MPM全自動印刷機(jī)中文操作手冊

1、.PAGE ：.；PAGE 82M P M中 文 操 作 手 冊Ultraprint (forAP )軟體版本7.1A適用Frank製Start Cycle開始循環(huán)按鈕Emergency Stop警急停頓開關(guān)3D雷射鑰匙開關(guān)Power電源燈門鎖鑰匙開關(guān)Power電源燈Off電源關(guān)閉開關(guān)On電源啟動開關(guān)警急停頓開關(guān)主電源開關(guān)斷路器電源線主電源圓形開關(guān)1.聲明:UP2000中文手冊節(jié)錄自MPM公司UltraprintAP英文手冊,僅做為琋瑪企業(yè)員工及客戶教育訓(xùn)練之用,特此聲明,假設(shè)有不詳之處,敬請見諒。 2.系統(tǒng)簡介:UPAP印刷機(jī)特性視覺自動對準(zhǔn)裝置 Vision Alignment Syste

2、m慢速脫模功能 Slow Snap-off Function可程式設(shè)定刮刀頭 Programming Squeegee自動擦拭鋼板系統(tǒng)Stencil Wipper 2.1關(guān)於印刷週期Printing Cycle印刷週期包含以下過程基板搬入Loading Board基板定位 Locating Board視覺系統(tǒng)對位 Vision Alignment印刷平臺上升 Z Tower UP刮刀向前後刮印錫膏 Printting慢速脫模 Slow Snap-Off印刷平臺下降 Z Tower Down基板搬出 Unloading Board2.2硬體2.2.1操作介面軌跡球或螢?zāi)?Trackball or

3、 Monitor)他可以從螢?zāi)簧现繳ltraprint 2000的狀態(tài),以及它提供給他的相關(guān)訊息,並且經(jīng)由軌跡球,來採取各項(xiàng)的操作程序。Trackball軌跡球:移動螢?zāi)簧系闹笜?biāo)移動各軸數(shù)入數(shù)字、參數(shù)等等.SELECT按鈕:在指標(biāo)所在的地方,按了SELECT按鈕,即是啟動操作、功能、或子功能、或輸入狀態(tài)NEXT按鈕:按了NEXT按鈕,表示他已認(rèn)知目前機(jī)器的提示或狀態(tài)EXIT按鈕:按了EXIT按鈕,表示離開目前的狀態(tài)上述運(yùn)用方法,在螢?zāi)挥蚁路降膶υ捒?訊息顯示區(qū))會顯示操作方法3.軟體介面開機(jī)後,顯示如下的畫面For 7.0以上(因軟體版本新舊不一樣而不同)Ultraprint AP內(nèi)全部馬達(dá)

4、,都是步進(jìn)馬達(dá),所以剛開機(jī)必需RESET重新回原點(diǎn)後才干開始運(yùn)用。Print Teach File Utilities Maintenance CHANGEDFRANKFILE:SUPERVISOROEX AXIS BOARD COUNT REJECTSRESET 0 00.000Y AXISSqueegee starting in back0.000Z AXIS0.000CLEAR FAULTTHETA AXIS0.000SQUEEGEE STROKESETUP MENUS0.000TRANSPORT 1230.000VX AXISVY AXIS0.0000.000SQUEEGEE HEIG

5、HT0.000TACTILE0.000STENCILLIGHTVACUUMMOTORSQUEEGEEUP/DOWNBOARDLIGHTVACUUMMOTORFRAMECLAMPUP/DOWNDISPENSESOLVENTWIPERPAPERSQUEEGEEFLIPSQUEEGEECLAMPSMPM CorporationPrint Teach File Utilities Maintenance 下拉功能表CHANGEDFRANKFILE:更改檔案內(nèi)參數(shù)後,未存檔檔案(生產(chǎn)程式)區(qū),顯示他目前叫出程式SUPERVISOROE目前運(yùn)用者方式X AXIS BOARD COUNT REJECTSRE

6、SET 0 00.000Y AXISSqueegee starting in back0.000Z AXIS0.000CLEAR FAULTTHETA AXIS0.000SQUEEGEE STROKESETUP MENUS0.000TRANSPORT 1230.000VX AXISVY AXIS0.000復(fù)原(機(jī)器歸零)和設(shè)定程式參數(shù)按鈕0.000SQUEEGEE HEIGHT基板計(jì)數(shù)區(qū)(RESET :數(shù)量歸零COUNT:印刷片數(shù)、REJECT:退貨)和刮刀行程指示(指出刮刀在前或後)0.000TACTILE0.000各軸移動區(qū)STENCILLIGHTVACUUMMOTORSQUEEGEEUP

