Fabrication-technology-of-piezoresistive-conductive-PDMS-for-對壓阻式導(dǎo)電PDMS制作技術(shù)課件

1、Fabrication technology of piezoresistive conductive PDMS for micro fingerprint sensorsIEEE MEMS 2007Miao Lu, Amine Bermak, Yi-Kuen Lee學(xué)號:9635517姓名:陳立仁Fabrication technology of piezOutlineIntroductionMaterial characterizationDevice fabricationDevice characterizationConclusionOutlineIntroductionIntrod

2、uctionWith the progress of computer and internet,our life become more convenient and comfortable. But it is also convenient for hackers. Though, how to keep personal privacy is very important.IntroductionWith the progress Introduction (cont.)/products.html/es/image_library/b2b/media_app_systems/deta

3、il?asset_id=26642Introduction (cont.)http:/wwwMaterial characterizationCoductive PDMS (CPDMS):Mixture of PDMS and carbon blackGauge factor=(R/R0)/CPDMS7.4Constantan alloy2.1Si120Piezoresistive sensitivity (Pa )=(R/R0)/CPDMS3X10Si10-1-6-9Material characterizationCoducDevice fabrication1. Sputter Ti/W

4、 and Au electrodes2. Spin a layer of PR (AZ4620), then pattern the PR.Device fabrication1. Sputter TDevice fabrication (cont.)3. Electroplate the mushroom-shaped Au electrodes, then remove the PR.4. Spin and pattern another layer of PR. Etch electrodes and remove PR.Device fabrication (cont.)3. EDev

5、ice fabrication (cont.)5. Spin a layer of PR as a well. Pour the CPDMS on the substrate.6. Remove the excessive CPDMS. Strip the PR.Device fabrication (cont.)5. SDevice fabrication (cont.)7. Deposit parylene to protect the electrode.8. Spin and pattern the PR. Etch parylene , then strip the PR.Devic

6、e fabrication (cont.)7. DDevice fabrication (cont.)Device fabrication (cont.)Device characterizationDevice characterizationDevice characterization (cont.)Device characterization (cont.ConclusionThe operating pressure range of this device is really close to that of commercial products. If the package is not good enough, the sensing ability will be affected. A