GB 51037-2014 GB51037-2014微組裝生產(chǎn)線工藝設(shè)備安裝工程施工及驗(yàn)收規(guī)范:英文

專用

人人文庫

NATIONALSTANDARD

OFTHEPEOPLE'SREPUBLICOFCHINA

CODEFORCONSTRUCTIONANDACCEPTANCEOF

MICRO-ASSEMBLINGPRODUCTIONLINEPROCESS

EQUIPMENTINSTALLATIONENGINEERING

GB51037-2014

DevelopedbyTheMinistryofIndustryandInformationTechnologyof

thePeople'sRepublicofChina

ApprovedbyTheMinistryofHousingandUrban-Rural專用Developmentof

thePeople'sRepublicofChina

ImplementationDateMay1，2015

人人文庫

ChinaPlanningPress

Beijing2021

圖書在版編目（CIP）數(shù)據(jù)

GB51037-2014微組裝生產(chǎn)線工藝設(shè)備安裝工程施工

及驗(yàn)收規(guī)范：英文/中華人民共和國(guó)住房和城鄉(xiāng)建設(shè)部

組織編譯.--北京：中國(guó)計(jì)劃出版社，2021.12

ISBN978-7-5182-1415-0

Ⅰ.①G…Ⅱ.①中…Ⅲ.①微組裝—生產(chǎn)線—生產(chǎn)

工藝—設(shè)備安裝—工程施工—規(guī)范—中國(guó)—英文②微組裝

—生產(chǎn)線—生產(chǎn)工藝—設(shè)備安裝—工程驗(yàn)收—規(guī)范—中國(guó)

—英文Ⅳ.①TB4-65

中國(guó)版本圖書館CIP數(shù)據(jù)核字（2022）第010386號(hào)

ChineseeditionfirstpublishedinthePeople'sRepublicofChinain2014

EnglisheditionfirstpublishedinthePeople'sRepublicofChinain2021

byChinaPlanningPress

3rdFloor，CTower，GuohongBuilding專用

No.A11，Muxidi-Beili，XichengDistrict

Beijing，100038

PrintedinChinabyBeijingJingyintangGraphicPrintingCenter

?2014bytheMinistryofHousingandUrban-RuralDevelopmentof

thePeople'sRepublicofChina

Allrightsreserved.Nopartofthispublicationmaybereproducedortransmittedinanyformor

byanymeans，graphic，electronic，ormechanical，includingphotocopying，recording，

oranyinformation人人文庫storageandretrievalsystems，withoutwrittenpermissionofthepublisher.

Thisbookissoldsubjecttotheconditionthatitshallnot，bywayoftradeorotherwise，belent，

resold，hiredoutorotherwisecirculatedwithoutthepublisher'spriorconsentinanyformof

blindingorcoverotherthanthatinwhichthisispublishedandwithoutasimilarcondition

includingthisconditionbeingimposedonthesubsequentpurchaser.

ISBN978-7-5182-1415-0

中華人民共和國(guó)住房和城鄉(xiāng)建設(shè)部公告

2020年第129號(hào)

住房和城鄉(xiāng)建設(shè)部關(guān)于發(fā)布《微組裝生產(chǎn)線

工藝設(shè)備安裝工程施工及驗(yàn)收規(guī)范》等

11項(xiàng)工程建設(shè)標(biāo)準(zhǔn)英文版的公告

現(xiàn)批準(zhǔn)《微組裝生產(chǎn)線工藝設(shè)備安裝工程施工及驗(yàn)收規(guī)范》（GB51037-2014）、《電子工

業(yè)純水系統(tǒng)安裝與驗(yàn)收規(guī)范》（GB51035-2014）、《光纜生產(chǎn)廠工藝設(shè)計(jì)規(guī)范》（GB51067-

2014）、《光纖器件生產(chǎn)廠工藝設(shè)計(jì)規(guī)范》（51123-2015）、《電子工程防靜電設(shè)計(jì)規(guī)范》（專用50611-

