電路板類英語(yǔ)詞匯

1、Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(試驗(yàn)).Acceleration速化反應(yīng).Accelerator 加速劑,速化劑.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy準(zhǔn)確度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像顯微鏡.Acrylic壓克力(聚丙烯酸樹

2、脂).Actinic Light (or Intensity, or Radiation)有效光.Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動(dòng)零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進(jìn)劑.Adhesive膠類或接著劑.Admittance導(dǎo)納(阻抗的倒數(shù)).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.Air Inclusion氣泡夾雜.Air Knife風(fēng)刀.Al

3、gorithm算法.Aliphatic Solvent脂肪族溶劑.Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環(huán)境溫度.Amorphous無定形,非晶形.Amp-Hour安培小時(shí).Analog Circuit/Analog Signal模擬電路/模擬訊號(hào).Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal 韌化(退火).Annular Ring孔環(huán).Anode陽(yáng)極.Anode Sludge陽(yáng)極泥.Anodizing陽(yáng)極化.ANSI美

4、國(guó)標(biāo)準(zhǔn)協(xié)會(huì).Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動(dòng)光學(xué)檢驗(yàn).Apertures開口,鋼版開口.AQL品質(zhì)允收水準(zhǔn).AQL(Acceptable Quality Level)允收品質(zhì)水準(zhǔn).Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途績(jī)體電路器.Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動(dòng)電測(cè)設(shè)備.Attenuation訊號(hào)衰減.Autoclave壓力鍋.Axial-lead軸心引腳.Azeotrope共沸混合液.*B

5、*Back Light (Back Lighting)背光法.Back Taper反錐斜角.Backpanels, Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳數(shù)組(封裝).Bandability彎曲性.Banking Agent護(hù)岸劑.Bare Chip Assembly裸體芯片組裝.Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液體比重比水重則 Be=145-(145÷Sp.Gr)凡液體比重比水輕則

6、Be=140÷(Sp.Gr-130)*Sp.Gr 為比重即同體績(jī)物質(zhì)對(duì)"純水"1g/cm的比值).Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測(cè)試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil雙階式鋼板.Binder粘結(jié)劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔

7、.Blister局部性分層或起泡.Block Diagram電路系統(tǒng)塊圖 .Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍(lán)紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight彈標(biāo).Bond Strength結(jié)合強(qiáng)度.Bondability結(jié)合性.Bonding Layer結(jié)合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結(jié)合線.Bow, Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425870下進(jìn)行熔接的

8、方式).Break Point顯像點(diǎn).Break-away Panel可斷開板.Breakdown Voltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stageB階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process凸塊制程.Buoyancy浮力.Buried Via Hole埋導(dǎo)孔.Burn-in高溫加速老化試驗(yàn).Burning燒焦.Burr毛頭.Bus Bar匯電桿

9、.Butter Coat 外表樹脂層.*C*C4 Chip JointC4芯片焊接.Cable電纜.CAD計(jì)算機(jī)輔助設(shè)計(jì).Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法.Capacitance電容.Capacitive Coupling電容耦合.Capillary Action毛細(xì)作用.Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment, Active活化炭處理.Card卡板.Card Cages/Card Racks電路板構(gòu)裝箱.Carlson Pin卡氏定位稍.Carrier載體.Cartridge濾心.Cas

10、tallation堡型績(jī)體電路器.Catalyzed Board, Catalyzed Substrate催化板材.Catalyzing催化.Cathode陰極.Cation陰向離子, 陽(yáng)離子.Caul Plate隔板.Cavitation空泡化 半真空.Center-to-Center Spacing中心間距.Ceramics陶瓷.Cermet陶金粉.Certificate證明書.CFC氟氫碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學(xué)研磨.Chemi

