INPAQ Company Profile 20220621一級(jí)代理分銷經(jīng)銷KOYUELEC光與電子

PassiveSystemAllianceOnevision,thestrengthofmanyINPAQ佳邦授權(quán)代理商KOYUELEC光與電子電話075582574660，82542001謝謝惠顧PSAMemberCompanies&ProductOfferingsWalsinTechnology(2492.TW)JoinedPSAin1992MLCC,Chip-R,DiscCap,Varistor,RFdevice,Inductor,CoilKamayaJoinedPSAin2006ChipFuse,Chip-R,ESDNitsukoElectronicsJoinedPSAin2001FilmCapacitorProsperityDielectrics(6173.TW)JoinedPSAin2005MLCC,Chip-R,ceramicdielectricpowders,disctypesemi-conductivecapacitorelements,Inductor,ProtectiveChoke,CoilInpaqTechnology(6284.TW)JoinedPSAin2018RFAntenna,

ESDSuppressor,

MultilayerVaristor,EMIFilter,

ChipBead,

RFInductor,PowerInductor,Coil,X’FRMHannstarBoard(5469.TW)JoinedPSAin2008NB、Telecom、IPC、Multi-layer、HDIBoardInfo-TekCorp(8183.TW)JoinedPSAin2009PCBAAssembly、SMT、Motherboard、VGACardGlobalBrandsMfr(6191.TW)JoinedPSAin2010PCBproduction、EMSElnaPrintedCircuitsCo.,Ltd.JoinedPSAin2018PCBproductionWaltonAdvanced(8110.TW)JoinedPSAin1995TurnkeyICAssembly&TestingINPAQOverview2021

SalesRevenues(USDMillion)2211998Established23Y+

GlobalINPAQPeople2218Factories5IntellectualProperties100GlobalBrandsCustomers100Chambers14IPOinTaiwanstockmarket(code#6284)EstablishedJune23,1998HeadquartersMiaoli,TaiwanFounder&CEODr.DJChengPresidentDr.MingTsanTsengCapitalUS$49.5MillionChairmanEuniceChenGlobalINPAQ

FactorySite

Chunan,

TaiwanSpace:

15,942m2Product:

ESD/EMC/Power

Staff:731

Taichung,

TaiwanSpace:

8,231m2Product:

EMC

Staff:103

Suzhou,

ChinaSpace:

13,398m2Product:

Antenna

Staff:1044

Wuxi,

ChinaSpace:

35,879m2Product:

EMCStaff:340Yongzhou,

ChinaSpace:39,600m2Product:Coil/TransformerStaff:365Yongzhou13%28%

32%ComputerAutomotive17%Phone&WearableNetworking

10%ConsumerElectronics■Automotiveapplication■ElectricVehicle(EV)■TBOX■PC/NB/Tablet■SmartTV■APRouter■SmartHome■Internetofthings(IOT)■Gaming■VR/MR/AR■Entertainment■MobilePhone■SmartWatch/Glasses■DiverseWearableSalesRevenue&BusinessSegmentUnit:USDMillion2019-2022

CAGR

(CompoundAnnualGrowthRate)

16.45%FactoryQualityGuaranteeCertification&SystemQCISO14001:2015ISO45001:2018IATF16949:2016AutomotiveEnvironmentSocialResponsibilityQC080000:2017ISO45001:2018IATF16949:2016ISO9001:2015080000:2017QualityTaiwan_Taichung(EMI)Taiwan_Chunan(EMI/WIP)China_Wuxi(EMI)China_Suzhou(Antenna)AdvancedProductQualityPlanning(APQP)ProjectplanProductDesignAnddevelopmentverification(DFMEA)ProcessDesignAnddevelopmentverification(MSA,PFMEA,CP)Pre-launchandVerification(PPAP)ProductionRelease&SafeLaunchMarketOpportunityProjectKickoffDesignVerificationPhysicalVerification&SamplingProductionRelease&SafeLaunchMajorCustomerListINPAQisinyourlifeKeepwinningcustomers’trustTablet/PC/NBMobile&WearableConsumerElectronicsAutomotiveNetworking&5GICDesignHousePartnerReferenceDesignEMCsolutionRFsolutionPowersolutionCircuitProtectionMultilayerVaristor,ultralowcapprotector

