半導(dǎo)體通用縮略語abbreviation

1、Assy.半導(dǎo)體封裝車間EGSEngineering Support工程支持部EQSEquipment Support設(shè)備支持部PRDProductionMPAMicro Power Analog微型功率模擬器件PWRPower功率器件部WHWare House庫房TESTING測試部門Marking打標(biāo)Label標(biāo)簽QAQuality Assurance質(zhì)量部FACFacility動(dòng)力部TQMTotal Quality Management全面質(zhì)量管理TPMTotal Production Maintenance全面生產(chǎn)維護(hù)TRGTraining培訓(xùn)部HRHuman Resource人力資源

2、部TECHTechnician技術(shù)員OPTOperator操作員PMPreventive Maintenance預(yù)防性維護(hù)()ENGEngineer工程師 GLGroup Leader組長/MHMaterial Handler領(lǐng)料員EOEngineering Operator工程師助理MNGManagerGMGeneral Manager總經(jīng)理WMWafer Mount貼膜DSDie Saw芯片切割DADie Attach粘片WBWire Bond焊線RLRaw Line外觀檢查工位TFTesting and Finishing測試包裝MATMaterial物料EWSElectrical Wa

3、fer Sort晶圓電測MCMachine機(jī)器SOPStandard Operation Procedure標(biāo)準(zhǔn)操作規(guī)程Lead1LOPLocal Operation Procedure本地操作規(guī)程IPCIn Process Control過程控制SPCStatistical Process Control統(tǒng)計(jì)過程控制BSABuild Sheet Assembly裝配圖（配料單）MBDMounting and Bonding Diagram焊線圖MKCMarking Composition打印結(jié)構(gòu)圖TFITesting and Finishing Information測試包裝指導(dǎo)ESDEle

4、ctronic Statistic Discharge靜電釋放8D一種具有八個(gè)指定部分,關(guān)于缺陷原因分析及其改進(jìn)措施的標(biāo)準(zhǔn)報(bào)告CARCause Analysis Report原因分析報(bào)告FMEAFailure Mode & Effect Analysis失效模式分析OCAPOut of Control Action Plan失控狀態(tài)行動(dòng)計(jì)劃DOEDesign Of Experiment實(shí)驗(yàn)設(shè)計(jì)SAP一種多功能的企業(yè)系統(tǒng)管理軟件PRPurchase Requisition采購請求POPurchase Order采購定單PCSPieces個(gè)數(shù)UMUnit Measurement單位ADCSAdva

5、nced Document Control System先進(jìn)文件控制系統(tǒng)EDOCSEnterprise Document Control System企業(yè)文件控制系統(tǒng)WIPWaiting In Process等待生產(chǎn)的產(chǎn)品量IQCIncoming Quality Control來料質(zhì)量控制FAFailure Analysis失效分析FWFactory Work生產(chǎn)線軟件NCLNon Conforming Lot異常產(chǎn)品(不確定產(chǎn)品）PRPosition Reference參考位置設(shè)置DIDeionized去離子的EMSEquipment Monitoring System設(shè)備監(jiān)控系統(tǒng)ESSEm

6、ployee Suggestion System員工建議系統(tǒng)NEENet Equipment Efficiency設(shè)備凈效率OEEOverall Equipment Efficiency設(shè)備綜合效率MTBFMean Time Between Failure平均停機(jī)間隔時(shí)間MDMolding模封JDJob Description工作描述WI操作指導(dǎo)書OQC出料質(zhì)量控制CPCONTRAL PLAN控制計(jì)劃OJTOn the Job Training在線培訓(xùn)Packing包裝Visual Inspection 外觀檢查RET。-Reject 拒收Hold lot封存產(chǎn)品278. Incomplete

7、 fill 塑封/填充不完全（爛頭） 79. Rough surface表面粗糙 80. Resin voids樹脂有孔81. Chip崩角82. Crack / gap (interface resin/metal) / Scratches. 開裂 / 缺口 / 劃傷(金屬和樹脂之間)83. Flash on lead腳上有樹脂 84. Package mismatch模封錯(cuò)位85. Inverted molding / Wrong molding. 模封反轉(zhuǎn) / 錯(cuò)誤模封 86. Resin residue between leads管腳上的殘留樹脂 87. Warpage翹曲 88. S

8、tained, discoloured resin臟污，樹脂變色 89. defects缺陷 90. Incomplete cropping or off centred cropping 切筋不完全或切筋偏離中心 91. Lead coplanarity管腳的共面度 92. Metallic burr on lead管腳上的金屬毛刺 93. Broken / missing lead斷腳 / 腳丟失94. Damaged, cracked and Dented lead管腳有被損壞，有裂縫和被壓變形 95. Improper forming不正確的形狀 96.Stain on lead (f

9、oreign material, chemical stains, stripes, ) 腳贓污 (外來物，化學(xué)臟污，條紋) 97. Twisted lead / Warped lead管腳扭曲 / 歪曲398. Bridging錫搭橋 99. Exposed lead frame material 框架露銅100. Flaking and blister.脫皮和氣泡101. Foreign material外來物102. For Tin-Lead coated and for Tin coated devices錫鉛鍍層和純錫鍍層產(chǎn)品103. Tin base coating Thickne

10、ss.錫層厚度104. uncoated area.未覆蓋區(qū)域 105. Lead etching.管腳被腐蝕106. Cracks in coating 鍍層開裂107. Wrong marking (ink or laser)錯(cuò)誤的打印108. Marking inclination (ink or laser)打印傾斜109. Incomplete character (ink or laser marking). 打印字母不完全110. Marking illegible (ink or laser)打印不清晰 111. Laser marking depth.打印深度112. Stain 臟污113. Combine合并 114. Reel / Tube卷盤裝/管裝115. Mixing混管116.Anti-mixing預(yù)防混料117. UPH單位時(shí)間的生產(chǎn)效率118. CTM 生產(chǎn)周期119. QTY IN進(jìn)料數(shù)量120. QTY OUT出料數(shù)量121. Audit審核，檢查122. Follow chart流程圖123. Check list檢查表，點(diǎn)檢表 124.POD置標(biāo)語言125.FRAME框架126.SHIFT班次12