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1、POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)屋品名再Item :晶片電阻FMEA編虢FMEA Number:走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF裂程任 Process Responsibility: Printing次 Page:跨功能小務(wù)且Core Team :鼎冒導(dǎo)建日期Key Date:填表人Prepared By:更新版本日期FMEA Date:裂程/功能Process Step / Function要求Requirement潛在失效 模式PotentialFailure Mode潛在失
2、效 影警PotentialEffect(s) ofFailure鼠 重 度(S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current DesignRPN建坐寸策 Recommended Action人及 予期完成日 期Responsibili ty & Target Completion Date改善完成日 期Actions Taken Completion Date鼠 重 度(S)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度
3、 (D)P04C2 E0刷窿 生辱髓屑C2 Printing to Produce ConductorC2屑按規(guī)定要 求印在基板背 面C2 PrintingokC2 印反C2 Printing inversely影警良率 Affecting Yield7基板正反面放反 put substrate inversely通遏別正背面剝裂 常泉來圍分distinguish the topand bottom side ofsubstrae21.目視檢查Visual inspection2片狀A(yù)OI全檢100% visual check by 100%AOI456印刷BA ccd朋愈Print and
4、import CCD inspection隗德月券2019/6/30 Chendesheng 2019/6/30P04C2 E0刷窿 生辱髓屑C2 Printing to Produce Conductor油墨使用正碓Ink is used corrdctly油墨用昔Wrong use of ink影警良率 Affecting Yield7末核室寸油墨Unchecked ink系令觸帚描匹配油墨 System scan matching lnk2move in在泉檢測 move in on line detect228P04C2 E0刷窿 生辱髓屑C2 Printing to Produce
5、ConductorC2 E0刷屑照污 染no pollutionC2油墨污染到E0刷屑表面 pollution沾導(dǎo)易the plating layers overgrowth7手指套有沾污油墨Paste with finger glove按照手指套管理瓣法 幸可行According to finger management SOP21.測包CCD全檢 visualcheck by 100%taping456油墨罐加防 套,防止手指套 沾污Ink tank Cover to Prevent Finger Smudge惠正藏2019/7/30 huizhengdang 2019/7/30P04C2
6、 E0刷窿 生辱髓屑C2 Printing to Produce ConductorC2 E0刷位置在 規(guī)格內(nèi)In specC2 E0刷相對位 置偏移 C2printing position deviation影警測包良率AffectingYield7定位翰磨 roller of fixing position wore away每班誰行自主檢查 Make machine setting self check every shift. 每6侗月巡行更換. Replacement every 6 monthes.2首件檢查Visual inspection測包CCD全檢 visualcheck
7、by 100%taping456E0刷CCD在泉 100%全檢Printde CCD on 100% line喇德券2019/6/30 Chendesheng 2019/6/30真空吸力不足 vacuum force not enough每月保餐碓言忍 真空吸力.confirm vacuum force every month21每班黑占檢敷值Check the valuenumber every shift 2系#充自勤幸艮警 Automatic Alarm342人室寸位整不富 fixing position abnormal by person人培言川 Training2CCD 腿firs
8、t pieceinspection by lot測包CCD全檢visualcheck by 100%taping456E0刷CCD在泉 100%全檢Printde CCD on 100% line喇德券2019/6/30 Chendesheng 2019/6/30POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)屋品名再Item :晶片電阻FMEA編虢FMEA Number:走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF裂程任 Process Responsibility: Printing次 Page:跨功能
9、小務(wù)且Core Team :鼎冒導(dǎo)建日期Key Date:填表人Prepared By:更新版本日期FMEA Date:裂程/功能Process Step / Function要求Requirement潛在失效 模式PotentialFailure Mode潛在失效 影警PotentialEffect(s) of Failure鼠 重 度(S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current DesignRPN建坐寸 策 Recomme nded Action人及 予期完成日 期Responsibilit y & Target Comp
10、letion Date改善完成日 期Actions Taken Completion Date鼠 重 度(S)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (D)P04C2 E0刷/座 生髓屑C2 Printing to Produce ConductorC2油墨重量要 在范圉內(nèi)C2 ink weight in rangeC2油墨重量超 簸圉下限,走生 破洞C2 ink is lower bound影警測包良 率 Appearance NG6用散罔版Used the wrong