GBGB

2010）、《防靜電工程施工與質(zhì)量驗(yàn)收規(guī)范》（GB50944-2013）、《天線工程技術(shù)規(guī)范》（GB50922-

2013）、《試聽室工程技術(shù)規(guī)范》（GB/T51091-2015）、《體育場(chǎng)建筑聲學(xué)技術(shù)規(guī)范》（GB/T50948-

2013）、《電子會(huì)議系統(tǒng)工程設(shè)計(jì)規(guī)范》（GB50799-2012）、《電子會(huì)議系統(tǒng)工程施工與質(zhì)量驗(yàn)收

規(guī)范》（GB51043-2014）英文版。工程建設(shè)標(biāo)準(zhǔn)英文版與中文版出現(xiàn)異議時(shí)，以中文版為準(zhǔn)。

該11項(xiàng)工程建設(shè)標(biāo)準(zhǔn)英文版由住房和城鄉(xiāng)建設(shè)部組織中國(guó)計(jì)劃出版社有限公司出版發(fā)行。

中華人民共和國(guó)住房和城鄉(xiāng)建設(shè)部

2020年5月28日

人人文庫

AnnouncementoftheMinstryofHousingandUrban-Rural

DevelopmentofthePeople'sRepublicofChina

No.533

AnnouncementoftheMinistryofHousingandUrban-Rural

DevelopmentonPublishingNationalStandardof

CodeforConstructionandAcceptanceofMicro-assemblingProductionLine

ProcessEquipmentInstallationEngineering

CodeforConstructionandAcceptanceofMicro-assemblingProductionLineProcessEquipment

InstallationEngineeringhasbeenapprovedasanationalstandardwithaserialnumberofGB51037-

2014，andwillbeimplementedonMay1，2015.Inthiscode，Articles4.2.1（4），4.5.2（1），5.4.1（3），5.6.1

（3），5.7.1（5）7.7.2（3）專用.

andaremandatoryonesandmustbeimplementedstrictly

AuthorizedbytheResearchInstituteofStandardsandNormsofMinistryofHousingandUrban-

RuralDevelopmentofthePeople'sRepublicofChina，thiscodeispublishedanddistributedbyChina

PlanningPress.

MinistryofHousingandUrban-RuralDevelopmentofthePeople'sRepublicofChina

August27，2014

人人文庫

Foreword

ThiscodeisdevelopedbySinopecEngineeringIncorporationincooperationwithotherinvolved

organizationsaccordingtotherequirementsofDocumentJIANBIAO〔2010〕No.43issuedbythe

MinistryofHousingandUrban-RuralDevelopmentofthePeople'sRepublicofChina（MOHURD）—

“NoticeonPrintingandDistributing‘theDevelopmentandRevisionPlanofNationalEngineering

ConstructionStandardsin2010’”，thiscodeiscompiledandformulatedbyElectronicEngineering

StandardQuotaStationofChinaElectronicsStandardizationInstitute，the2ndResearchInstituteof

ChinaElectronicsTechnologyGroupandotherrelevantorganizations.

Basedontheinvestigationandresearch，thecompilationteamsummarizedthepracticalexperience，

absorbedthescientificresearchresultsinrecentyears，drewontheadvancedforeignexperiencewhichis

inlinewiththenationalconditionsofourcountry，andextensivelysolicitedpinionsfromthedomestic

relatedunitsondesign，productionandresearch.Andthecodewasfinalizedafterreview.

Thiscodeconsistsof8chaptersand1appendix，covering：generalprovisions；terms；basic

requirements；installation，debuggingandcommissioningoflowtemperature專用co-finedceramicandthick

filmsubstrateproductionprocessequipment；thinfilmsubstrateproductionprocessequipment

installation，debuggingandcommissioning；installation，debuggingandcommissioningofassembling

andpackagingprocessequipment；installation，debuggingandcommissioningofprocessinspection

equipment；engineeringacceptance，etc.

Theprovisionsprintedinboldtypearemandatoryonesandmustbeimplementedstrictly.