11、cal Resistance抗化性.Chemisorption化學(xué)吸附.Chip芯片(粒).Chip Interconnection芯片互連.Chip on Board芯片粘著板.Chip On Glass晶玻接裝(COG).Chisel鉆針的尖部.Chlorinated Solvent含氯溶劑,氯化溶劑.Circumferential Separation環(huán)狀斷孔.Clad/Cladding披覆.Clean Room無塵室.Cleanliness清潔度.Clearance余地,余環(huán).Clinched Lead Terminal緊箝式引腳.Clinched-wire Through Conne

12、ction通孔彎線連接法 .Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線.Coefficient of Thermal Expansion熱膨脹系數(shù).Co-Firing共繞.Cold Flow冷流.Cold Solder Joint冷焊點(diǎn).Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯(cuò)離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Co

13、mposites,(CEM-1,CEM-3)復(fù)合板材.Condensation Soldering凝熱焊接,液化放熱焊接.Conditioning整孔.Conductance導(dǎo)電.Conductive Salt導(dǎo)電鹽.Conductivity導(dǎo)電度.Conductor Spacing導(dǎo)體間距.Conformal Coating貼護(hù)層.Conformity吻合性, 服貼性.Connector連接器.Contact Angle接觸角.Contact Area接觸區(qū).Contact Resistance接觸電阻.Continuity連通性.Contract Service協(xié)力廠,分包廠.Contro

14、lled Depth Drilling定深鉆孔.Conversion Coating 轉(zhuǎn)化皮膜.Coplanarity共面性.Copolymer共聚物.Copper Foil銅皮.Copper Mirror Test銅鏡試驗(yàn).Copper Paste銅膏.Copper-Invar-Copper (CIC)綜合夾心板.Core Material內(nèi)層板材,核材.Corner Crack 通孔斷角.Corner Mark板角標(biāo)記.Counterboring方型擴(kuò)孔.Countersinking錐型擴(kuò)孔.Coupling Agent 偶合劑.Coupon, Test Coupon板邊試樣.Coverl

15、ay/Covercoat表護(hù)層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.Crossection Area截面積.Crosshatch Testing十字割痕試驗(yàn).Crosshatching十字交叉區(qū).Crosslinking, Crosslinkage交聯(lián),架橋.Crossover越交,搭交.Crosstalk噪聲, 串訊.Crystalline Melting Point晶體熔點(diǎn).C-Stage C階段.Cure硬化,熟化.Current Density電流密度.Current-Carrying Capability載流能力.Curtain Coating濂涂法

16、.*D*Daisy Chained Design菊瓣設(shè)計(jì).Datum Reference基準(zhǔn)參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長(zhǎng).Denier丹尼爾(是編織紡織所用各種紗類直徑單位,定義9000米紗束所具有的重量(以克米計(jì)).Densitomer透光度計(jì).Dent凹陷.Deposition 皮膜處理.De

17、siccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機(jī).Developing顯像 .Deviation偏差.Device電子組件.Dewetting縮錫.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重鉻 酸鹽.Dicing芯片分割.Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質(zhì).Dielectric Breakdown Voltage介質(zhì)崩潰電壓.Dielectric Const

18、ant介質(zhì)常數(shù).Dielectric Strength介質(zhì)強(qiáng)度.Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法.Diffusion Layer擴(kuò)散層.Digitizing數(shù)字化.Dihedral Angle雙反斜角.Dimensional Stability尺度安定性.Diode二極管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體.Dipole偶極,雙極.Direct / Indirect Stencil直接/間接版膜.Direct Emulsion直接乳膠.Dire

19、ct Plating直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復(fù)線板.Dish Down碟型下陷.Dispersant分散劑.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受擾焊點(diǎn).Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔.Drag In / Drag Out帶進(jìn)/帶出.Drag Soldering拖焊.Drawbridging吊橋效應(yīng)

20、.Drift漂移.Drill Facet鉆尖切削面.Drill Pointer鉆針重磨機(jī).Drilled Blank已鉆孔的裸板.Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接.Ductility展性.Dummy Land假焊墊.Dummy, Dummying假鍍(片).Durometer橡膠硬度計(jì).DYCOstrate電漿蝕孔增層法.Dynamic Flex(FPC)動(dòng)態(tài)軟板.*E*E-Beam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Co

