QYResearch 半導(dǎo)體業(yè)務(wù)介紹：2023年全球半導(dǎo)體規(guī)模達(dá)到了5268億美元

Copyright?|北京恒州博智國(guó)際信息咨詢有限公司全球知名的半導(dǎo)體公司SemiconductorMarketResea網(wǎng)址：公司簡(jiǎn)介Whoweare行業(yè)涵蓋各高科技行業(yè)產(chǎn)業(yè)鏈細(xì)分市場(chǎng)，如半導(dǎo)體、消費(fèi)電子、光電顯示、化工材料、可再生能源、汽車科技、通信、人工智能、機(jī)器人、機(jī)械制造、食品藥品、醫(yī)療器械、農(nóng)業(yè)、石油天然氣等。分析師團(tuán)隊(duì)來(lái)自各產(chǎn)業(yè)領(lǐng)域的精英，擁有深厚造詣和豐富研究經(jīng)驗(yàn)。QYResearch（北京恒州博智國(guó)際信息咨詢有限公司）成立于2007年，總部位于美國(guó)洛杉磯和中國(guó)北京。經(jīng)過連續(xù)17年多的沉淀，QYResearch是全球知名的大型咨詢公司、具備全球高科技產(chǎn)業(yè)深度分析能力,并提供企業(yè)顧問咨詢服務(wù)的研究機(jī)構(gòu)。業(yè)務(wù)遍及世界160多個(gè)國(guó)家，在全球30多個(gè)國(guó)家有固定營(yíng)銷合作伙伴，在美國(guó)、歐洲、日本、韓國(guó)、印度、等有分支機(jī)構(gòu)，在國(guó)內(nèi)主要城市北京、石家莊、太原、大同、重慶、成都、長(zhǎng)沙、武漢、昆明、廣州、日照等地設(shè)有辦公室和專業(yè)研究團(tuán)隊(duì)。半導(dǎo)體行業(yè)橫跨半導(dǎo)體設(shè)備/零部件、半導(dǎo)體材料、IC設(shè)計(jì)、制造、封測(cè)、存儲(chǔ)器、分立器件、傳感器、光電顯示、工程服務(wù)等。為全球及中國(guó)半導(dǎo)體產(chǎn)業(yè)鏈客戶提供深度的市場(chǎng)調(diào)研服務(wù)，助力相關(guān)產(chǎn)業(yè)企業(yè)更快速發(fā)展。服務(wù)范圍Whatwedo研究報(bào)告提供全球中國(guó)市場(chǎng)調(diào)研報(bào)告定制咨詢根據(jù)客戶需求，提供定制調(diào)研報(bào)告競(jìng)爭(zhēng)分析企業(yè)調(diào)研、份額、成本盈利、客戶等行業(yè)分析全球地區(qū)規(guī)模、產(chǎn)銷量、價(jià)格、進(jìn)出口等客戶分布GlobalClientBase合作客戶OurClients半導(dǎo)體產(chǎn)業(yè)鏈半導(dǎo)體市場(chǎng)規(guī)模根據(jù)世界半導(dǎo)體貿(mào)易統(tǒng)計(jì)組織（WSTS），2023年全球半導(dǎo)體規(guī)模達(dá)到了5268億美元。根據(jù)預(yù)測(cè)，2030年全球半導(dǎo)體規(guī)模將達(dá)到8560億美元。全球半導(dǎo)體市場(chǎng)規(guī)模（億美元）增速9,0008,0007,0006,0005,0004,0003,0002,0001,00008,56130%25%20%15%10%5%8,14626.2%7,2477,1966,9156,8405,9845,7415,55914.3%5,26813.6%12.4%4,4046.8%4,1235.2%5.1%4.8%3.3%0%-3.9%-5%-10%-15%-8.2%-12.1%201920202021202220232024202520262027202820292030半導(dǎo)體市場(chǎng)規(guī)模細(xì)分根據(jù)世界半導(dǎo)體貿(mào)易統(tǒng)計(jì)組織（WSTS）數(shù)據(jù)，半導(dǎo)體細(xì)分領(lǐng)域，集成電路IC占比最高。9,0008,0007,0006,0005,0004,0003,0002,0001,00008,5618,1463366483196227,2477,1966,9156,8407332855632755586812695422585304855,9845,8012235275765,5591912234694105395,2691974383414343034,4041504323554,1231354044162382396,8456,5255,8365,8235,5685,5654,8834,8004,6302,0214,2843,6123,3342,0192,0202,0222,0232,0242,0252,0262,0272,0282,0292,030集成電路分立器件光電器件傳感器合計(jì)半導(dǎo)體-Design根據(jù)調(diào)研，2023年全球半導(dǎo)體Fabless市場(chǎng)規(guī)模為2036億美元，預(yù)計(jì)2030年將達(dá)到5469億美元。