機(jī)電與自動(dòng)化專業(yè)STM32簡(jiǎn)介(Introduction-of-STM32)文外文文獻(xiàn)翻譯及原文

畢業(yè)設(shè)計(jì)/論文外文文獻(xiàn)翻譯畢業(yè)設(shè)計(jì)/論文外文文獻(xiàn)翻譯要求：（此頁(yè)打印在封面反面）1．外文文獻(xiàn)翻譯的內(nèi)容應(yīng)與畢業(yè)設(shè)計(jì)/論文課題相關(guān)。2．外文文獻(xiàn)翻譯的字?jǐn)?shù)：非英語(yǔ)專業(yè)學(xué)生應(yīng)完成與畢業(yè)設(shè)計(jì)/論文課題內(nèi)容相關(guān)的不少于2000漢字的外文文獻(xiàn)翻譯任務(wù)（其中，漢語(yǔ)言文學(xué)專業(yè)、藝術(shù)類專業(yè)不作要求），英語(yǔ)專業(yè)學(xué)生應(yīng)完成不少于2000漢字的二外文獻(xiàn)翻譯任務(wù)。格式按《華中科技大學(xué)武昌分校本科畢業(yè)設(shè)計(jì)/論文撰寫規(guī)范》的要求撰寫。3．外文文獻(xiàn)翻譯附于開題報(bào)告之后：第一部分為譯文，第二部分為外文文獻(xiàn)原文，譯文與原文均需單獨(dú)編制頁(yè)碼（底端居中）并注明出處。本附件為封面，封面上不得出現(xiàn)頁(yè)碼。4．外文文獻(xiàn)翻譯原文由指導(dǎo)教師指定，同一指導(dǎo)教師指導(dǎo)的學(xué)生不得選用相同的外文原文。A.IntroductionofSTM32STM32isbasedonthefamilyofARMCortex-M3core-designedspecificallyforembeddedapplicationsthatrequirehighperformance,lowcost,lowpowerconsumption.Theperformanceisdividedintotwodifferentseries:STM32F103the"Enhanced"seriesandSTM32F101the"Basic"series.TheclockfrequencyofEnhancedSeriesisupto72MHz,thehighestperformanceofsimilarproducts;theclockfrequencyofBasicSeriesis36MHz,andthepricesof16positionproductssignificantlyenhancetheperformanceofmorethan16positionproducts,isthebestchoiceuserstobuythem.Thetwoseriesarebuilt-inflashfrom32Kto128K,isthecombinationofthemaximumcapacityoftheSRAMandperipheralinterfaces.Whentheclockfrequencyreaches72MHz,itexecutesfromFlashandtheSTM32powerconsumptionis36mA,thelowestpowerconsumptioninthe32-bitmarketproducts,theequivalentanimpressive0.5mA/MHz.a.STMicroelectronicsGroupSTMicroelectronicsGroupwasestablishedinJune1987,isamergerofItaly'sSGSMicroelectronicsandtheFrenchThomsonsemiconductorcompany.InMay1998,SGS-THOMSONMicroelectronicswillchangethecompanynametoSTMicroelectronicsLimited.STMicroelectronicsisoneofthelargestsemiconductorcompaniesintheworld.Fromitsinceptiontodate,ST'sgrowingfasterthantheoverallrateofgrowthofthesemiconductorindustry.Since1999,SThasalwaysbeenoneoftheworld'stoptensemiconductorcompanies.Accordingtothelatestindustrystatistics,STMicroelectronicsistheworld'sfifthlargestsemiconductormanufacturerandaworldleaderinmanymarkets.Forexample,STMicroelectronicsistheworld'slargestdedicatedanalogchipsandpowerconversionchipmanufacturers,theworld'slargestindustrialsemiconductorandset-topboxchipsuppliersanddiscretedevices,mobilephonecameramoduleandcarfieldofintegratedcircuitshighestintheworld.STMicroelectronicshastheentiregroupemploysnearly50,000,with16state-of-the-artR&Dinstitutionsand39designandapplicationcenters,15mainmanufacturingplant,andhas78salesofficesin36countries.ThecompanyisheadquarteredinGeneva,Switzerland,isalsotheheadquartersofEuropeanandemergingmarkets;company'sU.S.headquartersinDallas,Texas,Carrollton;