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DISCLAIMER

ThispresentationhasbeenpreparedbySamsungElectronicsCo.,Ltd.(the"Company").ItdoesnotpurporttocontainalltheinformationthataprospectiveinvestormayrequireinconnectionwithanypotentialinvestmentintheCompany.Youshouldnottreatthecontentsofthispresentation,oranyinformationprovidedinconnectionwithit,asfinancialadvice,financialproductadviceoradvicerelatingtolegal,

taxationorinvestmentmatters.

Norepresentationorwarranty(whetherexpressorimplied)ismadebytheCompanyoranyofitsofficers,advisers,agentsoremployeesastotheaccuracy,completenessorreasonablenessoftheinformation,statements,opinionsormatters(expressorimplied)arisingoutof,containedinorderivedfromthispresentationorprovidedinconnectionwithit,oranyomissionfromthispresentation,norastothe

attainabilityofanyestimates,forecastsorprojectionssetoutinthispresentation.

Thispresentationisprovidedexpresslyonthebasisthatyouwillcarryoutyourownindependentinquiriesintothematterscontainedinthepresentationandmakeyourownindependentdecisionsabouttheaffairs,financialpositionorprospectsoftheCompany.TheCompanyreservestherighttoupdate,amendorsupplementtheinformationatanytimeinitsabsolutediscretion(withoutincurringanyobligationtodoso).

NeithertheCompany,noritsrelatedbodiescorporate,officers,theiradvisers,agentsandemployeesacceptanyresponsibilityorliabilitytoyouortoanyotherpersonorentityarisingoutofthispresentationincludingpursuanttothegenerallaw(whetherfornegligence,understatuteorotherwise).Anysuchresponsibilityorliabilityis,tothemaximumextentpermittedbylaw,expresslydisclaimedandexcluded.Nothinginthismaterialshouldbeconstruedaseitheranoffertosellorasolicitationofanoffertobuyorsellsecurities.ItdoesnotincludeallavailableinformationandshouldnotbeusedinisolationasabasistoinvestintheCompany.

FutureMatters

Thispresentationcontainsreferencetocertainintentions,expectations,futureplans,strategyandprospectsoftheCompany.Thoseintentions,expectations,futureplans,strategyandprospectsmayormaynotbeachieved.Theyarebasedoncertainassumptions,whichmaynotbemetoronwhichviewsmaydifferandmaybeaffectedbyknownandunknownrisks.TheperformanceandoperationsoftheCompanymaybeinfluencedbyanumberoffactors,manyofwhichareoutsidethecontroloftheCompany.Norepresentationorwarranty,expressorimplied,ismadebytheCompany,oranyofitsdirectors,officers,

employees,advisersoragentsthatanyintentions,expectationsorplanswillbeachievedeithertotallyorpartiallyorthatanyparticularrateofreturnwillbeachieved.

GiventherisksanduncertaintiesmaycausetheCompany'sactualfutureresults,performanceorachievementstobemateriallydifferentfromthoseexpected,plannedorintended,recipientsshouldnotplaceunduerelianceontheseintentions,expectations,futureplans,strategyandprospects.TheCompanydoesnotwarrantorrepresentthattheactualresults,performanceorachievementswillbeasexpected,plannedorintended.

USDisclosure

Thisdocumentdoesnotconstituteanypartofanyoffertosell,orthesolicitationofanyoffertobuy,anysecuritiesintheUnitedStatesorto,orfortheaccountorbenefitofany"USperson"asdefinedin

RegulationSundertheUSSecuritiesActof1993("SecuritiesAct").TheCompany'sshareshavenotbeen,andwillnotbe,registeredundertheSecuritiesActorthesecuritieslawsofanystateorother

jurisdictionoftheUnitedStates,andmaynotbeofferedorsoldintheUnitedStatesortoanyUSpersonwithoutbeingsoregisteredorpursuanttoanexemptionfromregistrationincludinganexemptionforqualifiedinstitutionalbuyers.

SAMSUNGMEMORY

InvestorPresentation

2024

BUSINESSUPDATE

CONTENTS

MEMORYMARKETOPPORTUNITIESSAMSUNGSTRATEGY

SAMSUNGMEMORYBUSINESSREVIEW

#1inMemoryWorldwideSince1993,WellBalancedDRAM/NANDPortfolio

2023MarketShareDRAM42%NAND34%

2021

2022

2017

2020

2019

MarketShare

39%

$35B

2023

Revenue

Mar.‘24

Source:IDC

,

2018

MEMORYBIZ.PARADIGMSHIFTLEDBYSAMSUNG

SamsungisPoweringtheTechnologiesthatbringInnovationtoLifestyle

3rdQuantumJump

2ndJump

BigFluctuations1stJump

Autonomous

AI

DataCenter

ChinaS/Phone

GalaxyS

AndroidMarket

iPhone

AppStore

MemoryRevenue

iPod

20102020

19902000

BeyondTheBoundary

AI

HUMAN

SamsungMemory

BUSINESSUPDATE

CONTENTS

MEMORYMARKETOPPORTUNITIESSAMSUNGSTRATEGY

SPREAD-OUTOFPUBLICCLOUD

ExplosiveGrowthofData

THEFLOODOFDATA

1stWAVE

2ndWAVE

3rdWAVE

4THWAVE

Automotive

CloudServiceProviders

.Com&ForbesTop100TelcosAI

201620202024

SMARTCITY&AUTONOMOUSCARFUELEDBY5GNETWORK

HugeAmountsofDataGeneratedbyHyper-connectedDevices

IoTSensors

SmallCellsDrone

*HotSpot(Zone)