全球Fabless規(guī)模（億美元）增速6,0005,0004,0003,0002,0001,000040%35%30%25%20%15%10%5%5,4695,14033.9%33.5%4,28327.0%4,0373,8573,45320.0%15.2%2,58713.6%2,0361,9291,69820216.4%6.1%5.6%4.7%1,2681,1010%-3.4%-5%-10%20192020202220232024202520262027202820292030半導(dǎo)體-Fabless排名根據(jù)調(diào)研，2023年全球半導(dǎo)體Fabless3企業(yè)都分布在美國(guó)，其中英偉達(dá)占有全球超過20%的份額。2023Fabless收入（百2023Fabless收入（百萬(wàn)美排名企業(yè)名稱2023Fabless份額排名企業(yè)名稱2023Fabless份額萬(wàn)美元）元）英偉達(dá)高通博通奇景光電Semtech12345678949,16130,38228,18222,68013,8275,50824.14%14.92%13.84%6.79%2.71%1.76%1.58%1.52%1819202122232425269458698558358006396285985920.47%0.43%0.42%0.41%0.39%0.31%0.31%0.29%0.29%創(chuàng)意電子海光信息兆易創(chuàng)新慧榮科技北京君正瑞鼎科技匯頂科技AMD聯(lián)發(fā)科美滿電子聯(lián)詠科技新紫光集團(tuán)瑞昱半導(dǎo)體3,5883,2163,097韋爾股份MonolithicPowerSystems矽創(chuàng)電子Nordic102,4921,8211.22%0.89%27285455430.27%0.27%矽力杰復(fù)旦微電子世芯電子121314CirrusLogic,Inc.SocionextInc.樂爾幸半導(dǎo)體1,7891,5711,4280.88%0.77%0.70%2930315034644470.25%0.23%0.22%海思半導(dǎo)體Synaptics敦泰電子MegaChips15161,3901,2200.68%0.60%32334420.22%0.20%其他廠商17AllegroMicroSystems1,0490.52%3420,37110.00%半導(dǎo)體-制造半導(dǎo)體制造環(huán)節(jié)企業(yè)主要有兩大類：Foundry和IDM。根據(jù)調(diào)研，2023年全球純代工市場(chǎng)規(guī)模為億美元、IDM制造環(huán)節(jié)規(guī)模為1386億美元。預(yù)計(jì)2030年晶圓代工規(guī)模將達(dá)到2779億美元。6,0005,0004,0003,0002,0001,00005,0654,7964,2263,9813,8261,8142,2863,5171,7232,1711,9332,8051,4822,7841,4451,8532,5171,3862,3741,4091,9481,2201,7211,1232,7792,0302,6262,0292,2932,0282,1282,0272,0122,0261,7932,0251,3232,0221,3392,0241,1312,0239657285982,0192,0202,021FoundryIDM半導(dǎo)體-制造企業(yè)份額半導(dǎo)體制造環(huán)節(jié)企業(yè)主要有兩大類：Foundry和IDM。其中Foundry最大廠商為臺(tái)積電，2023年占全球54%；IDM最大企業(yè)主要分布在韓國(guó)、美國(guó)和歐洲。年全球晶圓代工企業(yè)份額6.03%年全I(xiàn)DM企業(yè)制造環(huán)節(jié)份額臺(tái)積電三星代工54.26%2023三星15.77%英特爾格羅方德SK海力士聯(lián)華電子UMC中芯國(guó)際6.10%5.12%美光7.95%德州儀器2.63%高塔半導(dǎo)體力積電1.26%1.27%意法半導(dǎo)體3.62%4.43%2.74%2.75%1.82%0.84%1.81%世界先進(jìn)VIS1.07%鎧俠華虹半導(dǎo)體上海華力微1.93%1.43%索尼英飛凌恩智浦0.80%東部高科0.72%晶合集成0.88%英特爾0.84%AnalogDevices,Inc.