21、nnector板邊(金手指)承接器.Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測(cè)試.EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級(jí)玻璃.Elastomer彈性體.Electric Strength(耐)電性強(qiáng)度.Electrodeposition電鍍.Electro-deposition Photoresist電著光阻, 電泳光阻.Electroforming電鑄.Electroless-Deposition無電鍍.Electrolytic Tough Pitch電解銅.Electrolytic-Clea

22、ning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動(dòng), 電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation 延伸性, 延伸率.Embossing凸出性壓花.EMF(Electromotive Force)電動(dòng)勢(shì).EMI(Electromagnetic Interference)電磁干擾.Emulsion乳化.Emulsion Side藥膜面.Encapsulating膠囊.Encroachment沾污,侵犯.End Tap封頭.Entek有機(jī)護(hù)銅處理.Entrapment夾雜物.Entry Mat

23、erial蓋板.Epoxy Resin環(huán)氧樹脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.Etching Indicator蝕刻指針.Etching Resist蝕刻阻劑.Eutetic Composition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.*F*Fabric綱布.Face Bonding反面朝下結(jié)合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布線/扇入布線.Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強(qiáng)度.Fault缺陷.Fault P

24、lane斷層面.Feed Through Hole導(dǎo)通孔.Feeder 進(jìn)料器.Fiber Exposure玻纖顯露.Fiducial Mark基準(zhǔn)記號(hào).Filament纖絲.Fill緯向.Filler填充料.Fillet內(nèi)圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過濾器.Fine Line細(xì)線.Fine Pitch密腳距,密線距,密墊距.Fineness粒度, 純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法.First Article首產(chǎn)品.First Pass-Yield初檢良品率.Fixtu

25、re夾具.Flair刃角變形.Flame Point自燃點(diǎn).Flame Resistant耐燃性.Flammability Rate燃性等級(jí).Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡(luò).Flat Cable扁平排線.Flat Pack扁平封裝(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)軟板.Flexural Failure撓曲損壞.Flexural Module彎曲模數(shù), 抗撓性模數(shù) .Flexural Strength抗撓強(qiáng)度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Strok

26、e Print覆墨沖程印刷.Flow Soldering (Wave Soldering)流焊.Fluorescence熒光.Flurocarbon Resin碳氟樹脂.Flush Conductor嵌入式線路 , 貼平式 導(dǎo)體.Flush Point閃火點(diǎn).Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print (Land Pattern)腳墊.Foreign Material 外來物,異物.Form-to-List布線說明清單.Four Point Twisting四點(diǎn)扭曲法.Free Rad

27、ical自由基.Freeboard干舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.*G*G-10由連續(xù)玻纖所織成的玻纖布與環(huán)氧樹脂粘結(jié)劑所復(fù)合成的材料.Gage, Gauge量規(guī).Gallium Arsenide (GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動(dòng)次序).Galvanizing鍍鋅.GAP第一面分離,長(zhǎng)刃斷開.Gate

28、Array閘列,閘極數(shù)組.Gel Time膠化時(shí)間.Gelation Particle膠凝點(diǎn).Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線路圖形與孔位,所發(fā)展一系列完整的軟件檔案).Ghost Image陰影.Gilding鍍金 (現(xiàn)為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging, Groove玻纖突出/挖破.Glass Transition Temperature, Tg玻璃態(tài)轉(zhuǎn)化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測(cè)試法

29、.Glycol (Ethylene Glycol)乙二醇.Golden Board測(cè)試用標(biāo)準(zhǔn)板.Grain Size結(jié)晶粒度.Grass Leak 大漏.Grid標(biāo)準(zhǔn)格.Ground Plane /Earth Plane接地層.Ground Plane Clearance接地空環(huán).Guide Pin導(dǎo)針.Gull /Wing Lead鷗翼引腳.*H*Halation環(huán)暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名.Hard Anodizing硬陽(yáng)極化.Hard Chrome Plating鍍硬鉻.

