Backsidemark7鏡頭Lens8打印不良\模糊Illegiblemarking9漏打Nomarking10斷字Brokencharacter11缺字Missingcharacter12印字傾斜Slantmarking13印記錯誤Wrongmarking14重印Remark15印字模糊（褪色）Fademark16印字粘污Smear19電流current21字體（字形）Font22定位針Locationpin23膠皮打印機Padprinter24激光打印機LaserMarkingM/C25后固化PMC(PostMoldCure)26后固化烤箱PMCOven27打印污斑Markingstain28印記移位Markingshift電鍍Plating1電鍍Plating2來料Incoming3沖廢Dejunk4熱煮軟化槽SockingTank7檢驗Inspection外觀檢測8烘烤Curing/Baking150℃9出料Unload10高速線電鍍High-speedPlatingLine11統(tǒng)計過程控制SPC12搭錫Solderbridge13錫絲、錫須Solderflick/Whisker14鍍層不良Platingdefects15發(fā)黃Yellowish16發(fā)黑Blacken17變色Discolor18露底材（露銅）Exposecopper19粘污Smear20鍍層厚度Platingthickness7-20um21鍍層成分Platingcomposition電鍍成分,Sn22外觀Outgoing23易焊性Solderability24無鉛化Pb-free/leadfree25結(jié)合力Adhesiveforce26可靠性Reliability27電解Electrolyticdeflash28清洗（自來水）Citywater29高壓清洗Highpressurerinse30脫脂Descale31清洗（純水）DIwater32活化（合金）Activation33預(yù)鍍、預(yù)浸Pre-dip34電鍍Plating35吹風Airblow36中和Neutralization37褪鍍Stripper38拖出Dragout39上料機Loader40下料機Unloader41純錫Tin42純水(去離子水)DIwater43水壓Waterpressure44理化分析Physicalandchemicalanalysis45測厚儀PlatingThicknessMeter/ElectroplatedCoatingThicknessTest46離子污染度測試儀IonContaminationTesterContaminoCT10047C含量測試儀CarbonTester51去氧化HSCUDescale52預(yù)浸Pre-dip53電鍍電流Current54鍍液溫度Temperature電鍍液platingsolution55電鍍槽platingtank56中和Neutralization59烘干Curing60錫球Solderball61錫厚度和成分Snthickness&composition62沖廢De-junk去膠渣63去溢料Degate沖塑，沖膠64去飛邊Deflash去膠(塑封工序)65錫鉛電鍍Tinleadplating66無鉛電鍍Leadfreeplating;Puretinplating67鍍層起泡Solderbump68鍍層剝落Solderpeeloff69鍍層偏厚或偏薄ThickorThinPlating70退錫Solderremove71電鍍報廢Platingscrap72錫渣Solderpeeling73電鍍錫塊Solderbump74電鍍橋接Platingbridge75電鍍變色SPDiscoloration76電鍍污染SPContamination77電鍍錫攀爬SPadhere78電解除油Electro-degreasing測試Testing1測試Testing2打印Lasermark3編帶機Tape&ReelMachine4編帶Reel5測試機Tester6分選機TrayTestHandler7Vision檢測Directionvision8劃傷Scratch9打錯Wrongmark10斷字