7、/DOWNBOARDLIGHTVACUUMMOTORFRAMECLAMPUP/DOWNDISPENSESOLVENTWIPERPAPERSQUEEGEEFLIPSQUEEGEECLAMPS操作控制面板MPM Corporation訊息先顯示區(qū)即時影像任務(wù)區(qū)關(guān)於MPM公司資訊VACUUMMOTORFRAMECLAMPUP/DOWN 啟動鋼板固定鈕 啟動真空馬達(dá)鈕DISPENSESOLVENTSQUEEGEECLAMPS 啟動刮刀座固定鈕 啟動溶劑幫浦鈕STENCILLIGHTSQUEEGEEFLIP 啟動更換前後刮刀 啟動照鋼板燈泡鈕 座鈕BOARDLIGHTSQUEEGEEUP/DOWN 啟動

8、刮刀組上下鈕 啟動照基板燈泡鈕WIPERPAPERVACUUMMOTOR 啟動真空馬達(dá)閘門鈕 啟動捲紙馬達(dá)鈕3.1.1下拉式功能表PrintAuto PrintManual PrintPass ThroughDemo PrintSPC DataAuto Print自動印刷方式Manual Print手動印刷方式Pass Through將機(jī)器當(dāng)做輸送帶Demo Print展現(xiàn)印刷方式SPC Data生產(chǎn)統(tǒng)計(jì)過程資料1.Auto Print自動印刷,機(jī)器會做印錫膏的動作Press SELECT to begin or(按SELECT開始自動印刷)Next to change Cycle Limit

9、s : No Limit 如下圖(按NEXT,以更換印刷片數(shù):不限制)Print Cycle LimitsRoll Trackball To Change ValuePrint Cycle Limit : 3 Press Exit When Done.Print Cycle Limits(印刷週期設(shè)定)Roll Trackball To Change Value(滾動軌跡球,以變更印刷片數(shù))Print Cycle Limit : 3 (限定印刷週期: 3片)最高999片Press Exit When Done. (當(dāng)設(shè)定完成後，按EXIT)PAUSE暫時停頓印刷按鈕DISPENSERPENDI

10、NG啟動加錫膏按鈕(必須在設(shè)定第2頁Enable Buttons內(nèi)將Dispense打開為Yes)Press SELECT to raise squeegeeto allow move room when adding paste,or Press Next to continuePress SELECT to raise squeegee(按SELECT後刷刀會上昇，以便產(chǎn)生to allow move room when adding paste, 足夠空間,讓操作員加錫)or Press NEXT to continue(按NEXT後在原地,讓使操作員加錫) WIPERPENDING啟動一

11、次擦拭鋼板按鈕 (必須在設(shè)定第2頁Enable Buttons內(nèi)將Wiper打開為Yes)SPCDATA進(jìn)入生產(chǎn)統(tǒng)計(jì)過程資料視窗按鈕2.Manual Print手動印刷,機(jī)器會做印錫膏的動作3.Pass Through將機(jī)器當(dāng)做輸送帶Demo Print展現(xiàn)印刷方式5.SPC Data生產(chǎn)統(tǒng)計(jì)過程資料Cycle Time 顯示機(jī)器在印刷時所花的時間,如有擦拭,時間必加長Idle Time 機(jī)器在印刷時所等待送板與出板時間Correction 顯示PCB板進(jìn)入印刷位置與鋼板對位時X、Y、THETA軸修正值Shape Score 視覺系統(tǒng)辨別PCB板與鋼板Mark點(diǎn)亮度接受值顯示圖表Alignme

