PCB專業(yè)用語總集

pcb專業(yè)用語綜合詞匯

1、印制電路：printedcircuit

2、印制線路：printedwiring

3、印制板：printedboard

4、印制板電路：printedcircuitboard(pcb)

5、印制線路板：printedwiringboard(pwb)

6、印制元件：printedcomponent

7、印制接點：printedcontact

8、印制板裝配：printedboardassembly

9、板：board

10、單面印制板：single-sidedprintedboard(ssb)

11、雙面印制板：double-sidedprintedboard(dsb)

12、多層印制板：mulitlayerprintedboard(mlb)

13、多層印制電路板：mulitlayerprintedcircuitboard

14、多層印制線路板：mulitlayerpritedwiringboard

15、剛性印制板：rigidprintedboard

16、剛性單面印制板：rigidsingle-sidedprintedborad

17、剛性雙面印制板：rigiddouble-sidedprintedborad

18、剛性多層印制板：rigidmultilayerprintedboard

19、撓性多層印制板：flexiblemultilayerprintedboard

20、撓性印制板：flexibleprintedboard

21、撓性單面印制板：flexiblesingle-sidedprintedboard

22、撓性雙面印制板：flexibledouble-sidedprintedboard

23、撓性印制電路：flexibleprintedcircuit(fpc)

24、撓性印制線路：flexibleprintedwiring

25、剛性印制板：flex-rigidprintedboard,rigid-flexprintedboard

26、剛性雙面印制板：flex-rigiddouble-sidedprintedboard,rigid-flexdouble-sidedprinted

27、剛性多層印制板：flex-rigidmultilayerprintedboard,rigid-flexmultilayerprintedboard

28、齊平印制板：flushprintedboard

29、金屬芯印制板：metalcoreprintedboard

30、金屬基印制板：metalbaseprintedboard

31、多重布線印制板：mulit-wiringprintedboard

32、陶瓷印制板：ceramicsubstrateprintedboard

33、導電膠印制板：electroconductivepasteprintedboard

34、模塑電路板：moldedcircuitboard

35、模壓印制板：stampedprintedwiringboard

36、順序層壓多層印制板：sequentially-laminatedmulitlayer

37、散線印制板：discretewiringboard

38、微線印制板：microwireboard

39、積層印制板：buile-upprintedboard中國最大的資料庫下載

40、積層多層印制板：build-upmulitlayerprintedboard(bum)

41、積層撓印制板：build-upflexibleprintedboard

42、外表層合電路板：surfacelaminarcircuit(slc)

43、埋入凸塊連印制板：b2itprintedboard

44、多層膜基板：multi-layeredfilmsubstrate(mfs)

45、層間全內導通多層印制板：alivhmultilayerprintedboard

46、載芯片板：chiponboard(cob)

47、埋電阻板：buriedresistanceboard

48、母板：motherboard

49、子板：daughterboard

50、背板：backplane

51、裸板：bareboard

52、鍵盤板夾心板：copper-invar-copperboard

53、動態(tài)撓性板：dynamicflexboard

54、靜態(tài)撓性板：staticflexboard

55、可斷拼板：break-awayplanel

56、電纜：cable

57、撓性扁平電纜：flexibleflatcable(ffc)

58、薄膜開關：membraneswitch

59、混合電路：hybridcircuit

60、厚膜：thickfilm

61、厚膜電路：thickfilmcircuit

62、薄膜：thinfilm

63、薄膜混合電路：thinfilmhybridcircuit

64、互連：interconnection

65、導線：conductortraceline

66、齊平導線：flushconductor

67、傳輸線：transmissionline

68、跨交：crossover

69、板邊插頭：edge-boardcontact

70、增強板：stiffener

71、基底：substrate

72、基板面：realestate

73、導線面：conductorside

74、元件面：componentside

75、焊接面：solderside

76、印制：printing

77、網格：grid

78、圖形：pattern

79、導電圖形：conductivepattern

80、非導電圖形：non-conductivepattern

81、字符：legend

82、標志：mark

二、基材：

1、基材：basematerial

2、層壓板：laminate

3、覆金屬箔基材：metal-cladbadematerial

4、覆銅箔層壓板：copper-cladlaminate(ccl)