TVSdiode

MultilayerchipBead

CommonModeChoke

RFChipinductorandAircoil

.BigMoldedpowerinductor

.MiniMoldedpowerinductor

.Assemblypowerinductor,Transformer&C.MChoke

InpaqcomponentsolutionWeprotectWeconnectProductGroupCapacity(Mpcs)/MonthCapacity(Mpcs)/MonthCapacity(Mpcs)/MonthY2022Y2023Y2024Multi-layerHighFrequencyInductor4001,0002,000Multi-layerChipBead1,0001,1001,200Multi-layerCommonModeFilter100120150Multi-layerPowerinductor80100120MetalMoldingPowerInductor400600800TVSDiode300350400MultilayerVaristor400500600ESDGuard200250300INPAQGroupCapacityINPAQINPAQInnovationby3-CoreTechnologyCoreTechnologyMaterialsystemDesignsystemProcessTechnologyAnsysMaxwellAnsysHFSSDielectricCeramicMagneticCeramicMagneticAlloyMultilayerLTCCThinFilmMoldingLTCCThinFilmCoreProcessThinFilmFluidMoldingforPowerInductorLaserThecorevalueofINPAQistoownvariousmanufacturingprocess(LTCC,ThickFilm,ThinFilmforfinepitchcircuit,Molding,Laser/Chemical/ElectricPlating/AntennaAutomaticProduction,...andetc)forhandlingCeramic,Plastic,MagneticFerrite/AlloyandConductiveCircuit.

Theseprocessarethestepstodevelopnewproductandconceptsinworld-widemarket.YourdesignsandconceptscanberealizedwithINPAQmanufacturingprocesstoputinmassproduction.OurprocesscanhelpgeniusAntenna&ComponentdesignertojumpoutofordinaryspaceandthendropintoaAlice'sWonderland

AntennaAutomaticProductionINPAQManufactureProcessWeConnect/WeProtectPowerSolutionCircuitProtectionEMI/EMCSolutionRFAntennaSMDVaristorwithprotectivelayerforterminalplating

TVSDiodewithprotectionlayerofCSPPackageUltra-LowCap(0.05pF)ESDProtectorsGPSAntennaMobilePhone/NoteBookPC/Game...FerriteSheetMaterialforNFC/WirelessPowerChargingShipping30MillionpcsofantennaMonthlyMoldingAlloyPowerInductorMulti-LayerPowerInductorWirewoundPowerinductorTransformerCommonModeFilterFerriteChipBeadRFInductorAirCoilBalun

No.2

No.1patentedNo.5INPAQInductorProcess&PackageMetalMoldingWire-WoundMultilayerSMDMiniaturetype1412~3225mmsizeApplyforsmartphone,Modules,Memory,PC/Notebook,NetcomComplianceAECQ200SMDtype,Highsaturation,lowerDCR3.0*3.0~17*17mmsizeApplyforMotherboard,VGA,Server,Memory,Notebook,NetcomComplianceAECQ200HighQvalue,HighSRFSmallchipsuitableforsurfacemountingHighQCustomizewindingLowinsertionLossSMDTypeSMDtype,DipType,Customized0201~4536mmsizeComplianceAECQ2000201~1608mmsizeComplianceAECQ200FerriteLTCCceramicMinimoldedBigmoldedChipInductorRFBalunAirCoilShielding,un-shieldingChokeChipBead,powerInductor,

CommonmodefilterChipInductor15AutomotiveLevelSOLUTIONAPPEARANCESERIESEIASIZEWIP1412~3225DCtoDCConverterLine:MobileDevice,HDDs,

DSCs,Pads,LCD,

LEDdisplay.NBServerVGASTBRouter2016~2520WPAMetalMoldingAIP4040~1314MetalMoldingPowerInductorWIPAIPVEFL4040~1314ComponentSolutionPowerSolutionMetalMoldingMultilayerFerrite

