電路板術語總整理

1、*A*Abietic Acid松脂酸.Abrasion Resistance 耐磨性.Abrasives 磨料,刷材.ABS樹脂.Absorption 吸收(入).Ac Impedance 交流阻抗.Accelerated Test(Aging)加速老化(試驗).Acceleration速化反應.Accelerator 加速劑，速化劑.Acceptability,Acceptance 允收性，允收.Access Hole 露出孔，穿露孔.Accuracy準確度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像顯微鏡.Acrylic

2、壓克力(聚丙烯酸樹脂).Actinic Light (or Intensity, or Radiation)有效光.Activation 活化.Activator 活化齊1J .Active Carbon 活性炭.Active Parts(Devices)主動零件.Acutance解像銳利度.Addition Agent 添加劑.Additive Process 力口成法.Adhesion附著力.Adhesion Promotor 附著力促進劑.Adhesive膠類或接著劑.Admittance導納(阻抗的倒數).Aerosol噴霧劑，氣熔膠，氣懸體.Aging老化.Air Inclusion

3、氣泡夾雜.Air Knife 風刀.Algorithm 算法.Aliphatic Solvent脂肪族溶劑.Aluminium Nitride(AlN) 氮化鋁.Ambient Tamp環(huán)境溫度.Amorphous無定形，非晶形.Amp-Hour安培小時.Analog Circuit/Analog Signal 模擬電路 / 模擬訊號.Anchoring Spurs 著力爪.Angle of Contack 接觸角.Angle of Attack 攻角.Anion陰離子.Anisotropic 異向性，單向的.Anneal韌化(退火).Annular Ring 孔環(huán).Anode陽極.Anode

4、 Sludge 陽極泥.Anodizing 陽極化.ANSI美國標準協(xié)會.Anti-Foaming Agent消泡齊U .Anti-pit Agent抗凹齊1J .AOI自動光學檢驗.Apertures 開口，鋼版開口 .AQL品質允收水準.AQL(Acceptable Quality Level)允收品質水準Aramid Fiber 聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork 底片.ASIC特定用途績體電路器.Aspect Ratio 縱橫比.Assembly組裝裝配.A-stage A 階段.ATE自動電測設備.Attenuation訊號衰減.Auto

5、clave 壓力鍋.Axial-lead 軸心引腳.Azeotrope共沸混合液.*B*Back Light (Back Lighting) 背光法.Back Taper反錐斜角.Backpanels, Backplanes 支撐板.Back-up 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳數組(封裝).Bandability 彎曲性.Banking Agent 護岸劑.Bare Chip Assembly裸體芯片組裝.Barrel孔壁，滾鍍.Base Material 基材.Basic Grid基本方格.Batch 批.Bau

6、me波美度(凡液體比重比水重則Be=145-(145 + Sp.Gr)凡液體比重比水輕則Be=140 -(Sp.Gr-130)*Sp.Gr為比重即同體績物質對 純水1g/cm的 比值).Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter 貝他射線反彈散射.Bevelling 切斜邊.Bias斜張綱布，斜纖法.Bi-Level Stencil雙階式鋼板.Binder粘結劑.Bits 頭(Drill Bits).Black Oxide黑氧化層.Blanking 沖空斷開.Bleac

7、k 漂洗.Bleeding 溢流.Blind Via Hole肓通孔.Blister局部性分層或起泡.Block Diagram 電路系統(tǒng)塊圖.Blockout 封綱.Blotting 干印.Blotting Paper 吸水紙.Blow Hole 吹孔.Blue Plaque 藍紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight 彈標.Bond Strength 結合強度.Bondability 結合性.Bonding Layer 結合層接著層 .Bonding Sheet(Layer) 接合片.Bonding Wire 結合線.Bow, Bowing

8、 板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425 C870 c下進行熔接的方式).Break Point 顯像點.Break-away Panel可斷開板.Breakdown Voltage 崩潰電壓.Break-out 破出.Bridging 搭橋.Bright Dip 光澤浸漬處理.Brightener 光澤劑.Brown Oxide 棕氧化.Brush Plating 刷鍍.B-stageB 階段.Build Up Process增層法制程.Build-up 堆積.Bulge鼓起.Bump突塊.Bumping Process 凸塊制程.Buoyancy 浮力.

