便攜式設(shè)備-Notebook與Pad的設(shè)計(jì)制造流程

NotebookPC&Tablet相關(guān)設(shè)計(jì)介紹Common專案設(shè)計(jì)流程簡(jiǎn)介Keyparts規(guī)格簡(jiǎn)介Notebook設(shè)計(jì)簡(jiǎn)介Tablet設(shè)計(jì)簡(jiǎn)介Connectors設(shè)計(jì)簡(jiǎn)介Trendof3CproductsAgendaCommon專案設(shè)計(jì)流程簡(jiǎn)介RFIRFPRFQPMSalesCostTeamAwardMEEESWRFThermalNPSUPlacementstudyThermalSimulationLayoutSimulationMasterScheduleProductSpecificationRFSimulationIDIDstudyOS/Driver/BIOSProductionLineSimulationKeypartsListNOKick-offStartIDlockdownPCBreleaseOthersAStageMockup/ToolingSMTOthersB/CStageToolingTestQA/IQC/SQESafety……Pre-MPMPFCSTeamrosterColorplanICTnegotiationflowchartInformationandcommunicationstechnology

(ICT)

PMrequestRFI(RequestForinformation)RFP(RequestForProposal)RFQ(Requestforquotation)QualityRequirementsRegulationWarranty/ServiceQuotationProcurementISODocument1.NRE2.Samplerequestbystage3.Schedule4.Connectwindow1.SSA/SPA2.EnvironmentalRequirements3.RequestsForChange4.RegularReportsandMeetings5.QualityGoalsIFRTarget&Formulation6.AFRcompensationfee1.GuidelineofRestrictionofHazardousSubstance2.Regulatory3.ReportforEMC/Safety/Energyrequirement1.WarrantyPeriod2.OutofWarrantyService3.ReturnforRepair4.Landing-combatIFR(NPI)5.ServicePartsProvision6.ProductSupport7.FailureAnalysisreport8.SparePartsBufferandLocalRepair9.KeyPartsWarranty10.SparePartsWarranty1.ForecastAcceptance2.OrderConfirmation3.DeliveryRequirementContainerLoadingISODocumentsRequirement(SA8000,ISO14001&OHSAS18001)Keyparts規(guī)格簡(jiǎn)介Keyparts規(guī)格簡(jiǎn)介Keyparts為在3C專案進(jìn)行任何一流程前必須選定之部品.Keyparts佔(zhàn)整個(gè)機(jī)種開發(fā)成本約20~30%.Keyparts定義:

a.TouchPanel觸控面板

b.LCM液晶螢?zāi)籧.WebCAM攝影鏡頭

前鏡頭&後鏡頭

d.Antenna無線天線

e.RF無線模組

Wi-Fi/WWAN/3G/GPS/Bluetooth

f.Batterypack/cell電池g.Keyboard鍵盤

h.GlidePad/Touchsensor滑鼠板i.HDD硬碟9.5H/7.0H/5.0H/SSD…..

j.ODD光碟機(jī)9.5H/8.5H/7.0H

k.CPU中央處理器Wintel(AMD/Intel)+ARM(Qualcomm/…..)

l.DDR記憶體模組DDR3/DDR4j.OS.Windows/AndroidKeyparts規(guī)格簡(jiǎn)介-Touchpanel多點(diǎn)觸控技術(shù)大致可分為五種疊層結(jié)構(gòu)，而以觸控疊構(gòu)和顯示面板的相對(duì)位置，又可歸納為三類，包括Out-Cell、On-Cell及In-Cell等技術(shù)架構(gòu)。其中，Out-Cell係指觸控面板模組外掛於顯示模組之外，共有單玻璃觸控方案(OGS)、雙玻璃(GG)與雙薄膜(CoverGlass/SensorFilmX/SensorFilmY,GFF)觸控方案三種主要類型。

與LCM結(jié)合的方式可分為Airbonding&Directbonding共二種。Keyparts規(guī)格簡(jiǎn)介-Touchpanel

各項(xiàng)觸控面板之基本特性比較Keyparts規(guī)格簡(jiǎn)介-TouchpanelAppleiPadairKeyparts規(guī)格簡(jiǎn)介-LCMLCM設(shè)計(jì)上通常分為二種:

Module模組Opencell(Hingeup)Panelsize:

5”/6”/7”/7.9”/8.3”/10.1”/11.6”/13.3”/14.1”/15.6”/17”/18”/21.5”/23.3”/24”Keyparts規(guī)格簡(jiǎn)介-LCMNoteBook設(shè)計(jì)簡(jiǎn)介N/B設(shè)計(jì)上通常分為二區(qū):

Displayunit(面板)Baseunit

(主機(jī))主件分為4大件:

A:

Display

unitFrontcover

B:

Display

unitBackcover

C:BaseunitTopcase

D:BaseunitBottomcaseDisplayunitBaseunitNotebook設(shè)計(jì)分類-Teardown說明ABCDNotebook設(shè)計(jì)分類-DisplayunitA

coverLCMBcoverCable-RCable-LHinge-RHinge-LAntennaWebCAM+MICNotebook設(shè)計(jì)分類-BaseunitGlidePadM/BSpeakerboxFANBatterypackHeat-sinkD

coverKeyboardC

coverODDHDDD/BTablet設(shè)計(jì)簡(jiǎn)介Tablet設(shè)計(jì)分類-Teardown說明Tablet設(shè)計(jì)上僅分為2主件:

A:

FrontcoverB:

BackcoverABConnector設(shè)計(jì)簡(jiǎn)介I/OPorts-影像輸出CRT

portHDMI

portDisplay

portI/OPorts-資料傳輸U(kuò)SB2.0USB3.0ThunderBoltI/OPorts-資料傳輸&聲音傳輸AudioJackMICJackSDcardRJ45I/OPorts-電源供應(yīng)DC-INI/OPorts-Tablet專用型MicroUSB2.0MiniUSB2.0MicroUSB3.0MiniHDMI

MicroHDMIMicroSDcardMiniSDcardMultifunctionconnector(USB+SD/DP+HDMI/USB+AC……..)//2013/06/30/apple-patent-stuffs-two-ports-in-one-saves-space-in-your-laptop/I/OPorts-SpecialtypeofmultifunctionUSB+ACpowermaynotimplementcontrollerICbyUSBassociationdefinition??Howtodo??Combinemagnetsolution(Applepatentissue)

Waterproofsolution-IPX5levelI/OPorts-Specialtypeofmultifunction外觀件加工法外觀處理與

設(shè)計(jì)簡(jiǎn)介外觀件材料簡(jiǎn)介-塑膠成型塑膠粒子塑膠模具塑膠成型機(jī)塑膠成型品外觀件材料簡(jiǎn)介