Asia-PacificheadquartersinSingapore;businessinJapanbyTokyoasaheadquarters;GreaterChinaheadquartersinShanghai,responsibleforbusinessinHongKong,mainlandChinaandTaiwan.December8,1994forthefirsttimesincethecompletionofthepublicofferingofshares,STMicroelectronicshasbeeninNewYorkStockExchange(tickersymbol:STM)andPanOuBaliStockExchangelisted,inJune1998,inMilan,Italy,securitiesExchange.STMicroelectronicshasnearly900millionsharesinthepublicofferingofshares,ofwhichapproximately71.1%ofthesharesarepubliclytradedonthevariousstockexchanges.Another27.5%ofthestockbySTMicroelectronicsHoldingIIBVLimitedhelditsshareholdersFinmeccanicaandCDPItalianFinmeccanicaconsortiumArevaandFranceTelecom,theFrenchconsortium;remaining1.4%oftreasurysharesbySTMicroelectronicshold.b.STultra-low-powerARM?Cortex?-M3microcontroller STM32Lseriesofproductsarebasedontheultra-low-powerARMCortex-M3processorcore,STMicroelectronicstwouniqueenergy-savingtechnologies:130nmdedicatedlow-leakagecurrentmanufacturingprocessandoptimizeenergy-savingarchitecturetodeliverindustry-leadingenergy-savingperformance.Thisseriesbelongstothelineup32STMicroelectronicsSTM32microcontrollerproductfamily,theproductfamily,atotalof180balanceofproduct,thefullrangeofproductssharemostofthepin,softwareandperipherals,excellentcompatibilitywithdeveloperstothemaximumdesignflexibility.c.STultra-low-powerARM?Cortex?-M0microcontrollerSTM32F0seriesofproductsarebasedontheultra-low-powerARMCortex-M0processorcoretechnologyandfeatures,enhancedintegration,aimedattheapplicationofultra-low-costbudget.Thefamilyofmicrocontrollerstoshortenthe8-bitand16-bitmicro-controllerdevicesandtheperformancegapbetweenthe32-bitmicrocontrollerdevice,theuserterminalproductsintheeconomytoachievestate-of-the-artcomplexfeatures.d.ProductsBeforeSTM32F105andSTM32F107interconnectfamilyofmicrocontrollers,STMicroelectronicshasintroducedtheSTM32AccessLineEnhancedSeries,theseriesoftheUSBbasicseriesandenhanced;newproductsfollowtheEnhancedSeries72MHzprocessingfrequency.Memory64KBto256KBFlashand20KBto64KBembeddedSRAM.TheLQFP64,LQFP100,andLFBGA100threepackageinthenewseries,adifferentpackagetomaintainthepinoutconsistency,combinedwiththeSTM32platformdesignphilosophy,anddevelopersbyselectingtheproductscanbere-optimizationfunction,memory,performanceandpincount,withaminimumofhardwarechangestomeetindividualapplicationneeds.UntilJuly1,2010,thecirculationofmodels:Basic:STM32F101R6STM32F101C8STM32F101R8STM32F101V8STM32F101RBSTM32F101VBEnhanced:STM32F103C8STM32F103R8STM32F103V8STM32F103RBSTM32F103VBSTM32F103VESTM32F103ZESTM32modelsDescription:STM32F103RBT6chipmodel,forexample,thecompositionsofthemodelsofsevenparts,itsnamingrulesareasfollows:(1)STM32:STM32ARMCortex-M3representskernelof32-bitmicrocontrollers.