石墨烯泡沫應(yīng)用于寬屏電磁波屏蔽PPT file Wentao Zhai

1、1Microcellular graphene foam for improved broadband electromagnetic interference shielding石墨烯泡沫應(yīng)用于寬屏電磁波屏蔽石墨烯泡沫應(yīng)用于寬屏電磁波屏蔽Wentao Zhai翟文濤翟文濤Ningbo Institute, CAS中科院寧波材料所中科院寧波材料所20161018Our research interests我們的研究興趣我們的研究興趣Development of extrusion foaming technology開發(fā)連續(xù)擠出發(fā)泡技術(shù)開發(fā)連續(xù)擠出發(fā)泡技術(shù) Extrusion foaming

2、system with using CO2 as the blowing agent; 以超臨界CO2流體為發(fā)泡劑 Regular PP was used to produce PP foam 通用PP用作發(fā)泡體系Development of autoclave foaming technology開發(fā)釜壓發(fā)泡技術(shù)開發(fā)釜壓發(fā)泡技術(shù)EPPEPPEPLAEPIETPUOur research interests我們的研究興趣我們的研究興趣4Development of multi-functional polymer foam film開發(fā)多功能聚合物發(fā)泡薄膜開發(fā)多功能聚合物發(fā)泡薄膜 Polyme

3、r/filler/DMFPrecipitationDryingRedissolving Water vapor induced phase separationWater vaporH2OSolution blendingPolymer nanocompositePolymer foam filmDryingFilm casting Our research interests我們的研究興趣我們的研究興趣5Advantages of (microcellar) foaming微發(fā)泡的優(yōu)勢(shì)微發(fā)泡的優(yōu)勢(shì) lightweight/輕量化輕量化; Thermal insulation/隔熱隔熱; So

4、und insulation/隔音；隔音； Improved impact/cushion properties/提高提高了沖擊了沖擊/緩沖性能；緩沖性能； Reduced dielectric properties/降低了介電性能降低了介電性能 Absorbing the microwave as a maze structure; 為電磁波提供迷宮結(jié)構(gòu)；為電磁波提供迷宮結(jié)構(gòu)；EMI shielding materials電磁屏蔽材料電磁屏蔽材料Advantages of (microcellar) foaming微發(fā)泡的優(yōu)勢(shì)微發(fā)泡的優(yōu)勢(shì)EM interference effects 電磁干

5、擾電磁干擾 Compromise the performance and lifetime of devises Interfere with the function of other nearby components EM information leakage 電磁泄露電磁泄露Computer, cell phone,To damage the human body 危害人體危害人體Harmful effects of EM wave電磁波的危害電磁波的危害8Radar detection雷達(dá)探測(cè)雷達(dá)探測(cè)Electromagnetic stealth materialsRadar de

6、tection: Broad band EM wavetransmitted or received by radarClassical protection against EMIMetal sheetsBut: high density Poor mechanical flexibility Corrosion Limited tuning of the shielding effectiveness (SE)Advantages brought by polymersEasy shapingLightweightLow costBut most polymers are transpar

7、ent to the EMI waveMethods to improve the EMI SE of polymersTo disperse electrically conductive fillers in polymer matrixThe carbon materials such as carbon black, graphite, carbon nanotube, graphene nanosheets are usually selected as the conductive fillers.Classical materials for EMI shielding經(jīng)典的電磁

8、屏蔽材料經(jīng)典的電磁屏蔽材料Novel cellular structure of polymer composites for EMI shieldingPolymer/conductive filler compositePolymer/conductive filler composite foam金屬材料的電磁屏蔽機(jī)制為反射損耗；金屬材料的電磁屏蔽機(jī)制為反射損耗；聚合物復(fù)合材料以反射損耗為主；聚合物復(fù)合材料以反射損耗為主；均易導(dǎo)致電磁波二次污染問(wèn)題。均易導(dǎo)致電磁波二次污染問(wèn)題。 入射波能量入射波能量 反射波能量反射波能量透射波能量透射波能量聚合物發(fā)泡材料以吸收損耗為主，有效聚合物發(fā)泡材料