9、Buried Via Hole埋導孔.Burn-in高溫加速老化試驗.Burning 燒焦.*C*Burr毛頭.Bus Bar匯電桿.Butter Coat外表樹脂層C4 Chip JointC4芯片焊接.Cable電纜.CAD十算機輔助設計.Calendered Fabric軋平式綱布.Cap Lamination 帽式壓合法.Capacitance 電容.Capacitive Coupling 電容耦合.Capillary Action毛細作用.Carbide碳化物.Carbon Arc Lamp 碳弧燈.Carbon Treatment, Active活化炭處理.Card卡板.Card

10、Cages/Card Racks電路板構裝箱.Carlson Pin 卡氏定位稍.Carrier 載體.Cartridge 濾心.Castallation堡型績體電路器.Catalyzed Board, Catalyzed Substrate 催化板 材.Catalyzing催化.Cathode 陰極.Cation陰向離子，陽離子.Caul Plate 隔板.Cavitation 空泡化 半真空.Center-to-Center Spacing中心間距.Ceramics 陶瓷.Cermet陶金粉.Certificate 證明書.CFC氟氫碳化物.Chamfer 倒角.Characteristi

11、c Impedance 特性阻抗.Chase綱框.Check List檢查?t單.Chelate 螯合.Chemical Milling化學研磨.Chemical Resistance 抗化性.Chemisorption 化學吸附.Chip芯片(粒).Chip Interconnection芯片互連.Chip on Board 芯片粘著板.Chip On Glass 晶玻接裝(COG).Chisel鉆針的尖部.Chlorinated Solvent 含氯溶劑，氯化溶劑Circumferential Separation 環(huán)狀斷孔.Clad心ladding披覆.Clean Room 無塵室.Cl

12、eanliness 清潔度.Clearance余地，余環(huán).Clinched Lead Terminal 緊箝式引腳.Clinched-wireThroughConnection 通孔彎線連接法.Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線.Coefficient of Thermal Expansion熱膨脹系數.Co-Firing 共繞.Cold Flow 冷流.Cold Solder Joint 冷焊點.Collimated Light平行光.Colloid 膠體.Columnar Structure 柱狀組織.Comb Pat

13、tern 梳型電路.Complex Ion 錯離子.Component Hole 零件孔.Component Orientation零件方向.Component Side 組件面.Composites,(CEM-1,CEM-3)復合板材.Condensation Soldering 凝熱焊接，液化放熱焊 接.Conditioning整孔.Conductance 導電.Conductive Salt 導電鹽.Conductivity 導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity 吻合性，服貼性.Connector 連接器.Co

14、ntact Angle 接觸角.Contact Area 接觸區(qū).Contact Resistance 接觸電阻.Continuity 連通性.Contract Service 協(xié)力廠,分包廠.Controlled Depth Drilling定深鉆孔.Conversion Coating 轉化皮膜.Coplanarity 共面性.Copolymer 共聚物.Copper Foil 銅皮.Copper Mirror Test 銅鏡試驗.Copper Paste 銅膏.Copper-Invar-Copper (CIC)綜合夾心板.Core Material 內層板材，核材.Corner Crac

15、k通孔斷角.Corner Mark板角標記.Counterboring方型擴孔.Countersinking錐型擴孔.Coupling Agent偶合劑.Coupon, Test Coupon 板邊試樣 .Coverlay/Covercoat 表護層.Crack裂痕.Crazing 白斑.Crease 皺折.Creep潛變.Crossection Area 截面積.Crosshatch Testing 十字割痕試驗.Crosshatching十字交叉區(qū).Crosslinking, Crosslinkage交聯(lián)，架橋.Crossover 越交,搭交.Crosstalk 噪聲，串訊.Crystal