5、單面覆銅箔層壓板：single-sidedcopper-cladlaminate

6、雙面覆銅箔層壓板：double-sidedcopper-cladlaminate

7、復合層壓板：compositelaminate

8、薄層壓板：thinlaminate

9、金屬芯覆銅箔層壓板：metalcorecopper-cladlaminate

10、金屬基覆銅層壓板：metalbasecopper-cladlaminate

11、撓性覆銅箔絕緣薄膜：flexiblecopper-claddielectricfilm

12、基體材料：basismaterial

13、預浸材料：prepreg

14、粘結片：bondingsheet

15、預浸粘結片：preimpregnatedbondingsheer

16、環(huán)氧玻璃基板：epoxyglasssubstrate

17、加成法用層壓板：laminateforadditiveprocess

18、預制內層覆箔板：masslaminationpanel

19、內層芯板：corematerial

20、催化板材：catalyzedboard,coatedcatalyzedlaminate

21、涂膠催化層壓板：adhesive-coatedcatalyzedlaminate

22、涂膠無催層壓板：adhesive-coateduncatalyzedlaminate

23、粘結層：bondinglayer

24、粘結膜：filmadhesive

25、涂膠粘劑絕緣薄膜：adhesivecoateddielectricfilm

26、無支撐膠粘劑膜：unsupportedadhesivefilm

27、覆蓋層：coverlayer(coverlay)

28、增強板材：stiffenermaterial

29、銅箔面：copper-cladsurface

30、去銅箔面：foilremovalsurface

31、層壓板面：uncladlaminatesurface

32、基膜面：basefilmsurface

33、膠粘劑面：adhesivefaec

34、原始光潔面：platefinish

35、粗面：mattfinish

36、縱向：lengthwisedirection

37、模向：crosswisedirection

38、剪切板：cuttosizepanel

39、酚醛紙質覆銅箔板：phenoliccellulosepapercopper-cladlaminates(phenolic/paperccl)

40、環(huán)氧紙質覆銅箔板：epoxidecellulosepapercopper-cladlaminates(epoxy/paperccl)

41、環(huán)氧玻璃布基覆銅箔板：epoxidewovenglassfabriccopper-cladlaminates

42、環(huán)氧玻璃布紙復合覆銅箔板：epoxidecellulosepapercore,glassclothsurfacescopper-cladlaminates

43、環(huán)氧玻璃布玻璃纖維復合覆銅箔板：epoxidenonwoven/wovenglassreinforcedcopper-cladlaminates

44、聚酯玻璃布覆銅箔板：ployesterwovenglassfabriccopper-cladlaminates

45、聚酰亞胺玻璃布覆銅箔板：polyimidewovenglassfabriccopper-cladlaminates

46、雙馬來酰亞胺三嗪環(huán)氧玻璃布覆銅箔板：bismaleimide/triazine/epoxidewovenglassfabriccopper-cladlamimates

