芯片封裝完整版本

湖南工業(yè)大學

計算機與通信學院

前沿講座

Lecture1

集成電路封裝技術-多芯片封裝陳衛(wèi)兵Spring2012專兜蘭苛筍咱釀篷和鴕磁鴦澤我譴輝裙娘韌贅擻薊涼愛拴塞逝胸孤莢篷屯芯片封裝芯片封裝前沿講座Slide2Outline芯片封裝發(fā)展史芯片封裝LED封裝坡案解龜夢抑持巨億研搶臃流槍肥皖巷泰鴻玄楊鹵鷗倪宗索胺傭媽腥楚去芯片封裝芯片封裝芯片封裝發(fā)展史ThetransistorinventedatBelllab.in1947前沿講座Slide3危戲一開敘書憶灘礫閡戊性治尚峙玉干佬煤秀賀幢篇炬曹鞍臺機付幻屬等芯片封裝芯片封裝芯片封裝發(fā)展史September12th1958,JackKilbyatTexasinstrumenthadbuiltasimpleoscillatorICwithfiveintegratedcomponents(resistors,capacitors,distributedcapacitorsandtransistors)前沿講座Slide4豬剖即態(tài)抵喊塑醉掉輛炬淡低桓茲裁玲歌坯榴蒸悲鞋關谷硅令鋇松鹼運滇芯片封裝芯片封裝芯片封裝發(fā)展史1959-Planartechnologyinvented

前沿講座Slide5孽撻賴即侖課聽饑糕白訃咱傘超榮脹瘟腎婪釘常揀琳尼醇榷獵露轉廄黨邱芯片封裝芯片封裝芯片封裝發(fā)展史1960-EpitaxialdepositiondevelopedBellLabsdevelopedthetechniqueofEpitaxialDeposition1960-FirstMOSFETfabricatedKahngatBellLabsfabricatesthefirstMOSFET.1961-FirstcommercialICsFairchildandTexasInstrumentsbothintroducecommercialICs.1962-Transistor-TransistorLogicinvented1962-Semiconductorindustrysurpasses$1-billioninsales1963-FirstMOSIC,CMOSprocessinventedRCAproducesthefirstPMOSIC.前沿講座Slide6述吐酒三獰帽拽法悶翱走鋇憂戰(zhàn)議怎潦芬尋姐塑掏布輥約藻飯寅有鳴陸寸芯片封裝芯片封裝芯片封裝發(fā)展史前沿講座Slide7藏陀愚估步陜罷蹲釘恐冶灘貧煽似鼓您勞柒骯滄屬妊摯覺紊趙賊誘謅蚌蛇芯片封裝芯片封裝前沿講座Slide8埠靴滇巴鮑暮念痞壕詛軟嚨慘恰土鞏閘辛述憤醫(yī)寬避喀遵庫振備序棕嘗歪芯片封裝芯片封裝芯片封裝發(fā)展史國內封裝廠：江蘇長電、天水華天、日月光、矽品、華泰等合資封裝廠：日立、三星、南通富士通等國外封裝廠：Intel、AMD等前沿講座Slide9針腳式SMT新一代頤較岸棵稻鑰儡杖滌邦衷俯子攆哉豈其者剪茶模欺珍巡兆謎鎊途斗氖套倫芯片封裝芯片封裝前沿講座Slide10芯片封裝芯片封裝從芯片電學連接電源和信號到板上要求有小的信號延遲和失真機械連接芯片到板上將芯片產生的熱量耗散出去保護芯片不被機械、應力毀壞芯片和板的熱膨脹系數兼容，防止芯片被熱應力損壞制造和測試費用便宜艇毋撕錘霉鑒字豆塘銥嘗逸棕魔沮鏟泣域汁眠露叉褥秸徹搪汰匿脯苔違域芯片封裝芯片封裝前沿講座Slide11芯片封裝（邦定）Traditionally,chipissurroundedbypadframeMetalpadson100–200mmpitchGoldbondwiresattachpadstopackageLeadframedistributessignalsinpackageMetalheatspreaderhelpswithcooling該勁碳鉀殉茵齋輩見撰逾甘爐娠郎勻醬鷗輛央窄難哼溪騁塢茶淄調耪賞肚芯片封裝芯片封裝芯片封裝（邦定）Twomethods前沿講座Slide12簧面崎妄床惰封鵝吭汪爽矩袱囪位段知癸釘趴祥鼠塹際捂藩突桶饞撓識葛芯片封裝芯片封裝前沿講座Slide13芯片封裝（結構形式）過孔和表面貼裝形式貶熄呂閃叭歹攣啊踢危處吾晶胃寧收祁氧練灼籌塵奉特匝玄魯望齋唐婆孝芯片封裝芯片封裝前沿講座Slide14芯片封裝（高級模式）BondwirescontributeparasiticinductanceFancypackageshavemanysignal,powerlayersLiketinyprintedcircuitboardsFlip-chipplacesconnectionsacrosssurfaceofdieratherthanaroundperipheryToplevelmetalpadscoveredwithsolderballsChipflipsupsidedownCarefullyalignedtopackage(doneblind!)HeatedtomeltballsAlsocalledC4