16、line Melting Point 晶體熔點.C-Stage C 階段.Cure硬化，熟化.Current Density 電流密度.Current-Carrying Capability載流能力.Curtain Coating 濂涂法.*D*Daisy Chained Design菊瓣設計.Datum Reference 基準參考.Daughter Board 子板.Debris碎屑，殘材.Deburring 去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing 脫脂.Deionized Water 去離子水.D

17、elamination 分離.Dendritic Growth枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單 位，定義9000米紗束所具有的重量(以克米計).Densitomer透光度計.Dent凹陷.Deposition皮膜處理.Desiccator 干燥器.Desmearing 去膠渣.Desoldering 解焊.Developer顯像液，顯像機.Developing 顯像.Deviation 偏差.Device電子組件.Dewetting 縮錫.D-glassD 玻璃.Diaze Film偶氮棕片.Dichromate重銘酸鹽.Dicing芯片分割.Dicyandiamid

18、e(Dicy)雙富胺.Die沖模.Die Attach 晶粒安裝.Die Bonding 晶粒接著.Die Stamping 沖壓.Dielectric 介質.Dielectric Breakdown Voltage 介質崩潰電壓.Dielectric Constant介質常數.Dielectric Strength介質強度.Differential Scanning Calorimetry(DSC) 微差掃瞄熱卡分析法.Diffusion Layer 擴散層.Digitizing數字化.Dihedral Angle 雙反斜角.Dimensional Stability尺度安定性.Diode

19、二極管.Dip Coating 浸涂法.Dip Soldering 浸焊法.DIP(Dual Inline Package)雙排腳封裝體.Dipole偶極，雙極.Direct / Indirect Stencil直接/間接版膜.Direct Emulsion 直接乳膠.Direct Plating 直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板，復線板.Dish Down碟型下陷.Dispersant 分散劑.Dissipation Factor 散失因素.Disspation Factor 散逸因子.Disturbed Joint

20、 受擾焊點.Doctor Blade修平刀，刮平刀.Dog Ear 狗耳.Doping 摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔.Drag In / Drag Out 帶進/帶出.Drag Soldering 拖焊.Drawbridging 吊橋效應.Drift漂移.Dr川Facet鉆尖切削面.Drill Pointer鉆針重磨機.Drilled Blank已鉆孔的裸板.Dross浮渣.Drum Side銅箔光面.Dry Film 干膜.Dual Wave Soldering雙波焊接Ductility 展性.Dummy Land假焊墊.Dummy

21、, Dummying假鍍(片).Durometer橡膠硬度計.DYCOstrate電漿蝕孔增層法.Dynamic Flex(FPC)動態(tài)軟板.* *匚 *E-Beam (Electron Beam) 電子束.Eddy Current 渦電流.Edge Spacing板邊空地.Edge-Board Connector板邊(金手指)承接器.Edge-Board Contact 板邊金手指.Edge-Dip Solderability Test 板邊焊錫性測試EDTA乙二胺四乙酸.Effluent 排放物.E-glass電子級玻璃.Elastomer 彈性體.Electric Strength(耐)

22、電性強度.Electrodeposition電鍍.Electro-deposition Photoresist電著光阻,電泳光阻.Electroforming 電鑄.Electroless-Deposition 無電鍍.Electrolytic Tough Pitch 電解銅.Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis 電泳動，電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation 延伸性，延伸率.Embossing凸出性壓花.EMF(Electromotive

23、Force) 電動勢.EMI(Electromagnetic Interference)電磁干擾Emulsion 孚L化.Emulsion Side 藥膜面.Encapsulating 膠囊.Encroachment 沾污,侵犯.End Tap 封頭.Entek有機護銅處理.Entrapment 夾雜物.Entry Material 蓋板.Epoxy Resin環(huán)氧樹脂.Etch Factor蝕刻因子.Etchant蝕刻劑（液）.Etchback 回蝕.Etching Indicator 蝕刻指針.Etching Resist 蝕刻阻劑.Eutetic Composition共融組成.Exot

