NVIDIA Jetson Xavier NX Thermal Design Guide原版完整文件

TDG-09774-001_v1.0|February2020

NVIDIAJetsonXavierNX

ThermalDesignGuide

DocumentHistory

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Date

DescriptionofChange

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February10,2020

InitialRelease

TableofContents

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Chapter1. Introduction 1

CustomerRequirements 1

Definitions 1

TotalModulePower 1

JetsonXavierNX 2

XavierSoCTemperature 4

Chapter2. Specifications 5

ThermalSpecifications 5

Chapter3. DesignGuidance 6

ThermalInformation 6

JetsonXavierNXThermalPerformance 6

JetsonXavierNXThermalDesignDetails 10

CustomerThermalSolution 11

TemperatureCycling 11

MechanicalInformation 11

HeatSinkMountingGuidelines 12

AssemblyGuidelines 13

Chapter4. ThermalManagement 14

TemperatureMode 14

FanControl 14

XavierSoCMaximumOperatingTemperature 17

XavierSoCHardwareThermalThrottling 17

XavierSoCShutdownTemperature 18

ListofFigures

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Figure1-1. JetsonXavierNX–TopsideView 2

Figure1-2. JetsonXavierNX–BacksideView 3

Figure3-1. ThermalResistanceNetwork 7

Figure3-2. ComponentPlacementMapforJetsonXavierNX 8

Figure3-3. ThermalStack-upSchematic 11

Figure3-4. ModuleBoardwithMountingFeatures 12

Figure3-5. ModuleBoardPCBBackSupportKeepOutArea 13

Figure4-1. FanControlAlgorithmfor“QuietMode” 15

Figure4-2. FanControlAlgorithmfor“CoolMode” 16

ListofTables

Table2-1. JetsonXavierNXThermalSpecifications 5

Table3-1. JetsonXavierNXThermalPerformance 9

Table4-1. DefaultFanControlParametersfor“QuietMode” 15

Table4-2. DefaultFanControlParametersfor“CoolMode” 16

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Chapter1.Introduction

Thisdocumentisthethermaldesignguide(TDG)fortheNVIDIA?JetsonXavier?NXproduct.

Thepurposeofthisthermaldesignguideistoprovidethesystem-levelthermal,mechanicalandqualificationrequirementsfortheJetsonXavierNX.

RefertotheJetsonXavierNXmoduledatasheetfordetaileddrawingandmoduledimensions.

CustomerRequirements

Thecustomerrequirementsareasfollows:

?Customersareresponsibleforreadingandunderstandingthisentirethermaldesignguide.

?CustomersareresponsibleforimplementingathermalsolutionthatmaintainstheNVIDIA?Xavier?systemonchip(SoC)temperaturesbelowthespecifiedtemperaturesin

Table2-1

underthemaximumthermalloadandsystemconditionsfortheirusecase.

?CustomersareresponsiblefordesigningasystemthatdeliversenoughpowertotheJetsonXavierNXtosustainthemaximumthermalloadfortheirusecase.

?CustomersareresponsibleforqualificationoftheJetsonXavierNXintheirsystemandareresponsibleforanyissuesrelatedtofailuretoqualifytheproductproperly.

Definitions

Thissectiondescribesterminologythatwillbereferencedthroughoutthisthermaldesignguide.

TotalModulePower

Thetotalmodulepower(TMP)representstheaverageboardpowerdissipationwhilethesystemisrunningthetargetworkloadundertheworst-caseconditionsinsteadystate.SystemdesignsmustbecapableofprovidingenoughcoolingfortheJetsonXavierNXwhenoperatingattheTMPlevel.

Introduction

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JetsonXavierNX

Figure1-1

providesatopsideviewoftheJetsonXavierNXwhile

Figure1-2

providesthebacksideview.

