新編-TFT-LCD_工藝制程簡(jiǎn)介-精品課件

1、2009年04月21日TFT-LCD 工藝制程簡(jiǎn)介周剛7/24/2022周剛09-4-19編寫(xiě)Contents 2. 1. 3. Array process Module ProcessCell Process TFT LCD 客戶(hù)導(dǎo)向，團(tuán)結(jié)協(xié)作 DeptEvery Process is important 天馬顯示屏無(wú)處不在 精益生產(chǎn)，精益管理 Team workTFT-LCDCOGRecipeOICSTKODFADI TFT-LCD ENGLISH一：Array Process ARRAY生產(chǎn)計(jì)劃PHOTOWETCVDPVDDRY Organization Array Layout TFT

2、 ARRAY PROCESSCCITO pixel electrodeCross-section C-CSelect lineData lineStorage capacitorCCITO pixel electrodeCross-section C-CSelect lineData lineStorage capacitora-Si TFTTFT StructureDeposit and pattern gate metalFunctions:Gate of TFTSelect linesBottom electrode of storage capacitorMetal options:T

3、i/Al/TiAl/MoCrMoCCCross-section CCa-Si TFT array process step 1a-Si TFT array process step 2Deposition of SiN/a-Si/n+ by PECVD, patterning of a-SiSiN is gate dielectric and storage capacitor dielectricSelective etch of a-SiSiN is not etchedCCSiNa-Si/n+a-Si TFT array process step 3Deposition and patt

4、erning of source/drain metalFunctions:Source and drain metalData line metalMetal optionsTi/Al/Ti or Ti/AlCrMo or Mo/AlBack etch of n+ a-Si from channel areaCCa-Si TFT array process step 4Deposition and patterning of passivation SiN by PECVDFunction:Passivate TFTCCa-Si TFT array process step 5Deposit

5、ion and patterning of ITOFunction:Pixel electrodeTop electrode of storage capacitorCCITO pixel electrodeCross-section C-CSelect lineData lineStorage capacitorCCITO pixel electrodeCross-section C-CSelect lineData lineStorage capacitora-Si TFT TFT ARRAY PROCESS_PVD/CVDUsed for ITO (Indium Tin Oxide tr

6、ansparent conductor) and for metals (Al, Mo, Cr, etc.)DC Sputter depositionSchematic diagram of DC powered sputter deposition equipment(glow discharge)ground-V (DC)VacuumCathode shield-100-1000VPVD原理ACLSLoadlockT/CP/CP/CP/CP/CP/CAKT-5500PECVD (即等離子體增強(qiáng)化學(xué)氣相沉積) 工作原理:采用等離子輔助對(duì)化合物進(jìn)行催化分解目的: 利用等離子體輔助活化反應(yīng)氣體,

7、降低反應(yīng)溫度,改善薄膜質(zhì)量PECVD原理LayerFeed gasMaterialTempFunction3 LayerSiH4, N2, NH3A-SiNx320350Gate insulator SiH4, H2a-SiSemiconductorSiH4, PH3, H2n+ a-SiContact layer at source and drain1 LayerSiH4, N2, NH3A-SiNx270290 passivation溫度氣體流量比 (Si:H,N:H,Si:N)RFPressure Spacing (上下電極間距)影響成膜工藝的主要參數(shù)周剛09-4-19編寫(xiě) M/A E

8、UVMAINT EXT/COL4U/CU/CU/CU/C C/SSCRHP3HP3HP1HP3HP1COL1COL1 M/A DP DEVELOPEREXTPSPSEXT M/A HP2HP2I/FBUFCOL3TITLER/EE EXTEXTHP2COL2EXTPSPSPSPSOUTINOUTINOUT30600mm6000mmHeight:2450mm5585mm TFT ARRAY PROCESS_PHOTOSLIT COATEREXPOSURECANON MPA6000 JUMPstageNozzleSlit Coater & DPDP照明光學(xué)系統(tǒng)掩膜板臺(tái)基板臺(tái)投影光學(xué)系統(tǒng)掩膜板交換裝

9、置操作用電腦緩沖裝置MPA6000 Exposure unitArrayCFTP & OL MarkOLTP TFT ARRAY PROCESS_WETStripperWet etcher TFT ARRAY PROCESS_DRYCassette stationL/LT/CP/CP/CP/CP/CDET原理利用Plasma將反應(yīng)氣體解離，ion轟擊與radicals反應(yīng)將Film移除，真空下進(jìn)行RIE：指的是Reactive ion etching，即反應(yīng)離子刻蝕 目的 蝕刻終點(diǎn)檢測(cè)。原理利用從蝕刻中開(kāi)始到結(jié)束為止特定的波長(zhǎng)的光強(qiáng)度的變化，檢測(cè)出蝕刻的最合適的終點(diǎn)。plasma13.56 M

10、Hz検出器Optical fiberArray Tester將TFT Array Panel進(jìn)行測(cè)試，如果有短路（SHORT),或是短路(OPEN),就將坐標(biāo)點(diǎn)記錄下來(lái)，傳給Laser Repair（激光修復(fù)機(jī)）修復(fù)之1.測(cè)量元件導(dǎo)通電流,ION2.測(cè)量元件截止電流,IOFF3.測(cè)量切入(CUT IN)電壓VT4.測(cè)量電壓電流曲線TV CURVE電壓V電流I切入電壓IOFFIONTEG7/24/2022TAKE A BREAKQUESTION AND ANSWERCF/Color FilterLCSealantSpacer in SealSeal whit AU BallSpacerPITFT

11、 GlassPolarizerPanel 制 做 完 成 ！周剛09-4-19編寫(xiě)二：Cell ProcessPI前清洗CFTFTPI涂布預(yù)烤固烤配向PI LineRubbing LineRubbing后清洗UV照射框膠點(diǎn)膠Seal Oven液晶滴下CFTFTODF Line襯墊料貼合一次切割（自動(dòng)）二次切割（手動(dòng)）CleanerPOL AttachCELLCFTFTTrimmerCELL工藝流程Scraper TypeDoctor RollDispenserAPR 版APR: Asahi Photosensitive ResinPI CoaterProcessPI Coater要求特性Rub

12、bingRubbing 動(dòng)作摩擦輪平臺(tái)玻璃ProcessSpacer SprayShort DispenserSeal DispenserLC DispenserUV CURE C F上基板 TFT下基板AssemblyProcessODF制成12ProcessScriberZero level detect工作臺(tái)運(yùn)動(dòng)方向及速度切割過(guò)程.5.6.ProcessProcessE-C-PLength GrindingWidth GrindingInOutEdge Grind (Skip)ProcessCleanerProcessPOL Attach側(cè)面動(dòng)作示意正面動(dòng)作示意POL AttachProcess周剛09-4-19編寫(xiě)三：Module ProcessMODULE工藝流程圖ACFFOG UV LINKCOGIC 邦定鏡檢AOI檢測(cè)FOGACF 粘貼FOG 邦定鏡檢電測(cè)1封膠膠帶粘貼補(bǔ)強(qiáng)UV固化組裝副屏電測(cè)背光源檢測(cè)背光源組裝主副屏焊接背光源焊接主副屏組裝外框組裝外框焊接觸摸屏組裝觸摸