24、herm 放熱（曲線）.Exposure 曝光.Eyelet 釧眼.*F*Fabric 綱布.Face Bonding反面朝下結合.Failure 故障.Fan Out Wiring/Fan In Wiring 扇出布線 /扇入 布線.Farad 法拉.Farady法拉第.Fatigue Strength 抗疲勞強度.Fault缺陷.Fault Plane 斷層面.Feed Through Hole 導通孔.Feeder進料器.Fiber Exposure 玻纖顯露.Fiducial Mark基準記號.Filament 纖絲.Fill緯向.Filler 填充料.Fillet 內圓填角.Film

25、底片.Film Adhesive 接著膜，粘合膜.Filter 過濾器.Fine Line 細線.Fine Pitch 密腳距，密線距，密墊距.Fineness 粒度，純度.Finger 手指.Finishing 終修（飾）.Finite Element Method有限要素分析法.First Article 首產品.First Pass-Yield 初檢良品率.Fixture 夾具.Flair刃角變形.Flame Point 自燃點.Flame Resistant 耐燃性.Flammability Rate 燃性等級.Flare扇形崩口 .Flash Plating 閃鍍.Flashover

26、 閃絡.Flat Cable 扁平排線.Flat Pack 扁平封裝（之零件）.Flatness平坦度.Flexible Printed Circuit （FPC）軟板.Flexural Failure 撓曲損壞.Flexural Module 彎曲模數，抗撓性模數Flexural Strength抗撓弓S度.Flip Chip 覆晶，扣晶.Flocculation 絮凝.Flood Stroke Print覆墨沖程印刷.Flow Soldering （Wave Soldering） 流焊.Fluorescence 熒光.Flurocarbon Resin碳氟樹脂.Flush Conducto

27、r 嵌入式線路，貼平式導體.Flush Point 閃火點.Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination 銅箔壓板法.Foot殘足（干膜殘余物）.Foot Print （Land Pattern） 腳墊.Foreign Material 外來物，異物.Form-to-List 布線說明清單.Four Point Twisting四點扭曲法.Free Radical 自由基.Freeboard 干舷.Frequency 頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fuse

28、d Coating 熔錫層.Fusing 熔合.Fusing Fluid 助熔液.*G*G-10由連續(xù)玻纖所織成的玻纖布與環(huán)氧樹脂粘結劑所復合成的材料.Gage, Gauge 量規(guī).Gallium Arsenide （GaAs） 碑化錢.Galvanic Corrosion賈凡尼式腐蝕（電解式腐蝕）.Galvanic Series賈凡尼次序（電動次序）.Galvanizing 鍍鋅.GAPI一面分離,長刃斷開.Gate Array 閘列，閘極數組.Gel Time膠化時間.Gelation Particle膠凝點.Gerber Data ,Gerber File格博檔案(是美商Gerber公司

29、專為PCB面線路圖形與孔位，所發(fā)展一系列完整的軟件檔案).Ghost Image 陰影.Gilding 鍍金(現為：Glod Plating).Glass Fiber 玻纖.Glass Fiber Protrusion/Gouging, Groove 玻纖 突出/挖破.Glass Transition Temperature, Tg 玻璃態(tài)轉化 溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測試法.Glycol (Ethylene Glycol) 乙二醇.Golden Board測試用標準板.Grain Size 結晶粒度.Grass Leak 大漏.Gr

30、id標準格.Ground Plane /Earth Plane 接地層.Ground Plane Clearance接地空環(huán).Guide Pin 導針.Gull /Wing Lead 鷗翼引腳.*H*Halation 環(huán)暈.Half Angle 半角.Halide鹵化物.Haloing白圈，白邊.Halon海龍，是CFC氟碳化物的一種商品名.Hard Anodizing 硬陽極化.Hard Chrome Plating鍍硬銘.Hard Soldering 硬焊.Hardener (Curing Agent) 硬化劑(或 CuringAgent).Hardness 硬度.Haring-Blum