12、nt 視覺系統(tǒng)辨別PCB板與鋼板Mark點(diǎn)X、Y修正補(bǔ)償顯示圖表2D Data 2D錫面覆蓋率檢查顯示圖表(需有此項(xiàng)功能才干顯示)3D Data 3D錫膏厚度檢查顯示圖表(需有此項(xiàng)功能才干顯示)Temperature 顯示機(jī)器內(nèi)的溫度(需有ECU溫溼度監(jiān)控配備此項(xiàng)功能)Humidy 顯示機(jī)器內(nèi)的濕度(需有ECU溫溼度監(jiān)控配備此項(xiàng)功能)Save Info將生產(chǎn)統(tǒng)計(jì)過程資料存入磁片Clear All 將生產(chǎn)統(tǒng)計(jì)過程資料全部刪除Pan Left將放大過資料與圖形向左邊移動Pan Right 將放大過資料與圖形向右邊移動Zoom In將生產(chǎn)統(tǒng)計(jì)過程資料內(nèi)(值及曲線)放大與縮小圖形Return toMa

13、in Menu回到主畫面按鈕S P COptions選擇預(yù)覽生產(chǎn)統(tǒng)計(jì)過程資料Enable Box：運(yùn)用SPC對話盒Enable SPC:運(yùn)用SPC Data資料顯示功能Enable DCA SPC: 運(yùn)用DCA SPC Data資料顯示功能Enable Cpk: 運(yùn)用Cpk Data資料顯示功能Prompt to Clear: 運(yùn)用即時去除SPC Data資料並重新載入新資料功能Cpk Calc Range Box：Cpk計(jì)算範(fàn)圍對話盒Start Board:設(shè)定起始PCB數(shù)量End Board: :設(shè)定結(jié)束PCB數(shù)量Graph Type Box：運(yùn)用圖形顯示對話盒Line Graph:顯示曲

14、線圖形Bar Graph: 顯示長條形圖形Save As Box：運(yùn)用存檔資料對話盒Text:資料以ASCII資料格式存檔 Binary: 資料以二進(jìn)制資料格式存檔Save As Default：存檔為目前SPC資料預(yù)設(shè)架構(gòu)。TeachTeach BoardTeach VisionDevice LayoutTeach IDTeach Custom BGATeach Offset MovesTeach Vision OffsetTeach Board做一片PCB板新程式Teach Vision做一片PCB新程式的Mark點(diǎn)Device Layout做2D檢查時,所要檢查零件Teach ID做辨識

15、鋼板身分Teach Custom BGA編輯自行設(shè)計(jì)的BGA零件檔案Teach Offset Moves設(shè)定印刷前的焊墊與 印刷後的焊墊位置修正值Teach Vision Offset設(shè)定視覺系統(tǒng) 位置修正值1.Teach Board重做新程式About to begin TEACH operation(開始設(shè)定操作)Press SELECT to teach a new board or(按SELECT,設(shè)定新基板)Press NEXT to continue on this board setup (按NEXT,繼續(xù)這基板的設(shè)定)按SELECT之後，出現(xiàn)以下訊息視窗：CAUTION, Th

16、e machine must move toTEACH POSITION before teach can beginThe machine is now going to move.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine must move to(警告,設(shè)定開始前,機(jī)器必須移動到TEACH POSITION before teach can begin設(shè)定位置)The machine is now going to move. (機(jī)器即將移動)Press NEXT to Continue, or EXIT to

17、 Quit. (按NEXT繼續(xù), 按EXIT離開)1.1 選擇Board Parameters 進(jìn)入PCB參數(shù)設(shè)定Board ParametersHardware Required:BoardBoard Parameters基板(PCB)參數(shù)設(shè)定X size 228.600(PCB)基板X軸方向長度Y size 406.400(PCB)基板Y軸方向?qū)挾萒hickness 1.570(PCB)基板厚度PCB板Y XEnter Board Dimensions into setup menu.Click on Y size to adjust Track Width.Press Done when

18、 finished.Enter Board Dimensions into setup menu. (輸入基板X、Y、厚度)Click on Y size to adjust Track Width. (點(diǎn)取Y方向尺寸，可調(diào)整軌道寬度)Press Done when finished. (當(dāng)他做完上述之步驟，按Done)點(diǎn)取X size，輸入基板寬度X size，按EXIT完成輸入，單位mm。例14.5cm = 145mm點(diǎn)取Y size輸入基板寬度Y size，按EXIT之後出現(xiàn)如下訊息視窗：About to adjust the TRACK WIDTH for the board.Pres

19、s NEXT to Continue, or EXIT to Quit.About to adjust the TRACK WIDTH for the board. (調(diào)整基板的軌道寬度)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：This is the current Track widthPress SELECT to fine adjust Press NEXT to acceptThis is the current Track width(這是目前的軌道寬度)Press SEL