Thiscodeisunderthejurisdictionof，anditsmandatoryprovisionsareinterpretedbytheMinistry

ofHousingandUrban-RuralDevelopment.TheMinistryofIndustryandInformationTechnology

takescareoftheroutinemanagement，whilethe2ndResearchInstituteofChinaElectronics

TechnologyGroupCorporationisresponsiblefortheinterpretationoftechnicalspecifications.All

relevantorganizationsarekindlyinvitedtosummarizeandaccumulateactualexperienceswhen

implementingthiscode.Relevantcommentsandrecommendations，whenevernecessary，shallbe

submittedtothe2ndResearchInstituteofChinaElectronicsTechnologyGroupCorporation（Address：

No.115HepingSouthRoad，TaiyuanCity，ShanxiProvince，Postcode：030024）forfuturerevision.

ChiefDevelopmentOrganizations，Co-DevelopmentOrganizations，ChiefDrafters，Chief

Reviewers，Chief人人文庫TranslatorsandChiefTranslationReviewersofthiscode：

ChiefDevelopmentOrganizations：

ElectronicEngineeringStandardQuotaStationofChinaElectronicsStandardization

Institute

The2ndResearchInstituteofChinaElectronicsTechnologyGroup

Co-DevelopmentOrganizations：

The214thResearchInstituteofChinaNorthIndustriesGroupCorporation

The14thResearchInstituteofChinaElectronicsTechnologyGroup

The29thResearchInstituteofChinaElectronicsTechnologyGroup

The43rdResearchInstituteofChinaElectronicsTechnologyGroup

ChinaElectronicSystemEngineeringNo.2ConstructionCorporationLimited

TheITElectronicEleventhDesignandResearchInstituteScientificand

TechnologicalEngineeringCorporationLimited

The26thResearchInstituteofChinaElectronicsTechnologyGroup

ChinaElectronicsEngineeringDesignInstitute

ChiefDrafters：

CHAOYuqingHEZhongweiYANWeiDUBaoqiangGAONengwu

WANGZhengyiWANGKaiyuanZHENGBingxiaoLIXiaoxuan

QIAOHailingWANGGuipingLVQinHongHUANGWensheng

WUJianhua

ChiefReviewers：

WUXiangXUEChangliSHENXianfengCHENGKaiQIUYingxia

HULaipingLIYangxingHEChangfengZHANGYu

ChiefTranslators：

LIJingzhaoZHOULiDUBaoqiangZHANGXiaomingZHUZongjiu

ChiefTranslationReviewers：

LIAOYanlinSONGGuixiaYANGKegui專用

人人文庫

Contents

1Generalprovisions…………………（1）

2Terms…………………（2）

3Basicrequirements………………（3）

3.1Constructionconditions……………（3）

3.2Equipmentunpacking…………………（3）

3.3Equipmentmoving………………………（4）

3.4Equipmentinstallation…………………（5）

3.5Debuggingandcommissioningofequipment……………（6）

4Installation，debuggingandcommissioningoflowtemperatureco-finedceramicand

thickfilmsubstrateproductionprocessequipment………………（7）

4.1Generalrequirements……………………（7）

4.2Tapecaster……………（7）

4.3Blanker……………………………專用（8）

4.4Greentapepuncher……………………（8）

4.5Laserscribingmachine…………………（9）

4.6Viafillingmachine………………………（9）

4.7Screenprinter…………………………（10）

4.8Stackingmachine…………………………（10）

4.9Isostaticlaminator……………………（11）

4.10Hotcutter……………………………（12）

4.11Lowtemperatureco-finedceramicboxfurnace（LTCCboxfurnace）………（12）

4.12Thick-filmbeltfurnace……………（13）

4.13Laserresistortrimmer……………（13）

5Thinfilmsubstrateproductionprocessequipmentinstallation，debuggingand

commissioning………………………（15）

5.1Generalrequirements……………………（15）

5.2Magneticsputteringdepositionsystem…………………（15）

5.3Vacuumevaporative人人文庫copper-coatedmachine……………（16）

5.4Chemicalvapordepositionsystem………………………（17）

5.5Spincoatingandhotplatesystem…………（18）

5.6Exposuremachine……………………（19）

5.7Developingsystem……………………（19）

5.8Reactiveionetchingmachine……………（20）

5.9Chemicalmechanicalpolishingmachine…………………（21）