(2)F:Frepresentsthechipsub-series.(3)103:103representativesEnhancedSeries.(4)R:RThisisarepresentativeofthenumberofpins,whereTrepresents36feet,48feet,Crepresents,Rrepresentsa64feet,Vrepresentsthe100-pin144-pin,Zrepresents.(5)B:BarepresentativeofembeddedFlashcapacity,including6onbehalfof32KbytesofFlash,8onbehalfof64KbytesFlash,384KbytesFlashBonbehalfof128KbytesFlash,Conbehalfof256KbytesFlash,DrepresentativesEonbehalfof512KbytesFlash.(6)T:Tarepresentativeofthepackage,inwhichHrepresentsBGApackage,TrepresentsLQFPpackage,UrepresentsVFQFPNpackage.(7)6:6Thisisarepresentativeoftheoperatingtemperaturerange,where6represents-40-85℃,7onbehalfof-40-105℃.e.STM32F103performancecharacteristicsFeature1.Thekernel:ARM32-bitCortex-M3CPU,themaximumoperatingfrequencyof72MHz,1.25DMIPS/MHz.Single-cyclemultiplyandhardwaredivision.2.Memory:integratedon-chip32-512KBofFlashmemoryand6-64KBSRAMmemory.3.Clockresetandpowermanagement:2.0-3.6VdrivevoltageofthepowersupplyandI/Ointerface,POR,PDRandprogrammablevoltagedetector(PVD),4-16MHzcrystaloscillator,embedded8MHzRCoscillatortuningcircuitinthefactory,40kHzinternalRCoscillatorcircuit.FortheCPUclockPLL.WiththecalibrationfortheRTC32kHzcrystal.4.Lowpowerconsumption:threekindsoflow-powermodes:Sleep,stop,standbymode.PoweredtheVBATRTCandbackupregisters.5.Debugmode:serialdebug(SWD)andJTAGinterfaces.6.DMA:12-channelDMAcontroller;supportedperipherals:timers,ADC,DAC,SPI,IICandUSART.7.212usclassA/Dconverter(16-channel):A/Dmeasurementrange:0-3.6V.Dualsampleandholdcapability.Thechipintegratesatemperaturesensor.8.2-channel12-bitD/Aconverter:STM32F103xCSTM32F103xDSTM32F103xEunique.9.Amaximumofupto112fastI/Oports:Dependingonthemodel,26,37,51,80,and112I/Oports,allportscanbemappedtothe16externalinterruptvector.Inadditiontotheanaloginputcanacceptlessthan5Vinput.10.Amaximumofupto11timers:four16-bittimers,eachtimer4IC/OC/PWMorpulsecounter.Two16-channeladvancedcontroltimer:upto6channelsforPWMoutput.2watchdogtimers(independentwatchdogandwindowwatchdog).Systicktimer:24-bitdowncounter.Two16-bitbasictimerisusedtodrivetheDAC.11.Amaximumofupto13communicationinterfaces:twoIICinterface(SMBus/PMBus),5USARTinterface(ISO7816interface,LIN,IrDAcompatible,thedebuggingcontrol),ThreeSPIinterface(18Mbit/s),twoandIISreuse,CANinterface(2.0B),USB2.0full-speedinterface,SDIOinterface.12.ECOPACKpackage:STM32F103xxfamilyofmicrocontrollersECOPACKpackage.Systemrole1.IntegratedembeddedFlashandSRAMmemory,ARMCortex-M3core.Andcomparedtothe8/16devices,theARMCortex-M332-bitRISCprocessorprovidesahigherefficiencyofthecode.TheSTM32F103xxmicrocontrollerwithanembeddedARMcore,socanbecompatiblewithallARMtoolsandsoftware.2