20、ECT to fine adjust (按SELECT微調(diào)軌道寬度)Press NEXT to accept(按NEXT，接受目前的軌道寬度)假設(shè)，他按SELECT之後，出現(xiàn)以下訊息視窗：Jog ACTIVETRK WIDTH 126.Press NEXT to quit(調(diào)整完後，按EXIT)Jog ACTIVE(這段訊息告訴他，用Jog方式去調(diào)整基板的軌道寬度)TRK WIDTH 126.Press NEXT to quit(調(diào)整完後，按NEXT)點(diǎn)取Thickness，輸入基板厚度。運(yùn)用游標(biāo)卡尺測量。Press Done when finished. (當(dāng)他做完上述之步驟，按Done)S

21、tencil Dimensions鋼板尺寸設(shè)定參數(shù)Inner 660.400鋼板尺寸Enter stencil inner dimensionPress Done when finished.Enter stencil inner dimension(輸入內(nèi)部鋼板尺寸)Press Done when finished. (當(dāng)他做完上述之步驟，按Done)1.2 選擇Worknest 進(jìn)入印刷任務(wù)平臺參數(shù)設(shè)定WorknestHardware Required:Board ,Tactile , Vacuum ChucksPlease remove the stencil.Squeegee will

22、 now move back.Press SELECT when ready.Please remove the stencil. (請移開鋼板)Squeegee will now move back. (刮刀組現(xiàn)在將移動到後面)Press SELECT when ready. (準(zhǔn)備好後按SELECT)按NEXT之後，出現(xiàn)以下訊息：Now, adjust the vacuum rear and side platesIf you have a dedicated work holder, install it nowPress NEXT to Continue, or EXIT to Qui

23、t.Now, adjust the vacuum rear and (現(xiàn)在請調(diào)整後隔板和側(cè)(左右)隔板)side platesIf you have a dedicated work holder, (假設(shè)有運(yùn)用專用PCB板支撐架,請現(xiàn)在install it now 把他裝上)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)按NEXT之後，出現(xiàn)以下訊息：The Z TOWER is about to loadto tooling heightPress NEXT to Continue, or EXIT to Quit.Th

24、e Z TOWER is about to load (Z軸上升到tooling height的位置)to tooling heightPress NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)他按NEXT之後，出現(xiàn)以下訊息：If you have X snuggers,adjust snugger pins now.Press NEXT to Continue, or EXIT to Quit.If you have X snuggers,adjust snugger pins now. (假設(shè)有運(yùn)用X方向夾板,請調(diào)整好)Press

25、 NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)他按NEXT之後，出現(xiàn)以下訊息：CAUTION, The machine is now going toCenter itself for this size board. The Y AXIS is about to move forward.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine is now going to(留意,機(jī)器現(xiàn)在將移動到基板Center itself for this size board

26、. 中心點(diǎn))The Y AXIS is about to move forward. (Y軸即將移動到前面(基板中心點(diǎn))Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)Board Parameters基板(PCB)參數(shù)設(shè)定Detent12.7PCB停於中心印刷位置值Load speed 432進(jìn)板軌道皮帶轉(zhuǎn)速值(數(shù)字越大,轉(zhuǎn)速越快)Unload speed 381出板軌道皮帶轉(zhuǎn)速值(數(shù)字越大,轉(zhuǎn)速越快)Enter board loading parameters.Click on detent field to test.P

27、ress Done when finished.Enter board loading parameters. (輸入PCB進(jìn)板參數(shù))Click on detent field to test. (點(diǎn)取detent,測試PCB停於中心印刷位置值)Press Done when finished. (按Done完成全部動作)1.3.選擇Teach Boardstops進(jìn)入基板停頓位置參數(shù)設(shè)定Teach BoardstopsHardware Required:, Stencil , Tactile1.3.1 選擇Teach Boardstops-Y進(jìn)入基板Y方向板邊停頓位置參數(shù)設(shè)定Teaching

28、 Boardstop-YPlace a board on the input track.Press SELECT to Continue.Place a board on the input track. (請將PCB板放到軌道輸入端)Press SELECT to Continue.(按SELECT 繼續(xù))他按SELECT之後，出現(xiàn)開始做板邊視窗：Jog to the leading edge of the board.Stay 1/2 inch in from the rails. Press EXIT!Jog to the leading edge of the board. (請將十

