FPC-中英文對照教學(xué)課件

FPC名詞中英對照Qualitybeginswitheducation,andendsupwitheducation.ManufactureProcedure制程MaterialPreparation材料準(zhǔn)備Panelization/Shear下料Drilling鉆孔CopperPlating鍍銅ElectrolessCopperPlating化學(xué)銅BlackHole黒孔SensitiveDryFilm干膜貼合Exposure曝光Developing顯像Etching蝕刻DESStripping脫膜FPC_中英文對照CoverlayTacking貼保護(hù)膜Abrade粗化Lamination壓著Curing熟化Brushing刷磨Pre-treatment前處理SurfaceTreatment表面處理Dryup干燥Micro-etching微蝕AcidCleaning酸洗WaterCleaning水洗Anti-corrosionTreatment防銹處理anti表示反對，抵抗FPC_中英文對照(Gold、Solder、Nickel)Plating電鍍（金、錫、鎳）FlashPlating/StrikePlating閃鍍PatternPlate局部電鍍ENIG:ElectrolessNickel/ImmersionGold化學(xué)鎳金PrintingofLegend文字印刷BackBoardLamination

補(bǔ)強(qiáng)板壓著ElectricalTest電測LaserCut鐳射切割A(yù)utomaticOpticalInspection（AOI）自動(dòng)光學(xué)檢驗(yàn)SurfaceMountingTechnology（SMT）表面貼裝技術(shù)FPC_中英文對照Conductor

導(dǎo)體Conductor導(dǎo)體Open開路Short短路Nick缺口Pinhole針孔pin（針）+hole（洞）ExtraneousCopper銅刺

copper（銅）+extraneous（額外的）Spur毛邊Nodule結(jié)瘤

FPC_中英文對照EtchedConcave表面缺口concave（凹的）Delamination分層Discoloration異色dis（否定前綴）+colorationDent打痕Scratch傷痕DentonCoverlay/Covercoat打痕ScratchonCoverlay/Covercoat傷痕Void缺膠Misalign偏移CoverlayBurr毛邊

FPC_中英文對照ForeignMatters

異物ConductiveForeignMatter導(dǎo)電性異物

Conductor——ConductiveNon-conductiveForeignMatter非導(dǎo)電性異物non（否定前綴）同disBlisteringandDelamination起泡和分層Squeeze-outofAdhesiveofCoverlay溢膠Ooze-outofCovercoat覆蓋涂層滲出SkippingofCovercoat覆蓋涂層跳漏

FPC_中英文對照SurfaceConditionofPlatedMetalandSolder

電鍍金屬或焊錫的表面條件

GoldPlating鍍金

gold（金）+plating（電鍍）GoldPlatingDefect鍍金不良defect（缺陷、不良）TinPlating鍍錫

分解記憶同GoldPlating

FPC_中英文對照DarkenedAppearance(BlackeningDiscoloration)變暗（變黑）PlatedExposeWetting電鍍露銅Expose（暴露）——exposure（曝光）PeeledOff剝離PlatedWicking電鍍滲入NoPlating漏鍍Rough電鍍粗糙Wicking藥水滲入FPC_中英文對照VisualInspectionofEdgesofOutlinesandHoles

外形和孔邊緣

TearandNick撕裂和缺口ThreadyBurr絲狀毛刺Warpage彎曲、變形PoorMicro-joint微連結(jié)不良

joint（連結(jié)）OutlineMisalign外形偏移NoOutline外形漏沖BendingLineMisalign反折偏移FPC_中英文對照VisualInspectionRelatedtoStiffenerBonding

補(bǔ)強(qiáng)

ForeignMatterFPC與補(bǔ)強(qiáng)板之間的異物Void氣泡Chip-off缺角Deformation變形FPC_中英文對照AffixedSubstancesontheSurface

表面附著物

ThermosettingAdhesive熱固膠PSA-PressureSensitiveAdhesive壓敏膠FluxResidue助焊劑殘?jiān)?/p>

Residue（殘?jiān)?/p>

ResidueofMetalPowders金屬粉末殘?jiān)?/p>

Powder（粉末）ResidueofAdhesive粘結(jié)劑殘?jiān)麱PC_中英文對照Marking

標(biāo)記

Thickness厚度ComponentHole元件孔ViaHole導(dǎo)通孔ViaHoleMisalign導(dǎo)通孔偏移MountingHole組裝孔