CustomerApplications&Spec.SimulationSystem

Spec.design

Losssimulation

PerformanceVerify

Customerdesign/AEMechanicalSystemMaterialSystem

Alloypowderdevelopment

Density

HighBs

Lowcoreloss

Wirewound

Formingofchoke

ProcessdevelopmentHighPerformancePerfectionoforganizationalefficiency.Dotherightthinganddothethingright.ComponentSolution

--WIPseries制程

MagneticpowderCoilWindingCoilPlacingMagneticPastePrinting&DryingForcepressureChipPanelInsulation(Blackepoxy)PlatingLs:4.7000μHRs:0.5000ΩAppearanceTestingPackingComponentSolutionPowerSolutionMetalMoldingMultilayerFerriteMoldingPowerInductorINPAQCyntec-PIFETOKO-EINPAQUniqueProcesscanhaveahomogeneousanddensemicrostructure,善用濕式填膠制程帶來(lái)的優(yōu)點(diǎn):結(jié)構(gòu)上,流動(dòng)性帶來(lái)均勻/高致密性結(jié)構(gòu),特性上,高致密性帶來(lái)特性的提升,制程上,整板制程得以實(shí)現(xiàn),ComponentSolutionPowerSolutionMetalMoldingMultilayerFerriteCoilarrayfor1KPCSwith2520/2016SizeMagneticPasteHighestmaterialdensity!Ultrahighproduceefficiency!BOMcostsavingforyou!ComponentSolutionINPAQ(WIP)TO*(DFE)UniqueProcessDesignPowerSolutionMetalMoldingMultilayerFerriteForPhoneandModules

:

powerinductorminimize,smallerLowDCR,HighsaturationPhoneModules

Inductance(uH)DCR(mΩ)Isat(A)Irms(A)PartNoValueTolerance(%)Typ.Max.Typ.Max.Typ.Max.WIP201610Y-R47ML0.4720%19235.755.34.7WIP201610Y-1R0ML1.0020%37444.243.43.1*WIP141208V-R24M0.2420%212565.54.54*WIP141208V-R33M0.3320%25285.654.13.7*WIP141208V-R47M0.4720%28354.94.53.73.5*WIP201208V-R47M0.4720%21255.54.84.44Application

佳邦乾坤階段目標(biāo)201208Y201208U201208VHTQPHTQLDCRMax.(m?)<35<29<25<29<25DCR

Typ.(m?)2925212520I-satMax(A)>4.2>4.3>4.8>4.3>4.8INPAQMiniMoldingNewProductCompetitorPartNumberLWHL(uH)DCR(mΩ)

MaxIsat(A)PSCyntecHTQP20120H-R47MSR-392.01.20.80.47254.6底部電極佳邦WIP201208V-R47M2.01.20.80.47254.8底部電極奇力新BDHHDG201208R47MFC2.01.20.80.47294.3L型電極佳邦WIP201208U-R47ML2.01.20.80.47294.3L型電極ForPhoneandModules

:

Wire-woundCeramicChipInductorSet-Top-BoxCableModemMoCAFilterWi-Fi5G/6GBaseStationWirelessLAN

HighQvalueandhighself-resonantfrequencywithceramicmaterialSmallchipsuitableforsurfacemountingCeramicbodyandwirewoundconstructionprovidehighSRFsWire-WoundRFInductorDESCRIPTIONStandardTypeSIZE0402~1812Inductance1.0nH~4700nHRatedCurrent(A)1500mA~50mAHighCurrentTypeSIZE0603~1008Inductance1.3nH~390nHRatedCurrent(A)3150mA~170mAFeaturesApplicationStandardEIASize0201/0402/0603(0603/1005/1608inmm)TightToleranceForHighFrequencyMatchingCircuitsHighproductqualityandoutstandingreliabilityGeneralandautomotiveapplicationMobilephone,Netcom,AIOTModulesRFmatchingcircuitForPhoneandModules

:

Multilayer–RFchipInductorINPAQTestFrequency(MHz)InductanceRangeRatedCurrentCrossMurataMCI0603HQ_series1000.3nH~39nH120mA~850mAMCI0603TG_series5000.3nH~39nH120mA~850mALQP03TG_seriesMCI0603TN_series5000.6nH~22nH150mA~850mALQP03TN_seriesMCI1005HQ_series1000.3nH~150nH140mA~1ALQG15HS_seriesMCI1608HQ_series1001.0nH~470nH150mA~1ALQG18HN_seriesFeaturesApplicationCharacteristics:Passive:VSWR*

、EfficiencyActive:OTA(TRP**、TIS***)*VSWR=VoltageStandingWaveRatio**TRP=TotalRadiatedPower***TIS=TotalIsotropicSensitivitySMARTPhone:GSM900/1800/1900,WCDMA2100,andLTE26905GAPRouterVSWRTISEfficiencyTRPAntennaMatchingOrRFInductor

ApplicationBenchmark

ApplyforpowerchargerPowerlinematchingcircuitHighspeedsignallineover10MhzGeneralsignallineunder10MhzMultilayer–chipBeadMobile,

I/OPortforMB,NB,TVPanelLinkCircuitApplicationEquivalentCircuitFeaturesINPAQESD/SurgeProcess&PackageThicknessFilmTheproductusesahightemperaturesinteredmaterialsystemExtremelylowleakagecurrentExtremelylowcapacitance(0.2pFtypical)EIA0201~0603,Array1206/2510ComplianceAEC-Q200ESDGuardLeadfreeplatingterminationprovidedgoodsolderabilityInsulatorovercoat,excellentlowandstableleakagecurrentEIA0201~2220,HV0604/0806(UL/cUL1449approved)ComplianceAEC-Q200SMDtypeMetalOxideVaristorEncapsulationmaterialaccordingtoUL94-V0UL/cUL1449approvedEIA2825/4032MultilayerVaristorSMDMetalOxideVaristorLeadfreeplatingterminationprovidedgoodsolderabilityInsulatorovercoat,excellentlowandstableleakagecurrent.EIA0201~0402ESDTVS(CSPpackage)DFN0603/DFN1006/DFN1610/DFN2520/DFN2020SOD&SOTpackage,SOD323/SOD523/SOT523Array/SOT23Array/SOT143Array,etc.POWERTVSPackageSOD123/SMA/SMB/SMC/DO-218GlasspassivatedchipjunctionComplianceAEC-Q101ESDTVS(DFNpackage)SemiconductorMultilayerCeramicbase–ESD

GuardApplicationRFantennaNetworking(Route/Set-topbox/CPE...)Communication(Table/Projector/Barcodescanner…)Automotive(Infotainment/RFAntennas…)AdvantageTheproductusesahightemperaturesinteredmaterialsystemESDGuardmaterialisdevelopedbyINPAQAirgapstructurebyThinfilmprocessFeaturesProtectionagainstESDvoltagesandcurrents(IEC61000-4-2Level4)Extremelyquickresponsetime(<1ns)presentidealESDprotectionExtremelylowcapacitance(0.2/0.05pFtypical)ExtremelylowleakagecurrentAutomotivegradeNo.1patentedwithultralowcapacitanceSupplierApplication–ESDGuardforRFantennaProductspecCharacteristic

EGA10201seriesTFE10201seriesCharacteristicSymbolUnitTypical.Typical.RatedvoltageVDCV5/126/12/15LeakagecurrentILμA0.010.01TriggervoltageVtV250300ClampingvoltageVcV3020Capacitance,@1MHzCppF0.20.05Responsetime

ns<1<1ESDvoltagecapability,

Contactdischargemode

kV88ESDvoltagecapability,

Airdischargemode

kV1515ESDpulsewithstand

pulses10001000ComponentSolutionCircuitProtectionEMI/ESDSuppressorTransientVoltageSuppressorMultilayerVaristorSMDMetalOxideVaristorINPAQSpecialPackageTraditionalICPackageCSP(ChipScalePackage)withOvercoatingSemiconductorbase