.EmbeddedFlashmemoryandRAMmemory:built-upto512KBembeddedFlash,canbeusedtostoreprogramsanddata.Upto64KBofembeddedSRAMcanreadandwritetotheclockspeedoftheCPU(notwaitstate).3.Avariablestaticmemory(FSMC):FSMCembeddedinSTM32F103xC,STM32F103xD,STM32F103xE,withfourchipselectsupportfourmodes:Flash,RAM,PSRAM,NORandNAND.AfterORafterthreeFSMCinterruptlinesconnectedtotheNVIC.Noread/writeFIFOPCCARDoutside,thecodeisexecutedfromtheexternalmemory,anddoesnotsupporttheBoottooktargetfrequencyequaltoSYSCLK/2Therefore,whenthesystemclockis72MHz,externalaccess,accordingto36MHz.4.Nestedvectorinterruptcontroller(NVIC):canhandle43maskableinterruptchannels(notincludingthe16interruptlinesofCortex-M3),provides16interruptpriority.TightlycoupledNVIClowerinterruptprocessingdelaydirectlypassedtothekernelinterruptentryvectortableaddress,tightlycoupledtheNVICkernelinterface,allowsinterruptstobeanticipated,afterthehigher-priorityinterrupthandlingsupporttailchain,automaticallysavethestateoftheprocessor,interruptentryautomaticallyresumewhentheinterruptexit,noinstructionintervention.5.Theexternalinterrupt/eventcontroller(EXTI):Externalinterrupt/eventcontrollerfor19togenerateaninterrupt/eventrequestedgedetectorlines.Eachlinecanbeindividuallyconfiguredtoselectthetriggerevent(risingedge,fallingedge,orboth),canalsobeindividuallyshielded,apendingregistertomaintainthestateoftheinterruptrequest.WhentheexternallineappearlongerthaninternalAPB2clockcyclepulse,EXTIisabletodetect.Upto112GPIOconnectedtothe16externalinterruptlines.6.Clockandstart:startorsystemclockselection,butresetwhentheinternal8MHzcrystalwasselectedastheCPUclock.Canselectoneof4-16MHzexternalclock,andwillbemonitoredtodeterminewhethersuccessful.Duringthisperiod,thecontrollerisdisabledandthesoftwareinterruptmanagementsubsequentlyalsobeprohibited.Atthesametime,ifthereisaneed(forexample,encounteredanindirectuseofcrystalfailed),PLLclockinterruptmanagementfullyavailable.Multiplepre-comparatorcanbeusedtoconfiguretheAHBfrequency,includinghigh-speedAPB(PB2)andlow-speedAPB(APB1),high-speedAPBhighestfrequencyof72MHz,low-speedAPBhighestfrequencyof36MHz.7.Bootmode:startup,BootpinisusedtoselectoneofthreekindsBootOptionskinds:ImportfromuserFlashmemoryfromthesystemimport,importfromSRAM.TheBootimportprogramislocatedinthesystemmemoryforFlashMemoryProgrammingbyUSART1re.8.Powersupplyprogram:VDDvoltagerangeof2.0V-3.6V,VDDpinprovidesanexternalpowersupplythrough,forI/Oandinternalregulator.VSSAandVDDA,voltagerangeof2.0-3.6V,externalanalogvoltageinputfortheADCresetmodule,RCandPLLVDDrange(ADCislimitedto2.4V);VSSAandVDDAmustbecorrespondingconnectiontoVSSandVDD.VBAT,thevoltagerangeof1.8-3.6V,VDDinvalidforRTC,external32KHzcrystaloscillatorandbackupregisterspowersupply(viathepowerswitchtoachieve).9.Powermanagement:Thedevicehasapower-onreset(POR)circuitandpower-downreset(PDR).Thiscircuithasbeenusedtoensurethatthenecessaryoperatingfrom2Vstartsfellto2V.WhenVDDdropsbelowaspecificlowerlimitVPOR/PDR,withouttheneedforanexternalresetcircuit,thedevicecanalsobeheldinresetmode.Equipmentspecifictoanembeddedprogrammablevoltagedetector(PVD)PVDfordetectingVDDcompareandVPVDlimit,willgenerateaninterruptwhenVDDtolowerthanVPVDorVDDgreaterthanVPVD.InterruptserviceroutinecangenerateawarningmessageorMCUwillbesettoasafestate.PVDisenabledbysoftware.10.Voltageregulator:Theregulatorhasthreeoperationmodes:main(MR),lowpower(LPR)andpower-down.MRusedinthetraditionalsenseoftheadjustmentmode(operatingmode),LPRisusedinthestopmode,powerdowninstandbymode:regulatoroutputishighimpedance,thecorecircuitpower-down;includingzeroconsumption(thecontentsoftheregistersandSRAMwillbelost).11.Thelow-powermode:STM32F103xxsupportthreekindsoflow-powermode,soastoachievethebestbalancebetweenlow-power,shortstart-uptimeandwake-upsourceavailable.Sleepmode:onlytheCPUstopsworking,allperipheralscontinuetorun,wakeuptheCPUinterrupt/eventoccurs;Stopmode:allowskeepingthecontentsoftheSRAMandregisteringwithminimalpowerconsumption.The1.8Vregionsoftheclockarestopped,thePLL,theHSIandtheHSERCoscillatorsaredisabled,andtheregulatorissettonormalorlow-powermode.Thedevicecanwake-upfromstopmodebyexternalinterruptlines.Theexternalinterruptsourcescanmakeoneofthe16externalinterruptlines,PVDoutputorTRCwarning.Standbymode:thepursuitofminimumpowerconsumption,theinternalvoltageregulatoristurnedoff,so1.8Vregionalpoweroutage.PLL,HSIandtheHSERCoscillatorsarealsoclosed.Enterstandbymode,inadditiontobackupregisterandStandbycircuit,SRAMandregistercontentswillbelost.Whenanexternalreset(NRSTpin),theIWDG,reset,WKUPpinarisingedgeorTRCwarningoccurs,thedeviceoutofstandbymode.Entersthestopmodeorstandbymode,TRC,IWDGclocksourcedoesnotstop.f.ArchitecturaladvantagesInadditiontothenewfeaturesenhancedperipheralinterface,STM32interconnectionseriesalsoprovidethesamestandardinterfacewithotherSTM32microcontrollersharedthisperipheralenhanceapplicationflexibilityoftheentireproductfamily,sothatdeveloperscanmultipledesignstorepeateduseofthesamesoftware.NewSTM32standardperipheralsinclude10timers,two12-Msample/sanalog-to-digitalconverter(Interleaved2-Msample/smode),two12-bitdigital-to-analogconverters,twoI2CinterfacefivetheUSARTinterfaceandthreeSPIports.Atotalof12newproductsperipheralDMAchannels,thereisaCRCcalculationunit,likeotherSTM32microcontrollersupports96uniqueidentificationnumber.ThenewfamilyofmicrocontrollersalsohasfollowedtheSTM32productfamilyoflow-voltageandenergy-savingadvantages.Theoperatingvoltagerangeof2.0Vto3.6V,compatiblewithmainstreambatterytechnology,suchaslithiumbatteriesandnickel-metalhydridebatteries,thepackagealsofeaturesabatterymodededicatedpinVbat.72MHzfrequencycodeexecutionfromflashconsumesonly27mAofcurrent.Low-powermode,therearefour;thecurrentconsumptioncanbereducedtotwomicroamps.Faststartfromthelow-powermodetosaveenergy;startcircuitSTM32internallygenerated8MHzsignaltowakeupthemicrocontrollerfromstopmodewithlessthan6microseconds.一、STM32簡(jiǎn)介STM32系列是為要求高性能、低成本、低功耗的嵌入式應(yīng)用專門設(shè)計(jì)的ARMCortex-M3內(nèi)核。按性能分成兩個(gè)不同的系列：“增強(qiáng)型”STM32F103系列和STM32F101“基本型”STM32F101系列。增強(qiáng)型系列時(shí)鐘頻率達(dá)到72MHz，是同類產(chǎn)品中頻率最高的產(chǎn)品；基本型時(shí)鐘頻率為36MHz，以跟16位產(chǎn)品一樣的價(jià)格得到比16位產(chǎn)品更大的性能，是16位產(chǎn)品的最佳選擇。兩個(gè)系列都內(nèi)置32K到128K的閃存，不同的是SRAM的最大容量和外設(shè)接口的組合。時(shí)鐘頻率為72MHz時(shí)，從閃存執(zhí)行代碼來(lái)看，STM32功耗36mA，是32位市場(chǎng)上功耗最低的產(chǎn)品，相當(dāng)于0.5mA/MHz。(一)意法半導(dǎo)體1987年6月意法半導(dǎo)體公司成立，是由意大利的SGS微電子公司和法國(guó)Thomson半導(dǎo)體公司合并而成。1998年5月，SGS-THOMSONMicroelectronics將公司名字改為意法半導(dǎo)體有限公司。意法半導(dǎo)體公司是世界最大的半導(dǎo)體公司之一。從成立至今，ST的增長(zhǎng)速度超過(guò)了半導(dǎo)體工業(yè)整體增長(zhǎng)的速度。從1999年起，ST一直是世界十大半導(dǎo)體公司之一。根據(jù)最新的工業(yè)統(tǒng)計(jì)數(shù)據(jù)，意法半導(dǎo)體是全球第五大半導(dǎo)體廠商并且在很多市場(chǎng)居世界領(lǐng)先水平。例如，意法半導(dǎo)體是世界最的大模擬芯片和電源轉(zhuǎn)換芯片的制造商，也是世界第一大工業(yè)半導(dǎo)體和機(jī)頂盒芯片供應(yīng)商，而且在分立器件、手機(jī)相機(jī)模塊和車用集成電路一直領(lǐng)域居世界前列。意法半導(dǎo)體集團(tuán)共有員工近50000名，擁有16個(gè)先進(jìn)的研發(fā)機(jī)構(gòu)、39個(gè)設(shè)計(jì)和應(yīng)用中心、15主要制造工廠，并在36個(gè)國(guó)家設(shè)有78個(gè)銷售辦事處。公司總部設(shè)在瑞士日內(nèi)瓦，也是歐洲和新興市場(chǎng)的總部；公司的美國(guó)總部設(shè)在德克薩斯州達(dá)拉斯市的卡羅頓；亞太區(qū)總部設(shè)在新加坡；日本的業(yè)務(wù)則以東京為總部；大中國(guó)區(qū)總部設(shè)在上海，主要負(fù)責(zé)香港、大陸和臺(tái)灣三個(gè)地區(qū)的業(yè)務(wù)。1994年12月8日首次公開發(fā)行股票以來(lái)，意法半導(dǎo)體已經(jīng)在紐約證券交易所和泛歐巴黎證券交易所掛牌上市，1998年6月，又在意大利米蘭證券交易所上市。意法半導(dǎo)體擁有大約9億股公開發(fā)行股票，有大約71.1%的股票是在證券交易所公開交易的。另外大約有27.5%的股票由意法半導(dǎo)體控股有限公司持有，其股東為Finmeccanica和CDP組成的意大利Finmeccanica財(cái)團(tuán)和Areva及法國(guó)電信組成的法國(guó)財(cái)團(tuán)；剩余1.4%的庫(kù)藏股由意法半導(dǎo)體公司持有。(二)ST超低功耗ARMCortex-M0微控制器STM32F0系列產(chǎn)品基于超低功耗的ARMCortex-M0處理器內(nèi)核，整合增強(qiáng)的技術(shù)和功能，瞄準(zhǔn)超低成本預(yù)算的應(yīng)用。該系列微控制器縮短了采用8位和16位微控制器的設(shè)備與采用32位微控制器的設(shè)備之間的性能差距，能夠在經(jīng)濟(jì)型用戶終端產(chǎn)品上實(shí)現(xiàn)先進(jìn)且復(fù)雜的功能。(三)ST超低功耗ARMCortex-M3微控制器STM32L系列產(chǎn)品基于超低功耗的ARMCortex-M3處理器內(nèi)核，采用意法半導(dǎo)體特有的兩大節(jié)能技術(shù)：130nm專用低泄漏電流制造工藝和優(yōu)化的節(jié)能架構(gòu)，提供了業(yè)界領(lǐng)先的節(jié)能性能。該系列屬于意法半導(dǎo)體陣容強(qiáng)大的32位STM32微控制器產(chǎn)品家族，目前該產(chǎn)品家族共有180余款產(chǎn)品，全系列產(chǎn)品共用大部分引腳、軟件和外設(shè)，優(yōu)異的兼容性為開發(fā)人員帶來(lái)最大的設(shè)計(jì)靈活性。