11、screen人核室寸Personnel to check2move in在富泉檢測 move in on line detect224P04C2 E0刷健 生辱髓屑C2 Printing to Produce ConductorC2 E0刷屑圈形 完整Graphic integrity of C2 printingC2 E0刷屑塞,4罔, 走生破洞 C2 printing layer network背辱E0刷屑E0 干,走生破洞C2 printing process影警外良 率 Appearance NG6聿灰崖大Dust in workshop隔雕p耶方Isolation doorprote
12、ction粘地Glue to stick2每班檢測落崖量Detect the amount of dust every shift448油墨量少Ink quantity islittle系#充言殳置片敷停檄 Aystem sets the number of pieces to stop2系#充自勤幸艮警Automatic alarm336P04C2 E0刷窿 生辱髓屑C2 Printing to Produce ConductorC2乾燥充分 Drying fully粘料背辱刮僵 脫落C2 peeled off scratched or stick to another substrate影
13、警良品率 Affecting yield7乾燥溫度超出規(guī)格 drying temperature out of spec.每月測就燧溫狀熊,有 巽常畤誰行整Every month test dryer temperature and adjust it when any abnormality happens.每班誰行 自主檢查Make machine setting self check every shift2系#充自勤幸艮警Automatic alarm342別罔速度超范凰Net speed out of spec月保餐Maintenance everymonth系#充自勤幸艮警Auto
14、matic alarm342POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)屋品名再Item :晶片電阻FMEA編虢FMEA Number:走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF裂程任 Process Responsibility: Printing次 Page:跨功能小務(wù)且Core Team :鼎冒導(dǎo)建日期Key Date:填表人Prepared By:更新版本日期FMEA Date:裂程/功能Process Step / Function要求Requirement潛在失效 模式PotentialF
15、ailure Mode潛在失效 影警PotentialEffect(s) ofFailure鼠 重 度 (S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current DesignRPN建1坐寸策 Recommended Action人及 予期完成日 期Responsibili ty & Target Completion Date改善完成 日期 Actions Taken Completio n Date鼠 重 度 (S)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Cont
16、rols Detection值 測 度 (D)P05C1 E0刷健 生辱髓屑C1 Printing to Produce ConductorC1屑按規(guī)定要 求印在基板正 面 C1 PrintingC1E0反C1 Printing inversely影警良率 Affecting Yield7基板正反面放反 put substrate inversely通遺別正背面剝裂 來圍分 distinguish the topand bottom side of substrae21目視檢查Visual inspection2片狀A(yù)OI全檢100% visual check byAOI456印刷BA ccd
17、朋愈Print and import CCD inspection隗德月券2019/6/30 Chendesheng 2019/6/30油墨使用正碓Ink is used corrdctly油墨用昔Wrong use of ink影警良率 Affecting Yield7末核室寸油墨Unchecked ink系令觸帚描匹配油墨 System scan matching lnk2move in在富泉檢測 move in on line detect228C1E0刷后料品 照污染no pollutionC1油墨污染到E0刷屑背面 pollution沾導(dǎo)易the plating layers ove
18、rgrowth7手指套有沾污油墨Paste with finger glove按照手指套管理瓣法幸可 行According to fingermanagement SOP21.測包CCD全檢 visualcheck by 100%taping456油墨罐加防 套,防止手指套 沾污Ink tank Cover to Prevent Finger Smudge惠正藏2019/7/30 huizhengdang 2019/7/30C1E0刷位置在 規(guī)格內(nèi)In specC1 E0刷相對位 置偏移 C1printing position deviation影警良率 Affecting Yield7定位翰
19、磨 roller of fixing position wore away每班誰行自主檢查 Make machine setting self check every shift. 每6侗月巡行更換. Replacement every 6 monthes.21.首件檢查Visual inspection2片狀A(yù)OI全檢100% visual check by 100%AOI 3.測包CCD全檢 visualcheck by 100%Taping456E0刷CCD在泉 100%全檢Printde CCD on 100% line喇德券2019/6/30 Chendesheng 2019/6/3
20、0真空吸力不足 vacuum force not enough每月保餐碓言忍 真空吸力.confirm vacuum force every month21每班黑占檢敷值Check the valuenumber every shift 2系#充自勤幸艮警 Automatic Alarm342人室寸位整不富 fixing position abnormal by person人培言川 Training21. CCD檢查Visual inspection2片狀A(yù)OI全檢100% visual check by 100%AOI 3.測包CCD全檢 visualcheck by 100%Taping