6Installation，debuggingandcommissioningofassemblingand

packagingprocessequipment……………………（23）

6.1Generalrequirements……………………（23）

6.2Dieattachingmachine……………………（23）

6.3Dieeutecticbonder………………（23）

6.4Eutecticoven………………………（24）

6.5Wirebonder………………………（25）

6.6Flipchipbonder………………………（25）

6.7Plasmacleaner……………………（26）

6.8Selectivespraycoatingmachine…………（26）

6.9Parallelseamwelder………………（26）

6.10Energystoragewelder…………………（27）

6.11Laserwelder……………………（28）

7Installation，debuggingandcommissioningofprocessinspectionequipment……（29）

7.1Generalrequirements…………………（29）

7.2Probetester………………………（29）

7.3Acousticscanner…………………（30）

7.43Dopticalprofiler………………………（30）

7.5Automaticopticalinspector……………（30）

7.6Laserthicknessgauge……………………（31）

7.7X-rayscanner……………（31）

7.8Chipshearing/wirepullingtester…………專用（32）

8Engineeringacceptance……………（33）

8.1Generalrequirements…………………（33）

8.2Handoveracceptance…………………（33）

8.3Completedacceptance…………………（34）

8.4Disposalofreject………………………（34）

AppendixARecordformsofacceptanceformicro-assemblingproductionlineprocess

equipmentinstallationengineering……………………（35）

Explanationofwordinginthiscode………………（40）

Listofquotedstandards…………………（41）

人人文庫

1Generalprovisions

1.0.1Thiscodeispreparedwithaviewtostandardizingtheconstructionandqualityacceptanceof

micro-assemblingproductionlineequipmentinstallationengineering，guaranteetheinstallationquality

andreliableoperationofthemicro-assemblingline，andpromotingthedevelopmentofequipment

installationtechnologyinthisfield.

1.0.2Thiscodeisappliedtoconstruction，debugging，commissioningandacceptance，whilethemicro-

assemblingproductionlineisnewlybuild，reconstructedandextended.

1.0.3Inadditiontoimplementingthiscode，theconstructionandacceptanceofprocessequipmentfor

micro-assemblingproductionlineshallmeettherulesofnationalcurrentrelevantstandards.

專用

人人文庫

2Terms

2.0.1Micro-assembling

Thetechnologyofformingadvancedmicroelectronicmoduleisassemblyofvariousmicroparts

andcomponents，integratedcircuitchipsandchipcomponentswhichconsistofelectroniccircuitsonthe

highdensitymultilayerinterconnectedsubstratebysurfacemountingandinterconnectionprocess.

2.0.2Multilayersubstrate

Substratewithembeddedconductorlayersforimplementingcomplexinterconnectioncircuits.

2.0.3Thickfilm

Filmwhichisdepositedonthesubstratebyscreenprintingprocessandsinteredatthehighest

temperatureofabout850℃.

2.0.4Lowtemperatureco-firedceramic（LTCC）multilayersubstrate

Aftermultipleunsinteredflexiblegreentapes，ofwhichthickfilmconductorsandresistancefigures

（includinginterconnectedlinesthatconsistofthesefigures，embeddedpassivecomponent，etc.）are

printedonthesurface，andwhichinterlaminarinterconnectedmetallized專用holesaremanufactured，are

stackedinorder，laminatingthemintoawholestructurebyheatingandpressingsimultaneously.By

sinteringthegreentapesandthickfilmelectronicpasteatamaximumtemperatureofabout850℃

（sinteringfurnace）rigidandhighdensitymultilayerinterconnectedsubstratesareformedfinally.

2.0.5Thinfilmmultilayersubstrate

Multilayerinterconnectedsubstratewhichoverlappedandinterconnectedmultilayerthinfilm

conductorandinterlaminarinsulatingfilmaremanufacturedoninsulatingsubstrateorsiliconwaferwith

filmformingprocessesofvacuumevaporation，sputtering，chemicalvapordepositionetc.and

technologyofphotoetching，etchingetc.