31、Cell 海固槽.Harness電纜組合.Hay Wire 跳線.Heat Cleaning 燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(溫度).Heat Sealing 熱圭寸.Heat Sink Plane 散熱層.Heat Transfer Paste 導熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA) 高效空氣塵粒過瀘機.Hipot Test 高壓電測.Hi-Rel高度靠度.Hit擊(鉆孔時鉆針每一次刺下的動作).H

32、olding Time 停置時間.Hole Breakout 孔位破出.Hole Counter 數孔機.Hole Density孔數密度.Hole Preparation通孔準備.Hole Pull Strength孔壁強度.Hole Void 破洞.Hook切削刀緣外凸.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風手焊.HTE(High Temperature Elongation)高溫延伸性.Hull Cell 哈氏槽.Hybrid Integrated Circuit 混成電路Hydraulic Bulge

33、Test 液壓鼓起試驗.Hydrogen Embrittlement 氫脆.Hydrogen Overvoltage 氫過(超)電壓.Hydrolysis 水解.Hydrophilic 親水性.Hygroscopic 吸濕性.Hypersorption 超吸咐.*I*I.C. Socket績體電路器插座.Icicle 錫尖.Illuminance 照度.Image Transfer影像轉移.Immersion Plating 浸鍍.Impedance 阻抗.Impedance Match 阻抗匹配.Impregnate 含浸.In-Circuit Testing組裝板電測.Inclusion

34、異物,夾雜物.Indexing Hole 基準孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output 輸入/輸出.Insert, Insertion 插接.Inspection Overlay 套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)績體電路器.Inter Face 接口 .Interconnection互連.Intermetallic Compound (IMC)Internal Stress內應力.接口共化物Interposer互邊導電物.Interstitial Via-Hole(IV

35、H)局部層間導通孔Invar 殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins 離子交換樹脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization 游離,電離.Ionization Voltage (Corona Level) 電離化電 壓(電纜內部狹縫空氣中，引起其 電離所施加之最小電壓).IPC美國印刷電路板協(xié)會.Isolation 隔離性，隔絕性.*JEDEC(Joint Electronic Device 聯(lián)合電子組 件工程委員

36、會.Engineering Council)J-LeadJ型接腳.Job Shop專業(yè)工廠.Joule焦耳.Jumper Wire 跳線.Junction 接(合)面，接頭.Just-In-Time(JIT)適時供應，及時出現*K*Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鉆石)=0.2g 純金則24k金為100%勺鈍金.Kauri-Butanol Value考立丁醇值(簡稱 K.B.值).Kerf.切形，裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board 鍵盤.Kiss Pressure 吻壓，低壓.Knoop Hardness 努普硬度.Known Good Die(KG

37、D)已知之良好芯片.Kovar 科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*L*Lamda Wave延伸平波.Laminar Flow 平流.Laminar Structure片狀結構.Laminate Void 板材空洞.Laminate(s) 基板.Lamination Void壓合空洞.Laminator 壓膜機.Land孔環(huán)焊墊，表面焊墊.Landless Hole 無環(huán)通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching 雷射力口工法.Laser Photogenerator(LPG), LaserPh

38、otoplotter 雷射曝光機.Laser Soldering雷射焊接法.Lay Back刃角磨損.Lay Out布線，布局.Lay Up疊合.Layer to Layer Spacing層間品目離Leaching焊散漂出，熔出.Lead弓I腳.Lead Frame 腳架.Lead Pitch 腳距.Leakage Current 漏電電流.Legend文字標記.Leveling 整平.Lifted Land 孔環(huán)(焊墊)浮起.Ligand錯離子監(jiān)i屬體.Light Emitting Diodes (LED)發(fā)光二極管.Light Integrator 光能累積器.Light Intensi