Figure1-1. JetsonXavierNX–TopsideView

Figure1-2. JetsonXavierNX–BacksideView

Thethermalsolutionofthecustomer’ssystemdesignshouldattachtothemoduledirectly.MountingholesareprovidedonthePCBtoenableattachmentofthecustomer’sthermalsolution.MoredetailsareprovidedinSection

3.2

“MechanicalInformation.”Customer’ssystemthermalsolutionmustprovideadequatecoolingtomaintainallthecomponentsonthePCBincludingtheXavierSoCbelowthemaximumtemperaturespecificationsasdetailedinSection

2.1

andSection

3.1.

XavierSoCTemperature

TheXavierSoCjunctiontemperature(Tj)representstheXavierSoCdietemperaturereadfromanyoftheinternaltemperaturesensors.Theon-diethermalsensorsareusedforhigh-temperatureTjmanagementandmanyothertemperature-dependentfunctions.Detailsregardingthesoftwarethermalmechanismsaredescribedin

Chapter4

.

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Chapter2.Specifications

ThermalSpecifications

OnXavierSoC,therearemultipleon-dietemperaturesensorsthatareplacedclosetodominanthotspotsforrealtimemeasurementsofjunctiontemperature.Abuilt-inhardwarecontrollerisusedtoreadthesensorsandengagethermalprotectionmechanisms.

Chapter4

containsthedetailsrelatedtosensorthermalprotectionmechanisms.Thespecificationsin

Table2-1

mustbefollowedinordertomaintaintheperformanceandreliabilityoftheJetsonXavierNXmodule.

Table2-1. JetsonXavierNXThermalSpecifications

Parameter

Value

Units

MaximumXavierSoCoperatingtemperature1

T.cpu=90.5

°C

T.gpu=91.5

°C

T.aux=90.0

°C

XavierSoCshutdowntemperature2

T.cpu=96.0

°C

T.gpu=97.0

°C

T.aux=95.5

°C

Notes:

1TheXavierSoCmaximumoperatingtemperatureisthetemperaturebelowwhichtheproductwilloperateatthespecifiedclockspeeds.Softwarewillapplyclockspeedreductionsoncethistemperatureisreached.NotethatpowerfluctuationsthatinduceTjfluctuationsabovethesethresholdswillcausetemporaryclockreductions.SeeSection

4.3

fordetails.

2TheXavierSoCwillshutdowntheJetsonXavierNXmoduleonceanyofthesesoftware-imposed

temperaturelimitsarereachedinordertomaintainthereliabilityoftheXavierSoC.SeeSection

4.5

fordetails.

Chapter3.DesignGuidance

ThischapterprovidesdesignguidanceinordertomeettheJetsonXavierNXmodulespecifications.

ThermalInformation

ThedesigngoalforsystemthermalmanagementistokeeptheXavierSoCtemperaturebelowthelimitsspecifiedinSection

2.1.

JetsonXavierNXThermalPerformance

TheJetsonXavierNXmoduleisnotequippedwithasystemlevelthermalsolutiontodissipatetheTMPthermalloadintotheambientenvironment.Itisthecustomer’sresponsibilitytodesignanadequatethermalsolutiontomaintainallthecomponenttemperaturesbelowthede-ratedlimitsasspecifiedin

Table3-1.

Figure3-2

providesamapofthecomponentplacementontheJetsonXavierNXPCBaslistedin

Table3-1.

Thethermalresistancenetworkforthesystemthermalsolutioncanberepresentedwiththefollowingequation:

Where:

????12

=????1?????2

????

????12 ThethermalresistancebetweenPoint1andPoint2

???????? ThetemperatureatPointn

???? Theheatload(i.e;dissipatedpower)transferredbetweenPoints1and2

Asimpleexampleofathermalresistancenetworkisshownin

Figure3-1,

whereθjarepresentsthethermalresistancefromTjtotheambientofthesystemthermalsolution.Thethermalresistanceofthesystemthermalsolutionmayincludemultiplecomponentsincluding,butnotlimitedto,thermalinterfacematerial,heatspreaders,andheatsinks.