9、以吸收損耗為主，有效避免電磁波的二次污染問(wèn)題避免電磁波的二次污染問(wèn)題透射波能量透射波能量入射波能量入射波能量反射波能量反射波能量Tendency of EMI shielding materials電磁屏蔽材料發(fā)展趨勢(shì)電磁屏蔽材料發(fā)展趨勢(shì)Lighter/輕量化輕量化Thinner/更薄更薄Higher EMI SE/更高的屏蔽效能更高的屏蔽效能For the application in special fields such as aerospace, weapon equipment, microelectrionics.Superior thermal stability/耐高溫耐高溫F

10、lame retardancy/阻燃阻燃Excellent mechanical properties/有益的性能有益的性能Flexible/柔性柔性High Tg: 220 C;Flame retardant;Solid stat foaming using compressed CO2 as the physical blowing agentPreparation of high performance PEI microcellular foam 制備高性能制備高性能PEI微發(fā)泡材料微發(fā)泡材料Miller, D. et al., Polymer, 2011, 52, 2910.Publ

11、ished data of microcellular high performance foam/發(fā)表的高性能聚合物發(fā)泡材料論文發(fā)表的高性能聚合物發(fā)泡材料論文Expansion ratio lower than 5 times膨脹倍率低于膨脹倍率低于5倍倍Method to improve the expansion ratio of PI microcellular foam/提高膨脹倍率的方法提高膨脹倍率的方法Density：90 kg/m3Expansion rate: 15timesW.T. Zhai*, W.W. Feng, J.Q. Ling, W.G. Zheng, Ind.

12、Eng. Chem. Res., 2012, 51, 12827. THF as a co-blowing agentTg: 265 C50 mCell size：2030 mCell morphology of microcellular PI bead foam PEI微發(fā)泡粒子的泡孔形態(tài)微發(fā)泡粒子的泡孔形態(tài)Compression molding of PI bead foam模壓粘結(jié)成型模壓粘結(jié)成型Tg:230 C, 50 times expansion/50倍膨脹倍膨脹;翟文濤，鄭文革，凌建強(qiáng)，中國(guó)發(fā)明專利， 201210171721.X翟文濤，鄭文革，馮衛(wèi)衛(wèi)，凌建強(qiáng)，中國(guó)發(fā)明專利，

13、201210170254.9PI microcellular foam with superhigh volume expansion/制備超高倍率制備超高倍率PI泡沫泡沫Compression molding模壓成型模壓成型 High processing temperature up to 320-360 C/加工加工溫度高達(dá)溫度高達(dá)320-360度度； High viscosity of composite melt and difficult to disperse high content of nanofillers/體系粘度高，難以分散體系粘度高，難以分散; Difficult

14、to achieve a high foam expansion ratio/難以難以得到高的膨脹倍率；得到高的膨脹倍率； A high filler content requirement to achieve a good EMI shielding properties/優(yōu)異的屏蔽效能需要添加高含量的吸優(yōu)異的屏蔽效能需要添加高含量的吸收劑！收劑！Challenging in the preparation of PI composite foam with high filler loading 制備高填充制備高填充PI復(fù)合材料泡沫的挑戰(zhàn)復(fù)合材料泡沫的挑戰(zhàn)20Polymer/filler

15、/DMFPrecipitationDryingRedissolving Water vapor induced phase separationWater vaporH2OSolution blendingPolymer nanocompositePolymer foam filmDryingFilm casting Method to solve the challenging/解決辦法解決辦法Preparation of PEI/graphene microcellular foam/制備制備PEI/石墨烯發(fā)泡材料石墨烯發(fā)泡材料J.Q. Ling, W.T. Zhai*, W.W. Fen