(四)產(chǎn)品介紹在STM32F105和STM32F1系列微控制器之前，意法半導(dǎo)體已經(jīng)推出STM32基本型、增強(qiáng)型、USB基本型系列和增強(qiáng)型系列；新系列產(chǎn)品沿用增強(qiáng)型系列的72MHz處理頻率。內(nèi)存包括64KB到256KB閃存和20KB到64KB嵌入式SRAM。新系列采用LQFP64、LQFP100和LFBGA100三種封裝，不同的封裝保持引腳排列的一致，結(jié)合STM32平臺(tái)的設(shè)計(jì)理念，開發(fā)人員通過(guò)選擇產(chǎn)品可重新優(yōu)化功能、存儲(chǔ)器、性能和引腳數(shù)量，以最小的硬件變化來(lái)滿足個(gè)性化的應(yīng)用需求。至2010年7月1日，市面上的型號(hào)有：基本型：STM32F101C8STM32F101R6STM32F101R8STM32F101RBSTM32F101V8STM32F101VB增強(qiáng)型：STM32F103R8STM32F103V8STM32F103C8STM32F103VBSTM32F103VESTM32F103RBSTM32F103ZESTM32型號(hào)的說(shuō)明：用STM32F103RBT6型號(hào)的芯片為例，該型號(hào)的組成為7個(gè)部分，其命名規(guī)則如下：（1）STM32：STM32代表ARMCortex-M3內(nèi)核的32位微控制器。（2）F：F代表芯片子系列。（3）103：103代表增強(qiáng)型系列。（4）R：R這一項(xiàng)代表引腳數(shù)，其中T代表36腳，C代表48腳，R代表64腳，V代表100腳，Z代表144腳。（5）B：B這一項(xiàng)代表內(nèi)嵌Flash容量，其中6代表32K字節(jié)Flash，8代表64K字節(jié)Flash，B代表128K字節(jié)Flash，C代表256K字節(jié)Flash，D代表384K字節(jié)Flash，E代表512K字節(jié)Flash。（6）T：T這一項(xiàng)代表封裝，其中H代表BGA封裝，T代表LQFP封裝，U代表VFQFPN封裝。（7）6：6這一項(xiàng)代表工作溫度范圍，其中6代表-40——85℃，7代表-40——105℃。(五)STM32F103性能特點(diǎn)特點(diǎn)1、內(nèi)核：ARM32位Cortex-M3的CPU，最高工作頻率為72MHz，1.25DMIPS/MHz。單周期乘法和硬件除法。2、存儲(chǔ)器：片上集成32-512KB的Flash存儲(chǔ)器。6-64KB的SRAM存儲(chǔ)器。3、時(shí)鐘、復(fù)位和電源管理：2.0-3.6V的電源供電和I/O接口的驅(qū)動(dòng)電壓。POR、PDR和可編程的電壓探測(cè)器（PVD）。4-16MHz的晶振。出廠前的8MHzRC振蕩電路和內(nèi)部40kHz的RC振蕩電路。用于CPU時(shí)鐘的PLL。校準(zhǔn)用于RTC的32kHz的晶振。4、低功耗：3種低功耗模式：休眠，停止，待機(jī)模式。5、調(diào)試模式：串行調(diào)試和JTAG接口。6、DMA：12通道DMA控制器。支持的外設(shè)：定時(shí)器，ADC，DAC，SPI，IIC和USART。7、2個(gè)12位的us級(jí)的A/D轉(zhuǎn)換器（16通道）：A/D測(cè)量范圍：0-3.6V。雙采樣和保持能力。片上集成一個(gè)溫度傳感器。8、2通道12位D/A轉(zhuǎn)換器：STM32F103xC,STM32F103xE，STM32F103xD獨(dú)有。9、最多高達(dá)112個(gè)的快速I/O端口：根據(jù)型號(hào)的不同，有26，37，51，80，和112的I/O端口，所有的端口都可以映射到16個(gè)外部中斷向量。10、最多有11個(gè)定時(shí)器：4個(gè)16位定時(shí)器，每個(gè)定時(shí)器有4個(gè)IC/OC/PWM或者脈沖計(jì)數(shù)器。Systick定時(shí)器：24位倒計(jì)數(shù)器。2個(gè)16位的6通道高級(jí)控制定時(shí)器：最多6個(gè)通道可用于PWM輸出。2個(gè)看門狗定時(shí)器（獨(dú)立看門狗和窗口看門狗）。2個(gè)16位基本定時(shí)器用于驅(qū)動(dòng)DAC。11、最多多達(dá)13個(gè)通信接口：2個(gè)IIC接口（SMBus/PMBus）。3個(gè)SPI接口（18Mbit/s），兩個(gè)和IIS復(fù)用。CAN接口（2.0B）。USB2.0全速接口。SDIO接口。5個(gè)USART接口（ISO7816接口，LIN，IrDA兼容，調(diào)試控制）。12、ECOPACK封裝：STM32F103xx系列微控制器采用ECOPACK封裝形式。系統(tǒng)作用1、集成嵌入式Flash和SRAM存儲(chǔ)器的ARMCortex-M3內(nèi)核。和8/16位設(shè)備相比，ARMCortex-M332位RISC處理器擁有了更高的代碼效率。STM32F103xx微控制器帶有一個(gè)嵌入式的ARM核，所以可以兼容所有的ARM工具和軟件。2、Flash存儲(chǔ)器和RAM存儲(chǔ)器：內(nèi)置多達(dá)512KB的嵌入式Flash，可用于存儲(chǔ)程序和數(shù)據(jù)。多達(dá)64KB的嵌入式SRAM可以以CPU的時(shí)鐘速度進(jìn)行讀寫（不待等待狀態(tài)）。3、可變靜態(tài)存儲(chǔ)器（FSMC）：FSMC嵌入在STM32F103xC，STM32F103xD，STM32F103xE中，支持四種模式：Flash，RAM，PSRAM，NOR和NAND。3個(gè)FSMC中斷線連接到NVIC。沒有讀/寫FIFO，除PCCARD之外，代碼都是從外部存儲(chǔ)器執(zhí)行，不支持Boot，目標(biāo)頻率等于SYSCLK/2，所以當(dāng)系統(tǒng)時(shí)鐘是72MHz時(shí)，外部訪問(wèn)按照36MHz進(jìn)行。4、嵌套矢量中斷控制器（NVIC）：可以處理43