Smartphone

CCTV

SMARTCITY

V2X

*VehicletoEverything

HYPERCONNECTION

FWA

AR/VR

*FixedWirelesssAccess

Tablet

PC

DigitalSignage

MARKETOPPORTUNITYINBIGDATAANALYTICS

SSD

*

LowLatencyFastResponse

CPU

CLOUD

BIGDATA

Un-structuredData

StructuredData

DemandIncreaseforHighDensity&PerformanceMemorytoEnhanceComputingPower

Accelerator+HBM

(GPGPU,FPGA,ASIC)

HighDensity/Performance

DRAM&

CXLMemoryExpander

MoreDensity

*Latency:TimeDelaybetweeninputandoutputinasystem

CONTINUOUSGROWTHOFMEMORYDEMAND

MemoryGrowthledbyServer&MobiledevicesbasedonBigDataEcosystem

Autonomous

AutomotiveServer

BigDataAnalytics/ML

Cons.&GfxMobile

SmartHome

PC

AI

In-MemoryDB

EdgeComputing

PublicCloudService

IoT

NetworkEquipment

AR&VR

DualCamera

On-DeviceAI

2017

2024

BUSINESSUPDATE

CONTENTS

MEMORYMARKETOPPORTUNITIES

SAMSUNGSTRATEGY

SAMSUNGSTRATEGY

Break-throughTechnology

TECHLEADERSHIP

EnhancedSolutions

S/W&CONTROLLERS

Advanced

Manufacturing

EFFICIENCY&FLEXIBILITY

Break-throughTechnology

CONTINUOUSTECHNOLOGYSCALING

ThruTechnologyEvolution

DRAM

Cost/Gb

BEYOND<10nm

35nm28nm25nm20nm1xnm1ynm1znm1anm1bnm...

Source:Samsung

FUTUREDRAMTECHNOLOGY

DPT

QPT

EUV

*DPT:DoublePatterningTechnology

*QPT:QuadruplePatterningTechnology

*EUV:ExtremeUltraViolet

ADVANDCEDDESIGNTECH

Cost/Gb

PUSHINGTHELIMITSOFV-NAND

ThruInnovativeLayerStackingTechnology

NAND

BEYOND200LAYERS

21nm

19nm

16nm

V32

14nm

V48V64V9x

Planer

V-NAND

V12xV17xV23x

...

Break-throughTechnology

FUTUREV-NANDTECHNOLOGY

VerticalStack-up

Multi-Stacking

CellOverPeri

LateralShrink

QLC

*QLC:Quad-LevelCell

Source:Samsung

EnhancedSolutions

UNIQUECAPABILITIESFORDIFFERENTIATEDSOLUTIONS

IntegratingKeyComponentstoDeliverValue-addedSolutions

ADVANCEDPROCESSTECHNOLOGY

Wafer/Chip

ADVANCEDPACKAGINGTECHNOLOGY

Stacking/TSV

VERTICAL

INTEGRATION

Software&Logic(Controller)

Smaller

HigherDensity

LessPowerConsumption

Faster

Thinner

Smaller

NoPerformanceLoss

Customized

Expandable

Smarter

Secure

EnhancedSolutions

SAMSUNGSOLUTIONSFORTHE5GERA

EnhancedProcessingforMassiveDatawithLowerLatency&LessPowerConsumption

FASTERDATARATESWITHLOWPOWER

LPDDR5/5X

HigherSpeed

LowerPowerConsumption

SmallerPackage

RDIMM,UFS

LowLatency*

HighCapacity

StableQoS

*Latency:TimeDelaybetweeninputandoutputinasystem

EnhancedSolutions

SAMSUNGSOLUTIONSFORARTIFICIALINTELLIGENCE

SuperlativePerformanceandHighReliabilityUsingLessEnergy

ENHANCEDPERFORMANCE

FORDATA-INTENSIVETASKS

36GBHBM3E*32TBSASSSD,64TBNVMeSSD

FastestPerformance

EnergyEfficiency

LargestDensity

HigherReliability

UnparalleledPerformance

*HBM:HighBandwidthMemory

EnhancedSolutions

SAMSUNGSOLUTIONSFORAUTOMOTIVEINDUSTRY

AdvancedTotalMemorySolutionforAutonomousDrivingTechnology

DedicatedSupportforautomotive

FullMemoryLine-upsQuality&LongevityFullIn-houseSolution

ELECTRIFIEDCONNECTEDAUTONOMOUS

AutomotiveStorage

AutomotiveDRAM

HighBandwidth

LowerPowerConsumption

HighDensity

HighPerformance

HighReliabilityHigherReliability

AdvancedManufacturing

APPLICATION-ORIENTEDLINEMANAGEMENT

2-TrackStrategyforEfficientProduction&CapacityAllocation

AUTOMOTIVE

ARTIFICIALINTELLIGENCE

INDUSTRIAL

HIGH

PERFORMANCECOMPUTING

NETWORK

FLEXIBILITY

DRAM/NANDConversion

LONGEVITY

ProvenProcessTechnology

PERFORMANCE

LeadingProcessTechnology

AdvancedManufacturing

EVOLUTIONTOSMARTERFACTORY

CustomerValueImprovementthroughHighProductivityandEnhancedSCM

AutomatedOperation

DemandFulfillment

SCM

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