SMT鋼網(wǎng)開孔教程

#OF3STENCILBUILDSTANDARD

鋼板制作標準1.0GeneralSpecification:IPC-7525總體說明AreaRatio>0.66;Apertureholecliffshallbesmooth.Forfinepitchcomponents,Stencilfabricationmethodshallbeelectropolished;孔內壁應平滑，鋼板制作應拋光。Apertureshapeshallbeconverselycone-shaped.開孔應是倒錐形。2.0ApertureFabricationRequirement:孔的制作要求：2.1FinePitchIC:ApertureWidthreferencetobelowlist1細間距：開口寬度參考下表一List1:RecommendApertureSizeComponentPitchPadWidthApertureWidth1.270.640.641.020.510.760.430.410.640.380.30~0.350.510.30.23~0.250.410.250.18~0.152.2Chip,SOT,MELFandBGA:apertureSizereferencetobelowlist2Chip,SOT,MELF和BGA：開口尺寸參考表二List2:StandardApertureDesignComponentPadWidthPadLengthApertureWidthApertureLengthChip33473047Chip40404037Chip40903760Chip9518092180Connector20791776SOT30303030SOT32403236SOT50504750SOIC25752259SOIC16901290Rnet(L)30402235Rnet(S)21401537TSOPIC1260953BGA(P=50)22dia*22dia*BGA(P=40)20dia*20dia*FineP(25)16801277.5QFP12801077.5STENCILBUILDSTANDARD

鋼板制作標準AperturesizeofexclusiveComponentsinList1andList2shallbe95%tocounterpads.表一和表二以外的元件應按95%開口。3.0Singleaperturesizeshallnotexceed3x3mm.單一開口應小于3X3mm4.0Tension:Fornewstencil,tension>5N/cm5.0MarksengravedinPCBside:Color:BlackSize:identicaltooneofPCBForMPMAP21andUP2000.6.0StencilThickness:ReferencetoList3.ComponentPitchStencilThicknessQFPSOICSOPTSOPConn.1.270.18/5/0.180.62/20.30.1BGA70.1520.6PLCC1.270.18/0.20402*0.10/0.12/0.150201*0.10/0.12FlipChip0.250.08/5/3/0.087.0Indicatedinformationonstencil:SANMINA-SCISYSTEM(KUNSHAN)CO.LTD.SMTLASERSTENCILMODEL:xxxxxxxxREV:xTHICK=0.xxmm(orTHICK=0.xxmm~0.xxmm)DATE:xxxx-xx-xx8.0OverallPCBAperturesshallbecentraltothestencilandouterframe.PCB的開口應在鋼板的中心9