21、456E0刷CCD在泉 100%全檢Printde CCD on 100% line喇德券2019/6/30 Chendesheng 2019/6/30POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)屋品名再Item :晶片電阻FMEA編虢FMEA Number:走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF裂程任 Process Responsibility: Printing次 Page:跨功能小務(wù)且Core Team :鼎冒導(dǎo)建日期Key Date:填表人Prepared By:更新版本日期FMEA D
22、ate:裂程/功能Process Step / Function要求Requirement潛在失效 模式PotentialFailure Mode潛在失 效影警PotentialEffect(s) of Failure鼠 重 度 (S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current DesignRPN建耕寸 策 Recomme nded Action人及 予期完成日 期Responsibilit y & Target Completion Date改善完成日 期Actions Taken Completion Date鼠 重 度 (S
23、)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (D)P05C1 E0刷健 生辱髓屑C1 Printing to Produce ConductorC1油墨重量要在范圉內(nèi)C1 ink weight in rangeC1油墨重量超 簸圉下限G1 ink is lower bound影警良率 Affecting Yield6用散罔版Used the wrong screen1.人核室寸Personnel to check2move in在富泉檢測 move in on line de
24、tect224P05C1 E0刷健 生辱髓屑C1 Printing to Produce ConductorC1E0刷屑圈形完 整Graphic integrityof C1 printingC1 E0刷屑塞,4罔, 走生破洞C1printing layer network to cause hole影警外翟良 良率 AppearanceNG6聿灰崖大Dust in workshop1.隔雕p耶方Isolation doorprotection2粘地Glue to stick2每班檢測落崖量Detect the amount of dust every shift448背辱E0刷屑E0 干,走
25、生破洞C1 printing process油墨量少Ink quantity islittle系#充言殳置片敷停檄 Aystem sets the number of pieces to stop2系#充自勤幸艮警Automatic alarm336P05C1 E0刷健 生辱髓屑C1 Printing to Produce ConductorC1乾燥充分 Drying fully粘料背辱刮僵 脫落 conductor peeled off scratched or stick to another substrate影警良品 率Affecting yield7乾燥溫度超出規(guī)格 drying t
26、emperature out of spec.每月測就燧溫狀熊,有 巽常畤誰行整Every month test dryer temperature and adjust it when any abnormality happens.每班逵行自主檢查Make machine setting self check every shift.2系#充自勤幸艮警Automatic alarm342別舜遮速度超范凰Net speed out of spec月保餐Maintenance everymonthPOTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Proces
27、s FMEA)屋品名再Item :晶片電阻FMEA編虢FMEA Number:走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF裂程任 Process Responsibility: Printing次 Page:跨功能小務(wù)且Core Team :鼎冒導(dǎo)建日期Key Date:填表人Prepared By:更新版本日期FMEA Date:裂程/功能ProcessStep / Function要求Requirement潛在失 效模式Potential Failure Mode潛在失效 影警PotentialEffect(s) of Failure鼠 重 度 (S)分(C)不良/
28、失效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current DesignRPN建新寸 策 Recomme nded Action人及琪 期完成日期 Responsibility & TargetCompletion Date改善完成日期Actions Taken Completion Date鼠 重 度 (S)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (D)P06髓屑煥結(jié)/ 走生髓屑Conductor Layer Firing to Prod
29、uce Conductor煥結(jié)充分Firing fullyto produce Conductor腐結(jié)不完 全,影警阻 值 Incomplete firing,影警切良率Affecting yield7麻流量超出范圉 Aas flow is out of spec.月保餐Maintenance every month2每班黑占檢參數(shù)Check by every shift系#充自勤幸艮警 Automatic alarm342蠢流量增 加自勤幸艮 警Gas flow increases auto-alarm弓瓣 2019/12/30 Zhangkunda 2019/12/30別舜遮速度超范凰Ne
30、t speed out of spec溫度超出規(guī)定簸圉 Temperature is out of spec.每月測就燧溫狀 熊,有巽常畤誰行兼 整Every month test furnace temperature status and adjust it when any abnormality happens.言殳偷配置 自勤幸艮警 系令充,溫度超出規(guī)定 簸圉 畤畬自勤幸艮警 Machines are equipped with automatic alarm system. When temperature is out of range, machines can make au