(ADI)瑞薩微芯Microchip0.37%芯聯(lián)集成0.55%穩(wěn)懋半導(dǎo)體0.43%安森美1.41%其他廠商5.55%其他廠商30.19%半導(dǎo)體-OSAT半導(dǎo)體封測(cè)環(huán)節(jié)企業(yè)主要有三大類：、IDM和Foundry。根據(jù)調(diào)研，2023年全球市場(chǎng)規(guī)模為377億美元，預(yù)計(jì)2030年將達(dá)到574億美元。全球市場(chǎng)規(guī)模（億美元）增速700600500400300200100025%20%15%10%5%22.98%57454648748846646012.33%4294134108.63%3777.82%3365.77%5.10%3124.66%3.85%0%-4.30%-5%-10%-15%-12.07%201920202021202220232024202520262027202820292030半導(dǎo)體-OSAT企業(yè)份額根據(jù)調(diào)研，2023年全球前15大廠商占有接近85%的市場(chǎng)份額，核心廠商主要分布在中國(guó)臺(tái)灣、美國(guó)、中國(guó)大陸、東南亞等地區(qū)。合肥頎中科技股份有限公司,0.6%其他廠商,15.9%UnisemGroup,0.8%甬矽電子,0.9%日月光,26.5%Semicon,0.9%Carsem,1.0%頎邦科技,1.7%南茂科技,1.8%京元電子,2.4%1.9%華天科技,4.1%安靠科技,17.2%力成科技,5.6%通富微電,7.8%長(zhǎng)電科技,10.9%半導(dǎo)體設(shè)備根據(jù)SEMI（國(guó)際半導(dǎo)體產(chǎn)業(yè)協(xié)會(huì)）數(shù)據(jù)，2023年全球半導(dǎo)體設(shè)備市場(chǎng)規(guī)模為1063億美元，預(yù)計(jì)2030年將達(dá)到1681億美元。此外，根據(jù)調(diào)研，全球半導(dǎo)體二手/翻新設(shè)備市場(chǎng)規(guī)模也非?？陀^，2023年全球大約為35億美元。全球半導(dǎo)體設(shè)備市場(chǎng)規(guī)模（億美元）增速1,8001,6001,4001,2001,00080050%40%30%20%10%0%1,6811,60210.50%202943.96%1,4501,3731,3361,2801,0991,0761,0631,02519.26%16.55%7125975.60%5.01%4.90%4.30%6003.40%2.80%-1.29%400-8.15%-10%-20%200020192020202120222023202420252026202720282030半導(dǎo)體設(shè)備-企業(yè)排名根據(jù)調(diào)研數(shù)據(jù)，2023年全球前45大半導(dǎo)體設(shè)備廠商占有大約97%的市場(chǎng)份額。排名1企業(yè)ASML應(yīng)用材料2023年半導(dǎo)體設(shè)備收入（百萬(wàn)美元）2023份額排名企業(yè)NuFlareInc.盛美上海2023年半導(dǎo)體設(shè)備收入（百萬(wàn)美元）2023份額0.51%0.49%0.47%0.35%0.35%0.30%0.26%0.22%0.22%0.18%0.16%0.16%0.15%0.12%0.10%0.05%19,69812,9978,9227,6202,9652,4582,3542,2061,9001,8191,5161,4411,2671,2481,21021.8%18.5%12.2%8.4%7.2%2.8%2.3%2.2%2.1%1.8%1.7%1.4%1.4%1.2%1.2%1.1%242526272829303132333435363738395445235003753713212752382371881721681591231087723東京電子4泛林半導(dǎo)體KLAProSystemsSCREENIPS拓荊科技華海清科567北方華創(chuàng)愛德萬(wàn)SUSSGroupTECHNO,Ltd.