Alpha-Plasma

1、Technology of low pressure plasma Nature as model! Plasma is not a invention of humanity, it is formed in the tail of comets, in lightning at thunder storms, as well as in stars including our sun. Even northern lights are fascinating and well known occurrences of plasma. More than 99 % of

2、visible matter in the universe is in the state of plasma, such as lightning, flames, northern lights etc.The state of plasma is called the fourth state in addition to the liquid, solid and gaseous state.This technology, which was already described in the last century, was a long time only an exotic

3、niche. Through the rising understanding of the processes in and around plasma, this technology finds its way in rising numbers of laboratories and production facilities.Because of the rapid development in the area of semi-conductor technology, the processes and technologies were even more refined an

4、d adjusted to the present technical requirements.Today plasma processes are not only in the chip production, but also in many other industrial areas indispensable.Plasma, especially low pressure plasma are already used in many places in plastics technology, micro technology, sample analysis or at th

5、e production of photovoltaic cells and displays. This technology is even in the medical area successful used.Generally low pressure plasma is applied to clean samples, activate surfaces or to create coatings with functional layers via plasma polymerization. Thus the surfaces can be adjusted to the d

6、esired requirements. Application and Equipment In principle plasma processes can be classified in the following categories:Cleaning, activation and coating.To conduct a process under low pressure plasma the following technical equipment is needed: Vacuum pumpTo reach the needed low pr

7、essure in the process chamber of ca. 0,5 to 1,5 mbar, depending on application, so called dry running water meters or with oil greased vacuum pumps are employed. Particular attention is paid to the choice of oils. Especially at the utilization of oxygen as process gas, the application of oils specia

8、lly suited for this process is recommended. Induction of high-frequencyFor initiation or ionization of the process gases, a high-frequency is inducted. For that purpose generators or magnetrons are applied with a frequency, which is approved by the lawgiver for technical utilization. In the pro

9、cess frequencies in the area of KHz, MHz and GHz are applied.Each of these frequencies has its particular properties and should be chosen in accordance with its application. Gas flow and measuring componentsAccording to requirements, manual or electronic mass flow controllers are applied. Due t

10、o the reproducibility or at the application of gaseous mixtures, electronic mass flow controllers are required. Plasma equipment of series ALAL stands for aluminum chamber. This plasma equipment is mostly used in semi-conductor technology, solar-, plastics and electronic industry to activate pl

11、astics surfaces or to create ultrapure surfaces. Application examples:Pre treatment of metal and plastics parts prior to bonding, gluing, varnishing or printing. Micro cleaning of glasses, metals, ceramics or other vacuum suitable substrates.推薦精選Plasma equipment of series QPlasma equipment of s

12、eries Q are mostly used in semi-conductor technology and in the area of analysis and medical technology.Application examples:Cleaning and incineration of organic samples and varnishes in micro mechanics as well as for silicium wafers in semi-conductor industry.Chip packaging  Even in

13、the back end“ area of semi-conductor production micro wave plasma is a highly effective and gentle technology to clean the bond points ultra pure. Cleaning or activation before the packaging of semi-conductor parts or even at “flip chip” technology, the micro wave is the right choice because of its

14、particular gentle and effective application.To remove organic contamination or to treat oxide coating different process gases can be deployed. Due to a wide range of accessories and process variants we are ready for the present demands. With our roll to roll low pressure plasma equipment w

15、e can also treat flexible materials such as lead frames, foils and PCB.  Plasma equipment of series AL is fashioned as table version or ready for integration in clean room walls.Photo resist ashing  The removal of photo resist layers is a process in the semi-conductor produc

16、tion, which is very often conducted. For this purpose our systems at micro wave basic have been proved particularly.They form a remarkably low priced and environmentally friendly alternative.Especially after etching of structures and at highly pressured varnishes this technology has proved itself. E

17、ven after implantation processes the benefits of micro waves can be used not only through high incineration rates. Mostly oxygen is used a process gas. Because of the high ionization grade and the properties of isotopes of micro wave plasma there is a particular gentle treatment of components and hi