2.0.6Greentape

Atape-likeflexiblethinceramicmaterialwithsmoothsurface，uniformtextureandcertainstrength

whichismanufacturedbycastingprocess.

2.0.7Packaging

Microelectronictechnologyofinterconnection，protectionandheatdissipationforelectronicdevices

（microcircuitsormodule），whichmainlyincludeplasticpackaging，ceramicpackagingandmetal

packaging.人人文庫

2.0.8Processinspection

Theprocessofmeasuringandinspectingtheproducts'shape，size，positionanditsmechanical，

physical，chemicalcharacteristicsandsoonbytools，instrumentsorequipmentofmeasuringortesting，

andcomparingwiththetechnologyrequirementsofproducts.Itistheinspectiontechniquetoevaluate

theconformityofprocedureorstateofproductcompletionwiththeruleofdesignandprocedure

documents.

3Basicrequirements

3.1Constructionconditions

3.1.1Thecleanroomshallbeinaccordancewiththefollowingrequirementsbeforeinstallationofthe

micro-assemblingequipment：

1Acceptanceofemptyroomshallbequalifiedandtheairconditioningsystemshalloperate

continuouslyandnormallyformorethan24h.

2Temperatureshouldbe20℃to26℃.

3Relativehumidityshouldbe30%to70%.

4Load-bearingcapabilityoffloorshallmeetrequirementsofequipment.

5Clearanceheightshallmeetinstallationrequirementsofequipment.

6Bodypurificationfacilityattheroomentranceshallhavebeeninoperation.

7Theequipmententryshallbeavailable.

8Firefightingfacilitiesshallhavebeenpassedspecialacceptanceandcanbeenabled.

9Theantistaticfacilitiesintheantistaticworkingareashallhavepassed專用thetestandacceptance.

10Powersupply，gassource，watersourceandgroundingterminalshallbeavailableandin

accordancewithrequirements.

11Employeesafeevacuationchannelsshallbesetup.

3.1.2Theinstallationofmicro-assemblingequipmentshallhavethefollowingtechnicaldocuments：

1Equipmentinstallationplan.

2Equipmentpackinglist.

3Technicaldocumentsforinstallation，operation，maintenanceandinstallationtechnicalparameters

ofequipmentprovidedbyequipmentmanufacturers.

3.1.3Theconstructionpersonnelshallenterthepurificationroomwithapassportofenteringtheclean

area.Specialtypesofworkersshallbecertificatedinaccordancewithrelevantprovisions.

3.1.4Equipmentinstallationandhook-upengineeringmaterialsshallmeettherelevantrequirements

ofcurrentnationalstandardGB50472CodeforDesignofElectronicIndustryCleanRoom.

3.1.5Equipmentandtoolsusedinconstructionshallmeettherelevantrequirementsofcurrent

nationalstandardGB50467CodeforConstructionandAcceptanceofMicro-electronicsManufacturing

EquipmentInstallation人人文庫Engineering.

3.2Equipmentunpacking

3.2.1Equipmentshallbeunpackedwithjointparticipationofresponsiblepersonnelofsupplyunit，

constructionunitanddevelopmentunit.Unpackingofimportedequipmentforstatutorycommodity

inspectionshallbeattendedbycustomsinspectionrepresentatives.

3.2.2Packingcaseshallbecheckedfordamageanddamagedegreebeforeequipmentunpacking，anti-

vibrationandanti-tiltmarksshallnotbeabnormal.

3.2.3Equipmentunpackingshallbeinaccordancewiththefollowingrequirements：

1Packingcaseshallbeunpackedbyeffectivetoolsandfollowingreasonableproceduresunder

thepremiseofcausingnodamagetotheequipmentanditsaccessoriesinthecase.

2Thetopcoverofthecaseshallberemovedfirstafterremovingroofnailsorrelevantfasteners.

