SMT表面貼裝制程.ppt

1、SMT Manufacture process,Write by MOEBG / SMT Manufacture Engineer Yx lan,DSC-Main board,Main component-BGA chipset,DSC- FPC board,Optical component-CCD,SMT Introduction,Automatic SMT line : 71 lines Location : C build - Floor 2 4 2D build - Floor 3 , 4 2E build - Floor 2 , 3 , 4 Line change：30 mins

2、Production Efficiency：99.5% Through rate : 88 % Defect PPM : 50PPM Lost rate : 0.4 % PCBA average output : 400K / month,Control by KPI,SMT process,PCBA Flow Chart,S.M.T : Surface Mount Technology What is SMT : Good Print , and Mount Good !,DIP,SONY SIP-950,SONY SIP-300,SONY SVP-2000,SMT EquipmentPri

3、nter (SONY),Solder paste vendor (Lead-free type),Stencil design rule,SMT - Mounter (SONY),SMT實(shí)裝設(shè)備中高速機(jī)(SONY),SMT實(shí)裝設(shè)備汎用機(jī)(SONY),SMT - Mounter (SONY),Mounter function,X-Y DATA CAM350 edit Gerber file Combination X-Y Data and Gerber file by CPS,Nozzle,Article：Lead-Free N2 Reflow Type：NIS-311TR / NIS-2082

4、C / N30-122-RLF Characteristic： 1.The consistency of N2 is low-reduce，Using N2 by PSA to control output and cost 2.PPM control system to control the consistency of O2 in 500PPM 3.Uniform heat convection make BGA and CSP heat completely. 4.More heating zone could offer better temperature profile (8 z

5、ones and 12 zones),SMT - Reflow (ETC),Method -Reflow profile (example : Lead free),25150 ,150217 ,Over 217 ,Over 230 ,below 217 ,Ramp up : 6/sec (max),Ramp down : 6/sec (max),25,150,217,230,Pre-heat,Soaking,Reflow,Cooling,Peak temp = 235255,Temp,Time,SMT profile Pre-heat zone,This heating zone cause

6、 the uniform-temperature in all part of PCBA, that can reduce PCB warped ,and avoid solder-paste heating disproportion ally to cause splash down to get another failure Pre-heat zone temperature setting : ( generally setting, actually constant follow vendors data specification ) Lead-free 25(room tem

7、p) 150 :,SMT profile Soaking zone,Solder-paste include solder alloy and Flux. Commonly, Flux content include Rosin, Activation, Solvent, and Rchological addition. Flux-heating can cause the content of Flux deoxidize solder to raise the soldering of the joint. Soaking zone temperature setting : (gene

8、rally setting, actually constant follow vendors data specification Lead-free 150 220 :,SMT profile Reflow zone,In the Reflow zone, solder-joint comes into being Interface-alloy, that because most of metal becomes being melting. Peak temperature is in this zone, that is the highest temperature in the

9、 profile. Generally, in this zone (230 to peak temp) means solder alloy is in the melting states and different metals are becoming interface-alloy. Sometimes, we can raise the of this zone to reduce void occur ratio. Reflow zone temperature setting : (generally setting, actually constant follow vend

10、ors data specification ) Lead-free Over 220 Peak temp : 235255 ,In IPC 610-D, solder-joint must to be bright , shine and smooth . When interface-alloy coagulated, the ramp down ratio (cooling rate) is more fast, that cause alloy atomic bond becomes more tightly, that cause solder surface is more shi

11、ne and smooth . Cooling zone temperature setting : (generally setting, actually constant follow vendors data specification ) Lead-free Ramp down ratio : 6 /sec,SMT profile Cooling zone,Profile limit,Solder-Paste Mpt : 217 220 Reflow peak temp : 235255 Reflow zone (over 220 ): 6090sec,Temperature pro

12、file board,Six measure point (for actual PCB states) Temp point : critical parts Exp: BGA, IC, SD Connector Connect the thermal couple to measure profile,Profile measurement (for Data PAQ),Reflow profile,Automatic Optic Inspection (AOI),Cyclone 系列,Sample image,inspect image,1. Adopt 2D AOI inspect t

13、echnique ； 2.Inspection Item：Missing parts/Polarity/Reverse/missing solder/Bridge/Shift /etc; 3.Inspect the minimum part ：Angular chips 0201；,Automatic Inspection,CCC system Function：By Regional network , control production line and feedback the NG phenomenon from AOI machine in factory at once. REPAIR sys