18、gh removal rates. If your application needs a plasma activation using MHz, our systems are also available with MHz frequency. In the micro technology it is increasingly necessary to partly remove very thick varnish layers, which can be done successfully and notably low priced with our plasma eq

19、uipment of series Q. For these applications our standard systems with silica glass chamber are available with a diameter of 150, 240 and 310 mm. Other dimensions are available on demand.  推薦精選     Plasma equipment of series Q is fashioned as table version or r

20、eady for integration in clean room walls. Flat Panel Displays Pre treatment of PLED before ink jet print processes.Achievement of hydrophobic or hydrophilic surfaces to restrict the spreading of liquid drops to the desired pixel area. Due to scalable chamber sizes this system is even

21、suitable for cleaning and activation of the most different substrates, especially for flat substrates. Hydrophilic and Hydrophobic coatings e.g. to optimize the properties of slide layers, anti corrosive or functional layers (customer-spezific).        &#

22、160;        Plasma system AL 140Plasma in analysis推薦精選 Plasma incineration takes place in the most different areas of analysis:With the help of low temperature incineration in oxygen plasma, organic matrix can be oxidized.As pre treatment plasma incinerat

23、ion is suitable at the determination of asbestos fibers or fabric using REM/ARTEM.In airborne dust analysis or the determination of trace elements and heavy metals in different matters such as coal, fabric samples or plastics with TXRF, AAS-ICP etc.        

24、60;    Plasma equipment of series Q Desmearing   Desmearing is term from the PCB production.It is used to describe the process of cleaning the bore holes of luting and impurity, which occur at the drilling of the PCB.Even residues of laser boring can be remove

25、d with the help of low pressure plasma.Plasma is used as an environment friendly alternative to sulfuric acid, chromic acid and permanganate.Chamber assembling and electrodes can be variably constructed.Plasma polymerization Plasma polymerization is a vacuum coating process and offers for many

26、application areas interesting resolution approaches. Vaporous organic monomers are channeled first through special mass flow controllers into a chamber which is suitable for the substrates. First the substrates are stimulated and activated with an inducted high 推薦精選voltage. Due  to the developi

27、ng ionized molecules, molecule fragments in the form of cluster and chains are formed in the gaseous phase. The following condensation on the treated substrates results in polymerization and the creation of a closed layer.This Polymerization is a special form of the so called CVD processes (chemical

28、 vapor deposition). Applications of plasma polymer coatings:· Hydrophobic and hydrophilic layers· Slide and barrier layers· Scratch resistant coatings· Corrosive protection· Anti adhesive, dirt repelling coatings· Barrier layers For specific surface modificati

29、on we can offer you the following processes which are developed form us and proved themselves: THIN GLYDEReduces the friction of plastic and rubber surfacesDirt repelling properties on siliconesAnti static properties   MICRO FLOWHigh surface energyOffers permanent hydrophilic pro

30、perties on plasticsExcellent optical propertiesCan be adjusted in relation to absorptive capacity to different media    推薦精選 THIN GUARDReduced surface energyOffers permanent hydrophobic surface, passivationOptimal barrier properties   MICRO TIEAdhesion improve

31、ment on metals and plasticsMetal on metal, metal on plastics or plastics on plasticsReplaces chemicals which are harmful to the environment     CUSTOM COATDevelopment of customer-specific coatingsActivation with Plasma In the case of activation, the polymeric surface is

32、 exposed to plasma.Used for the plasma are inert gases (noble gases) of gases consistent of molecules which have no atoms who can build chains, such as Ar, N2, O2 or NH3.In this case the bonds in the surface are split and reactive areas are built due to the electrons, ions and high-energy radia

33、tion which is created by the plasma. The so created radicals can then react with each other and cause an additional cross linking on the surface.推薦精選The so produced high cross linked surface is an activated surface. With gases which are not inert, such as N2 or O2, contained atoms can be imbedd

34、ed additionally in the surface and can cause a change in the surface properties of the substrates die to new functional groups.                  e.g.  Plasma system  AL 76 in tall cupboard format     Drum equipment for the treatment of bulk goods with customized drum.               &