47、環(huán)氧合成纖維布覆銅箔板：epoxidesyntheticfiberfabriccopper-cladlaminates

48、聚四乙烯玻璃纖維覆銅箔板：teflon/fiberglasscopper-cladlaminates

49、超薄型層壓板：ultrathinlaminate

50、陶瓷基覆銅箔板：ceramicsbasecopper-cladlaminates

51、紫外線阻擋型覆銅箔板：uvblockingcopper-cladlaminates

三、基材的材料

1、a階樹脂：a-stageresin

2、b階樹脂：b-stageresin

3、c階樹脂：c-stageresin

4、環(huán)氧樹脂：epoxyresin

5、酚醛樹脂：phenolicresin

6、聚酯樹脂：polyesterresin

7、聚酰亞胺樹脂：polyimideresin

8、雙馬來酰亞胺三嗪樹脂：bismaleimide-triazineresin

9、丙烯酸樹脂：acrylicresin

10、三聚氰胺甲醛樹脂：melamineformaldehyderesin

11、多官能環(huán)氧樹脂：polyfunctionalepoxyresin

12、溴化環(huán)氧樹脂：brominatedepoxyresin

13、環(huán)氧酚醛：epoxynovolac

14、氟樹脂：fluroresin

15、硅樹脂：siliconeresin

16、硅烷：silane

17、聚合物：polymer

18、無定形聚合物：amorphouspolymer

19、結晶現(xiàn)象：crystallinepolamer

20、雙晶現(xiàn)象：dimorphism

21、共聚物：copolymer

22、合成樹脂：synthetic

23、熱固性樹脂：thermosettingresin

24、熱塑性樹脂：thermoplasticresin

25、感光性樹脂：photosensitiveresin

26、環(huán)氧當量：weightperepoxyequivalent(wpe)

27、環(huán)氧值：epoxyvalue

28、雙氰胺：dicyandiamide

29、粘結劑：binder

30、膠粘劑：adesive

31、固化劑：curingagent

32、阻燃劑：flameretardant

33、遮光劑：opaquer

34、增塑劑：plasticizers

35、不飽和聚酯：unsatuiatedpolyester

36、聚酯薄膜：polyester

37、聚酰亞胺薄膜：polyimidefilm(pi)

38、聚四氟乙烯：polytetrafluoetylene(ptfe)

39、聚全氟乙烯丙烯薄膜：perfluorinatedethylene-propylenecopolymerfilm(fep)

40、增強材料：reinforcingmaterial

41、玻璃纖維：glassfiber

42、e玻璃纖維：e-glassfibre

43、d玻璃纖維：d-glassfibre

44、s玻璃纖維：s-glassfibre

45、玻璃布：glassfabric

46、非織布：non-wovenfabric

47、玻璃纖維墊：glassmats

48、紗線：yarn

49、單絲：filament

50、絞股：strand

51、緯紗：weftyarn

52、經紗：warpyarn

53、但尼爾：denier

54、經向：warp-wise

55、緯向：weft-wise,filling-wise

56、織物經緯密度：threadcount

57、織物組織：weavestructure

58、平紋組織：plainstructure

59、壞布：greyfabric

60、稀松織物：wovenscrim

61、弓緯：bowofweave

62、斷經：endmissing

63、缺緯：mis-picks

64、緯斜：bias

65、折痕：crease

66、云織：waviness

67、魚眼：fisheye

68、毛圈長：featherlength

69、厚薄段：mark

70、裂縫：split

71、捻度：twistofyarn

72、浸潤劑含量：sizecontent

73、浸潤劑殘留量：sizeresidue

74、處理劑含量：finishlevel

75、浸潤劑：size

76、偶聯(lián)劑：couplintagent

77、處理織物：finishedfabric

78、聚酰胺纖維：polyarmidefiber

79、聚酯纖維非織布：non-wovenpolyesterfabric

80、浸漬絕緣縱紙：impregnatinginsulationpaper

81、聚芳酰胺纖維紙：aromaticpolyamidepaper

82、斷裂長：breakinglength

83、吸水高度：heightofcapillaryrise

84、濕強度保存率：wetstrengthretention

85、白度：whitenness

86、陶瓷：ceramics

87、導電箔：conductivefoil

88、銅箔：copperfoil

89、電解銅箔：electrodepositedcopperfoil(edcopperfoil)

90、壓延銅箔：rolledcopperfoil

91、退火銅箔：annealedcopperfoil

92、壓延退火銅箔：rolledannealedcopperfoil(racopperfoil)

93、薄銅箔：thincopperfoil

94、涂膠銅箔：adhesivecoatedfoil

95、涂膠脂銅箔：resincoatedcopperfoil(rcc)