DesignGuidance

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Figure3-1. ThermalResistanceNetwork

θja

T.j

T.amb

TMP

JetsonXavierNXenablesawidevarietyofapplicationsthatmayexercisedifferentcomponentsonthemodule.ThevariationbetweenapplicationswillcausevariationinheatloadsonthedifferentcomponentsontheJetsonXavierNXandhotspotsindifferentlogicalpartitionsoftheXavierSoC.Whilethesystemthermalsolutionwillhelptospreadtheheatandmakethethermalperformanceasconsistentaspossible,differentapplicationswillhavedifferentlevelsofthermalperformance.ThemoreevenlythemodulepowerisdistributedacrosstheJetsonXavierNXthehigherthethermalperformancewillbe.

Figure3-2. ComponentPlacementMapforJetsonXavierNX

15

2

2

1

9

5

8

4

6

6

10

10

12

13

16

TopSide

6

BottomSide

11

23

14

2

2

18 22

7

17

21

3

19

20

Table3-1. JetsonXavierNXThermalPerformance

Miscellaneous

Comp#onMap

REFDES(s)

Description

Qty

ThermalSpecifications

Tcase

(Number)

(Name)

(Count)

°C

1

U4

T194

1

Refertotable2-

1

2

M1,M2,M3,

M4

LPDDR4xMemory

4

85

3

U506

CPU/GPU/CVVoltageRegulator

1

85

4

Q14

CPU/GPU/CVDualPackageMOSFET

1

115

5

L17

CPU/GPU/CVInductor

1

125

6

C59,C64

CPU/GPU/CVOutputPOSCAP

2

105

7

U512

SOCVoltageRegulator

1

85

8

Q8

SOCDualPackageMOSFET

1

115

9

L5

SOCInductor

1

125

10

C22,C28

SOCOutputPOSCAP

2

105

11

U2

DDRVDD2Regulator

1

85

12

L2

DDRVDD2Inductor

1

85

13

C14

DDRVDD2OutputPOSCAP

1

105

14

U1

DDRVDDQRegulator

1

85

15

L1

DDRVDDQInductor

1

85

16

C11

DDRVDDQOutputPOSCAP

1

105

17

U15

PMIC

1

105

18

L502

PMICSD0Inductor

1

125

19

L98

PMICSD1Inductor

1

125

20

L503

PMICSD2Inductor

1

125

21

L504

PMICSD3Inductor

1

125

22

L505

PMICSD4Inductor

1

125

23

U521

eMMC(onlyinSKU1)

1

95

ComponentsthatwillbecontactedbythethermalsolutionandneedtobemonitoredComponentsthatmustbemonitored

Note:

Table3-1

issubjecttochange.

TherequiredsystemthermalperformancecanbedeterminedbasedontheambienttemperatureconditionsandTMPlevelrequiredbythecustomer.Considerthefollowingexample:

????.????????????=55°????

????.????????????=86.00°????(Targeting4°????T.cpuheadroomtoaccountforsensorinaccuracyandpossibleTjfluctuationsresultingfromworkloadvariation)

????????????????=15????

Theheatsinkthermalperformancerequirementfortheaboveconditions.

????

=86°?????55°????=????.????????°????

????????

15????

????

Inthisexample,a2.06°C/WthermalsolutionisexpectedtobesufficienttomaintaintheXavierSoCwithinthemaximumtemperaturespecificationasdetailedin

Table2-1.

Inadditiontothis,thecustomerisresponsibletoverifythatthisthermalsolutioncanmaintainallothercomponentsofthemodulewithintheirmaximumtemperaturespecificationsasdetailedin

Table3-1.

JetsonXavierNXThermalDesignDetails

Thecustomerisresponsibleforthefollowingitems:

?ThermalSolution–AsystemthermalsolutioncapableofcoolingtheappropriateamountofTMPforthetargetworkload.