SMT(S-Surface；M-Mounting；T-Technology)FPC_中英文對照ConductorWidth導(dǎo)體寬度

width（寬）length（長）height（高）thickness（厚度）ClearancebetweenConductors導(dǎo)體之間的間距DistancebetweenHoleCenters孔中心間距MinimumDistancebetweenBoardEdgeandConductor板邊和導(dǎo)體之間的最小距離

minimum（最?。﹎aximum（最大）WrongMarking標(biāo)記錯(cuò)誤UnclearLetter字符不清晰

un為否定前綴，同dis、non

FPC_中英文對照PositionalAccuracy

定位精度PositionalAccuracyofHole孔的定位精度RegistrationofHoletoLand孔與焊盤的重合性RegistrationofCoverlay(orCovercoat)toLand覆蓋層與焊盤的重合性Registration重合性FPC_中英文對照RegistrationofStiffenertoFPC

補(bǔ)強(qiáng)板與FPC的重合性

RegistrationofHole孔的重合性RegistrationofOutline外形的重合性RegistrationofPunchedOutlinetoConductorPattern沖外形與導(dǎo)體圖形的重合性

Punch沖切RegistrationofPressureSensitiveorThermosettingAdhesivetoFPCandStiffener壓敏膠或熱固膠與FPC和補(bǔ)強(qiáng)板的重合性PressureSensitive壓敏膠；orThermosettingAdhesive熱固膠PlatingThicknessofCopperPlated-throughHole鍍通孔的鍍銅層厚度

FPC_中英文對照BoardType

板SingleSidedFlexBoardS/S單面板DoubleAccessorBack-baredFlexBoard單面雙接觸板DoubleSidedFlexBoardD/S雙面板Rigid-flexBoard軟硬結(jié)合板BareBoard空板FPC_中英文對照Die模具DieDrawing模具圖紙MassProductionDie量產(chǎn)模具

Mass（大量的）PrototypeDie樣品模具SteelDie鋼模Die刀模TopDie上模BottomDie下模WireCut線切割FPC_中英文對照OutlineDie外形模具PressureSensitiveAdhesiveDie膠紙模具StiffenerDie補(bǔ)強(qiáng)模具SilverDie銀漿模具Post導(dǎo)柱Punch沖頭Pin銷釘FPC_中英文對照J(rèn)ig(Fixture)治具ElectricalTestJig電測治具TackingJig假貼治具ExposureJig曝光治具ScreenPrintingFrame絲印網(wǎng)框FPC_中英文對照Hole孔GuideHoleforExposure曝光定位孔GuideHoleforDie模具定位孔GuideHoleforTacking假貼定位孔GuideHoleforAdhesive貼合定位孔GuideHoleforElectricalTest電測定位孔GuideHoleforScreenPrinting絲印定位孔LiftedLand孔環(huán)StannizeHole滲錫孔FittingHole裝配孔FPC_中英文對照Material原材料CopperFoil(Cu)——銅箔ED——ElectroDeposit電解銅RA——RolledAnnealed壓延銅CVL——Coverlay保護(hù)膠片BaseMaterial基材FCCL——FlexibleCopperCladLaminate撓性覆銅板FPC_中英文對照PI——Polyimide聚酰亞胺PET——PolyesterFilm聚酯FR4——Fiberboard玻纖板SheetSteel——鋼片PSA（PressureSensitiveAdhesive）壓敏膠ReleasePaper離型紙Stiffener補(bǔ)強(qiáng)FPC_中英文對照FPCReliabilityTestItemsTestingofElectricalPerformance電氣性能SIR——SurfaceInsulationResistance表面層絕緣電阻DielectricWithstandingVoltageofSurfaceLayers表面介質(zhì)層耐電壓強(qiáng)度Withstanding承受TestingofMechanicalProperty機(jī)械性能測試Peel