96、復合金屬箔：compositemetallicmaterial

97、載體箔：carrierfoil

98、殷瓦：invar

99、箔〔剖面〕輪廓：foilpro、光面：shinyside

101、粗糙面：matteside

102、處理面：treatedside

103、防銹處理：stainproofing

104、雙面處理銅箔：doubletreatedfoil

四、設計

1、原理圖：shematicdiagram

2、邏輯圖：logicdiagram

3、印制線路布設：printedwirelayout

4、布設總圖：masterdrawing

5、可制造性設計：design-for-manufacturability

6、計算機輔助設計：computer-aideddesign.(cad)

7、計算機輔助制造：computer-aidedmanufacturing.(cam)

8、計算機集成制造：computerintegratmanufacturing.(cim)

9、計算機輔助工程：computer-aidedengineering.(cae)

10、計算機輔助測試：computer-aidedtest.(cat)

11、電子設計自動化：electricdesignautomation.(eda)

12、工程設計自動化：engineeringdesignautomaton.(eda2)

13、組裝設計自動化：assemblyaidedarchitecturaldesign.(aaad)

14、計算機輔助制圖：computeraideddrawing

15、計算機控制顯示：computercontrolleddisplay.(ccd)

16、布局：placement

17、布線：routing

18、布圖設計：layout

19、重布：rerouting

20、模擬：simulation

21、邏輯模擬：logicsimulation

22、電路模擬：circitsimulation

23、時序模擬：timingsimulation

24、模塊化：modularization

25、布線完成率：layouteffeciency

26、機器描述格式：machinedescriptionmformat.(mdf)

27、機器描述格式數(shù)據(jù)庫：mdfdatabse

28、設計數(shù)據(jù)庫：designdatabase

29、設計原點：designorigin

30、優(yōu)化〔設計〕：optimization(design)

31、供設計優(yōu)化坐標軸：predominantaxis

32、表格原點：tableorigin

33、鏡像：mirroring

34、驅動文件：drive、中間文件：intermediate、制造文件：manufacturingdocumentation

37、隊列支撐數(shù)據(jù)庫：queuesupportdatabase

38、元件安置：componentpositioning

39、圖形顯示：graphicsdispaly

40、比例因子：scalingfactor

41、掃描填充：scanfilling

42、矩形填充：rectanglefilling

43、填充域：regionfilling

44、實體設計：physicaldesign

45、邏輯設計：logicdesign

46、邏輯電路：logiccircuit

47、層次設計：hierarchicaldesign

48、自頂向下設計：top-downdesign

49、自底向上設計：bottom-updesign

50、線網：net

51、數(shù)字化：digitzing

52、設計規(guī)那么檢查：designrulechecking

53、走〔布〕線器：router(cad)

54、網絡表：netlist

55、計算機輔助電路分析：computer-aidedcircuitanalysis

56、子線網：subnet

57、目標函數(shù)：objectivefunction

58、設計后處理：postdesignprocessing(pdp)

59、交互式制圖設計：interactivedrawingdesign

60、費用矩陣：costmetrix

61、工程圖：engineeringdrawing

62、方塊框圖：blockdiagram

63、迷宮：moze

64、元件密度：componentdensity

65、巡回售貨員問題：travelingsalesmanproblem

66、自由度：degreesfreedom

67、入度：outgoingdegree

68、出度：incomingdegree

69、曼哈頓距離：manhattondistance

70、歐幾里德距離：euclideandistance

71、網絡：network

72、陣列：array

73、段：segment

74、邏輯：logic

75、邏輯設計自動化：logicdesignautomation

76、分線：separatedtime

77、分層：separatedlayer

78、定順序：definitesequence

五、形狀與尺寸：

1、導線〔通道〕：conduction(track)

2、導線〔體〕寬度：conductorwidth

3、導線距離：conductorspacing

4、導線層：conductorlayer

5、導線寬度/間距：conductorline/space

6、第一導線層：conductorlayerno.1

7、圓形盤：roundpad

8、方形盤：squarepad

9、菱形盤：diamond