?HS_TIM–Thecustomerisresponsibleforprovidingthethermalinterfacematerial(TIM)betweentheJetsonXavierNXmoduleandcustomer’ssystemlevelthermalsolution.Forbestthermalperformance,theTIMshouldprovidelowthermalimpedancewithinthemechanical,reliability,andcostconstraintsofthecustomer’sproduct.

?MaximumTemperature-ToensurethatthemaximumXavierSoCoperatingtemperatureislessthanthevaluespecifiedin

Table2-1,

andthemaximumcomponenttemperaturesonthePCBmustnotexceedthevaluespecifiedin

Table3-1.

Examplethermalstackupisshownin

Figure3-3

.

Figure3-3. ThermalStack-upSchematic

CustomerThermalSolution

XavierTIM

Xavier

PCB

TIM

TIM

Component

Component

CustomerThermalSolution

CustomerThermalSolution

Thecustomer’sthermalsolutionisthemechanicalelementthatinterfacestotheJetsonXavierNXmoduleandprovidescooling.Avarietyofthermalsolutionconfigurationsarepossibledependingonthecustomer’schassisdesign.Inallcases,however,thefollowingrecommendationsareapplicable:

?GoodcontactofthethermalsolutiontotheXavierSoCiscriticalformaximizingthethermalperformanceoftheJetsonXavierNX.TheXavierSoCconsumesthemajorityoftheTMP.

?Customermustdetermineifsystemthermalsolutionneedstocontactall/selectcomponentsonthePCBtomakesurethattheyaremaintainedwithinthemaximumtemperaturespecificationslistedin

Table2-1.

TemperatureCycling

Long-termreliabilityofallsolderinterconnectsisnegativelyimpactedbytemperaturecycling.Itisthecustomer’sresponsibilitytominimizethecomponent’sexposuretotemperaturecyclingandtonotexceedthatwhichthecomponentisqualified.NVIDIA’sgraphicsandcorelogiccomponentsarequalifiedtoJEDECstandardJESD47.

Note:NVIDIArecommendsthatcustomersrefertoJESD94B(ApplicationSpecificQualificationUsingKnowledgeBasedTestMethodology)formoreinformation.

MechanicalInformation

RefertotheJetsonXavierNXmodulemechanicaldrawingfortheexactmoduledimensionstodeterminehowtointerfacethemoduleboardwiththesystemthermalsolutionandensuremechanicalcompatibility.

HeatSinkMountingGuidelines

Asnotedinthethermalsection,themechanicaldesignofthesystemmustensuregoodcontactbetweenthethermalsolution,XavierSoCandthemoduleboard.Themoduleboardisprovidedwithmountingholestoaccommodatemountingoptionsforasuitableheatsink.

Figure3-4. ModuleBoardwithMountingFeatures

ThefollowingguidelinesshouldbefollowedtoensuregoodmechanicalandthermalcontactbetweenthechassisthermalsolutionandtheModuleboard.

?Fourholes(?3.2mm)areprovidedneartheXavierSoC(Shownin

Figure3-4

)andtwoholes(?2.75mm)ontheedgeoppositetoedgeconnector(Shownin

Figure3-5

).

?AllholesareNPTHwithannulargroundpads.TheseholescanbeusedforsystemmountaswellasHeatsinkmountbasedonindividualcustomerdesignintents.

?Shoulderscrewscanbeusedforallmountingholelocationstopreventthreaddamagingtheboard.

?Maximummountingforceforthethermalsolutionis4kgf.

?Thereisakeep-outareabehindthemoduleboardtoallowforbackplatetosupporttheboardwhileheatsinkismountedfromtopside.

?

Figure3-5

illustrateswheremoduleprovidesroomforbackplateshouldthedesignrequireabackplatetoassistinstiffeningtheboardandformounting/lockingfeatures.Theoutlineshowsthekeep-outareaforthebackplateonbacksideofthemodule.