29、字游標(biāo)移動到基板板邊Stay 1/2 inch in from the rails. Press EXIT! 中間位置後,按EXIT離開)此動作最主要是讓視覺系統(tǒng)內(nèi)基板停頓感應(yīng)器,感應(yīng)基板能否停頓在印刷平臺中心點(diǎn)位置 1.3.2 選擇Teach Boardstops-X進(jìn)入PCB板停頓到印刷平臺中心點(diǎn)位置參數(shù)設(shè)定與PCB板和鋼板對位Mark點(diǎn))Teaching Boardstop-XIs the board centered correctly?Press SELECT to accept location.Press NEXT to-locate board.Press EXIT to ab

30、ort process.Is the board centered correctly? (基板有無正確停頓到印刷平臺中心點(diǎn)位置)Press SELECT to accept location. (按SELECT接受目前位置 )Press NEXT to-locate board. (按NEXT調(diào)整基板正確停頓到印刷平臺中心點(diǎn)位置)Press EXIT to abort process. (按EXIT 中止這一項(xiàng)步驟)他按NEXT之後，出現(xiàn)以下視窗：(將基板往前及往後送到印刷平臺中心點(diǎn)位置)他按SELECT之後，出現(xiàn)以下訊息：Please insert a stencil. Press NEX

31、T to continue!Please insert a stencil. (請放入鋼板)Press NEXT to continue! (按NEXT繼續(xù))他按NEXT之後，出現(xiàn)以下訊息及視窗：Jog to any target on the board!Center the object. Press EXITJog to any target on the board! (請移動到基板上任一個對位Mark點(diǎn))Center the object. Press EXIT(對正Mark中心點(diǎn)，按EXIT離開)他按EXIT之後，出現(xiàn)以下訊息及視窗：Jog to the same target o

32、n the stencil!Center the object. Press EXITJog to the same target on the stencil!(請移動到鋼板上任一個對位Mark點(diǎn)Center the object. Press EXIT，對正Mark中心點(diǎn)，但必須與基板上Mark點(diǎn)一樣,按EXIT離開)但假設(shè)X軸方向,超過軟體保護(hù)極限會出現(xiàn)以下訊息,能夠需重做對位點(diǎn)。Warning MessageX AXIS SOFTWARE LIMIT WARNING!Press NEXT to Continue.1.3.3選擇Calc. Pre-Boardstops-X進(jìn)入基板X方向停

33、頓位置參數(shù)設(shè)定Calc. Pre-Boardstop-XPre board stop position learnedPress SELECT to continuePress Done when finished.Pre board stop position learned (機(jī)器自行計(jì)算基板停頓位置)Press SELECT to continue(按SELECT 繼續(xù))Press Done when finished. (當(dāng)他做完上述之步驟，按Done)1.4選擇Stencil進(jìn)入測鋼板高度參數(shù)設(shè)定StencilHardware Required:Board , Stencil , T

34、actile , Please install a stencil now. The FRAME CLAMPS will activate whenyou press NEXT. Press NEXT to Continue, or EXIT to Quit.Please install a stencil now. (請現(xiàn)在放入鋼板)The FRAME CLAMPS will activate when (按NEXT後,啟動鎖住鋼板)you press NEXT. Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)他按NEX

35、T之後，出現(xiàn)以下訊息及視窗：The next step is to set STENCIL HEIGHT.Press NEXT to Continue, or EXIT to Quit.The next step is to set STENCIL HEIGHT. (然後進(jìn)行測鋼板高度)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)他按NEXT之後，出現(xiàn)以下訊息及視窗：CAUTION, The machine is now going tomove. STAY CLEAR.Press NEXT to Continue, o

36、r EXIT to Quit.CAUTION, The machine is now going to(警告,機(jī)器現(xiàn)在要移動,內(nèi)部不能有move. STAY CLEAR.任何東西,需去除)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)他按NEXT之後，出現(xiàn)以下訊息及視窗：Press SELECT to JOG the sensor clear ofpaste or stecil apertures,or Press NEXT to CONTINUE.Press SELECT or NEXT to Continue.Pres

