substratedesigntrainning

1、Substrate Design Training Manual8/4/2003Prepared by Neo Zhang1SummaryChapter 1:About BGA Substrate (Introduction)What is a BGAWhat is a substrateHow to design a substrateChapter 2: Substrate Fabrication ProcessThe raw material of a substrateThe base Process flow of the substrate FabricationChapter 3

2、: Substrate Design Rule IntroduceWhy we need the design ruleHow to use the design rule (RND-AB07)Chapter 3-1: Substrate Material SpecHow to choose the material. (Core; P.P; S/R)The cross-section design of the substrate.Substrate Design Training Manual8/4/2003Prepared by Neo Zhang2SummaryChapter 3-2:

3、 Wire Bonding SPECHow to layout the wire bonding (Fingers;GND/PWR rings)How to choose the wire diameter.Chapter 3-3: Substrate Fabrication SPECHow to choose the drill sizeThe Pitch and Space of the traceChapter 3-4: The base electrical concern in substrate layoutThe material of the H/S packageHow to

4、 reduce the noise in BGA packageChapter 4: The flow of substrate designWhat information we need to do a substrate designThe basic design flow Why we need confirm the Gerber form the substrate vender. Substrate Design Training Manual8/4/2003Prepared by Neo Zhang3SummaryChapter 5: How to use the APDHo

5、w to setup the design rule in APDHow to Setup the optionsHow to setup the cross-sectionHow to create a customer dieHow to create a BGAHow to input the Net-listHow to set the DRC checkHow to do the Auto W/BHow to align the fingers layoutHow to create the PWR/GND ringsHow to arrange the viasHow to smo

6、oth the traces Substrate Design Training Manual8/4/2003Prepared by Neo Zhang4SummaryHow to create the teardropsHow to setup the design rule in APDHow to run DRC checkHow to verify the design after the layoutChapter 6: Post designHow to create the GerberHow to check the GerberMake out the Fabrication

7、 Spec Chapter 7: CustomerHow to create substrate approved formWhy we need customer approve before we release it to Fabrication? How to do get the approve.Substrate Design Training Manual8/4/2003Prepared by Neo Zhang5SummaryChapter 8: Substrate SupplierWhat information we need to provide.How to confi

8、rm the Gerber from the suppliersHow to confirm the Fab Spec from the suppliers Chapter 9: Drawing Management How to submit you drawingGAPT coding method What information should be backup in RND serverChapter 10: OthersEveryone should complete a TFBGA 10 x10 2 layer substrate designSandy & David

9、should complete a PBGA 35x35 4 layer substrate designSandy & Sophia should know how to check the substrate design and how to confirm the suppliers Gerber.David should know how to complete a QFP design.Substrate Design Training Manual8/4/2003Prepared by Neo Zhang6Chapter 1About BGA Substrate (Int

10、roduction)We need to know:What is a BGAWhat is a substrateHow to design a substrateSubstrate Design Training Manual8/4/2003Prepared by Neo Zhang7BGA: Ball Grid Array (球柵陣列封裝)PBGAFBGATBGAFCCSPSuper BGACBGAChapter 1Substrate Design Training Manual8/4/2003Prepared by Neo Zhang8SIPOther substrate type p

11、roductMMCLeadless Chip Carrier (LCC)Chapter 1Substrate Design Training Manual8/4/2003Prepared by Neo Zhang9What is a substrateSubstrate Substrate 是是BGA,PGA BGA,PGA 等封裝中所用到的一種載體；目的是為了等封裝中所用到的一種載體；目的是為了提供：提供：1.1.一種信號的通路；一種信號的通路；2.2.對芯片提供支撐；對芯片提供支撐；3.3.散熱的途徑散熱的途徑Chapter 1Substrate Design Training Manua

12、l8/4/2003Prepared by Neo Zhang10How to do a good designChapter 1Tool (Design Software)Persons with ability Good DesignDesign RuleDesign DatabaseSubstrate Design Training Manual8/4/2003Prepared by Neo Zhang11How to get a good BGA package Chapter 1EquipmentsPersons with ability A successful productA D

13、ependable Substrate VenderDesign DatabaseSubstrate Design Training Manual8/4/2003Prepared by Neo Zhang12Chapter 2Substrate Fabrication ProcessWe need to know:The raw material of a substrateThe base Process flow of the substrate FabricationSubstrate Design Training Manual8/4/2003Prepared by Neo Zhang

14、13Substrate Substrate 的制造工藝的制造工藝（硬板（硬板4 4layerlayer）雙面覆銅板貼干膜曝光顯影蝕刻去菲林Chapter 2Substrate Design Training Manual8/4/2003Prepared by Neo Zhang14Substrate Substrate 的制造工藝的制造工藝( (硬板硬板4 4layerlayer）層壓鉆孔鍍通孔塞孔貼干膜曝光Chapter 2Substrate Design Training Manual8/4/2003Prepared by Neo Zhang15Substrate Substrate 的制

15、造工藝的制造工藝( (硬板硬板4 4layerlayer）顯影蝕刻去菲林印綠油曝光綠油顯影Chapter 2Substrate Design Training Manual8/4/2003Prepared by Neo Zhang16Substrate Substrate 的制造工藝的制造工藝（硬板（硬板4 4layerlayer）電鍍鎳金成型Chapter 2Note: Its only a typical flow. Since substrate fabrication is very complex. There are many different process in each s

16、ubstrate Fab.Substrate Design Training Manual8/4/2003Prepared by Neo Zhang17The raw material of a substrateChapter 2雙面覆銅板1.BT core: 芯板厚度Core Thickness (mm)芯板覆銅層厚度Copper Clad (um)材料名稱Material Name*0.0612/12HL832HS*0.0812/12HL832HS0.1012/12HL832HS or HL832*0.1018/18HL8320.1512/12HL832HS or HL8320.1518

17、/18HL8320.1535/35HL8320.212/12HL832*0.218/18HL832*0.412/12HL832注：*表示GAPT不建議使用之材料Note: These materials are not suggested which marked with a “*”Substrate Design Training Manual8/4/2003Prepared by Neo Zhang18Chapter 2層壓2.P.P. (Prepreg)半固化片厚度Core Thickness (mm)銅層厚度Copper Foil(um)材料名稱Material Name*0.041

18、2CCL-GHPL8300.0612CCL-GHPL8300.1112CCL-GHPL8300.1312CCL-GHPL830注：*表示GAPT不建議使用之材料Note: These materials are not suggested which marked with a “*”注：注：1.BT:1.BT:是三菱瓦斯公司的一種材料牌號！是三菱瓦斯公司的一種材料牌號！2.2.除了三菱瓦斯公司除了三菱瓦斯公司BTBT系列外，還有諸如系列外，還有諸如HitachiHitachi公司的公司的E679E679系列，也是系列，也是PBGAPBGA封裝常封裝常用的樹脂材料。用的樹脂材料。Substrate Design Training Manual8/4/2003Prepared by Neo Zhang19Chapter 23.Solder Mask印綠油AUS5TaiyoNormalAUS303TaiyoLead freeS/R Ink NameCompanyAUS308TaiyoHalogen free在在Solder MaskSolder Mask（綠油）的選用上，一般以綠油）的選用上，一般以TaiyoTaiyo公司的公司的PSR4000PSR4000系列為主