39、ty 光強度.Limiting Current Density 極限電流密度.Liquid Crystal Display (LCD) 液晶顯示器.Liquid Dielectrics液態(tài)介質.Liquid Photoimagible Solder Mask, (LPSM) 液 態(tài)感光防焊綠漆.Local Area Network區(qū)域性網絡.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor 損失因素.Loss Tangent (Tan 6 DK)損失正切.Lot Size 批量.Luminance發(fā)光強度.Lyophilic 親水性膠體.*M*Macro-Thro

40、wing Power 巨觀分布力.Major Defect主要(嚴重)缺點.Major Weave Direction主要織向.Margin刃帶(鉆頭尖部).Marking 標記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination 大型壓板.Mass Transport 質量輸送.Master Drawing 主圖.Mat 席(用于 CEM-3(Composite Epoxy Material) 的復合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).Mealing 泡點.Mean Time To Failure (MTTF)故障前

41、可用之平均時數.Measling 白點.Mechanical Stretcher 機械式張網機.Mechanical Warp 機械式纏繞.Mechanism 機理.Membrane Switch 薄膜開關.Meniscograph Test弧面狀沾錫試驗.Meniscus彎月面.Mercury Vaper Lamp 汞氣燈.Mesh Count 綱目數.Metal Halide Lamp金屬鹵素燈.Metallization 金屬化.Metallized Fabric 金屬化綱布.Micelle 微胞.Micro Wire Board微封線板.Micro-electronios 微電子.Mi

42、croetching微蝕.Microsectioning微切片法.Microstrip微條.Microstrip Line微條線，微帶線.Microthrowing Power微分布力.Microwave 微波.Migration 遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環(huán)下限.Minimum Electrical Spacing 電性間距下限.Minor Weave Direction次要織向.Misregistration 對不準度.Mixed Componmt Mounting Technology 混合零件 之組裝技術.Modem

43、s變及解調器.Modification修改.Module 模塊.Modulus of Elasticity彈性系數.Moisture and Insulation Resistance Test濕氣與絕緣電阻試驗.Mold Release 脫模劑，離型劑.Mole摩爾.Monofilament 單絲.Mother Board 主機板，母板.Moulded Circuit模造立體電路機.Mounting Hole 安裝孔.Mounting Hole 組裝孔，機裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現不規(guī)則缺 口).Multi-Chip-Module(MCM)多芯片芯片模塊.Multiw

44、iring Board (or Discrete Wiring Board) 復線板.*N*N.C.數值才S制.Nail Head 釘頭.Near IR近紅外線.Negative負片，鉆尖的第一面外緣變窄.Negative Etch-back 反回蝕.Negative Stencil 負性感光膜.Negative-Acting Resist 負性作用之阻劑.Network綱狀元件.Newton 牛頓.Newton Ring 牛頓環(huán).Newtonian Liquid牛頓流體.Nick 缺口 .N-Methyl Pyrrolidine (NMP)N-甲基四氫嘩咯.Noble Metal Paste

45、貴金屬印膏.Node節(jié)點.Nodule 節(jié)瘤.Nomencleature 標示文字符號 .Nominal Cured Thickness標示厚度.Non-Circular Land非圓形孔環(huán)焊墊.Non-flammable 非燃性.Non-wetting 不沾錫.Normal Concentration (Strength)標準濃度，當量濃度.Normal Distribution 常態(tài)分布.Novolac酯醛樹脂.Nucleation , Nucleating 核化.Numerical Control 數值制.Nylon尼龍.*O*Occlusion 吸藏.Off-Contact架空.Off

46、set第一面大小不均.OFHC(Oxyen Free High Conductivity)無氧高導電銅.Permeability 透氣性,導磁率.Permittivity 誘電率，透電率.pH Value酸堿值.Phase 相.Phase Diagram 相圖.Phenolic酚醛樹脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator 感光啟始劑.Photomask 光罩.Photoplotter, Plotter光學繪圖機.Photoresist 光阻.Photoresist Chemical Machinning (Mill