31、tomatic alarm.POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)走品名 Item :晶片電阻走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF 跨功能小務(wù)且Core Team :裂程任 Process Responsibility: Printing H導(dǎo)建日期Key Date:FMEA 編虢 FMEA Number: B次 Page:填表人 Prepared By: 更新版本日期FMEA Date:裂程/功能ProcessStep / Function潛在失潛在失效鼠 重 度 (S)分(C)不良/失
32、效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current Design建新寸人及琪改善完成日期Actions Taken Completion Date鼠 重 度 (S)畿 生 度 (O)值 測 度 (D)要求Requirement效模式Potential Failure Mode影警PotentialEffect(s) of Failure控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (D)RPN策 Recomme nded Action期完成日期 Responsibility & T
33、arget Completion DateRPN油墨使用正碓Ink is used corrdctly油墨用昔Wrong use of ink影警良率Affecting yield7末核室寸油墨Unchecked ink系令觸帚描匹配油墨 System scan matching lnk2move in在富泉檢測 move in on line detect228電阻印刷屑照污 染no pollution雷阻油墨 污染到基 板背面 Resistance ink to the surface of the back side粘導(dǎo)易the plating layers overgrowth7手指套
34、有沾污油墨Paste with finger glove按照手指套管理瓣法 幸可行According to finger management SOP21.測包CCD全檢 visualcheck by 100%taping456油墨罐加 防套,防 止手指套 沾污Ink tank Cover to Prevent FingerSmudge惠正藏2019/7/30 huizhengdang 2019/7/30P07雷阻印刷/ 走生阻值 ResistorPrinting Produce resistance電阻印刷位置在 規(guī)格內(nèi) Resistance printing position within
35、 the specificationsR E0刷相對 位置偏移 Rprinting position deviation定位翰磨 roller of fixing position wore away每班誰行自主檢查 Make machine setting self check every shift. 每6侗月巡行更換. Replacement every 6 monthes.2首件檢查Visual inspection片狀A(yù)OI全檢 100% visual check by lot456E0刷 CCD 在泉100% 全檢 Printde CCD on 100% line隗德月券2019/
36、6/30 Chendesheng 2019/6/30辱致切良率 下降A(chǔ)ffecting Yield7真空吸力不足 vacuum force not enough每月保餐碓言忍 真空吸力.confirm vacuum force every month21每班黑占檢敷值 Check the value number every shift 2系#充自勤幸艮警 Automatic Alarm342人室寸位整不富 fixing position abnormal by person人培言川 Training21.目視檢查 Visual inspection 2片狀A(yù)OI全檢 100% visual
37、check by 100%AOI456E0刷 CCD 在泉100% 全檢 Printde CCD on 100% line喇德券2019/6/30 Chendesheng 2019/6/30POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)屋品名再Item :晶片電阻FMEA編虢FMEA Number:走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF裂程任 Process Responsibility: Printing次 Page:跨功能小務(wù)且Core Team :鼎冒導(dǎo)建日期Key Date:填表人Prepa
38、red By:更新版本日期FMEA Date:裂程/功能ProcessStep / Function要求Requirement潛在失效 模式PotentialFailure Mode潛在失效 影警PotentialEffect(s) of Failure鼠 重 度(S)分(C)不良/失效 原因 Potential Cause(s) of Failure說彳行 管控 Current DesignRPN建坐寸策Recommend ed Action人及 琪期完成日期 Responsibility & TargetCompletion Date改善完成日期Actions Taken Completi
39、on Date鼠 重 度(S)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (D)P07雷阻印刷/走生阻值ResistorPrinting Produce resistanc雷阻屑油墨 重量要在范 圉內(nèi)R inkweight inrange雷阻屑油墨重量 超簸圉上限R ink issuperlimit辱致RO良率下降A(chǔ)ffecting Yield6用散罔版Used the wrong screen人核室寸Personnel to check2move in在制袍 move in
40、on line detect224P07雷阻印刷/走生 阻值 Resistor PrintingProduce resistanc雷阻印刷屑 圈形完整Graphic integrity of resistance printing雷阻印刷屑塞,4罔 Resistance printing layer network辱致RO良率下降A(chǔ)ffecting Yield6聿灰崖大Dust in workshopL隔雕p耶方Isolation doorprotection粘地晝占Glue to stick2每班檢測落崖量Detect the amount of dust every shift448雷阻印