–ESDTransientVoltageSuppressor

Advantage4-sidedcoatingprotectiontopreventshortcircuit5-sidedelectrode,easytosolder/tinclimbingheightStableprocessandmassproductionFeaturesFor3.3V/5V/7V/9V/12VOperatingVoltageProtectionagainstESDvoltagesandcurrents(IEC61000-4-2Level4)Extremelyquickresponsetime(<1ns)presentidealESDprotectionExtremelylowleakagecurrentExcellentpackage0.6mm×0.3mm×0.3mmNo.1CSP0201PackageApplicationControlsignallinesprotectionSerialandparallelportprotectionGenericInterfaceLinesNotebooks,desktopsandserversSpecialcoatingtechnologyprovidesgoodreliabilitygoodsolderabilityPartNumberVRWM(V)IL(uA)Cp(pF)Ipp(A)ESD(kV)MaxMaxTyp.8/20usContactAirTVL0201013VAA03.3111.58±25±25TVL0201015VAA05.5156±15±15TVN0201015VAA051188±20±20TVL0201017VAA07169±20±30TVL0201019VAA09154±20±30TVL02010112VAA01217.54±20±30TVW0201015VAA0510.93±14±20Application–TVSDiodes

forMobilePhone&TabletApplicationINPAQPNDirectionChannelVRWM(V)Cp(pF)Ipp(A)ESD(kV)MaxTypMax8/20usContactAirI/OUSB2.0TVW0201015VAA0Bi1511515USB3.0/3.2TVC5VB1S-DFN0603-2LBi150.20.2592020RFWifi/BTTVC5VB1S-DFN0603-2LBi150.20.2592020PowerVbusTVH0201015VSS0Bi1535193030OtherKeypad/Mic/SpeakerTVL0201015VAA0Bi15561515TVN0201015VAA0Bi151882020SimTVW0201015VAA0Bi1511420ProductspecPMUDVPICUSBconnectorProductCrossreferenceINPAQMurataTaiyoYudenTDKChilisinSunlordMCI0603HQ_seriesHK0603_series

MLG0603S_seriesBSCH_060303MCI0603TG_seriesLQP03TG_seriesHKQ0603_series

BSCQ_060303_HRSDCL0603Q_B02MCI0603TN_seriesLQP03TN_seriesHKQ0603W_seriesMLG0603P_seriesBSCQ_060303SDCL0603Q_B03MCI1005HQ_seriesLQG15HS_seriesHK1005_seriesMLG1005S_seriesBSCH00100505SDCL1005CMCI1608HQ_seriesLQG18HN_seriesHK1608_seriesBSCH00160808SDCL1608CINPAQMurataTaiyoYudenTDKTOKOChilsinMCI0603HW_seriesHK0603_series

MLG0603S_seriesMCI1005HW_seriesLQG15HH_seriesHK1005_seriesMLG1005S_seriesLL1005-FHLSeriesASCH00100505_00MCI1608HW_seriesLQG18HH_seriesLL1608-FSL_seriesASCH00160808_00AEC-Q200CrossreferenceMultilayerRFchipinductorINPAQCyntecTOKO/MurataChilisinSunlordTaiyoSemcoTDKWIP-VWIP141208VHTQL14120H

WIP201208VHTQL20120H

WIP-YWIP201208YHTQP20120H

BDHHDG201208

CIGT201208EHTFM201208BLDWIP-YWIP201610YHTQH2016

EHEI2016

MEKK2016CIGT2016EH

WIP-SWIP201610SHMMQ2016DFE2016EHEI2016WPN2016UMEKK2016CIGT2016EHTFM2016ALMAWIP252010/12SHMMQ2520DFE2520FHEI2520WPN2520U

CIGT2520EHVLS2520HBXWIP-PWIP252010/12PPIFE/PCSB2520DFE2520C/P/RMHCD2520WPN2520MAKK2520CIGT2520LMTFM2520GHMSPH2520WIP201610PPIFE/PCSB2016DFE2016C/P/RMHCD2016WPN2016MAKK2016CIGT2016LMTFM2016GHMSPH2016MainMoldingMoldingMoldingMoldingAlloycoreMoldingThintype