30、Hard Soldering硬焊.Hardener (Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(diǎn)(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導(dǎo)熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate A

31、ir Filter (HEPA)高效空氣塵粒過瀘機(jī).Hipot Test 高壓電測(cè).Hi-Rel高度靠度.Hit 擊(鉆孔時(shí)鉆針每一次"刺下"的動(dòng)作).Holding Time停置時(shí)間.Hole Breakout孔位破出.Hole Counter數(shù)孔機(jī).Hole Density孔數(shù)密度.Hole Preparation通孔準(zhǔn)備.Hole Pull Strength孔壁強(qiáng)度.Hole Void破洞.Hook 切削刀緣外凸.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風(fēng)手焊.HTE(High Tempe

32、rature Elongation)高溫延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗(yàn).Hydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸濕性.Hypersorption超吸咐.*I*I.C. Socket績(jī)體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉(zhuǎn)移.Immersion Plating浸鍍.Impedance

33、阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing組裝板電測(cè).Inclusion異物,夾雜物.Indexing Hole基準(zhǔn)孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert, Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)績(jī)體電路器.Inter Face接口.Interconnection互連.Intermetallic Compound (IMC)接

34、口共化物.Internal Stress內(nèi)應(yīng)力.Interposer互邊導(dǎo)電物.Interstitial Via-Hole(IVH)局部層間導(dǎo)通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization游離,電離.Ionization Voltage (Corona Level)電離化電壓(電纜內(nèi)部狹縫空氣中,引起其電離所施加之最小電壓).IPC美國(guó)印刷電路板協(xié)會(huì).I

35、solation隔離性,隔絕性.*J*JEDEC(Joint Electronic Device 聯(lián)合電子組件工程委員會(huì).Engineering Council)J-LeadJ型接腳.Job Shop專業(yè)工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時(shí)供應(yīng),及時(shí)出現(xiàn).*K*Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鉆石)=0.2g 純金則24k金為100%的鈍金.Kauri-Butanol Value考立丁醇值(簡(jiǎn)稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤.K

36、iss Pressure吻壓, 低壓.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*L*Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結(jié)構(gòu).Laminate Void板材空洞.Laminate(s)基板.Lamination Void壓合空洞.Laminator壓膜機(jī).Land孔環(huán)焊墊,表面焊墊.Landless Hole無環(huán)通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser

37、Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光機(jī).Laser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out布線,布局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出.Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標(biāo)記.Leveling整平.Lifted Land孔環(huán)(焊墊)浮起.Ligand錯(cuò)離子附屬體.Light Emitting Diodes (LED)

38、發(fā)光二極管.Light Integrator光能累積器.Light Intensity光強(qiáng)度.Limiting Current Density極限電流密度.Liquid Crystal Display (LCD)液晶顯示器.Liquid Dielectrics液態(tài)介質(zhì).Liquid Photoimagible Solder Mask, (LPSM)液態(tài)感光防焊綠漆.Local Area Network區(qū)域性網(wǎng)絡(luò).Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent (TanDK)損失正切.Lot Size批量.Luminance發(fā)光強(qiáng)

39、度.Lyophilic親水性膠體.*M*Macro-Throwing Power巨觀分布力.Major Defect主要(嚴(yán)重)缺點(diǎn).Major Weave Direction主要織向.Margin刃帶(鉆頭尖部).Marking標(biāo)記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport質(zhì)量輸送.Master Drawing主圖.Mat席(用于CEM-3(Composite Epoxy Material)的復(fù)合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).Mealing泡點(diǎn).Mean Time