Figure3-5. ModuleBoardPCBBackSupportKeepOutArea

AssemblyGuidelines

TheJetsonXavierNXcomeswithJEDECstandard260DDR4SODIMM0.5MMpitchedgeconnectorandareprovidedtointerfacewith260PINDDRSODIMMSOCKETWITH0.5MMPICTH,basedonSO-018.

Orientationoftheunitistobealignedwiththeconnectorandsecuredtothebaseboard.Suggestedhardwareformountingthemoduletothebaseboardisuseofstandoffbetweenthetwoboard,anchoredwithscrewoneachboard.

Herearesomesuggestedassemblyguidelines.

Assembletheheatsinkandfanifneededonthemoduleboard.

InstalltheJetsonXavierNXmodule

BaseboardwithsuitablestandoffforasperSoDIMMconnectorheightdefined

Insertmoduleatanangleof25-35degreeintotheSODIMMconnector.

ArcdownthemoduleboarduntilitlatchestotheSODMMconnector

SecuretheJetsonXavierNXmoduletothebaseboardwithscrewsontothestandoff/spacer.

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Chapter4.ThermalManagement

TemperatureMode

TheXavierSoCjunctiontemperaturecanbedirectlyreadfromsysfsnodes,asshowninthefollowingexample.Notethatthenameofeachtemperaturezoneisnotedinthetypenodeandthatthetemperaturevaluesarereportedinunitsofm°C.

cat/sys/devices/virtual/thermal/thermal_zone0/typecpu-therm

#cat/sys/devices/virtual/thermal/thermal_zone0/temp35000

FanControl

TheJetsonXavierNXcanbeconfiguredtocontrolasystemfan.Pulsewidthmodulation(PWM)outputandtachometerinputaresupported.JetsonXavierNXhasconfigurablefancontrolofstep-basedspeedcontrolwithhysteresis,asshownin

Figure4-1

and

Figure4-2.

Twodifferentfanmodesettingsareavailableforbetteruserexperience.Thetwofanmodesare“QuietMode”and“CoolMode”respectively.Thedefaultfanmodeissetto“QuietMode.”Thedefaultfancurvesettingsforthe“QuietMode”arelistedin

Table4-1.

Thedefaultfancurvesettingsforthe“CoolMode”arelistedin

Table4-2.

NotethatPWMisconfiguredona2^8scale,with255beingequivalentto100%dutycycle.

ThermalManagement

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Figure4-1. FanControlAlgorithmfor“QuietMode”

Table4-1. DefaultFanControlParametersfor“QuietMode”

“thermalfan-est”ThermalZoneTemperature1

PWM

Hysteresis2(°C)

46

130

8

60

160

8

68

200

7

76

255

7

Notes:

1Fanspeediscontrolledbythethermal-fan-estsensor,whichreportstheweightedaverageoftheCPU,GPU,andAUXsensorsata3:3:4ratio.

2Thehysteresissetforeachtrippointmustbegreaterthantheprevioustrippoint.

Figure4-2. FanControlAlgorithmfor“CoolMode”

Table4-2. DefaultFanControlParametersfor“CoolMode”

“thermalfan-est”ThermalZoneTemperature1

PWM

Hysteresis2(°C)

35

140

8

45

170

8

53

200

7

61

255

7

Notes:

1Fanspeediscontrolledbythethermal-fan-estsensor,whichreportstheweightedaverageoftheCPU,GPU,andAUXsensorsata3:3:4ratio.

2Thehysteresissetforeachtrippointmustbegreaterthantheprevioustrippoint.

Customfansettingscanbeimplementedifneeded.RefertothePlatformAdaptationandBring-upGuidefordetails.

XavierSoCMaximumOperatingTemperature

Therecommendedoperatingtemperaturelimitisthethresholdatwhichthemodulewilloperatewithoutperformancereduction.Thesetemperaturesarelistedin

Table2-1

andcannotbeadjusted.Thecustomer’stoleranceforperformancereductionshoulddeterminetheamountofTjoperatingheadroominthethermalsolutiondesigninordertoaccommodatethetemperaturesensoraccuracyof±3°C.