3Afterremovingthetopcoverandpart（orall）sidecoversofthecase，smallpartsandaccessories

shallberemovedfromthecasepriortomainframe，andthencarryouttheremainingworkofunpacking.

3.2.4Afterequipmentunpacking，packingmaterialshallberemovedintime.

3.2.5Afterequipmentunpacking，intactnessofinternalequipment，packageandaccessoriesshallbe

checked，anyabnormalsituationshallhaveimagerecordimmediatelyandputforwardtheprocessing

advice.

3.2.6Afterequipmentunpacking，equipmentshallbecheckedinaccordancewiththefollowing

requirements：

1Typespecificationontheequipmentnameplateshallbeconsistentwithequipmentlistor

technicalparameterlist.

2Iftheexteriorandprotectivepackageofequipmenthavedefects，damageorrustiness，itshallbe

putforwardandrecordedintime.Formanufacturingdefects，notifytheequipmentmanufacturerto

researchthehandlingmethod.

3Checkwhethertheparts，components，tools，accessories，subsidiarymaterials，andother

technicaldocumentsarecompleteonebyoneaccordingtothepackinglist，andshallmakearecord.

4Afterunpackingandinspectingtheequipment，theparts，accessories專用，accessorymaterials，tools

andfixtures，andtechnicaldocumentsthatneednottoinstallorbeusedforinstallationshallbeputinto

thecustodyoftheuser.

3.2.7Inspectionrecordsshallbefilledinwhenunpackingequipment，thecontentandformatshallbe

inaccordancewiththosespecifiedinTableA.0.1ofthiscode.

3.3Equipmentmoving

3.3.1Equipmentmovinginmethodofliftingshallbeinaccordancewiththefollowingrequirements：

1Steelcableusedinliftingshallbeabletowithstandover10tofweight.

2Craneoperatorsshallbecertificated.

3Cablebindingpositionshallavoidinstrumentandfragilestructure.Theequipmentcenterof

gravityshallbepaidattentionwhenlifting，andpreventtheequipmentfromdumpingandfalling.

4Theliftingheightofequipmentshouldbesuitableforremovingtheouterbottompackaging.

5Liftingandloweringspeedshallbecontrolledwhenoperating，noimpactorcollisionshall

occur.

3.3.2Themechanical人人文庫facilitiesofforkliftsoraircushionsetc.shallbeusedwhenpositioninglarge-

scalemicro-assemblinglineproductionprocessequipmentintheroom.

3.3.3Thelengthoftwoforksshallexceed100mmofgravitycenterofequipmentwhenforkliftisused.

3.3.4Operationshallbesteadywhenmovingequipmentwithahydraulicloader.

3.3.5Movingequipmentwithaircushionshallbeinaccordancewiththefollowingrequirements：

1Aircushionsshallbeplacedundertheloadbeamatthebottomofequipment，andthenumberof

aircushionsforeachequipmentshallnotbelessthan4.

2Aircushionsshalltravelsteadilyafterinflating.Theheightofequipmentbottomfromthe

groundshallnotbelessthan2mm.

3.3.6Theprotectivemeasuresforthefloorshallbetakenwhenequipmentismovedintheroom.

3.4Equipmentinstallation

3.4.1Installationofmicro-assemblingequipmentshallbeinaccordancewiththefollowing

requirements：

1Full-openspaceofelectricboxandspaceofoperationandmaintenanceshallbereservedwhen

positioningtheequipment.

2Theprimarypipeandlinedistributionofpowersupply，gassource，watersourceandground

terminalsshallhavebeeninplace.

3Surfaceofequipmentshallbeprotectedduringinstallation.Sealingsurfaceshallnotbe

damagedorscratched.Installationofequipmentshallbefirmandreliable.Sunkscrewshallnotprotrude

overthesurfaceofconnectedparts.

4Whentheequipmenthasrequirementsofanti-vibrationcontrolorparticularload-bearing，

correspondingmeasuresofanti-vibrationorimprovementofload-bearingcapabilityshallbetaken.