40、 To Failure (MTTF)故障前可用之平均時(shí)數(shù).Measling白點(diǎn).Mechanical Stretcher機(jī)械式張網(wǎng)機(jī).Mechanical Warp機(jī)械式纏繞.Mechanism機(jī)理.Membrane Switch薄膜開關(guān).Meniscograph Test弧面狀沾錫試驗(yàn).Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數(shù).Metal Halide Lamp 金屬鹵素?zé)?Metallization金屬 化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-elect

41、ronios微電子.Microetching微蝕.Microsectioning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線.Microthrowing Power微分布力.Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環(huán)下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向.Misregistration 對(duì)不準(zhǔn)度.Mixed Componmt Mounting Technology混合零件之組裝

42、技術(shù).Modem調(diào)變及解調(diào)器.Modification修改.Module模塊.Modulus of Elasticity彈性系數(shù).Moisture and Insulation Resistance Test濕氣與絕緣電阻試驗(yàn).Mold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機(jī)板,母板.Moulded Circuit模造立體電路機(jī).Mounting Hole安裝孔.Mounting Hole組裝孔,機(jī)裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現(xiàn)不規(guī)則缺口).Multi-Chip-Module(MCM)多芯片芯片模塊.Mult

43、iwiring Board (or Discrete Wiring Board)復(fù)線板.N.C.數(shù)值控制.Nail Head釘頭.Near IR近紅外線.Negative負(fù)片,鉆尖的第一面外緣變窄.Negative Etch-back反回蝕.Negative Stencil負(fù)性感光膜.Negative-Acting Resist負(fù)性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環(huán).Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.Noble Metal Paste貴金屬印膏.Node

44、節(jié)點(diǎn).Nodule節(jié)瘤.Nomencleature標(biāo)示文字符號(hào).Nominal Cured Thickness標(biāo)示厚度.Non-Circular Land非圓形孔環(huán)焊墊.Non-flammable非燃性.Non-wetting不沾錫.Normal Concentration (Strength)標(biāo)準(zhǔn)濃度,當(dāng)量濃度.Normal Distribution常態(tài)分布.Novolac酯醛樹脂.Nucleation , Nucleating核化.Numerical Control數(shù)值控制.Nylon尼龍.*O*Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Ox

45、yen Free High Conductivity)無氧高導(dǎo)電銅.Ohm歐姆.Oilcanning蓋板彈動(dòng).OLB(Outer Lead Bond)外引腳結(jié)合.Oligomer寡聚物.Omega Meter離子污染檢測(cè)儀.Omega Wave振蕩波.On-Contact Printing密貼式印刷.Opaquer不透明劑,遮光劑.Open Circuits斷線.Optical Comparater光學(xué)對(duì)比器(光學(xué)放大器.)Optical Density光密度.Optical Inspection光學(xué)檢驗(yàn).Optical Instrument光學(xué)儀器.Organic Solderability

46、 Preservatives (OSP)有機(jī)保焊劑.Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側(cè)出.Output產(chǎn)出,輸出.Overflow溢流.Overhang總懸空.Overlap 鉆尖點(diǎn)分離.Overpotantial(Over voltage)過電位,過電壓.Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*P*Packaging封裝,構(gòu)裝.Pad焊墊,圓墊.Pad Master圓墊底片.Pads Only Board唯墊板.Palladium鈀.Panel制程板.Panel Plat

47、ing全板鍍銅.Panel Process全板電鍍法.Paper Phenolic紙質(zhì)酚醛樹脂(板材).Parting Agent脫膜劑.Passivation鈍化 ,鈍化外理.Passive Device (Component)被動(dòng)組件(零件)Paste膏,糊.Pattern板面圖形.Pattern Plating線路電鍍.Pattern Process線路電鍍法.Peak Voltage峰值電壓.Peel Strength抗撕強(qiáng)度.Periodic Reverse (PR) Current周期性反電流.Peripheral周邊附屬設(shè)備.Permeability透氣性,導(dǎo)磁率.Permitt