16、g. et al., ACS Appl. Mater. Interfaces, 2013, 5, 2677.B. Shen, D.D. Lu, W.T. Zhai*, et al., ACS Appl. Mater. Interfaces, 2013, 5, 11383.PEI/Graphene/DMF solutionSample size: 2.3 mm22EMI SE test/電磁屏蔽效能測(cè)試電磁屏蔽效能測(cè)試R&S ZVA67 vestor network analyzer 網(wǎng)絡(luò)分析儀 Sample size: 22.5 mm 10.0 mmFoaming: Volume expans

17、ion of 5 timesFor the commercial usage 20dB商用電磁屏蔽材料商用電磁屏蔽材料需要效能大于需要效能大于20dBPEI/graphene microcellular foam used for EMI shielding/電磁屏蔽效能電磁屏蔽效能24Preparation of high thermal stable PI/graphene microcellular foam/制備泡沫制備泡沫The improved dispersion of graphene oxide by in-situ polymerization通過(guò)原位聚合來(lái)改善氧化石墨通過(guò)

18、原位聚合來(lái)改善氧化石墨烯的分散烯的分散Y. Li, W.T. Zhai*, et al., RSC Adv., 2015, 5, 24342.25Thermal imidization at 350 C350度亞胺化Cell morphology of PAA/graphane and PI/graphene microcellular foams/泡孔形態(tài)泡孔形態(tài)Samples with the thickness of 0.8 mm樣品厚度僅為樣品厚度僅為0.8毫米毫米 EMI SE of PI/graphene microcellular foam/PI/石墨烯泡沫的電磁屏蔽效能石墨烯泡

19、沫的電磁屏蔽效能16 wt % rGO27PMDA/ODA/GO/DMFCarbonization and graphitizationImidizationCasting on glass substrateIn situ polymerizationPhase separationMicrocellular PI/graphene foamsCarbon/graphene foamGraphite plateN2 atmospherePAA/GO casting solutionCoagulant bathPreparation of carbon/graphene microcellul

20、ar foam/制備石墨烯制備石墨烯/碳泡沫碳泡沫Y. Li, W.T. Zhai*, et al., Carbon, 2016, 100, 375-385.350 C1000 C1500 C2100 C2600 C2600 C5 m5 m5 m5 m5 m1 m10203040506070802600 C2100 C1500 C1000 C(004)(100) (002)350 C Intensity (a.u.)2 100015002000250030002600 CID/IG= 0.429ID/IG= 0.814ID/IG= 2.207ID/IG= 1.425ID/IG= 1.972G-

21、bandD-bandG-bandD-band350 C1000 C1500 C Intensity (a.u.)Raman shift (cm-1)2100 CPI (350C) Carbonization (1000-1500C) Graphitization (2100-2600 C) Cell morphology evolution during the pyrolysis/碳化碳化/石墨化過(guò)程中泡孔結(jié)構(gòu)的演變石墨化過(guò)程中泡孔結(jié)構(gòu)的演變EMI SE of carbon/graphene microcellular foam/石墨烯石墨烯/碳復(fù)合泡沫的屏蔽效能碳復(fù)合泡沫的屏蔽效能Prep

22、aration of graphene film by direct evaporation of GO suspension/GO薄膜薄膜 self-assembly of GO into the GO film 自組裝成自組裝成GO薄膜；薄膜； GO was thermal reduction into graphene film； 熱還原成石墨烯薄膜熱還原成石墨烯薄膜B. Shen, W.T. Zhai*, W.G. Zheng*, Advanced Functional Materials, 2014, 24, 4542.Proofs of the thermal reduction of graphene oxide into graphene/熱還原的證據(jù)熱還原的證據(jù)Conductivity of GO and grpahene電導(dǎo)率電導(dǎo)率sp3 Csp2 CThe EMI SE of GO and graphene屏蔽效能屏蔽效能 B. Shen, W.T. Zhai* et al., Carbon, 2016, 102,154.Preparation of graphene foam by the hydrazine foaming/水合肼發(fā)