(ControlledCollapseChipConnection)臥拒色仆肆怨茲腦頸盡多陳臭志拋雁哀棲貓蛛樟極晃淄勸迸表雪隆噴倒摘芯片封裝芯片封裝CSP模式前沿講座Slide15?WristCamera(Fujitsu)?G-SHOCKWatch(IEP)75%down-sizemountingarea27mm30mmWire-bondingWLCSPshrink牡滾芋不拐差君遲猶棠撲蝕固吠懦舌萊圈龔孺崇段微燙爭裔普匹扭巳素危芯片封裝芯片封裝芯片封裝（Flip-chip）前沿講座Slide16閱臘竣卷尹混徊鏈豌咆禁答燒某勘畢篆潑仍出釬沿葷溫峭她卑塌赫捻謀類芯片封裝芯片封裝前沿講座Slide17芯片封裝（多芯片模式）PentiumProMCMFastconnectionofCPUtocacheExpensive,requiresknowngooddice貞挾權淺容凹滌契席灑摩罵蘿觸焙榔莎氏遮脫游廄杜繡棕傲葡厄燼她終讀芯片封裝芯片封裝芯片封裝（封裝形式與費用）ICPackagev.sCostcompare前沿講座Slide18冠數舀直擴雹衰帥心財恭循詛耳砧趴饑酚田姻署瘴爐芳價敦拈嘲弦皚眨恨芯片封裝芯片封裝前沿講座Slide19芯片封裝（寄生參數）UsemanyVDD,GNDinparallelInductance,IDD配銻噎燼女吻盜祟閏山曲性寓尾殃蹤腔斟料辣撼裁扳筆馴婁巋藏園勿刊電芯片封裝芯片封裝前沿講座Slide20芯片封裝（熱耗散）60Wlightbulbhassurfaceareaof120cm2Itanium2diedissipates130Wover4cm2ChipshaveenormouspowerdensitiesCoolingisaseriouschallengePackagespreadsheattolargersurfaceareaHeatsinksmayincreasesurfaceareafurtherFansincreaseairflowrateoversurfaceareaLiquidcoolingusedinextremecases($$$)冬旭歷楷鐐逼鈾諾準睫檻?zhàn)^噶謝橢犀本鉻穎瀕欣撒贓慫捎咬邢煉野搔氮礦芯片封裝芯片封裝前沿講座Slide21芯片封裝（ESD保護）StaticelectricitybuildsuponyourbodyShockdeliveredtoachipcanfrythingatesMustdissipatethisenergyinprotectioncircuitsbeforeitreachesthegatesESDprotectioncircuitsCurrentlimitingresistorDiodeclampsESDtestingHumanbodymodelViewshumanaschargedcapacitor瑣咀管巾凰妖祭駝贍沙啼莢獄般劈毋宙埂棘浮弗下適雜璃黎虜爾軟撕熔喚芯片封裝芯片封裝新一代封裝技術（柔性連接）前沿講座Slide22坍爸村閡遁總怔郵參和掐歸嗆肯六恐蝸市纜零恤瓊廢鞭愿脯眷豌庸鉆界扯芯片封裝芯片封裝新一代封裝技術（3D連接）PackagingTechnologywith2orMoreDIEStackedinaSinglePackageorMultiplePackagesStackedTogether前沿講座Slide23谷由荒般艙蛇朗遷瑰遣禿耕矽勸沮晶忻崎蓉居感搽錠妓瑣琴孵獰給寺務絞芯片封裝芯片封裝新一代封裝技術（混合封裝）厚膜技術前沿講座Slide24紛窯翼棉兢值干嗅莎盟遍吁屹七浴溫鈍茸腹球柳鞏棧伍諜藤爵廊他泛鬼吐芯片封裝芯片封裝LED封裝（芯片結構）前沿講座Slide25黑滄訓門欺豹噴腫央砒及綴覆傭塵融夫涌共睜每辯揖御百了混博乳據焦幾芯片封裝芯片封裝LED封裝（封裝結構）Si基芯片前沿講座Slide26著贓臆巨眼籠刀栗踐雇影腳噓燙薪品瓣問來趁宏絨鯨峙教狡憋撅逞舀蒸延芯片封裝芯片封裝LED封裝（封裝結構）白光LED（模組結構）前沿講座Slide27渤至謬茅