37、s SELECT to JOG the sensor clear of(按SELECT移動偵測感應(yīng)器,勿paste or stecil apertures,碰到鋼板上錫膏及鋼板上PAD孔)or Press NEXT to CONTINUE. (按NEXT馬上開始在本位置偵測鋼板高度)Press SELECT or NEXT to Continue. (按SELECT 或 NEXT繼續(xù))他按SELECT之後，出現(xiàn)以下訊息及視窗：JOG ACTIVESQUEEGEE STROKE -112.050Press EXIT to quit.JOG ACTIVE(移動現(xiàn)在刮刀行程位置)SQUEEGEE S

38、TROKE -112.050Press EXIT to quit. (按EXIT離開)他按NEXT與EXIT之後，出現(xiàn)以下訊息及視窗：Locating the boardCAUTION：Auto height sensor in progress. Please wait (開始載入PCB,自動偵測鋼板高度)Stencil height FOUND.Press NEXT to Continue.Stencil height FOUND. (完成偵測鋼板高度)Press NEXT to Continue. (按NEXT繼續(xù)下一步驟)1.5選擇Squeegee進(jìn)入測刮刀高度與刮刀行程參數(shù)設(shè)定Squ

39、eegeeHardware Required:Squeegee Blades , Stencil , TactileThis Utility will set the SQUEEGEE height.Press NEXT to Continue, or EXIT to quit.This Utility will set the SQUEEGEE height.(運(yùn)用測刮刀高度)Press NEXT to Continue, or EXIT to quit. (按NEXT繼續(xù), 按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：Please install a stencil now.The

40、REAME CLAMPS will activate when you press NEXT.Press NEXT to Continue, or EXIT to quit.Please install a stencil now. (現(xiàn)在請放入鋼板)The REAME CLAMPS will activate when(按NEXT之後,啟動鋼板固定夾)you press NEXT. Press NEXT to Continue, or EXIT to quit. (按NEXT繼續(xù), 按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：You must now install the squee

41、gee blade.Press NEXT to Continue, or EXIT to quit.You must now install the squeegee blade. (他現(xiàn)在必須安裝刮刀)Press NEXT to Continue, or EXIT to quit. (按NEXT繼續(xù), 按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：CAUTION, The machine is now going toMove the Z TOWER and cyclethe SQUEEGEE UP and DOWN.Press NEXT to Continue, or EXIT to

42、Quit. CAUTION, The machine is now going to(留意,機(jī)器的Z軸和刮刀上下將Move the Z TOWER and cycle會移動)the SQUEEGEE UP and DOWN.Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：Press SELECT to find Stencil Heightor NEXT to Bypass.Press NEXT to Continue, or EXIT to Quit. Press SELECT to fi

43、nd Stencil Height(按SELECT之後,再測一次鋼板高度or NEXT to Bypass. 按NEXT之後,不測鋼板高度)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)按NEXT之後，出現(xiàn)以下訊息視窗：Press SELECT to JOG the sensor clear ofpaste or stencil aperturesor press NEXT to CONTINUE.Press SELECT or NEXT to Continue. Press SELECT to JOG the senso

44、r clear of(按SELECT移動偵測感應(yīng)器,勿paste or stencil apertures碰到鋼板上錫膏及鋼板上PAD孔)or press NEXT to CONTINUE. (按NEXT馬上開始在本位置偵測刮刀高度)Press SELECT or NEXT to Continue. (按SELECT 或 NEXT繼續(xù))他按SELECT之後，出現(xiàn)以下訊息及視窗：JOG ACTIVESQUEEGEE STROKEPress EXIT to quit.JOG ACTIVE(移動現(xiàn)在刮刀行程位置)SQUEEGEE STROKE -112.050Press EXIT to quit.

45、(按EXIT離開)他按NEXT與EXIT之後，出現(xiàn)以下訊息及視窗並開始測前後刮刀高度：Leveling front blade.Leveling rear blade.CAUTION：Auto height sensor in progress. Please wait (開始偵測刮刀高度。測前刮刀時,偵測感應(yīng)器先下降碰到鋼板後,前刮刀下降,第一次先壓平刮刀,第二次自動偵測前刮刀高度;測後刮刀時, 偵測感應(yīng)器先下降碰到鋼板後,後刮刀下降,第一次先壓平刮刀,第二次自動偵測後刮刀高度)(測完刮刀高度後,開始設(shè)定刮刀行程)About to set SQUEEGEE STROKE.Press NEXT

