杜邦產(chǎn)品介紹(2)ppt課件

1、Introduction to Flexible Circuit MaterialsPresented by: Jonathan C. LimPart II : ( 40 minutes)簡報大綱軟性電路板基材之介紹基材的主要CompositionDielectric Substrates (絕緣體)Adhesive (膠質(zhì))Conductor (導體)m簡報大綱 (continue)杜邦產(chǎn)品壓克力膠系列(Modified WA Acrylic)之基材環(huán)亞樹脂膠系列(Modified Epoxy)之基材杜邦 料號解說PyraluxTelcamm軟性電路板之主要基材Copper Clad Lam

2、inates (銅箔基材)Single-Sided C.C.L.(單面銅箔基材)AdhesiveConductorDielectric SubstratemDouble-Sided C.C.L. .(雙面銅箔基材)ConductorDielectric SubstrateAdhesive軟性電路板之主要基材mAdhesive-Less C.C.L. .(無膠銅箔基材)Dielectric SubstrateConductor軟性電路板之主要基材mCoverlay(覆蓋膜)軟性電路板之主要基材mDielectric SubstrateAdhesive離型紙AdhesiveKaptonStiffn

3、er (補強材)軟性電路板之主要基材Dielectric SubstrateAdhesivemBondplyDielectric SubstrateAdhesiveAdhesive軟性電路板之主要基材mMylarAdhesiveKaptonAdhesiveSheet AdhesivePhotoImageable Coverlay (PIC)Dry FilmFine-Line ApplicationCameraAutomotiveOthers軟性電路板之主要基材mDielectric SubstratesDefinitionA base film on which the printed con

4、ductors are laid.A film which provides electrical insulation between conductors.A film which provides mechanical strength of the circuit.m必備之特性Mechanical StrengthFlexibilityDimensional StabilityDielectric PropertiesThermal PropertiesChemical ResistanceMoisture AbsorptionCostDielectric SubstratesmSub

5、strates 之種類PolyimidePolyesterFluorocarbonAramid PaperCompositeDielectric SubstratesmPolyimide:Popularized by DuPont under “KaptonAlso known as PI First choice of film in most FPCInfusible and flame retardantHigh Tg (約 260C - 280C)Good dimensional stabilitySubstratesmSubstratesPolyester:Popularized b

6、y DuPont under “Mylar Also known as PETLowest cost dielectric materialMostly used in low-cost consumer applicationGood mechanical propertiesBad thermal propertiesmSubstratesAramid Paper:Sold under DuPont trade name “NomexUsed in specialized applicationGood thermal insulation materialmProperty Polyes

7、ter Polyimide Fluorocarbon Aramid Paper CompositeTensile Strength Excellent Excellent Fair Good BestFlexibility Excellent Excellent Excellent Good Fair/GoodDim. Stability Fair/Good Good Fair Good Fair/GoodDielectric Str. Good Good Very Good Very Good GoodSolderibility Poor Excellent Fair Excellent E

8、xcellentC.O.T. (C) 105 200-230 150-180 220 105-180Thermal Exp. Low Low High Moderate LowChem. Resist. Good Good Excellent Very Good FairMoisture Absorp. Very Low High Very Low Very High LowCost Low High High Moderate ModerateTrade Name Mylar Kapton Teflon/Tedlar NomexDielectric SubstratesmAdhesiveDe

9、finitionMaterial that bonds layers togetherThermosettingThermoplasticmAdhesive必備之特性Adhesion StrengthFlexibilityChemical ResistanceThermal ResistanceMoisture AbsorptionElectrical PropertiesCostmAdhesiveAdhesive之種類PolyesterAcrylicEpoxyPolyimideButyral PhenolicmAdhesivePolyester:Used where the dielectr

10、ic is also polyesterUsed where no soldering is neededTypical application:Instant camera film interconnectsInstrument cluster connection in automobilesmAdhesiveAcrylic:Used in demanding temperature requirement applicationMost popular acrylic system is Pyralux by DuPontExcellent adhesionmAdhesiveEpoxy

11、:Widely used adhesive systemGenerally lower cost than acrylicAble to stand wave solderingGood in high temperature for long period of time (400 to 450 F)mAdhesivePolyimide:Used in adhesiveless ccl and coverlayUsed where dimension stability is criticalUsed in high temperature applicationHigh moisture

12、absorptionmAdhesivePolyesterAcrylicEpoxyPolyimideButyral PhenolicTemp.Resist.Chem.Resit.Elec.Prop.AdhesionFlexibilityCostMoisture FairGoodExcellentExcellentExcellentLowFairVery GoodGoodGoodExcellentVery GoodGoodGoodGoodGoodGoodExcellentExcellentExcellentGoodGoodGoodGoodGoodGoodModerateFairFairVery H

13、ighPoorFairFairHighModeratePoormConductors/FoilMajor types of conductorsMetalsMetal alloysconductive inksCopper (the most commonly used conductor in FPC)Electrolytically deposited copper (ED)Rolled Annealed copper (RA)mConductors/Foil必備之特性Current-carrying capacityFlexibilityService temperatureChemic

14、al resistanceMechanical strengthCostmConductors/FoilElectrical PropertiesThermal PropertiesMechanical PropertiesRelative CostAluminumCopperGoldNickelSilverExcellentGoodExcellentExcellentExcellentExcellentExcellentExcellentGoodGoodGoodGoodGoodFairFair/GoodFairFairVery GoodVery GoodBestm軟板基材製造過程Copper

15、 RollKapton RollCopper Clad LaminateHeater 1Heater 2Liquid AdhesiveAgingmIntroduction to DuPont ProductsmPart III: ( 15 minutes)DuPont Product FamilyPyraluxPyralux FRPyralux LFPyralux APPyralux PCTeclamTeclam FNCTeclam DNCPyralux FR - series (Acrylic Based)Copper-Clad LaminatesPanel Form Packaging.

16、(24 x 36)UL Approved. (File# E124294)Very Good Flexure EnduranceEx. FR9111, FR9110, FR8510, FR8515CoverlayRoll Form Packaging. (24 x 250)UL Approved. (File# E124294)Excellent Dimensional StabilityEx. FR0110, FR0210mPyralux FR continue.Sheet AdhesiveRoll Form Packaging. (24 x 250)UL ApprovedEx. FR010

17、0, FR0200Bond PlyRoll Form Packaging. (24 x 250)UL ApprovedEx. FR0111, FR0212mPyralux LF - series (Acrylic Based)Military SpecificationsExcellent Flexure EnduranceVery Good for High-Density CircuitrySame Product Offerings as FR - seriesPC - series (Acrylic, urethane, & imide-based)Dry FilmPhotoimage

18、able CoverlayCameras & Automotive ApplicationsmPyralux P/NsFR 9 111CuPICu7 - Special construction8 - 1/2oz. C.C.L.9 - 1oz or more C.C.L.5 - 1/2 oz. Cu1 - 1 oz. Cu2 - 2 oz. Cu1 - 1 mil PI2 - 2 mil PI3 - 3 mil PIFRLFAPCopper-Clad LaminatesmPyralux P/NsFR 0 111Adh.PIAdh.FRLFAP7 - Special construction0 - Coverlay or Sheet Adhesive1 - 1 mil adhesive2 - 2 mil adhesive3 - 3 mil adhesive1 - 1 mil PI2 - 2 mil PI3 - 3 mil PICoverlay & Sheet AdhesivemTeclam FNC - seriesCopper-