PCB各層含義(protel)

1、PCB各層含義(protel1 Signal layer(信號層信號層主要用于布置電路板上的導(dǎo)線.Protel 99 SE提供了32個信號層,包括Top layer(頂層,Bottom layer(底層和30個MidLayer(中間層.2 Internal plane layer(內(nèi)部電源/接地層Protel 99 SE提供了16個內(nèi)部電源層/接地層.該類型的層僅用于多層板,主要用于布置電源線和接地線.我們稱雙層板,四層板,六層板,一般指信號層和內(nèi)部電源/接地層的數(shù)目.3 Mechanical layer(機(jī)械層4 Solder mask layer(阻焊層在焊盤以外的各部位涂覆一層涂料,如防

2、焊漆,用于阻止這些部位上錫.阻焊層用于在設(shè)計(jì)過程中匹配焊盤,是自動產(chǎn)生的.Protel 99 SE提供了Top Solder(頂層和Bottom Solder(底層兩個阻焊層.5 Paste mask layer(錫膏防護(hù)層它和阻焊層的作用相似,不同的是在機(jī)器焊接時對應(yīng)的表面粘貼式元件的焊盤.Protel 99 SE 提供了Top Paste(頂層和Bottom Paste(底層兩個錫膏防護(hù)層.6 Keep out layer(禁止布線層用于定義在電路板上能夠有效放置元件和布線的區(qū)域.在該層繪制一個封閉區(qū)域作為布線有效區(qū),在該區(qū)域外是不能自動布局和布線的.7 Silkscreen layer(

3、絲印層絲印層主要用于放置印制信息,如元件的輪廓和標(biāo)注,各種注釋字符等.Protel 99 SE提供了Top Overlay和Bottom Overlay兩個絲印層.一般,各種標(biāo)注字符都在頂層絲印層,底層絲印層可關(guān)閉.8 Multi layer(多層電路板上焊盤和穿透式過孔要穿透整個電路板,與不同的導(dǎo)電圖形層建立電氣連接關(guān)系,因此系統(tǒng)專門設(shè)置了一個抽象的層,多層.一般,焊盤與過孔都要設(shè)置在多層上,如果關(guān)閉此層,焊盤與過孔就無法顯示出來.9 Drill layer(鉆孔層鉆孔層提供電路板制造過程中的鉆孔信息(如焊盤,過孔就需要鉆孔.Protel 99 SE提供了Drill gride(鉆孔指示圖和

4、Drill drawing(鉆孔圖兩個鉆孔層.相應(yīng)的在eagle中也有很多的層(常用的用綠色標(biāo)記In Layout and Package Editor1 Top Tracks, top side2 Route2 Inner layer (signal or supply3 Route3 Inner layer (signal or supply4 Route4 Inner layer (signal or supply5 Route5 Inner layer (signal or supply6 Route6 Inner layer (signal or supply7 Route7 Inn

5、er layer (signal or supply8 Route8 Inner layer (signal or supply9 Route9 Inner layer (signal or supply10 Route10 Inner layer (signal or supply11 Route11 Inner layer (signal or supply12 Route12 Inner layer (signal or supply13 Route13 Inner layer (signal or supply14 Route14 Inner layer (signal or supp

6、ly15 Route15 Inner layer (signal or supply16 Bottom Tracks, bottom side17 Pads Pads (through-hole元件的引腳(過孔型,貼片引腳算在頂層和底層上18 Vias Vias (through all layers過孔19 Unrouted Airlines (rubber bands20 Dimension Board outlines (circles for holes *板子外形,相當(dāng)于機(jī)械層21 tPlace Silk screen, top side絲印層22 bPlace Silk scree

7、n, bottom side絲印層23 tOrigins Origins, top side (generated autom.元件中間有個十字叉,代表元件位置24 bOrigins Origins, bottom side (generated autom.25 tNames Service print, top side (component NAME26 bNames Service print, bottom s. (component NAME27 tValues Component V ALUE, top side28 bV alues Component V ALUE, bott

8、om side2128制版時可全部放在絲印層29 tStop Solder stop mask, top side (gen. autom.30 bStop Solder stop mask, bottom side (gen. Autom.31 tCream Solder cream, top side32 bCream Solder cream, bottom side33 tFinish Finish, top side34 bFinish Finish, bottom side35 tGlue Glue mask, top side36 bGlue Glue mask, bottom

9、side37 tTest Test and adjustment information, top side38 bTest Test and adjustment inf., bottom side39 tKeepout Restricted areas for components, top side40 bKeepout Restricted areas for components, bottom s.41 tRestrict Restricted areas for copper, top side42 bRestrict Restricted areas for copper, bottom side43 vRestrict Restricted areas for vias44 Drills Conducting through-holes45 Holes Non-conducting holes46 Milling Mil