芯源微89ASMInternationalHitachi泰瑞達(dá)101213141516Eugene比思科集團(tuán)LasertecJusungEngineeringOxfordInstruments中科飛測(cè)DISCOCorporationCanonU.S.A.NikonPrecisionInc細(xì)美事至純科技TESCO.,1718Ebara1,0288841.0%0.8%4041SamcoInc.56560.05%0.05%AxcelisInc精測(cè)電子1920212223中微公司KokusaiElectric屹唐半導(dǎo)體OntoInnovation愛思強(qiáng)8828347926835750.8%0.8%0.7%0.6%0.5%4243444546Plasma-Therm弘塑科技漢辰科技天虹科技其他廠商55500.03%0.03%0.02%0.01%3.00%30283,186半導(dǎo)體二手設(shè)備-企業(yè)排名根據(jù)調(diào)研數(shù)據(jù)，2023年全球前50大半導(dǎo)體二手/翻新設(shè)備廠商占有大約95%的市場(chǎng)份額。排名企業(yè)名稱2023二手設(shè)備收入（百萬(wàn)美元）2023份額排名企業(yè)名稱2023二手設(shè)備收入（百萬(wàn)美元）2023份額12LamResearchAppliedMaterials,Inc.(AMAT)KLAProSystemsASML897.56458.80342.90341.49129.15115.0087.1180.6753.9152.6743.8342.8133.1032.6631.9831.7530.3229.4129.1527.7527.2125.9725.9125.2625.12%12.84%9.60%9.56%3.61%3.22%2.44%2.26%1.51%1.47%1.23%1.20%0.93%0.91%0.90%0.89%0.85%0.82%0.82%0.78%0.76%0.73%0.73%0.71%2627282930313233343536CanonU.S.A.MoovTechnologies,Inc.合肥開悅半導(dǎo)體嘉芯半導(dǎo)體21.2720.2719.7219.7219.4216.9615.7115.6015.5815.4915.1814.1414.0413.3313.2412.2411.8711.5211.3810.7810.4110.329.860.60%0.57%0.55%0.55%0.54%0.47%0.44%0.44%0.44%0.43%0.42%0.40%0.39%0.37%0.37%0.34%0.33%0.32%0.32%0.30%0.29%0.29%0.28%0.27%345CAEOnlineMaestechCo.,Ltd爭(zhēng)豐半導(dǎo)體6SurplusGLOBALNikon7上海微高精密寶虹科技8吉姆西半導(dǎo)體9KokusaiElectricIntelResaleCorporaton三井住友金融與租賃ASMInternational無(wú)錫卓?？萍糆-TechSolutionInc.亦亨電子101112131415161718192021222324Entrepix,Inc37AMTE(AdvancedMaterialsTechnology&Engineering)383940414243444546474849DISCOCorporationClassOneEquipmentCISCorporation江蘇大摩半導(dǎo)體PJPTECH上海圖雙精密MeidenshaCorporationSemicat,IncIchorSystemsTEL(TokyoElectronLtd.)HightecSystems盛吉盛EquipNet,Inc上海廣奕電子靖洋集團(tuán)RussellCo.,LtdAxcelisTechnologiesIncEbaraTechnologies,Inc.(ETI)江蘇晉譽(yù)達(dá)IntertecSalesCorp.AxusTechnologyAGSemiconductorServices(AGSS)ULVACTECHNO,Ltd.9.54MacquarieSemiconductorandTechnology2523.060.65%50SCREENSPEGermanyGmbH9.120.26%半導(dǎo)體材料根據(jù)SEMI數(shù)據(jù)，2023年全球半導(dǎo)體材料市場(chǎng)規(guī)模為667億美元，預(yù)計(jì)2030年將達(dá)到1022億美元。其中晶圓制造材料占比62%、封裝材料占比38%。