SMTBGA雙球枕頭效應原因分析及改善對策課件

In-situobservationofBGAsolderingClassificationofBGAsolderingfailuremodeCasestudyforBGAsolderingOutlineIn-situobservationofBGAso11-1ObservationofBGAsolderinggapchangeIn-situobservationofBGAsolderingPeakTemp.Coolingdown1-1ObservationofBGAsolderi2PKGPCBSoldersphereSolderpasteFluxcleantinoxideSolderball&pastemeltatmeltingpointThickeroxideandweakerfluxactivitycausednon-meltingDuringpeak&coolingNon-meltingcausedheadinpillowReflowProfileofProcessPKGPCBSoldersphereSolderpast3ClassificationofBGAsolderingfailuremodeSMTBGA雙球枕頭效應原因分析及改善對策課件4a.

Voidb.Bridged.Cracke.Head-in-Pillowf.Non-wettingc.Missingballa.Voidb.Bridged.Cracke.Hea5g.de-wettingh.shifti.solderballg.de-wettingh.shifti.solder6Head-in-pillowheatingheatingcoolingPeakTempHead-in-pillowheatingheatingco7BGAassemblyproblemanalysisBGAproblemComponent(84.8%)PCB(6.1%)Solderpaste(3.0%)SMTprocess(6.1%)BGAballpollution(45%)Padpollution(18.2%)others(9.1%)warpage(12.1%)Profile(3.0%)Pick&place(3.0%)Weakactivity(3.0%)warpage(3.0%)PADpollution(3.0%)BGAassemblyproblemanalysisB8VoidReflowPCBsubstrateBGAballPasteFluxPowdersizealloycompositionActivatorViscosityOxidationcontaminationCleannessshelflifeSurfacefinishDesignofpadOxidationofpadDegausstimingBridgeProcessSubstrateSolderFluxBendingMissmountingSlumpVoidReflowPCBsubstrateBGAbal9DewettingPCBsubstrateBGAballPasteFluxAlloycompositionOxidationcontaminationCleanness&shelflifeSurfacefinishOxidationofpadActivatorCrackPCBsubstrateSolderReflowconditionAlloycompositionDesignBendingDewettingPCBsubstrateBGAball10PillowAssemblyDeviceSolderBallSubstrateSurfaceissueShapeIssueCompositiondesignSplitSurfaceoxidationResidueoffluxContamination

Co-planarityBallsizedesignBendingSubstrate(PCB)PasteReflowMountingBendingAlloycompositiondesignPrintingTackinessdecayHeightorvolumeinsufficientFluxactivatorefficiencyHeatinsufficientOver-preheatFluxactivatordecayOxidationofBGAballHalf-meltingornon-meltingPickingPrecisionBGAPillowAssemblyDeviceSolderBal11CaseStudyBGAHead-in-pillowdefectissueCaseStudy12

Head-in-pillowcross-sectionviewHead-in-pillowcross-section13Componentinspection

TherearesomeblackareasonthesolderballComponentinspectionThereare14SEM-EDSanalysisNormalsurface：C、O<10%TheblackareahasS、Brelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisNormalsurface15SEM-EDSanalysisNormalsurfacehashigherOxygencontentTheblackareahasSelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisTheblackarea16SEMinspectionSEMinspection17SEMinspectionSEMinspection18SEMinspectionSEMinspection19SMTreflow-Profile

Redsettingprofile

GreenrealprofileSMTreflow-ProfileRedsettin20SMTreflow-Shenmaosolderpaste

pre-heatHeatingto220℃Heatingto230℃Heatingto210℃SMTreflow-Shenmaosolderp21Coolingto235℃Coolingto225℃Heatingto244℃Heatingto

240℃SMTreflow-Shenmaosolderpaste

Coolingto235℃Coolingto225℃22Coolingto100℃Coolingto215℃Shenmaosolderpastedoesnothaveheadinpillowresultduetogoodfluxperformance.SMTreflow-Shenmaosolderpaste

Coolingto100℃Coolingto215℃23

Thanksforyourattention!Thanksforyourattention!24

In-situobservationofBGAsolderingClassificationofBGAsolderingfailuremodeCasestudyforBGAsolderingOutlineIn-situobservationofBGAso251-1ObservationofBGAsolderinggapchangeIn-situobservationofBGAsolderingPeakTemp.Coolingdown1-1ObservationofBGAsolderi26PKGPCBSoldersphereSolderpasteFluxcleantinoxideSolderball&pastemeltatmeltingpointThickeroxideandweakerfluxactivitycausednon-meltingDuringpeak&coolingNon-meltingcausedheadinpillowReflowProfileofProcessPKGPCBSoldersphereSolderpast27ClassificationofBGAsolderingfailuremodeSMTBGA雙球枕頭效應原因分析及改善對策課件28a.

Voidb.Bridged.Cracke.Head-in-Pillowf.Non-wettingc.Missingballa.Voidb.Bridged.Cracke.Hea29g.de-wettingh.shifti.solderballg.de-wettingh.shifti.solder30Head-in-pillowheatingheatingcoolingPeakTempHead-in-pillowheatingheatingco31BGAassemblyproblemanalysisBGAproblemComponent(84.8%)PCB(6.1%)Solderpaste(3.0%)SMTprocess(6.1%)BGAballpollution(45%)Padpollution(18.2%)others(9.1%)warpage(12.1%)Profile(3.0%)Pick&place(3.0%)Weakactivity(3.0%)warpage(3.0%)PADpollution(3.0%)BGAassemblyproblemanalysisB32VoidReflowPCBsubstrateBGAballPasteFluxPowdersizealloycompositionActivatorViscosityOxidationcontaminationCleannessshelflifeSurfacefinishDesignofpadOxidationofpadDegausstimingBridgeProcessSubstrateSolderFluxBendingMissmountingSlumpVoidReflowPCBsubstrateBGAbal33DewettingPCBsubstrateBGAballPasteFluxAlloycompositionOxidationcontaminationCleanness&shelflifeSurfacefinishOxidationofpadActivatorCrackPCBsubstrateSolderReflowconditionAlloycompositionDesignBendingDewettingPCBsubstrateBGAball34PillowAssemblyDeviceSolderBallSubstrateSurfaceissueShapeIssueCompositiondesignSplitSurfaceoxidationResidueoffluxContamination

Co-planarityBallsizedesignBendingSubstrate(PCB)PasteReflowMountingBendingAlloycompositiondesignPrintingTackinessdecayHeightorvolumeinsufficientFluxactivatorefficiencyHeatinsufficientOver-preheatFluxactivatordecayOxidationofBGAballHalf-meltingornon-meltingPickingPrecisionBGAPillowAssemblyDeviceSolderBal35CaseStudyBGAHead-in-pillowdefectissueCaseStudy36

Head-in-pillowcross-sectionviewHead-in-pillowcross-section37Componentinspection

TherearesomeblackareasonthesolderballComponentinspectionThereare38SEM-EDSanalysisNormalsurface：C、O<10%TheblackareahasS、Brelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisNormalsurface39SEM-EDSanalysisNormalsurfacehashigherOxygencontentTheblackareahasSelements,andhigherC、OcontentonthesurfaceSEM-EDSanalysisTheblackarea40SEMinspectionSEM