Softwarethermalmanagementoperatesasfollows:

?Whenthemeasuredtemperatureisatorbelowtheoperatingtemperaturethreshold,softwareTjthermalmanagementisnotengagedandthesystemisfreetovarythesystemfrequenciesandvoltages.

?Whenthemeasuredtemperaturereachesthethermalmanagementthreshold,theinternalthermalsensorsgenerateaninterrupttosoftware.Atthispointthesoftwarethermalmanagementalgorithmengagesandbeginsperiodicallyperformingthefollowingoperations:

Pollingtemperature.

Runningathermalmanagementcontrolalgorithmtocalculatingthethrottledegree,indicatingtheamountofthrottlingtoapplyduringthenexttimeperiod.

Throttlingthesystemtothelevelofthrottlingindicatedbythethrottlingcontrolalgorithm.Throttlingisappliedthroughlimitsontheclockfrequencyofhigh-powerunitssuchastheCPUandgraphicsprocessingunit(GPU).Higherthrottlingdegreeresultsinlowerfrequencylimits.DVFSpoliciesoperatewithinthesefrequencylimits.

?SoftwarethermalmanagementremainsinoperationuntiltheXavierSoCtemperaturehasreturnedtoavaluebelowthethrottlingthresholdandthrottlingdegreehasreturnedtozero.

Note:PowerfluctuationsthatinduceTjfluctuationsabovethesoftwarethermalmanagementthresholdswillcausetemporaryclockreductions.Powerfluctuationsinthetargetworkloadshouldbeevaluatedfortheirpotentialtocausetemperaturetofluctuateabovethesoftwarethreshold.

XavierSoCHardwareThermalThrottling

IfsoftwarethermalmanagementisnotabletomaintaintheXavierSoCtemperature,thenhardwarethermalthrottlingwillengagetopreventthermalshutdown.Tohelpavoidthermalshutdownconditionswithoutbeingoverlyconservative,XavierSoChashardware-engagedclockthrottlingmechanismsthatareusedasalastresorttopreventshutdownconditions.ThiswilllowertheXavierSoCtemperature,butitwillalsosignificantlyreducetheoverall

XavierSoCperformance.TheXavierSoCthrottlesettingscannotbealtered.ThesesettingsareimplementedbyNVIDIAtomeetsafetyandreliabilitystandards.

XavierSoCShutdownTemperature

XavierSoCisratedtooperateatajunctiontemperaturenot-to-exceed105°C.XavierSoChashardwareshutdownmechanismsthatenforcethislimitbyautomaticallyhaltingthesystemwhenthistemperatureisexceeded.

Theshutdowntemperatureshouldnotbereachedatanytimeduringnormaloperation,butitmayoccurifcoolingsystemcomponentsarebroken,jammed,orotherwiseunabletocooltheXavierSoCunderworst-caseconditions.Ifathermalshutdowneventistriggered,thenamajorfaultintheJetsonXavierNXorsystemcoolingsolutionhasoccurred.Thermalshutdowncanbeinitiatedbyanyofthesensorslistedin

Table2-1.

Usingmultiplesensorsenablesoperationclosertothetemperaturelimitwithoutcompromisingreliabilitybyreducingtheuncertaintyassociatedwiththehotspotlocation.

Thefollowingthermalshutdownmechanismhasbeenimplemented:

?Internalsensor-basedshutdown.FailsafethermalshutdownisguaranteedbyusingtheSHUTDOWNsignaldirectlyfromXavierSoCtothePMIC.Afterthefailsafeshutdowntheuserwillhavetomanuallyturnthesystemonbypressingthepowerbuttonorequivalentinput.

TheXavierSoCshutdownsettingscannotbealtered.ThesesettingsareimplementedbyNVIDIAtomeetsafetyandreliabilitystandards.

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