1,2001,00080060040020001,022971860334853330821321803312398727280379703275667252643239555205520192623592523526492500447429415404350328201920202021202220232024202520262027202820292030晶圓制造材料封裝材料合計(jì)半導(dǎo)體材料-細(xì)分如下是三個(gè)代表性的半導(dǎo)體材料，根據(jù)調(diào)研，全球范圍內(nèi)企業(yè)排名如下：2023全球半導(dǎo)體硅片市場(chǎng)排名全球CMP拋光液與拋光墊排名2023全球半導(dǎo)體光刻膠企業(yè)排名2023DuPont26.23%21.10%信越半導(dǎo)體23.81%18.98%東京應(yīng)化TOK信越化學(xué)Shin-EtsuJSR23.28%19.35%17.12%英特格(CMCMaterials)FujimiIncorporatedResonac日立化成安集科技8.97%6.82%5.13%SUMCO環(huán)球晶圓13.02%9.89%9.28%6.14%2.82%DuPont12.59%12.40%MerckKGaA(VersumMaterials)富士膠片F(xiàn)ujifilmJSRCorporationAGC4.54%4.12%3.57%2.46%2.35%2.22%1.78%1.62%1.35%1.27%0.90%Siltronic世創(chuàng)SKSiltron富士膠片F(xiàn)ujifilm東進(jìn)世美肯住友化學(xué)3.68%2.87%Soitec鼎龍控股KCTech彤程新材1.10%2.88%臺(tái)塑勝高科技中環(huán)領(lǐng)先MerckKGaA(AZ)Soulbrain富士紡Fujibo智勝科技IVT晶瑞電材0.30%2.77%2.64%2.40%1.90%1.27%0.76%0.51%0.51%SKMaterials徐州博康0.60%杭州中欣晶圓滬硅產(chǎn)業(yè)SKC(SKEnpulse)圣戈班0.55%0.52%YCCHEMCo.,Ltd東進(jìn)世美肯0.58%恒坤新材料0.30%Futurrex0.29%合晶集團(tuán)公司立昂微（金瑞泓）上海超硅半導(dǎo)體北京奕斯偉科技普興電子TOPPANINFOMEDIA0.55%KPXChemical0.46%TWIIncorporated0.38%英格斯Engis0.31%3M0.27%KemLab?Inc0.24%永光0.18%AllresistGmbH0.14%江蘇艾森半導(dǎo)體0.07%捷斯奧集團(tuán)0.24%FNSTECH0.23%AceNanochem0.19%Vibrantz(Ferro)0.17%江豐電子0.12%上海新陽(yáng)半導(dǎo)體珠?；?.02%飛凱材料0.02%有研硅0.37%0.02%麥斯克0.32%浙江中晶科技0.16%國(guó)盛電子0.15%新安納電子0.09%天津海倫晶片0.04%北京航天賽德0.04%川研科技0.02%國(guó)科天驥0.02%容大感光0.00%北京欣奕華0.01%江蘇南大光電0.04%昂士特科技0.01%其他廠商2.31%其他廠商1.92%其他廠商1.41%半導(dǎo)體設(shè)備零部件根據(jù)數(shù)據(jù)，2023年全球半導(dǎo)體設(shè)備零部件市場(chǎng)規(guī)模為286億美元，預(yù)計(jì)2030年將達(dá)到472億美元。核心廠商主要分布在美國(guó)、歐洲和日本。全球前60大廠商占有大約80%的市場(chǎng)份額。排名企業(yè)名稱2023零部件收入（百萬(wàn)美元）2023份額排名企業(yè)名稱2023零部件收入（百萬(wàn)美元）2023份額12345678ZEISSEntegris2,7281,6421,4811,4711,1491,0169058267757677357075935585415325285214814203552932692472282282152091931809.52%5.73%5.17%5.13%4.01%3.55%3.16%2.88%2.71%2.67%2.57%2.47%2.07%1.95%1.89%1.86%1.84%1.82%1.68%1.46%1.24%1.02%0.94%0.86%0.80%0.80%0.75%0.73%0.67%0.63%313233343536373839404142434445464748495051525354555657585960GST(GlobalStandarardTechnology)FoxsemiconIntegratedTechnologyCSK169.33160.62159.32157.30151.04150.98149.47144.97143.00121.13120.30119.88118.73117.17116.04111.99110.40107.84107.3697.900.59%0.56%0.56%0.55%0.53%0.53%0.52%0.51%0.50%0.42%0.42%0.42%0.41%0.41%0.40%0.39%0.39%0.38%0.37%0.34%0.32%0.31%0.31%0.29%0.29%0.27%0.23%0.22%0.19%0.18%MKSInstrumentsAtlasCopco(Leybold,andEdwardsVacuum)TrumpfPfeifferVacuumGmbHDAIHENCorporationWatlow(CRC)UltraCleanHoldingsInc.(UCT)NGKInsulatorsVATVakuumventileASMLIchorSystemsAppliedMaterials,Inc.(AMAT)AdvancedEnergyBrooksAutomationKyoceraShin-EtsuPolymerTOTOAdvancedCeramicsAdvancedThermalSciencesCorporation(ATS)MorganAdvancedMaterialsSMCCorporationSevenstar9101112131415161718192021222324252627282930MiraialCo.,Ltd.UnisemShinwaControlsHORIBAEbaraCorporationRORZECorporationLamResearchFerrotecSwagelokMiCoCeramicsCo.,Ltd.YaskawaSchunkXycarbTechnologyKuzeTosohQuartzCorporationLOTVacuumPallFujikinCamfil91.7088.2987.4383.4482.7476.9465.9362.69KawasakiRoboticsParkerCoorstekNiterraCo.,Ltd.CKDHirataCorporationJELCorporationSHINKODockweilerDurexIndustriesKITZSCTKashiyamaIndustriesXPPower(Comdel)NipponSeisenGEMüHandyTube53.8851.88半導(dǎo)體零部件/服務(wù)-細(xì)分如下是三個(gè)代表性的半導(dǎo)體零部件/服務(wù)，根據(jù)調(diào)研，全球范圍內(nèi)企業(yè)排名如下：2023全球半導(dǎo)體設(shè)備用陶瓷排名年全球半導(dǎo)體熔射服務(wù)企業(yè)排名2023全球半導(dǎo)體Showhead排名2023NGKInsulatorsKyocera23.73%21.33%TOCALOKoMiCoUCT15.4%14.2%13.9%Lam(Silfex)57.40%HanaMaterialsAppliedMaterialsWorldexIndustryFitiGroup9.96%5.50%2.83%1.99%1.96%1.78%1.56%CoorstekNiterraCo.,Ltd.Ferrotec11.94%8.69%5.40%EnproIndustriesCinos6.5%6.3%MitsubishiMaterialsHahn&CompanyTokaiCarbonMorganAdvancedMaterialsTOTOAdvancedCeramicsMiCoCeramics珂瑪材料5.09%4.10%4.03%PentagonTechnologiesMitsubishiChemical(Cleanpart)FrontkenCorporationBerhadHansolIONESOerlikonBalzersDFtech3.3%3.2%3.0%CoorsTek1.47%RSTechnologies1.25%VERSACONNCORP(VCC)1.17%DSTechno1.09%1.85%KrosakiHarimaCeramTec1.60%0.91%0.89%0.73%0.58%2.3%KCParts0.97%2.1%1.7%1.6%1.6%1.4%1.4%1.4%1.3%1.1%1.1%1.1%1.1%1.0%AGCNHKSpring0.75%上海卡貝尼OneSemicon0.71%SchunkXycarbTechnologyTechnoQuartz0.67%先鋒精密0.