46、 to Continue, or EXIT to quit.About to set SQUEEGEE STROKE. (開始設(shè)定刮刀行程)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)You must now jog to the Rear squeegee position. Press NEXT to Continue, or EXIT to quit.You must now jog to the Rear squeegee position. (他必須現(xiàn)在移動後刮刀位置)Press NEXT to Continu

47、e, or EXIT to quit. (按NEXT繼續(xù), 按EXIT離開)JOG ACTIVESQUEEGEE STROKE -0.050Press EXIT to quit.(開始移動刮刀行程,完畢按EXIT離開)You must now jog to the front squeegee position. Press NEXT to Continue, or EXIT to quit.You must now jog to the(他必須現(xiàn)在移動前刮刀位置)Rear squeegee position. Press NEXT to Continus, or EXIT to quit.

48、(按NEXT繼續(xù), 按EXIT離開)JOG ACTIVESQUEEGEE STROKE -0.050Press EXIT to quit.(開始移動刮刀行程,完畢按EXIT離開)1.6選擇Print Parameters進(jìn)入印刷參數(shù)設(shè)定Print ParametersHardware Required:NoneSqueegee刮刀設(shè)定參數(shù)Total Force 5.4刮刀向下壓力(刮刀長度X1.2)/2.2Down Stop 1.905刮刀碰到鋼板後再向下壓之距離Print Speed 25刮刀印刷行程之速度Enter squeegee printing parameters. (輸入刮刀印刷

49、參數(shù))(this affects front AND rear squeegees) (包含前後刮刀)Press Done when finished. (按Done完成)Board Parameters基板(PCB)參數(shù)設(shè)定Snap off 0.000PCB與鋼板之間隙(數(shù)字越大,間隙越大)Tooling TypeUnier. Dedicat.治具不運(yùn)用治具運(yùn)用治具Enter Snapoff into setup menu. (輸入PCB與鋼板之間隙印刷參數(shù))Set to zero for CONTACT printing. (接觸式印刷時，請?jiān)O(shè)為0)Press Done when fini

50、shed. (按Done完成)Slow Snop off慢速脫模參數(shù)設(shè)定Enabled NoYes不運(yùn)用慢速脫模運(yùn)用慢速脫模Down Delay 0.00脫離鋼板前延遲時間Distance 1.570慢速脫模之距離Speed 123456慢速脫模速度1脫模速度 5mil/s2脫模速度 10mil/s3脫模速度 15mil/s4脫模速度 20mil/s5脫模速度 25mil/s6脫模速度 30mil/sEnter Slow snapoff parameters. (輸入慢速脫模參數(shù))Press Done when finished. (按Done完成)TEACH is now complete.

51、 (程式現(xiàn)在設(shè)定完成)Press SELECT to save now, or(按SELECT現(xiàn)在存入檔案)Press NEXT to continue. (按NEXT繼續(xù)回主畫面按SELECT之後,出現(xiàn)存入檔案鍵盤畫面Press NEXT to continue. (按NEXT繼續(xù),回主畫面)2. Teach Vision做一片PCB新程式的Mark點(diǎn)about to enter VISION TEACH operation.Press NEXT to Continue, or EXIT to Quit. about to enter VISION TEACH operation. (即將進(jìn)

52、入視覺系統(tǒng)設(shè)定操作)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)他按NEXT之後，出現(xiàn)以下訊息：Place a board on input track.Press NEXT to Continue, or EXIT to Quit. Place a board on input track. (請將基板放到軌道輸入端)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)他按NEXT之後，出現(xiàn)以下訊息：Locating the boardADD or DE

53、LETE targets to change the(新增或刪除,所指Mark點(diǎn)位置或變更目current vision layout.前Mark點(diǎn)位置) Press EXIT when you are FINISHED. (當(dāng)他已完成Teach vision按EXIT)ADD添加一個Mark點(diǎn)DELETE刪除一個Mark點(diǎn)VIEW辨視做完的PC板與鋼板Mark點(diǎn)ZOOM IN將點(diǎn)選到位置放大與縮小他按ADD之後，出現(xiàn)以下訊息：Are you training synthetic fiducials?SELECT for YES, NEXT for NOAre you training syn