41、刷屑E0干 Resistance printing is unfull辱致RO良率下降A(chǔ)ffecting Yield油墨量少Ink quantity islittle系#充言殳置片敷停檄 Aystem sets the number of pieces to stop2系#充自勤幸艮警Automatic alarm336雷阻印刷屑厚薄 不均Resistance printing layer thickness is uneven片內(nèi),。偏大 The SD in the tablet is relatively large刮刀不平整 ink-scraper not parallel每24H定期更
42、換 Replacement every 2 4H21.量具檢測Check by measuring tool2.每 Lot外測包CCD visualcheck by lot448P07雷阻印刷/ 走生阻值Resistor PrintingProduce resistanc乾燥充分Drying fully粘料R刮僵脫落 R peeled off scratched or stick to another substrate影警良品率Affecting yield7溫度超出規(guī)定簸 sTemperature is out of spec.檄臺每月季逵行保餐 碓咨忍燧溫PM monthly & qua
43、rterly每班逵行自主檢 查 Make machine setting self -check every shift. 殳偷配置自勤幸艮警系 統(tǒng),溫度超出規(guī)定簸s 畤畬自勤幸艮警 Automatic alarmsystem. Waperature is out of spec, machines will automaticly alarm.21.每班點(diǎn)檢 Check by every shift 2.系#充自勤 幸艮警Automatic alarm342別舜遮速度超范s Net speed out of spec月保餐Maintenance everymonthPOTENTIAL FAI
44、LURE MODE AND EFFECTSANALYSIS(Process FMEA)走品名 Item :晶片電阻走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF 跨功能小務(wù)且Core Team :裂程任 Process Responsibility: Printing H導(dǎo)建日期Key Date:FMEA 編虢 FMEA Number: B次 Page:填表人 Prepared By: 更新版本日期FMEA Date:裂程/功能Process Step / Function要求Requirement潛在失 效模式 Potential Failure Mode潛在失效 影警
45、PotentialEffect(s) of Failure鼠 重 度(S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current DesignRPN建1坐寸 策 Recommen ded Action人及 琪期完成日期 Responsibility & TargetCompletion Date改善完成日 期Actions Taken Completion Date鼠 重 度(S)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (
46、D)P08 雷阻屑煥結(jié) /產(chǎn)生阻值 ResistiveLayer Firing /to cause Resistance煥系吉完全,形成 要求的阻值 Firing fullyto produce resistance阻值未 要求 The resistance is not required影警良率Affecting yield7麻流量超出范圉 Aas flow is out of spec.每月保餐Maintenance everymonth 每月測就燧溫狀熊,有巽常畤 誰行言周整Monthly test DryerTemperature statusand adjust it when an
47、y abnormalityhappens.言殳偷配置自勤幸艮警系統(tǒng)溫度超 出規(guī)定簸圉畤畬自勤幸艮警 Automatic alarm system.Whentemperature is out ofspec, machines will automaticly alarm.2每班黑占檢Check by every shift雷切阻值100%沮冠 l/S resistor test 100%456麻流量增加 自勤幸艮警 Gas flow increases auto-alarm制帽 2019/12/30 Zhangkunda 2019/12/30別舜遮速度超范凰Net speed out of s
48、pec系#充自勤幸艮警Automatic alarm342溫度超出規(guī)定簸圉 Temperature is out of spec.1.每班黑占檢Check every shift 2系#充自勤幸艮警Automatic alarm 3 雷切阻值 100% 沮冠l/S resistor test 100%342POTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)走品名 Item :晶片電阻走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF 跨功能小務(wù)且Core Team :裂程任 Process Responsibili
49、ty: Printing H導(dǎo)建日期Key Date:FMEA 編虢 FMEA Number: B次 Page:填表人 Prepared By: 更新版本日期FMEA Date:裂程/功能ProcessStep / Function要求Requirement潛在失 效模式 Potential Failure Mode潛在失效 影警PotentialEffect(s) ofFailure鼠 重 度(S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current DesignRPN建1坐寸 策 Recommen ded Action人及 琪期完成日期
50、 Responsibility & TargetCompletion Date改善完成日 期Actions Taken Completion Date鼠 重 度(S)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (D)P09G1 印刷/保 雷阻屑 G1 printing to protect the ResistorG1 E0刷照污染 no pollutionG1油墨污染 到印刷屑表 面G1 ink to the surface of the printed surface影警外