48、ivity誘電率,透電率.pH Value酸堿值.Phase相.Phase Diagram相圖.Phenolic酚醛樹脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光啟始劑.Photomask光罩.Photoplotter, Plotter光學(xué)繪圖機(jī).Photoresist光阻.Photoresist Chemical Machinning (Milling)光阻式化學(xué)(銑刻)加工.Phototool底片.Pick and Place拾取與放置.Piezoelectric壓電性.Pin 插腳,插梢,插針.Pin Grid

49、 Array (PGA)矩陣式針腳對(duì)裝.Pinhole針孔.Pink Ring粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點(diǎn).Plain Weave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.Plated Through Hole鍍通孔.Platen熱盤.Plating鍍.Plotting標(biāo)繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.Pneumatic Stretcher氣動(dòng)拉伸器.Pogo Pin伸縮探針.Point 鉆尖.Point Angle鉆尖面.Point Source Light點(diǎn)狀光源.Poise泊."粘滯度"單位=1

50、dyne*sec/cm2.Polar Solvent極性溶劑.Polarity電極性.Polarization分極,極化.Polarizing Slot偏槽.Polyester Films聚酯類薄片.Polymer Thick Film (PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.Popcorn Effect爆米花效應(yīng).Porcelain瓷材,瓷面.Porosity Test疏孔度試驗(yàn).Positive Acting Resist正性光阻劑.Post Cure后續(xù)硬化,后烤.Post Separation后期分離,事后公離.Pot Life運(yùn)用期,鍋中

51、壽命.Potting鑄封,模封.Power Supply電源供應(yīng)器.Preform 預(yù)制品.Preheat預(yù)熱.Prepreg膠片,樹脂片.Press Plate鋼板.Press-Fit Contact擠入式接觸.Pressure Foot 壓力腳.Pre-tinning預(yù)先沾錫.Primary Image線路成像.Print Through壓透,過度擠壓.Probe探針.Process Camera制程用照像機(jī).Process Window操作范圍.Production Master生產(chǎn)底片.Profile輪廓,部面圖,升溫曲線圖棱線.Propagation傳播.Propagation De

52、lay傳播延遲.Puddle Effect水坑效應(yīng).Pull Away拉離.Pulse Plating脈沖電鍍法.Pumice Powder 浮石粉.Punch沖切.Purge, Purging凈空,凈洗.Purple Plague紫疫(金與鋁的共化物層).Pyrolysis熱裂解,高溫分解.*Q*Quad Flat Pack (QFP)方扁形封裝體.Qualification Agency資格認(rèn)證機(jī)構(gòu).Qualification Inspection資格檢驗(yàn).Qualified Products List合格產(chǎn)品(供應(yīng)者)名單.Qualitative Analysis定性分析.Quality

53、 Conformance Test Circuitry (Coupon)品質(zhì)符合之試驗(yàn)線路(樣板).Quantitative Analysis定量分析.Quench 淬火,驟冷.Quick Disconnect快速接頭.Quill緯紗繞軸.*R*Rack 掛架.Radial Lead放射狀引腳.Radio Frequency Interference (RFI)射頻干擾.Rake Angle摳角,耙角.Rated Temperature, Voltage額定溫度,額定電壓.Reactance電抗.Real Estate底材面,基板面.Real Time System 實(shí)時(shí)系統(tǒng).Reclaiming再生,再制.Rediometer輻射計(jì),光度計(jì).Reel to Reel卷輪(盤)式操作.Reference Dimension參考尺度.Reference Edge參考邊緣.Reflection反射.Reflow Soldering重熔焊接,熔焊.Refraction折射.Refractive Index折射率.Register Mark對(duì)準(zhǔn)用標(biāo)記.Registration對(duì)準(zhǔn)度.Reinforcement補(bǔ)強(qiáng)物.Rejection剔退,拒收.Relamination(Re-Lam)多層板壓合.Relaxat