54、thetic fiducials? (他要選擇自設(shè)Mark點(diǎn)嗎？)SELECT for YES, NEXT for NO (按SELECT要；按NEXT不要)當(dāng)他按SELECT後,需求輸入自設(shè)選擇Mark點(diǎn)長、寬、高、尺寸等.)當(dāng)他按NEXT後,依影像視覺系統(tǒng)自行判別Mark點(diǎn))按SELECT之後，出現(xiàn)以下視窗：當(dāng)他按SELECT後,需求輸入自設(shè)選擇Mark點(diǎn)長、寬、高、尺寸等.)ADD fiducial for the BOARD (添加Mark點(diǎn)到PCB上)Please SELECT the type of fiducial add. (請選擇Mark點(diǎn)型式)Press DONE when

55、 finished. (按DONE完成)按NEXT之後，出現(xiàn)以下視窗：Move the trackball pointer to the area(移動軌跡球指到PC板上Mark點(diǎn)位置後,where a target is to be Added and 按SELECT後，影像視覺系統(tǒng)會移動到他the press SELECT.所指的位置)按SELECT之後，出現(xiàn)以下視窗：JOG to Board Target(移動到PC板上Mark點(diǎn))Press NEXT for contrast ON, EXIT to finish. (按NEXT調(diào)整對比,按EXIT完成)按EXIT之後，出現(xiàn)以下視窗：B

56、oard Target 1(PC板上第一個Mark點(diǎn))Adjusting : Position(調(diào)整搜尋範(fàn)圍框大小、尺寸)X: 2.0258mm(搜尋範(fàn)圍框X方向)Y: 2.0258mm(搜尋範(fàn)圍框Y方向)Please Define the BOARD TARGET. (請定義基板上Mark點(diǎn)收尋範(fàn)圍的位置與尺寸)Press NEXT to alternate between POSITION(按NEXT變換搜尋範(fàn)圍框位置、尺adjust mode and SIZE adjust mode. 寸並調(diào)整)Press SELECT when DONE. (按SELECT完成)按SELECT完成後,

57、會出現(xiàn)做第二個Mark點(diǎn)的訊息Press SELECT for Multi Model Teach orPress NEXT for Single Model Teach. 當(dāng)做完第一個Mark點(diǎn)時,假設(shè)第二點(diǎn)與第一點(diǎn)形狀大小,都不一樣時按SELECT；假設(shè)第二點(diǎn)與第一點(diǎn)形狀大小,都一樣時按NEXT,此訊息主要是減少定義搜尋範(fàn)圍框時間)按SELECT全部做完後，出現(xiàn)以下PC板上Mark點(diǎn)視窗：ADD or DELETE targets to change the(新增或刪除,所指Mark點(diǎn)位置或變更目current vision layout.前Mark點(diǎn)位置) Press EXIT when

58、 you are FINISHED. (當(dāng)他已完成Teach vision按EXIT)按EXIT之後,出現(xiàn)存入檔案鍵盤畫面3. Device Layout做2D(錫膏覆蓋率)檢查時,所要檢查零件About to begin Device Layout TEACH.Press NEXT to Continue, or EXIT to Quit.About to begin Device Layout TEACH. (即將開始做2D檢查的零件之設(shè)定)Press NEXT to Continue, or EXIT to Quit. (按NEXT繼續(xù), 按EXIT離開)按NEXT之後,出現(xiàn)以下視窗畫面

59、ADD or DELETE Device(新增或刪除,所指2D零件點(diǎn)位置或變更目前位置)To change the current .Press EXIT when you are FINISHED. (當(dāng)他已完成Device Layout按EXIT)ADD添加一個2D檢查點(diǎn)DELETE刪除一個2D檢查點(diǎn)ZOOM IN將點(diǎn)選到位置放大與縮小他按ADD之後，出現(xiàn)以下訊息視窗：Please SELECT the type of device to be added . (請選擇新增2D零件型式)Press EXIT to quit. (按EXIT離開)選擇QFP 零件時Move the track

60、ball pointer to the AreaWhere the device is to be added and Press SELECTMove the trackball pointer to the Area(移動軌跡球,按SELECT點(diǎn)選到PC Where the device is to be added and板上QFP零件位置)Press SELECT按SELECT之後,出現(xiàn)以下訊息視窗畫面JOG to the closest Horizontal end pad. (移動虛線,選擇QFP第一點(diǎn)程度The object should be centered. PAD點(diǎn))Pr