GB/T 44839-2024微機電系統(tǒng)（MEMS）技術MEMS材料微柱壓縮試驗方法

ICS

31.080.99

CCS

L59

中華人民共和國國家標準

GB/T44839—2024/IEC62047?10:2011

微機電系統(tǒng)（MEMS）技術

MEMS材料微柱壓縮試驗方法

Micro-electromechanicalsystems（MEMS）

technology—

Micro-pillarcompressiontestforMEMSmaterials

（IEC62047-10:2011,Semiconductordevices—Micro-electromechanical

devices—Part10:Micro-pillarcompressiontestforMEMSmaterials,IDT）

2024-10-26發(fā)布2025-02-01實施

國家市場監(jiān)督管理總局發(fā)布

國家標準化管理委員會

GB/T44839—2024/IEC62047?10:2011

目次

前言

·····································································································

Ⅲ

1

范圍

··································································································

1

2

規(guī)范性引用文件

······················································································

1

3

術語和定義

···························································································

1

4

符號和名稱

···························································································

1

5

試件

··································································································

2

5.1

總體要求

·························································································

2

5.2

試件形狀

·························································································

2

5.3

尺寸測量

·························································································

3

6

試驗方法和測試儀器

·················································································

3

6.1

測試原理

·························································································

3

6.2

試驗儀器

·························································································

4

6.3

測試步驟

·························································································

4

6.4

試驗環(huán)境

·························································································

5

7

測試報告

······························································································

5

附錄A（資料性）

利用有限元法進行誤差估計

·······················································

6

A.1

誤差來源

························································································

6

A.2

有限元模型

······················································································

6

A.3

分析結果

························································································

6

參考文獻

··································································································

7

Ⅰ

GB/T44839—2024/IEC62047?10:2011

前言

本文件按照GB/T1.1—2020《標準化工作導則第1部分：標準化文件的結構和起草規(guī)則》的規(guī)

定起草。

本文件等同采用IEC62047?10:2011《半導體器件微機電器件第10部分：MEMS材料微柱壓

縮試驗方法》。

本文件增加了“術語和定義”一章。

本文件做了下列最小限度的編輯性改動：

—為與現有標準協(xié)調，將標準名稱改為《微機電系統(tǒng)（MEMS）技術MEMS材料微柱壓縮試

驗方法》；

—納入了IEC62047?10:2011/COR1:2012的勘誤內容，所涉及的條款的外側頁邊空白位置用垂直雙

線（||）進行了標示；

—5.2增加了注；

—更正了6.3c）應變速率數值，根據參考文獻，數值更正為“5×10-3/min”。

請注意本文件的某些內容可能涉及專利。本文件的發(fā)布機構不承擔識別專利的責任。

本文件由全國微機電技術標準化技術委員會（SAC/TC336）提出并歸口。

本文件起草單位：中國科學院微電子研究所、中機生產力促進中心有限公司、蘇州容啟傳感器科技

有限公司、武漢大學、北京大學、上海交通大學、昆山昆博智能感知產業(yè)技術研究院有限公司、蘇州晶

方半導體科技股份有限公司、東南大學、蘇州慧聞納米科技有限公司、中關村光電產業(yè)協(xié)會、中國電子

產品可靠性與環(huán)境試驗研究所、昆山雙橋傳感器測控技術有限公司、芯聯集成電路制造股份有限公司、

深圳市道格特科技有限公司。

本文件主要起草人：周維虎、李根梓、孫宏霖、劉勝、霍樹春、高成臣、劉景全、陳立國、

楊劍宏、陳志文、焦斌斌、黃慶安、聶萌、張平平、陳曉梅、盧永紅、陳思、王冰、謝紅梅、劉志廣。

Ⅲ

GB/T44839—2024/IEC62047?10:2011

微機電系統(tǒng)（MEMS）技術

MEMS材料微柱壓縮試驗方法

1范圍

本文件描述了微柱壓縮試驗方法，用于MEMS材料壓縮特性的高精度、高重復性測量，且試樣制造

難度適中；測量試樣單向壓縮應力?應變的關系，得到試樣壓縮彈性模量和屈服強度。

試樣是通過微加工技術在剛性（或高剛度）基體上制造的圓柱，其高徑比（高度與直徑的比值）大

于3為宜。本文件適用于金屬、陶瓷、高分子等材料制備的高度小于100μm微柱的測試。

2規(guī)范性引用文件

下列文件中的內容通過文中的規(guī)范性引用而構成本文件必不可少的條款。其中，注日期的引用文

件，僅該日期對應的版本適用于本文件；不注日期的引用文件，其最新版本（包括所有的修改單）適用

于本文件。

IEC62047?8半導體器件微機電器件第8部分：薄膜拉伸性能測量用帶材彎曲試驗方法

（Semiconductordevices—Micro?electromechanicaldevices—Part8:Stripbendingtestmethodfor

tensilepro