47、ing) 光阻式化學(銃刻)加工.Phototool 底片.Pick and Place拾取與放置.Piezoelectric 壓電性.Pin插腳，插梢，插針.Pin Grid Array (PGA)矩陣式針腳對裝Pinhole 針孔.Pink Ring 粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點.Plain Weave 平織.Plasma 電漿.Plasticizers 可塑劑，增塑劑.Plated Through Hole鍍通孔.Platen 熱盤.Plating 鍍.Plotting 標繪.Plowing 犁溝.Plug插腳，塞柱.Ply層，股.Pneumatic Stret

48、cher氣動拉伸器.Pogo Pin伸縮探針.Point 鉆尖.Point Angle 鉆尖面.Point Source Light點狀光源.Poise 泊.粘滯度單位=1dyne*sec/cm2.Polar Solvent極性溶劑.Polarity 電極性.Polarization 分極,極化.Polarizing Slot偏槽.Polyester Films聚酯類薄片.Polymer Thick Film (PTF) 厚膜糊.Polymerization 聚合.Polymide(PI)聚亞醯胺.OhmM姆.Oilcanning 蓋板彈動.OLB(Outer Lead Bond) 外引腳結合

49、.Oligomer寡聚物.Omega Meter離子污染檢測儀.Omega Wav琳蕩波.On-Contact Printing 密貼式印刷.Opaquer不透明劑，遮光劑.Open Circuits 斷線.Optical Comparater光學對比器(光學放大器.)Optical Density 光密度.Optical Inspection光學檢驗.Optical Instrument光學儀器.Organic Solderability Preservatives (OSP)有機保焊劑.Osmosis 滲透.Outgassing 出氣，吹氣.Outgrowth懸出，橫出，側出.Output

50、產出，輸出.Overflow 溢流.Overhang總懸空.Overlap鉆尖點分離.Overpotantial(Over voltage) 過電位，過電壓.Oxidation 氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*P*Packaging封裝,構裝.Pad焊墊，圓墊.Pad Master圓墊底片.Pads Only Board 唯墊板.Palladium 鋁.Panel制程板.Panel Plating全板鍍銅.Panel Process 全板電鍍法.Paper Phenolic紙質酚醛樹脂(板材).Parting Agent脫膜劑.Pa

51、ssivation 鈍化，鈍化外理.Passive Device (Component) 被動組件(零件)Paste 膏，糊.Pattern板面圖形.Pattern Plating線路電鍍.Pattern Process線路電鍍法.Peak Voltage 峰值電壓.Peel Strength抗撕弓雖度.Periodic Reverse (PR) Current 周期性反電流Peripheral周邊附屬設備.*Q*Quad Flat Pack （QFP） Qualification Agency Qualification Inspection Qualified Products List

52、單.Qualitative Analysis*R*Popcorn Effect 爆米花效應.Porcelain 瓷材，瓷面.Porosity Test 疏孔度試驗.Positive Acting Resist 正性光阻劑Post Cure后續(xù)硬化，后烤.Post Separation 后期分離，事后公離Pot Life 運用期，鍋中壽命.Potting 鑄封，模封.Power Supply 電源供應器.Preform預制品.Preheat 預熱.Prepreg膠片,樹脂片.Press Plate 鋼板.Press-Fit Contact 擠入式接觸Pressure Foot 壓力腳.Pre-t

53、inning預先沾錫.Primary Image 線路成像.Print Through 壓透，過度擠壓 Probe探針.Process Camera制程用照像機Process Window 操作范圍.Production Master生產底片.Profile 輪廓，部面圖，升溫曲線圖棱線.Propagation 傳播.Propagation Delay傳播延遲.Puddle Effect 水坑效應.Pull Away 拉離.Pulse Plating 脈沖電鍍法.Pumice Powder 浮石粉.Punch沖切.Purge, Purging 凈空，凈洗.Purple Plague 紫疫（金與