Strength剝離強(qiáng)度FPC_中英文對照Pull-outStrengthforPlainHolesandFootprints孔和焊墊的拉脫強(qiáng)度Footprints腳印，足跡PlatingAdhesion鍍層附著力(Ad)Adhesive接著劑Solderability可焊性FlexuralEndurance耐彎折性EnvironmentalPerformance環(huán)境性能TemperatureCycle溫度循環(huán)HumidityTest濕度測試ThermalShock冷熱沖擊FPC_中英文對照Migration遷移性ChemicalResistance耐化學(xué)性Cleanliness清潔度FlameResistance阻燃性ShearTest推力測試HandsetRenovateTest翻蓋測試WindowBendTest窗口彎折測試SlidingTest滑蓋測試Slide滑動(dòng)，滑行FPC_中英文對照PullStrengthTest焊點(diǎn)拉伸強(qiáng)度測試Pull:拉Push：推Salt（鹽）Fog（霧）TestCrossSection切片檢測Section區(qū)域PlatingThickness鍍層厚度ConstantTemperatureandHumidity恒溫恒濕Constant恒定的，常數(shù)FoldFatigueTest翻折疲勞測試DimensionalStability尺寸安定性Ductility延展性FPC_中英文對照Others其他Temperature溫度Humidity濕度Pressure壓力LineWidth/Space線寬/線距Pitch線路間距Connector連接器(abbr.——Conn.）Capacitance(C)電容Capacity容量Resistance(R)電阻Diode（D）二極管ESD——Electro-StaticDischarge靜電FPC_中英文對照Shortage短裝MixedPacking混裝AQL——AcceptableQualityLevel品質(zhì)允收標(biāo)準(zhǔn)Traveler流程單BoundarySample限度樣本Checklist檢查清單TrackingList追蹤表TrendChart走勢圖Foolproofing/Bakayoke防呆法Shielding屏蔽層FPC_中英文對照常用縮寫質(zhì)量管理五大工具APQP:AdvancedProductQualityPlanning產(chǎn)品質(zhì)量先期策劃SPC:StatisticalProcessControl統(tǒng)計(jì)過程控制FMEA:FailureModeandEffectAnalysis失效模式和效果分析MSA:MeasurementSystemAnalysis測量系統(tǒng)分析PPAP:ProductionPartApprovalProcess生產(chǎn)件批準(zhǔn)程序FPC_中英文對照油墨1.EMI——Electro-MagneticInterference電磁屏蔽膜2.S/R/S/M——SolderResistance/Mask阻焊油墨3.PSR——Photo-sensitiveSolderResistance感光油墨4.Silver——銀漿FPC_中英文對照IC封裝形式BGA——BallGridArray球柵陣列結(jié)構(gòu)QFN——QuadFlatNo-leadPackage方形扁平無引腳封裝QFP——PlasticQuadFlatPackage方型扁平式封裝技術(shù)CSP——ChipScalePackage芯片尺寸封裝TSOP——ThinSmallOutlinePackage薄型小尺寸封裝FPC_中英文對照RMA——ReturnMaterialAuthorization退貨授權(quán)MRB——MaterialReviewBoard材料審查會(huì)議ECN——EngineeringChangeNoticePCN——ProcessChangeNotice工序變更通知CTE——CoefficientofThermalExpansion熱膨脹系數(shù)BTO——BuildtoOrder產(chǎn)品按照客戶訂單生產(chǎn)QPA——QualityProcessAudit品質(zhì)過程稽核QSA——QualitySystemAudit品質(zhì)系統(tǒng)稽核GR&R:GaugeRepeatability/Reproducibility評價(jià)重復(fù)性和再現(xiàn)性FPC_中英文對照精益生產(chǎn)八大浪費(fèi)DOWNTIMED——Defect不良品O——Overproduction過量生產(chǎn)W——Waiting等待N——Non-utilize未使用的T——Transportation物料運(yùn)輸I——Inventory庫存M——Motion移動(dòng)E——Extraprocess多余步驟FPC_中英文對照英文郵件1.格式DearAria,Bestwishes,/Bestregards,Tom.2.活用詞、句子FYI.——ForyourinformationP.S.——Postscript后記，附言FPC_中英文對照常用語句1.MayIhaveyourattentiontosth.,please?2.Thereissth.Ineedyoutopayattentionto.3.Pleasekindlybeinformed/advisedthat...4.Pleasenotethat...5.Iwanttoinformyouthat...6.Wewouldbegratefulifyoucould...7.Itisgreatlyappreciatedifyoucould...FPC_中英文對照8.Iamenclosing...我附上9.Pleasefindenclosed...請查閱附件10.Attachedhereto...附件是關(guān)于11.Ifyouhaveanyfurtherquestions,pleasefeelfreetocontactme.

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