Molding

ProductiontypesINPAQ★Advantage:EfficiencyQuality–Qualcommapprovedhighefficiencyperformance,

CrossReferenceMiniMoldingpowerInductorESDGuardCrossReferenceProductseriesEIAINPAQLFEatonPanasonicMurataAutomotive0402EGA10402VxxAMAXGD10402---0603EGA10603VxxAMAXGD10603---General0201EGA10201VxxB0TFE10201VxxB0PGB2010201--LXES03AAA1-154LXES03AAA1-134LXES03AAA1-193LXES03AAA1-0980402EGA10402VxxB0PGB1010402

PGB2010402

XGD104020402ESDA-MLP1

PS04LTVA1EZAEG2ALXES15AAA1-153LXES15AAA1-100LXES15AAA1-1330603EGA10603VxxB0PGB1010603

XGD106030603ESDA-TR1

0603ESDA-TR2EZAEG3A-1206ArrayEGA41206VxxB0-41206ESDA--1204R1AArrayTVU1240R1A-42510ESDA-TR1--CrossReferenceCeramicchipinductorMFR.INPAQMuRataTDKTaiyoYudenTAI-TechPRODUCTIDSeriesPNSignallineMCBooooS/H

PowerlineMHCooooS/PSignallineBLMooA/BPowerlineBLMooP/K/SBSignallineMMZooooS/YPowerlineMPZooooSSignallineBKooooHS/HMPowerlineBKPooooFBMJooooSignallineFCMooooKF/CFPowerlineHCBooooKFHFZooooPFCharacteristic(Unit:ohm)10~3000--MCB10~1300--MHC10~1800—BLM10~1000--BLMooP/K10~2200—MMZ22~1000--MPZ22~2500--BK22~470--BKP80~1000--FBMJ7~2000--FCM10~1300--HCB10~1000--HFZEIASize0402~1812(MCB,MHC)0402~1806(BLM)0402~0805(MMZ,MPZ)0402~0805(BK,BKP)0402~1812(MCB,MHC)CrossReferenceFerriteBead39

Headquarters/ChunanPlant

ADD:No.11,Ke-YiSt.,Chunan,Miaoli,

35059Taiwan

TEL:+886-37-585-555FAX:+886-37-585-511

SuzhouPlantADD:No.1800ZhongshanWestRoad,4thFloor,ZhaoFeng

Universe

BuildingBlockD,XuhuiDistrict,ShanghaiCity200235

China

TEL:+86-21-6440-0398FAX:+86-21-6440-0138ShenzhenOffice

ADD:RM802,Unit2,BldA，KEXINGSCIENCE

PARK,No.15,

KeyuanAvenue,CentralZone,High-tech

Zone,Nanshan

District,ShenzhenCity,518057GuangdongProvince,ChinaTEL:+86-755-8279-4585

FAX:+86-755-8279-4565

TaipeiOfficeADD:1F,No.106,LigongStreet,Beitou

District,TaipeiCity,11261,TaiwanTEL:+886-2-7729-4296

FAX:+886-2-2858-5654

XianOfficeADD:Room608SOHOallianceBseat,ZhangBaOne

Road,GaoxinDistrict,Xian,China

TEL:+86-29-6569-1168FAX:+86-29-6569-1158TaiwanChina

SeoulADD:221RaemianSeochoUnivill,1445-4,Seocho-Dong,Seocho_gu,Seoul,Korea130-070

TEL:+82-2-584-8959

FAX:+82-2-584-8951

NewHampshire

ADD:21EchoBrookRoad,Rochester,NH03839,U.S.A.

TEL:+1-603-332-6222FAX:+1-603-509-2900USAKoreaShanghaiOffice

ADD:J2,14thFloor,ZhaoFengUniverseBuilding

Block,

No.1800ZhongshanWestRoad,Xuhui

District,ShanghaiCity200235,China

TEL:+86-21-6440-3187

FAX:+86-21-6440-0138

WuxiPlantADD:No1road81,AnZhengtown,XishanEconomicDevelopmentZone,WuxiCity,214105JiangSuProvince,TEL:+86-510-