54、鋁的共化物層）.Pyrolysis 熱裂解，高溫分解.方扁形圭d裝體.資格認證機構.資格檢驗.合格產品（供應者）名定性分析.Quality Conformance Test Circuitry （Coupon） 品質符合之試驗線路（樣板）.Quantitative Analysis定量分析.Quench淬火，驟冷.Quick Disconnect快速接頭.Quill緯紗繞軸Rack掛架.Radial Lead 放射狀引腳.Radio Frequency Interference（RFI）射頻干擾.Rake Angle 摳角，耙角.Rated Temperature, Voltage額定溫度，額

55、定電壓.Reactance 電抗.Real Estate 底材面，基板面.Real Time System 實時系統(tǒng).Reclaiming 再生，再制.Rediometer輻射計,光度計.Reel to Reel 卷輪（盤）式操作.Reference Dimension參考尺度.Reference Edge 參考邊緣.Reflection 反射.Reflow Soldering重熔焊接，熔焊.Refraction 折射.Refractive Index折射率.Register Mark 對準用標記.Registration對準度.Reinforcement 補強物.Rejection 剔退，拒

56、收.Relamination（Re-Lam）多層板壓合.Relaxation松弓& .緩和.Relay繼電器.Release Agent, Release Sheets脫模齊1J ,離模劑.Reliability可靠度，可信度.Relief Angle 浮角.Repair 修理.Resin Coated Copper Foil背膠銅箔.Resin Content膠含量，樹脂含量.Resin Flow膠流量，樹脂流量.Resin Recession 樹脂下陷.Resin Rich Area多膠區(qū)，樹脂豐富區(qū).Resin Smear 月$i（糊）渣.Resin Starve Area缺膠區(qū)，樹脂缺

57、乏區(qū).Resist阻膜，阻劑.Resistivity 電阻系數，電阻率.Resistor電阻器，電阻.Resistor Drift 電阻漂移.Resistor Paste 電阻印膏.Resolution 解像，解像度，分辨率.Resolving Power 解析（像）力，分辨力.Reverse Current Cleaning反電流（電解）清洗.Reverse Etchback反回蝕.Reverse Image負片影像（阻劑）.*S*Reverse Osmosis (RO) 反(逆滲透).Reversion 反轉，還原.Revision修正版.改訂版.Rework(ing)重工，再加工.Rho

58、logy流變學，流變性質.Ribbon Cable 圓線纜帶.Rigid-Flex Printed Board硬軟合板.Ring套環(huán).Rinsing 水洗，沖洗.Ripple紋波(指整流器所輸出電流中不穩(wěn)定成分).Rise Time上升時間.Roadmap線路與零件之布局圖.Robber輔助陰極.Roller Coating輻輪涂布.Roller Coating滾動涂布法.Roller Cutter 輻切機.Roller Tinning輻錫法，滾錫法.Rosin松香.Rotary Dip Test 擺動沾錫試驗.Routing切外型.Runout偏轉，累績距差.Rupture 迸裂.Sacri

59、ficial Protection 犧牲性保護層Salt Spray Test鹽霧試驗.Sand Blast 噴砂.Saponification 皂化作用.Saponifier 皂化劑.Satin Finish緞面處理.Separable Component Part可分離式零件.Separator Plate 隔板,鋼板.Sequential Lamination 接續(xù)性壓合法.Sequestering Agent 螯合齊U .Shadowing陰影，回蝕死角.Shank鉆針柄部.Shear Strength抗剪弓S度.Shelf Life 儲齡.Shield 遮蔽.Shore Hardne

60、ss 蕭氏硬度.Short短路.Shoulder Angle 肩斜角.Shunt分路.Side Wall 側壁.Siemens電阻值.Sigma (Standard Deviation)標準差.Signal 訊號.Silane 硅烷.Silica Gel硅膠砂.Silicon 硅.Silicone 硅銅.Silk Screen綱版印刷，絲綱印刷.Silver Migration 銀遷移.Silver Paste 銀膏.Single-In-Line Package(SIP)單邊插腳封裝體Sintering 燒結.Sizing 上膠，上漿.Sizing上漿處理.Skin Effect集膚效應(高頻