5Hook-upofequipmentshallbecompletedbyprofessionalsinaccordancewithtechnical

requirementsofequipment.TheSS316Lstainlesssteelpipeshouldbeusedforthevacuumpipelineof

accessequipment.Pipingofpurewater，compressedair，etc.shouldbeconnectedwithequipmentby

PTFEandpolyurethanehoses.

3.4.2Directinstallationofmicro-assemblingequipmentonthefloorshall專用beinaccordancewiththe

followingrequirements：

1Basegasketshallbeplacedonthegroundfirst，andconfirmedthatbasicgasketcanevenly

supporttheequipment.

2Handshallnotbeplacedabovethebasegasketduringoperation.

3Ifequipmentisequippedwithbottombolts，eachbottomboltshallbeproperlyinstalledinits

screwhole.Aircushionsshallbeusedtomovetheequipment.

4Theequipmentshallbeleveledgraduallybyadjustingtheheightofanchorboltsortheeffective

thicknessofbasegasket，andensurethatthelocknutisgaplessandeachbottomboltisfixedtothe

correspondingbasegasketonthefloor.

3.4.3Directinstallationofmicro-assemblingequipmentontheplatformshallbeinaccordancewith

thefollowingrequirements：

1Operatingplatformshallbehorizontal，steadyandfirm.

2Antistaticmaterialshallbelaidontheplatformandeffectivelyconnectedtoantistatic

groundingsystemofroom.

3.4.4Horizontal人人文庫adjustmentofequipmentshouldusethecross-testleveltomeasure，andthe

equipmentwithhighprecisionrequirementsmayusetwobracket-typelevels.

3.4.5Groundingofmicro-assemblingequipmentshallbeeffectiveandreliable，andgroundingterminal

shallbefirmlyconnectedtogroundingsystemofcleanroom.Groundingresistanceofequipmentshall

notexceed4Ω；Groundingsystemshallmeettherelevantrequirementsofcurrentnationalstandard

GB50169CodeforConstructionandAcceptanceofGroundingConnectionElectricEquipment

InstallationEngineering.

3.4.6Aftertheequipmentisinplace，powerconfigurationofequipmentshallbecheckedbytechnicians.

3.4.7Recordofinstallationprojectshallbefilledinaftertheequipmentisinstalled，contentandformat

shallbeinaccordancewiththosespecifiedinTableA.0.2ofthiscode.

3.5Debuggingandcommissioningofequipment

3.5.1Debuggingandcommissioningofmicro-assemblingequipmentshallbeinaccordancewiththe

followingrequirements：

1Theequipmenthasbeeninstalledinplace.

2Allkindsofpowerhook-upsshallensurethattheconnectiontotheequipmentissealedand

firm，thevariousparametersofthepowershallmeettherequirementsoftheequipment.

3Compressedairandprocessgasshallbecleanedbeforepumpingintotheequipment.

3.5.2Wiringofmicro-assemblingequipmentshallbecheckedbeforeoperating.

3.5.3Safetyofmicro-assemblingequipmentshallbetestedtomeetrequirementsbeforeoperation.

3.5.4Inthebootstate，aclampammetershallbeusedtomeasurewhetherthevoltageandcurrent

meettherequirementsofequipment.

3.5.5Inthebootstate，theequivalentcontinuousAweightedsoundlevelatpersonneloperating

positionshouldnotbegreaterthan70dB.

3.5.6Equipmentshallcontinuouslyoperatewithoutfailurefor48h.Beforeandafterthecontinuous

operation，themainperformanceindicatorsofequipmentshallbetested.Theresultsshallmeetthe

technicalrequirementsofequipment.

3.5.7Thedebuggingandcommissioningrecordsofmicro-assembling專用equipmentshallbefilledinfor

thesinglecommissioningwhichiscompliedwiththerelevantprovisionsofChapters4to7ofthiscode.

ThecontentandformatoftherecordsshallbeinaccordancewiththosespecifiedinTableA.0.3.

人人文庫

4Installation，debuggingandcommissioningoflowtemperatureco-fined

ceramicandthickfilmsubstrateproductionprocessequipment

4.1Generalrequirements

4.1.1Lowtemperature