51、良率 Affect appearance yield7手指套有沾污油墨 Paste with finger glove按照手指套管理瓣法幸可行According to finger management SOP21.測包CCD全檢 visualcheck by 100%taping456油墨罐加防套,防止手 指套沾污Ink tank Cover to Prevent FingerSmudge惠正藏2019/7/30 huizhengdang 2019/7/30P09G1 印刷/保 雷阻屑G1 printing to protect the Resisto油墨使用正碓Ink is used co
52、rrdctly油墨用昔Wrong use of ink影警良率Affecting yield7末核室寸油墨Unchecked ink系令觸帚描匹配油墨System scan matching lnk2move in在富泉檢測 move in on line detect228P09G1 印刷/保 雷阻屑 G1 printing to protect the ResistorG1 E0刷位置在 規(guī)格內(nèi) G1 printing position within the specificationsG1 E0刷相對 位置偏移 G1 printing position deviation影警外良率 Af
53、fect appearance yield7定位翰磨Roller of fixing position wore away每班逵行自主檢查Make machine setting self check every shift. 每6侗月巡行更換. Replacement every 6 monthes.21.首件檢查Visual inspection 2片狀A(yù)OI全檢 100% visual check by lot456E0刷CCD在 泉100%全檢 Printde CCD on 100% line隗德月券2019/6/30 Chendesheng 2019/6/30真空吸力不足Vacuum
54、 force not enough每月保餐碓言忍 真空吸力.confirm vacuum force every month21每班黑占檢敷值Check the value number every shift 2系#充自勤幸艮警Automatic Alarm342人室寸位整不富 Fixing position abnormal by person人培言川 Training21. CCD 腿 Visual inspection456E0刷CCD在 泉100%全檢 Printde CCD on 100% line喇德券2019/6/30 Chendesheng 2019/6/30POTENTIA
55、L FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)屋品名再Item :晶片電阻FMEA編虢FMEA Number:走品模務(wù)且 Model(s)/Program(s):卓規(guī)-AC&AF裂程任 Process Responsibility: Printing次 Page:跨功能小務(wù)且Core Team :鼎冒導(dǎo)建日期Key Date:填表人Prepared By:更新版本日期FMEA Date:裂程/功能ProcessStep / Function要求Requirement潛在失 效模式 Potential Failure Mode潛在失效 影警Pot
56、entialEffect(s) of Failure鼠 重 度(S)分(C)不良/失效 原因Potential Cause(s) of Failure現(xiàn)行管控 Current DesignRPN建1坐寸 策 Recommen ded Action人及 琪期完成日期 Responsibility & TargetCompletion Date改善完成日 期ActionsTaken CompletionDate鼠 重 度(S)畿 生 度 (O)值 測 度 (D)RPN控制琪防Controls Prevention畿 生 度 (O)控制檢測Controls Detection值 測 度 (D)P09
57、G1 印刷/保雷阻屑G1 printing to protect the ResistorG1油墨重量要 在范凰內(nèi)G1 ink weight in rangeG1油墨重量 超瓣上限G1 ink is superlimit影警切良率, 殛留皮膜Effects of radium -yield and residual film6用散罔版Used the wrong screen人核室寸Personnel to check2move in在制食測move in on line detect224G1油墨重量 超簸圉下限G1 ink is lower bound影警切良率 Influence of
58、laser yield, resistance disintegratioP09G1 印刷/保 雷阻屑 G1 printing to protect the Resistor保屑E0刷圈 形完整 Graphic integrity of resistance printing保屑E0刷塞G1 printinglayer network造成外不良 Appearance NG6聿灰崖大Dust in workshopL隔雕p耶方Isolation doorprotection粘地晝占Glue to stick2每班檢測落崖量Detect the amount of dust every shift
59、448保屑E0刷E0干G1 printing油墨量少Ink quantity islittle系#充言殳置片敷停檄 Aystem sets the number of pieces to stop2系#充自勤幸艮警Automatic alarm336P09G1 印刷/保雷阻屑G1 printing to protect the Resistor乾燥充分Drying fullyprocessG1乾燥 不完全 incomplete drying造成外不良Appearance NG6溫度超出規(guī)定簸圉 Temperature is out of spec.每月測就燧溫狀熊,有 巽常畤誰行整Every
60、month testdryer temperatureand adjustit whenany abnormality happens.每班誰行自主檢 查Make machine setting self check every shift.2系#充自勤幸艮警Automatic alarm336別罔速度超范凰Net speed out of spec月保餐Maintenance everymonthPOTENTIAL FAILURE MODE AND EFFECTSANALYSIS(Process FMEA)走品名 Item :晶片電阻走品模務(wù)且 Model(s)/Program(s):卓規(guī)-
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